JPH06125123A - Laser case body of gas laser system and gas exhausting method from laser case body - Google Patents

Laser case body of gas laser system and gas exhausting method from laser case body

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Publication number
JPH06125123A
JPH06125123A JP27289992A JP27289992A JPH06125123A JP H06125123 A JPH06125123 A JP H06125123A JP 27289992 A JP27289992 A JP 27289992A JP 27289992 A JP27289992 A JP 27289992A JP H06125123 A JPH06125123 A JP H06125123A
Authority
JP
Japan
Prior art keywords
gas
laser
housing
case body
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27289992A
Other languages
Japanese (ja)
Inventor
Yoshifumi Matsushita
嘉文 松下
Tadao Minagawa
忠郎 皆川
Shungo Tsuboi
俊吾 坪井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP27289992A priority Critical patent/JPH06125123A/en
Publication of JPH06125123A publication Critical patent/JPH06125123A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To provide a gas laser system and gas exhausting method from laser case body capable of efficiently removing any moisture content, impurity gas, etc., in the laser case body within a short time as well as decreasing the frequency of passivation processing times. CONSTITUTION:During the gas exhausting step of passivation process repeating the filling step of laser medium gas, the laser oscillating step and the polluted gas exhausting step, the polluted gas is exhausted while heating a case body 6 after filling a heater jacket 7 provided in the case body 6 with a heating medium.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、ガスレーザ筐体およ
びこのガスレーザ筐体の内壁および筐体内の構成部材に
付着した水分等、不純物ガスの排気方法に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas laser housing and a method for exhausting an impurity gas such as water adhered to the inner wall of the gas laser housing and the components inside the housing.

【0002】[0002]

【従来の技術】ガスレーザ発振部を構成するレーザ筐体
のレーザ媒質ガスを交換する場合、まず筐体の内壁およ
び筐体内の構成部材に付着した水分等、不純物ガスを排
気する必要がある。この排気方法として、レーザ媒質ガ
スの充填、レーザ発振、汚れたガスの排出を繰り返すパ
ッシベーション処理(不動態化処理)があり、この種の
技術として、例えば実開平1−146567号公報に示
されたものがある。すなわち、図9は上記公報に示され
た従来のガスレーザ装置のレーザ筐体内のガス排気装置
の概略図、図10は従来のガスレーザ筐体の組立から定
常運転に移るまでの工程図である。図において、1はガ
スレーザ発振部を構成する筐体、2は筐体1の排気用開
孔1aに接続された排気管、3は排気バルブ、4はハロ
ゲンガス処理装置、5は排気ポンプであり、筐体1内の
ガス交換時に、排気ポンプ5を駆動させた後排気バルブ
3を開き、排気管2を通して筐体1内に残留するガスを
排気するように構成されている。
2. Description of the Related Art When exchanging a laser medium gas of a laser casing constituting a gas laser oscillating section, it is first necessary to exhaust an impurity gas such as moisture adhering to an inner wall of the casing and constituent members in the casing. As this exhaust method, there is a passivation process (passivation process) in which the filling of the laser medium gas, the laser oscillation, and the discharge of the dirty gas are repeated, and a technique of this kind is disclosed in, for example, Japanese Utility Model Publication No. 1-146567. There is something. That is, FIG. 9 is a schematic view of a gas exhaust device in the laser housing of the conventional gas laser apparatus shown in the above publication, and FIG. 10 is a process diagram from assembly of the conventional gas laser housing to shifting to steady operation. In the figure, 1 is a housing constituting a gas laser oscillator, 2 is an exhaust pipe connected to the exhaust opening 1a of the housing 1, 3 is an exhaust valve, 4 is a halogen gas treatment device, and 5 is an exhaust pump. When exchanging the gas in the housing 1, the exhaust valve 5 is driven and then the exhaust valve 3 is opened to exhaust the gas remaining in the housing 1 through the exhaust pipe 2.

