JPH06124977A - Surface mount type circuit device and mounting method of tab package - Google Patents

Abstract

PURPOSE:To obtain a high reliability surface mount circuit device of high density wherein outer leads of a TAB package of multipin and narrow pitch can be surely electrically mechanically connected with specified connection pad surfaces, and a mounting method which can constitute the high reliability surface mount circuit device. CONSTITUTION:The title device consists of the following; a circuit board 7 on the main surface of which rows of connection pads 8 are arranged, a TAB package 6 wherein outer leads 6a are positioned and arranged so as to face the connection pads 8, and a photo-setting type resin part 9 which electrically connects connection pads 8 and the outer leads 6a which correspond with each other by compression bonding of cure shrinkage action.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a surface mount type circuit device and a surface mount type package (TAB package ... Tape Automated B).
onding) mounting method, in particular, a surface mount type circuit device in which the outer leads of the surface mount type package are easily and surely electrically connected / mounted to the corresponding connection pads,
Also, the present invention relates to a mounting method capable of realizing the surface mounting type circuit device.

[0002]

2. Description of the Related Art TAB (Tape Automated Bonding) is used as a high-density mounting or relatively simple mounting method for semiconductor elements.
The package is placed on the surface of a predetermined area of the circuit (wiring) board, and the outer lead group of the TAB package is soldered and connected to the corresponding row of connection pads provided on the surface of the circuit board. A surface mount type circuit device and a mounting means therefor are known. The mounting means or mounting method is generally as follows. That is,
As shown schematically in FIG. 5, after the preliminary solder 3 is applied to the surface of the connection pad 2 of the circuit board 1 and flux is further applied, the required TAB package (surface mount type package) 4 is positioned. While mounting and arranging them together, they were stacked on the surface of the corresponding connection pad 2 on which the preliminary solder 3 etc. were applied.
A so-called gang bonding method is used in which the outer leads 4a of the TAB package 4 are heated and pressed by a tool (hot bar) 5 capable of collectively contacting, the preliminary solder 3 is melted and soldered, and electrical connection is made. It has been implemented.
And, such a mounting method is a multi-pin, narrow-pitch Q
It is also applied to the mounting of TAB packages such as FP packages, and corresponding surface mount type circuit devices are provided.

[0003]

However, a surface mount type circuit device formed by mounting the TAB package 4 described above,
Also, in the case of the connection / mounting method of the surface mount type package (TAB package) 4, there are the following problems in implementation. First, in implementing the gang bonding method, a relatively expensive bonding device is required, resulting in an increase in cost.

Second, when the TAB package 4 to be mounted is a device with a large number of pins and a narrow pitch like a gate array, the outer leads 4a of the TAB package 4 stacked on the surface of the corresponding connection pad 2 as a whole. Since it is practically difficult to press and contact all of them substantially uniformly and collectively, it is often impossible to achieve highly reliable connection and mounting. In other words, the outer leads 4a of the surface mount type package (TAB package) 4 are laid on the surface of the corresponding connection pad 2 on which the preliminary solder 3 or the like is applied, and the surface of the tool 5 that presses and contacts the outer leads 4a at a constant Since it is extremely difficult to obtain parallelism, it is not possible to achieve uniform and necessary pressing / contacting collectively, in combination with the thinning or fine line formation of the outer leads 4a. Is.

Thirdly, as described above, when the TAB package 4 to be mounted is a device with a large number of pins and a narrow pitch, the corresponding connection pads 2 on the surface of the circuit board 1 inevitably have a large number of pads and a narrow pitch. As a result, it becomes very difficult to selectively apply the preliminary solder 3 to the surface of the connection pad 2 having a narrow pitch. That is, it is difficult to uniformly and selectively apply the required preliminary solder 3 to the connection pad surface having a narrow pitch or the connection pad surface having a relatively small pitch and a relatively small pitch without causing a solder bridge. In some cases, electrical and mechanical connections cannot be fully achieved.

For these reasons, the surface mount type circuit device in which the TAB package 4 is mounted and mounted by the gang bonding method, and the mounting means (method) constituting the surface mount type circuit device of this kind are electrically There is a problem in the reliability of the mechanical / mechanical connection, and it cannot be said to be satisfactory for practical use.

