JPH0612587Y2 - スイツチ - Google Patents
スイツチInfo
- Publication number
- JPH0612587Y2 JPH0612587Y2 JP3164488U JP3164488U JPH0612587Y2 JP H0612587 Y2 JPH0612587 Y2 JP H0612587Y2 JP 3164488 U JP3164488 U JP 3164488U JP 3164488 U JP3164488 U JP 3164488U JP H0612587 Y2 JPH0612587 Y2 JP H0612587Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- switch
- contacts
- conductor plate
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 45
- 239000004020 conductor Substances 0.000 claims description 40
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 description 10
- 238000005299 abrasion Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Contacts (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3164488U JPH0612587Y2 (ja) | 1988-03-11 | 1988-03-11 | スイツチ |
| US07/301,783 US4897513A (en) | 1988-03-11 | 1989-01-25 | Rotary switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3164488U JPH0612587Y2 (ja) | 1988-03-11 | 1988-03-11 | スイツチ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01135625U JPH01135625U (enrdf_load_stackoverflow) | 1989-09-18 |
| JPH0612587Y2 true JPH0612587Y2 (ja) | 1994-03-30 |
Family
ID=31257649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3164488U Expired - Lifetime JPH0612587Y2 (ja) | 1988-03-11 | 1988-03-11 | スイツチ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0612587Y2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1125790A (ja) * | 1997-06-27 | 1999-01-29 | Tokai Rika Co Ltd | ニュートラルスタートスイッチの接点面構造 |
| JP6296708B2 (ja) * | 2013-06-11 | 2018-03-20 | 朝日電装株式会社 | 摺動型スイッチ |
| JP6520756B2 (ja) * | 2016-02-24 | 2019-05-29 | アンデン株式会社 | 接点装置 |
-
1988
- 1988-03-11 JP JP3164488U patent/JPH0612587Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01135625U (enrdf_load_stackoverflow) | 1989-09-18 |
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