【0003】従来のガスレーザ装置では、筐体1内のガ
スの寿命についてはそれほど問題にされておらず、筐体
1内の残留ガスを排気する主目的は、レーザ媒質ガスを
交換することにあった。特に、エキシマレーザにおいて
は、レーザ装置組立後しばらくは所定のレーザ出力、レ
ーザ特性が得られない。これはハロゲンガスの反応性が
高いことに起因するものである。すなわち、レーザ装置
の筐体組立後は、筐体内壁および内部構成部材がハロゲ
ンガスと全く反応していない状態であり、そのような筐
体内にハロゲンガスを含むレーザ媒質ガスを充填してレ
ーザ発振を行うと、筐体の内壁および内部構成部材等に
付着している水分あるいは汚れ成分とハロゲンガスが激
しく反応し、極めて短時間でレーザガスが汚れて劣化し
てしまうためである。しかしながら、上記のようにレー
ザ発振とガス交換とを繰り返すいわゆるパッシベーショ
ン処理を施すことによって、筐体内壁および内部構成部
材の表面には部材とハロゲンガスとの反応生成物が形成
され、この反応生成物による保護効果によって反応が進
みにくくなる。また汚れ成分はガス交換の際に筐体外に
排出されるので次第に減少し、その結果、レーザ出力、
レーザ特性が向上してゆく。
In the conventional gas laser device, the life of the gas in the housing 1 has not been so much a problem, and the main purpose of exhausting the residual gas in the housing 1 is to replace the laser medium gas. It was Particularly, in the excimer laser, a predetermined laser output and laser characteristics cannot be obtained for a while after the laser device is assembled. This is due to the high reactivity of the halogen gas. That is, after the housing of the laser device is assembled, the inner wall of the housing and the internal components are in a state of not reacting with the halogen gas at all, and such a housing is filled with the laser medium gas containing the halogen gas to cause the laser oscillation. This is because the water or dirt components adhering to the inner wall of the housing and the internal components react violently with the halogen gas, and the laser gas becomes dirty and deteriorates in an extremely short time. However, by performing the so-called passivation treatment in which laser oscillation and gas exchange are repeated as described above, a reaction product of the member and the halogen gas is formed on the inner wall of the housing and the surfaces of the internal constituent members. Due to the protective effect of, the reaction becomes difficult to proceed. In addition, the dirt component is discharged outside the housing during gas exchange, so it gradually decreases, and as a result, the laser output,
Laser characteristics will improve.

【0004】[0004]

【発明が解決しようとする課題】エキシマレーザが半導
体露光装置の光源として実用化されるに伴って、レーザ
媒質ガスの寿命が問題になってきた。特に筐体の内壁に
水分等、不純物ガスが吸着していると、筐体にハロゲン
ガスを含む媒質ガスを充填してレーザ発振させた場合、
筐体内部では、H2O+F2→2HF+1/202の反応
が起こり、F2濃度の減少および生成した弗化水素ガス
と酸素ガスがレーザ発振効率の著しい低下をもたらす。
そこで筐体内壁に付着した水分等、不純物ガスを除去
し、また筐体内でレーザ媒質ガスに触れる部分を上記ガ
スと順応化させるために、レーザ媒質ガスとしての新鮮
なガスの充填104〜105シヨット程度の放電(レーザ
発振)、汚れたガスの排気の手順を、レーザ出力の低下
率が所定値以下になるまで繰り返すパッシベーション処
理が施されるのであるが、従来行われていた上記処理は
長時間にわたって多数回の繰り返しが必要であり、極め
て非能率かつ不経済であるという問題点があった。
As the excimer laser has been put to practical use as a light source for a semiconductor exposure apparatus, the life of the laser medium gas has become a problem. In particular, when impurity gas such as moisture is adsorbed on the inner wall of the housing, when the housing is filled with a medium gas containing a halogen gas to cause laser oscillation,
A reaction of H 2 O + F 2 → 2HF + 1/20 2 occurs inside the housing, the concentration of F 2 is reduced, and the generated hydrogen fluoride gas and oxygen gas cause a remarkable reduction in laser oscillation efficiency.
Therefore, in order to remove the impurity gas such as water adhered to the inner wall of the housing and to adapt the portion of the housing that comes into contact with the laser medium gas with the above gas, a fresh gas as the laser medium gas is filled 10 4 to 10 10. The passivation process is performed by repeating the discharge (laser oscillation) of about 5 sailboats and exhausting dirty gas until the reduction rate of the laser output falls below a predetermined value. There is a problem that it is extremely inefficient and uneconomical because it requires a large number of repetitions over a long period of time.