The present invention has been made in consideration of the above circumstances, and when connecting and mounting a surface mounting type package (TAB package) on a circuit board surface, a multi-pin, narrow pitch surface mounting type package is used. Highly reliable and high-density surface mount circuit device that can securely and electrically connect the outer leads to the prescribed connection pad surface, and mounting that can form such a highly reliable mount circuit device. The purpose is to provide a method.

[0008]

In a surface mount type circuit device according to the present invention, a circuit board having a main surface provided with connection pad rows and outer leads corresponding to the connection pads of the circuit board are positioned for positioning. The present invention is characterized in that it comprises a TAB package arranged and a photo-curing resin part for electrically connecting the corresponding connection pads and outer leads to each other by pressure contact of curing shrinkage action. The mounting method of the TAB package is the step of mounting and arranging the TAB package by aligning the corresponding outer leads with the connection pad surface provided in a row on the circuit board surface, and the TAB package that is aligned and arranged as described above. Apply photo-curable resin to the outer leads and connection pad areas of
The process of applying, and the photo-curable resin that has been applied / adhered is irradiated with light to be cured, and the outer lead of the TAB package is pressed against the corresponding connection pad surface by the contraction action accompanying the curing of the photo-curable resin. The steps of electrically connecting or applying / adhering a photo-curing resin to the connection pad surface provided in a row on the circuit board surface and the outer lead of the TAB package corresponding to the connection pad surface Aligning and mounting the TAB package, placing the outer lead retainer on the outer lead of the aligned and arranged TAB package, and applying ultrasonic waves to the outer lead retainer placed above Then, remove the resin that exists between the connection pad and the outer lead,
Further, it is characterized in that light is irradiated to cure the photocurable resin, and the outer lead of the TAB package is pressed against and electrically connected to the corresponding connection pad surface by the contraction effect accompanying the curing of the photocurable resin.

In the mounting method according to the present invention,
Prior to applying ultrasonic waves to the outer lead retainer, the photo-curing resin applied / adhered to each connection pad-outer lead portion may be semi-cured, or the connection pad of the circuit board may be It may be formed in a semi-circular cross section or the like so as to promote the selective removal of the resin by the application of the ultrasonic waves.

[0010]

According to the surface mount type circuit device of the present invention and the mounting method of the surface mount type package according to the manufacture thereof, the outer lead of the surface mount type package and the corresponding connection pad of the circuit board are connected to each other in their connection regions. By the curing / shrinking action of the selectively arranged light (for example, ultraviolet rays or visible light) curable resin, an easy and reliable electrical / mechanical connection is secured. In other words, the connection pad surface-outer lead surface is directly faced and joined regardless of soldering,
By utilizing the curing and shrinkage properties of the photo-curable resin by light irradiation, the outer leads of the surface-mount type package are mechanically pressure-contacted and connected to the corresponding connection pad surface of the circuit board, and the mechanical pressure-contact is also used. Accordingly, the required electrical connection is surely achieved. In particular, when ultrasonic waves are applied, the inclusion of resin in the joint surface portion between the connection pad and the outer lead is more completely eliminated, so that reliable electrical connection can be achieved more easily. In addition, at this time, since no solder intervenes, a short circuit between adjacent outer leads or between connection pads is eliminated, and highly reliable connection /
Mounting is realized, and it becomes possible to provide a surface mounting type circuit device that is functionally separated.

[0011]

EXAMPLES FIGS. 1, 2 (a) to 2 (b), 3 and 4 will now be described.
An embodiment of the present invention will be described with reference to FIG.

Embodiment 1 FIG. 1 schematically shows an embodiment of a mounting method of a surface mount type package, in which a TAB package 6 subjected to a required forming treatment and a required circuit board 7 are prepared,
First, an appropriate amount of a photo-curing resin, for example, an ultraviolet-curing resin 9 is applied and adhered (covered) on the region of the connection pads 8 provided in a row on the surface of the circuit board 7. Next, the outer lead 6a group corresponding to the TAB package 6 is aligned with the surface of the connection pad 8 of the circuit board 7 to which the ultraviolet curable resin 9 has been applied and adhered, and the TAB package 6 is mounted and arranged.

According to the above, the outer lead pressing member 10, for example, prismatic glass or plate-shaped glass is placed on the outer lead 6a group aligned and arranged in a shape orthogonal to the outer lead 6a group. For example, one outer lead 6a is pressed with a pressure of about 50 gf, and the ultraviolet curable resin 9 interposed between the surface of the connection pad 8 and the outer lead 6a is released to the peripheral portion to achieve more electrical connection. Make the shape easy.