【0005】この発明は、上記のような問題点を解消す
るためになされたもので、筐体内の水分等を効率よく短
時間で除去し、パッシベーション処理の回数を減少させ
ることができるレーザ筐体およびこのレーザ筐体内のガ
ス排気方法を得ることを目的とする。
The present invention has been made in order to solve the above problems, and it is possible to efficiently remove water and the like in the housing in a short time and reduce the number of passivation processes. It is also an object of the present invention to obtain a method for exhausting gas inside the laser housing.

【0006】[0006]

【課題を解決するための手段】この発明に係る請求項1
のガスレーザ装置のレーザ筐体内のガス排気方法は、レ
ーザ媒質ガスの充填、レーザ発振、汚れガスの排気を繰
り返すパッシベーション処理におけるガスの排出工程に
おいて、筐体内を加熱しながら排気するようにしたもの
である。
[Means for Solving the Problems] Claim 1 according to the present invention
The method for exhausting gas from the laser housing of the gas laser device is such that the housing is heated and exhausted in the gas discharge step in the passivation process in which filling of the laser medium gas, laser oscillation, and exhaust of dirty gas are repeated. is there.

【0007】また、請求項2のガスレーザ装置のレーザ
筐体は、レーザ筐体の外周面にこれを包囲する通路を設
け、この通路に加熱媒体を流通させて筐体内を加熱する
ように構成したものであり、また、請求項3のガスレー
ザ装置のレーザ筐体は、レーザ筐体にヒータを配設しこ
れにより筐体内を加熱するように構成したものである。
Further, in the laser casing of the gas laser device according to the second aspect, a passage is provided on the outer peripheral surface of the laser casing so as to surround the passage, and a heating medium is circulated in the passage to heat the inside of the casing. The laser housing of the gas laser device according to claim 3 is configured such that a heater is provided in the laser housing and the inside of the housing is heated by the heater.

【0008】[0008]

【作用】この発明におけるガスレーザ装置のレーザ筐体
内のガス排気方法は、レーザ筐体内を加熱しながら高真
空排気するのでパッシベーション処理の回数を減少させ
る。
According to the method of exhausting gas in the laser housing of the gas laser device of the present invention, the number of times of passivation processing is reduced because high vacuum exhaust is performed while heating the inside of the laser housing.

【0009】[0009]

【実施例】【Example】

実施例1.以下、この発明の実施例を図について説明す
る。図1はこの発明の実施例1におけるガスレーザ装置
のレーザ筐体に加熱ジャケットを設けた概略図である。
図1において6はガスレーザ発振部を形成する筐体であ
り、放出ガスの少ない18Cr8Ni系オーステナイト
ステンレス鋼を用いて製作され、しかも、レーザ媒質ガ
スと接する表面は面積を小さくするために鏡面仕上げを
施してある。7は筐体6を加熱するためのジャケットで
あり、その中に加熱媒体を流通させる通路(図示せず)
が形成されている。8はジャケット7へ加熱媒体を流入
させるための注入口、9は同じく排出口である。10は
レーザ媒質ガスの主排気管であり、その途中には排気バ
ルブ11および筐体内ガス排気用の高真空排気ポンプ1
2が設けられている。13は主排気管10から分岐した
副排気管であり、その途中には排気バルブ14および排
気ポンプ15が設けられている。
Example 1. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram of a heating jacket provided on a laser housing of a gas laser device according to a first embodiment of the present invention.
In FIG. 1, reference numeral 6 denotes a housing for forming a gas laser oscillation part, which is manufactured using 18Cr8Ni-based austenitic stainless steel that emits a small amount of emitted gas, and the surface in contact with the laser medium gas is mirror-finished to reduce the area. There is. Reference numeral 7 is a jacket for heating the housing 6, and a passage (not shown) for circulating a heating medium therein.
Are formed. Reference numeral 8 is an inlet for introducing the heating medium into the jacket 7, and 9 is an outlet. Reference numeral 10 is a main exhaust pipe for the laser medium gas, and an exhaust valve 11 and a high vacuum exhaust pump 1 for exhausting gas in the housing are provided in the middle thereof.
Two are provided. Reference numeral 13 denotes an auxiliary exhaust pipe branched from the main exhaust pipe 10, and an exhaust valve 14 and an exhaust pump 15 are provided in the middle thereof.

【0010】上記のように構成されたレーザ筐体による
ガス排気方法にあっては、筐体6を組み立てた後、ジャ
ケット7の注入口より150℃の熱油を注入し、筐体6
内を加熱しながら高真空排気ポンプ12を駆動して筐体
6内のベーキングを行い、更に次工程のパッシベーショ
ン処理におけるガスの排出工程においても筐体6内を加
熱しながら排気するようにしたもので、その工程が図6
に示されている。図6は上記実施例1での筐体6の組立
から定常運転に入るまでの工程を示しており、筐体6の
組立とパッシベーション処理との間に筐体6内を加熱し
てベーキングする工程が、また、パッシベーション処理
において筐体6内を加熱しながら排気する工程が挿入さ
れている。したがって従来のように筐体内を加熱しない
場合に比べて筐体内の水分等、不純物ガスの排除が効率
よく短時間に達成され、パッシベーション処理回数を大
幅に削減することができる。
In the gas exhaust method using the laser casing constructed as described above, after assembling the casing 6, hot oil of 150 ° C. is injected from the inlet of the jacket 7 to form the casing 6.
The inside of the housing 6 is baked by driving the high vacuum exhaust pump 12 while heating the inside, and the housing 6 is also exhausted while heating in the gas discharging step in the passivation process of the next step. Then, the process is shown in FIG.
Is shown in. FIG. 6 shows the steps from the assembly of the housing 6 to the start of steady operation in the first embodiment. The step of heating and baking the inside of the housing 6 between the assembly of the housing 6 and the passivation process. However, in the passivation process, a step of exhausting the inside of the housing 6 while heating is inserted. Therefore, as compared with the conventional case where the inside of the housing is not heated, the removal of the impurity gas such as moisture in the housing is efficiently achieved in a short time, and the number of passivation treatments can be significantly reduced.

【0011】図に示す高真空ポンプ12はベーキング終
了後取り外して通常の排気ポンプと交換してもよい。つ
まりガス交換にあたっては高真空ポンプ12は必ずしも
必要ではなく、取扱いの容易な小型の排気バルブ14お
よび排気ポンプ15を設けた副排気管13を使用すれば
よい。さらにレーザ発振時には、ジャケット7に熱油の
代わりに20℃以下の冷水を流して内部の温度上昇を抑
え、レーザ発振効率の向上に役立たせることもできる。
The high vacuum pump 12 shown in the figure may be removed after the baking is completed and replaced with a normal exhaust pump. That is, the gas exchange does not necessarily require the high vacuum pump 12, and may use a small exhaust valve 14 and an auxiliary exhaust pipe 13 provided with an exhaust pump 15 that are easy to handle. Further, during laser oscillation, instead of hot oil, cold water of 20 ° C. or less may be caused to flow through the jacket 7 to suppress an internal temperature rise, which may be useful for improving laser oscillation efficiency.

【0012】図8はベーキングを実施した後のパッシベ
ーション処理回数と、ガスレーザ出力半減シヨット数と
の関係を示す図であり、比較のためベーキングしない従
来例も併せて示している。図8からわかるように、ベー
キングであり(150℃加熱,高真空排気)の場合、パ
ッシベーション処理2回目にてレーザ出力が半減するま
でに107シヨット以上も発振できるのに対し、従来の
ベーキング無しの場合には、10回パッシベーション処
理を行っても106シヨットも発振できない。また、ベ
ーキング温度は、50℃よりも150℃と高温の方がパ
ッシベーション処理回数減少への効果は大きい。すなわ
ち、筐体内の構成部材の耐熱性が許す限りベーキング温
度を高くした方が、筐体内の水分等、不純物ガスの除去
効果が大きい。以上の結果から、ベーキングが筐体内の
水分等、不純物ガスの除去に有効であって、パッシベー
ション処理回数の減少を可能とし、さらにレーザ発振が
定常運転に入った場合の1回のレーザ媒質ガス充填にお
ける発振時間を長くするという効果があることがわか
る。
FIG. 8 is a diagram showing the relationship between the number of passivation treatments after baking and the number of gas laser output halves, and also shows a conventional example in which baking is not performed for comparison. As can be seen from FIG. 8, in the case of baking (heating at 150 ° C., high vacuum evacuation), it is possible to oscillate 10 7 or more yachts before the laser output is halved in the second passivation treatment, whereas conventional baking is not performed. In the case of, even if 10 times passivation processing is performed, 10 6 sailboats cannot oscillate. Further, the baking temperature as high as 150 ° C. rather than 50 ° C. is more effective in reducing the number of passivation treatments. That is, if the baking temperature is increased as much as the heat resistance of the constituent members in the housing allows, the effect of removing the impurity gas such as moisture in the housing is greater. From the above results, baking is effective in removing the impurity gas such as water in the housing, enables the number of passivation treatments to be reduced, and further, the laser medium gas is charged once when the laser oscillation enters the steady operation. It can be seen that there is an effect of lengthening the oscillation time in.