In this way, the surface of each outer lead 6a and the surface of the connection pad 8 are brought into direct contact with each other, and the ultraviolet ray curable resin 9 is irradiated with the required ultraviolet rays to apply the coating solution.
The adhered UV curable resin 9 was cured. Since the ultraviolet curable resin 9 shrinks as the ultraviolet curable resin 9 cures, in the region where the ultraviolet curable resin 9 is applied / adhered, the compressive force from the outside due to the curing shrinkage causes The surface of the outer lead 6a and the surface of the connection pad 8 are in close contact with each other to achieve an electrical connection, and mechanically, the mounting is firmly integrated on the connection pad 8 side, and thus on the circuit board 7 surface. It was

Embodiment 2 FIGS. 2 (a) to 2 (b) are diagrams schematically showing an embodiment of a mounting method of another surface mounting type package, which is carried out by the following procedure.

That is, in cross section in FIG. 2 (a) and in FIG.
As shown in a side view in (b), a TAB package 6 and a required circuit board 7 which have undergone a required forming process are prepared. First, a group of connection pads 8 provided on the surface of the circuit board 7 in a row. An appropriate amount of a photocurable resin, for example, an ultraviolet curable resin 9 is applied and adhered (covered) to the area.
Next, the outer lead 6a group corresponding to the TAB package 6 is aligned with the surface of the connection pad 8 of the circuit board 7 to which the ultraviolet curable resin 9 has been applied and adhered, and the TAB package 6 is mounted and arranged.

As described above, the outer lead pressing member 10, for example, prismatic glass or plate-shaped glass is placed and pressed on the outer lead 6a group aligned and arranged in a shape orthogonal to the outer lead 6a group. Form After that, the ultrasonic oscillator 11 is placed (arranged) on the surface of the outer lead retainer 10 and the generated ultrasonic wave is propagated to the outer lead 6a group via the outer lead retainer 10. Due to the propagation of the ultrasonic waves, vibration is imparted to the outer lead 6a group and the corresponding connection pad 8 and the like, and the ultraviolet curable resin 9 interposed between the outer lead 6a surface and the corresponding connection pad 8 surface is removed. For example, the side surface side is easily removed, and the surface of each outer lead 6a and the corresponding connection pad 8 surface are in direct contact with each other. In this way, each outer lead 6a surface and connection pad 8 surface directly
In a state of being in contact with each other, the ultraviolet curable resin 9 is irradiated with required ultraviolet rays to cure the applied / adhered ultraviolet curable resin 9. Since the ultraviolet curable resin 9 shrinks as the ultraviolet curable resin 9 cures, in the region where the ultraviolet curable resin 9 is applied / adhered, the compressive force from the outside due to the curing shrinkage causes Outer lead
The 6a surface and the connection pad 8 surface are in close contact with each other to achieve an electrical connection, and mechanically, the connection pad 8 side,
As a result, the surface of the circuit board 7 was firmly integrated.

In the above, the outer lead retainer 10
The ultrasonic oscillator 11 is placed (arranged) on the surface, and the generated ultrasonic waves are transmitted to the outer lead via the outer lead holder 10.
The ultraviolet curable resin 9 propagated to the 6a group and was interposed between each outer lead 6a surface and the corresponding connection pad 8 surface.
Of the UV curable resin 9 while eliminating it on the side surface side, for example.
The example in which the required ultraviolet rays are irradiated and cured to connect is shown in FIG. 3, but as shown in FIG. In a cured state, the ultrasonic oscillator 11 is placed (arranged) on the surface of the outer lead retainer 10 in this state, and the generated ultrasonic waves are transmitted through the outer lead retainer 10 to the outer lead 6a.
While being propagated to the group, the ultraviolet curable resin 9'in the semi-cured state may be irradiated with required ultraviolet rays to be completely cured and connected. In this case, each outer lead 6a
It was possible to more easily remove the semi-curable UV-curable resin 9 ′ that was interposed between the surface and the surface of the connection pad 8 on the side surface side.