【0013】実施例2.図2は、この発明の実施例2に
おけるガスレーザ装置のレーザ筐体の構成を示す概略図
である。上記実施例1では、筐体6の外側面に加熱媒体
である熱油を流通させる加熱ジャケット7を設けたもの
であるが、実施例2では、筐体6の周囲に加熱媒体を流
通させる加熱配管16を巻装したもので、筐体6のベー
キング時に注入口8より150℃の熱油を注入し、筐体
6の内部を加熱しながら高真空排気ポンプ12を駆動
し、高真空排気して脱ガスを行い、さらにパッシベーシ
ョン処理におけるガス排出工程において筐体6内を加熱
しながら排気するようにしたもので、上記実施例1と同
様の効果を奏する。また、レーザ発振時には注入口8か
ら20℃以下の冷水を注入することにより筐体6の内部
温度の上昇を抑制することができる。
Example 2. FIG. 2 is a schematic diagram showing the configuration of the laser housing of the gas laser device according to the second embodiment of the present invention. In the first embodiment described above, the heating jacket 7 for circulating the hot oil as the heating medium is provided on the outer surface of the housing 6, but in the second embodiment, the heating jacket 7 is heated around the housing 6. The pipe 16 is wound, and hot oil of 150 ° C. is injected from the inlet 8 when baking the casing 6, and the high vacuum exhaust pump 12 is driven while heating the inside of the casing 6 to perform high vacuum exhaust. Degassing is performed, and in the gas discharging step in the passivation process, the inside of the housing 6 is exhausted while being heated, and the same effect as that of the first embodiment is achieved. Further, at the time of laser oscillation, it is possible to suppress an increase in the internal temperature of the housing 6 by injecting cold water of 20 ° C. or lower from the injection port 8.

【0014】実施例3.図3は、この発明の実施例3に
おけるガスレーザ装置のレーザ筐体の構成を示す概略図
である。図3において、17および18は筐体6の内部
に配設した加熱ヒータであり、加熱ヒータ17にはマイ
クロシーズヒータを、また、加熱ヒータ18にはハロゲ
ンランプヒータを用いている。どちらも投入する電流量
によって温度調節が可能になっており、上記実施例1,
2と同様の効果を奏する。また、ハロゲンランプヒータ
18は筐体6とシール材19を介して固定され、しかも
着脱可能な構造となっており、ベーキング終了後には筐
体6から取り外し、盲栓をしておく。
Example 3. FIG. 3 is a schematic diagram showing the configuration of the laser housing of the gas laser device according to the third embodiment of the present invention. In FIG. 3, reference numerals 17 and 18 denote heating heaters disposed inside the housing 6. The heating heater 17 is a microsheath heater, and the heating heater 18 is a halogen lamp heater. In both cases, the temperature can be controlled by the amount of electric current to be applied.
The same effect as 2 is achieved. Further, the halogen lamp heater 18 is fixed to the housing 6 via the sealing material 19 and has a detachable structure. After the baking is completed, the halogen lamp heater 18 is removed from the housing 6 and is closed with a blind plug.

【0015】実施例4.図4は、この発明の実施例4に
おけるガスレーザ装置のレーザ筐体の構成を示す概略図
である。図4において、20は筐体6の外側面に貼着し
たテープヒータであり、上記実施例1〜3と同様の効果
を奏する。なお、テープヒータ20は着脱可能とし、ベ
ーキング終了後に取り外しておく。
Example 4. Fourth Embodiment FIG. 4 is a schematic diagram showing the configuration of a laser housing of a gas laser device according to a fourth embodiment of the present invention. In FIG. 4, reference numeral 20 is a tape heater attached to the outer surface of the housing 6 and has the same effect as that of the first to third embodiments. The tape heater 20 is detachable, and is removed after the baking is completed.

【0016】実施例5.図5は、この発明の実施例5に
おけるガスレーザ装置のレーザ筐体の加熱構成を示す概
略図である。図5において21は筐体6全体が納まる大
きさのオーブンであり、筐体6を上記オーブン21に収
容して筐体6を上記オーブン21に収容して筐体6を加
熱しながらベーキングおよびパッシベーション処理を行
うものであり、上記実施例1〜4と同様の効果を奏す
る。この実施例5のオーブン21を用いた筐体加熱構成
によれば、筐体6をオーブン21から取り出すだけでよ
く、上記実施例3,4のように加熱器を着脱する必要が
ないという簡便さがある。
Example 5. FIG. 5 is a schematic diagram showing a heating configuration of a laser housing of a gas laser device according to a fifth embodiment of the present invention. In FIG. 5, reference numeral 21 is an oven having a size capable of accommodating the entire housing 6, and the housing 6 is housed in the oven 21, the housing 6 is housed in the oven 21, and baking and passivation are performed while heating the housing 6. Processing is performed, and the same effect as that of the above-described first to fourth embodiments is obtained. According to the housing heating configuration using the oven 21 of the fifth embodiment, it is only necessary to take out the housing 6 from the oven 21, and it is not necessary to attach or detach the heater unlike the third and fourth embodiments. There is.

【0017】実施例6.図7は、この発明の実施例6で
の筐体の組立から定常運転に移るまでの工程図である。
図7に示すように、筐体を含め内部構成部材を組み立て
る前に、脱脂洗浄を十分に行った後、これらをオーブン
に収容して150℃以上に加熱し、ベーキングを実施
し、その後、筐体の組立を行う。こうすることにより、
筐体および内部構成部材の水分等、不純物ガスの除去を
より完全な状態にまで行うことができるので、後工程の
パッシベーション処理に好影響を与える。
Embodiment 6. FIG. 7 is a process diagram from assembly of a housing to shifting to steady operation in Embodiment 6 of the present invention.
As shown in FIG. 7, before assembling the internal components including the housing, after thoroughly degreasing and cleaning, these are housed in an oven and heated to 150 ° C. or higher, baking is performed, and then the housing is Assemble the body. By doing this,
Impurity gas such as moisture in the housing and internal components can be removed to a more complete state, which has a favorable effect on the passivation process in the subsequent process.

【0018】[0018]

【発明の効果】以上のように、この発明によれば、レー
ザ媒質ガスの充填、レーザ発振、汚れガスの排気を繰り
返すパッシベーション処理における上記ガスの排出工程
において、筐体内を加熱しながら排気するので、パッシ
ベーション処理の回数を大幅に削減することができる。
As described above, according to the present invention, in the gas discharging step in the passivation process in which the filling of the laser medium gas, the laser oscillation, and the exhaust of the dirty gas are repeated, the inside of the housing is exhausted while heating. , The number of passivation processes can be significantly reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の実施例1におけるガスレーザ装置の
レーザ筐体に加熱ジャケットを設けた概略図である。
FIG. 1 is a schematic diagram in which a heating jacket is provided on a laser housing of a gas laser device according to a first embodiment of the present invention.

【図2】この発明の実施例2におけるガスレーザ装置の
レーザ筐体に加熱配管を設けた概略図である。
FIG. 2 is a schematic diagram in which a heating pipe is provided in a laser housing of a gas laser device according to a second embodiment of the present invention.

【図3】この発明の実施例3におけるガスレーザ装置の
レーザ筐体内に加熱ヒータを設けた概略図である。
FIG. 3 is a schematic view of a heater provided in a laser housing of a gas laser device according to a third embodiment of the present invention.

【図4】この発明の実施例4におけるガスレーザ装置の
レーザ筐体の外面にテープヒータを設けた概略図であ
る。
FIG. 4 is a schematic diagram in which a tape heater is provided on an outer surface of a laser housing of a gas laser device according to a fourth embodiment of the present invention.

【図5】この発明の実施例5におけるガスレーザ装置の
レーザ筐体と加熱オーブンとの関係を示す概略図ある。
FIG. 5 is a schematic diagram showing a relationship between a laser housing and a heating oven of a gas laser device according to a fifth embodiment of the present invention.

【図6】実施例1における筐体の組立から定常運転に移
るまでの工程図である。
FIG. 6 is a process diagram from assembly of the casing to shifting to steady operation in the first embodiment.