Further, as schematically shown in FIG. 4 as another embodiment example, when the cross-sectional shape of the connection pad 8 on the surface of the circuit board 7 is formed in a hemispherical shape, for example, the connection pad Since the resin on the surface 8'becomes easy to flow, the action of the ultrasonic waves propagated through the outer lead retainer 10 causes the ultraviolet rays existing between the surface of each outer lead 6a and the surface of the connection pad 8 '. Elimination of the curable resin 9 is more easily achieved. In the case of the connecting pad 8'having a hemispherical cross-sectional shape, the connecting pad 8'and the outer lead 6a are initially in point contact with each other, but a flat contact is easily exhibited by the load of the outer lead retainer 10, so that the contact is made. The resistance is also kept low, and the required electrical connection / mounting and the hardening / integrating action of the ultraviolet curable resin 9 also achieve mechanical connection.

Further, although an example in which an ultraviolet curable resin is used as the photocurable resin has been shown above, the same effect can be obtained by using a photocurable resin which cures with visible light instead of the ultraviolet curable resin.・ I was able to obtain the effect.

[0021]

As described above, the surface mounting type circuit device and the mounting method of the surface mounting type package according to the present invention are provided with the connection pads on the surface of the circuit board and the outer leads of the surface mounting type package to be mounted / mounted. And are configured to be mounted and connected by mechanical joining by curing and shrinking of the photocurable resin. Therefore, even if the outer leads of the surface mounting type package to be mounted / connected have a large number of pins and a narrow pitch, and even if the outer leads are a thin film type or a fine wire, adjacent adjacent ones do not cause a short circuit, etc.
The required electrical connection can be easily and reliably ensured. Moreover, in the mechanical joining (compression joining), the photo-curable resin on the joined surfaces formed by the outer leads and the connection pads is easily removed, so that highly reliable electrical connection is maintained. Thus, the present invention brings many practical advantages such as that the surface mount type circuit device is functionally highly reliable and that the required surface mount type circuit device can be mounted and configured with high yield. Can be said.

[Brief description of drawings]

FIG. 1 is a cross-sectional view schematically showing an embodiment of a mounting method for a surface mount package according to the present invention.

FIG. 2 schematically shows an embodiment of a mounting method for a surface mount package according to the present invention, in which (a) shows a state in which outer leads of the surface mount package are aligned with connection pads of a circuit board. FIG. 3B is a side view showing a state where the outer leads of the surface mount package are aligned with the connection pads of the circuit board.

FIG. 3 is a cross-sectional view schematically showing another embodiment example of the mounting method of the surface mounting type package according to the present invention.

FIG. 4 is a sectional view schematically showing still another embodiment example of the mounting method of the surface mounting type package according to the present invention.

FIG. 5 is a cross-sectional view schematically showing an embodiment of a conventional mounting method for a surface mount type package.

[Explanation of symbols]

1, 7 ... Circuit board 2, 8, 8 '... Connection pad 3
... Solder (soldering) 4, 6 ... TAB package (surface mount type package) 5
Tool (hot bar) 9 Photocurable resin (ultraviolet curable resin) 9 '... Semi-cured photocurable resin (ultraviolet curable resin) 10 Outer lead holder 11 ...
Ultrasonic oscillator

Claims (3)

[Claims] 1. A circuit board having a main surface provided with a connection pad row, and a TAB package in which outer leads are positioned and positioned so as to correspond to the connection pads of the circuit board.
A surface-mounting type circuit device comprising: a photo-curing resin portion that electrically connects the corresponding connection pads and outer leads to each other by pressure contact of curing shrinkage. 2. A corresponding outer lead is aligned with a connection pad surface provided in a row on the circuit board surface.
A step of mounting / arranging the TAB package, and a step of applying / adhering a photo-curing resin to the outer leads and connection pad areas of the TAB package aligned / arranged as described above,
The photo-curable resin that has been applied / adhered is irradiated with light to be cured, and the shrinkage that accompanies the curing of the photo-curable resin causes T
And a step of electrically connecting the outer leads of the AB package to the corresponding connection pad surface by pressure contact, and mounting the TAB package. 3. A step of applying and depositing a photo-curing resin on the connection pad surface provided in a row on the circuit board surface, and aligning the outer leads of the TAB package corresponding to the connection pad surface. Mounting and arranging the outer TAB package, placing the outer lead retainer on the outer lead of the TAB package aligned and arranged, and connecting by applying ultrasonic waves to the outer lead retainer placed above. Excludes the resin interposed between the pad and the outer lead, and further irradiates light to cure the photo-curable resin, and the contraction that accompanies the curing of the photo-curable resin causes the outer lead of the TAB package to correspond to the corresponding connection pad surface. A method of mounting a TAB package, comprising the step of pressing and electrically connecting to.