【図7】実施例6における筐体の組立から定常運転に移
るまでの工程図である。
FIG. 7 is a process diagram from assembly of a housing to shifting to steady operation in a sixth embodiment.

【図8】この発明におけるレーザ筐体のパッシベーショ
ン処理回数と、レーザ出力半減シヨット数との関係を示
す図である。
FIG. 8 is a diagram showing a relationship between the number of times of passivation processing of the laser housing and the number of laser output halves in the present invention.

【図9】従来のガスレーザ装置のレーザ筐体内のガス排
気装置を示す概略図である。
FIG. 9 is a schematic view showing a gas exhaust device in a laser housing of a conventional gas laser device.

【図10】従来のレーザ筐体の組立から定常運転に移る
までの工程図である。
FIG. 10 is a process diagram from assembly of a conventional laser housing to shifting to steady operation.

【符号の説明】[Explanation of symbols]

6 レーザ筐体 7 加熱ジャケット 8 注入口 9 排出口 10 主排気管 11 排気バルブ 12 高真空排気ポンプ 16 加熱配管 17 マスクロシーズヒータ 18 ハロゲンランプヒータ 19 テープヒータ 20 オーブン 6 Laser Housing 7 Heating Jacket 8 Inlet 9 Outlet 10 Main Exhaust Pipe 11 Exhaust Valve 12 High Vacuum Exhaust Pump 16 Heating Piping 17 Mask Rossie's Heater 18 Halogen Lamp Heater 19 Tape Heater 20 Oven

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 レーザ媒質ガスの充填、レーザ発振、汚
れガスの排出を繰り返すパッシベーション処理における
ガスの排出工程において、筐体内を加熱しながら排気す
るようにしたことを特徴とするガスレーザ装置のレーザ
筐体内のガス排気方法。
1. A laser housing of a gas laser device, wherein a gas is exhausted while heating the inside of a housing in a gas discharging step in a passivation process in which filling of a laser medium gas, laser oscillation, and discharging of a dirty gas are repeated. How to exhaust gas from the body.
【請求項2】 レーザ筐体の外側面にこれを包囲する通
路を設け、この通路に加熱媒体を流通されて上記筐体内
を加熱するように構成したことを特徴とするガスレーザ
装置のレーザ筐体。
2. A laser housing for a gas laser device, characterized in that a passage surrounding the laser housing is provided on the outer surface, and a heating medium is circulated in the passage to heat the inside of the housing. .
【請求項3】 レーザ筐体にヒータを配設し、これによ
り上記筐体内を加熱するように構成したことを特徴とす
るガスレーザ装置のレーザ筐体。
3. A laser housing of a gas laser device, wherein a heater is provided in the laser housing, and the inside of the housing is heated by the heater.
JP27289992A 1992-10-12 1992-10-12 Laser case body of gas laser system and gas exhausting method from laser case body Pending JPH06125123A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27289992A JPH06125123A (en) 1992-10-12 1992-10-12 Laser case body of gas laser system and gas exhausting method from laser case body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27289992A JPH06125123A (en) 1992-10-12 1992-10-12 Laser case body of gas laser system and gas exhausting method from laser case body

Publications (1)

Publication Number Publication Date
JPH06125123A true JPH06125123A (en) 1994-05-06

Family

ID=17520313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27289992A Pending JPH06125123A (en) 1992-10-12 1992-10-12 Laser case body of gas laser system and gas exhausting method from laser case body

Country Status (1)

Country Link
JP (1) JPH06125123A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013232A (en) * 2004-06-28 2006-01-12 Komatsu Ltd Method of reproducing laser chamber of ultraviolet gas laser device
JP2007141941A (en) * 2005-11-15 2007-06-07 Komatsu Ltd Excimer laser device
WO2023170835A1 (en) * 2022-03-09 2023-09-14 ギガフォトン株式会社 Baking method for chamber of gas laser apparatus, and method for manufacturing electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013232A (en) * 2004-06-28 2006-01-12 Komatsu Ltd Method of reproducing laser chamber of ultraviolet gas laser device
JP2007141941A (en) * 2005-11-15 2007-06-07 Komatsu Ltd Excimer laser device
WO2023170835A1 (en) * 2022-03-09 2023-09-14 ギガフォトン株式会社 Baking method for chamber of gas laser apparatus, and method for manufacturing electronic device

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