JPH06124969A - Washing equipment of ic mold - Google Patents

Abstract

PURPOSE:To enable the effective washing of an IC mold, by installing a conveying part for conveying an IC mold in the upright state, and a washing material jetting part for jetting washing material against the IC mold. CONSTITUTION:The title washing equipment is provided with a conveying part 2 for conveying an IC mold in the upright state, and a washing material jetting part 3 for jetting power water containing abrasive grains against the IC mold. The washing material jetting part 3 for washing both side edge parts of the right and the left on the surface and the rear of an IC package on the surface and the rear of the IC mold is constituted of four nozzles 6AD, 6BC, 6'AD, 6'BC, two of which are arranged on the surface side as one pair and the other two of which are arranged on the rear side as the other pair. Thereby the upper and lower side edge parts on the surface and the rear of the IC package also can be washed. Further an interval changing mechanism 5 is installed which changes the interval between a pair of the nozzles 6AD, 6BC on the surface side and the interval between a pair of the nozzles 6'AD, 6'BC on the rear side. Thereby only the desired part positions can be washed without damaging the package.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC mold in which pressurized water (including pressurized water containing abrasive grains) is jetted to wash the IC mold (called a wet blast method, a shot blast method, etc.). The present invention relates to a cleaning device.

[0002]

2. Description of the Related Art A plurality of IC packages having protruding leads are sprayed onto an IC mold arranged in parallel in a frame to wash the IC mold (particularly, the IC package is attached to a connecting portion between the leads and the IC package). A conventional device used for the so-called wet blasting method (for removing burrs) is, for example, the actual open sho 6
No. 1-92538, the IC mold is continuously conveyed in a horizontal state, and pressurized water is jetted onto the entire front surface or front and back surfaces of the IC mold conveyed in this continuous state.
This is to clean the mold.

[0003]

As a result of various studies, the applicant has confirmed that the conventional example has the following drawbacks.

Since the conventional example has a configuration in which pressurized water is sprayed over the entire surface of the IC mold, there is a drawback that the IC package is damaged when the abrasive-containing pressurized water is used.

The conventional example is an IC that is transported in a horizontal state.
Since the pressurized water is sprayed onto the mold, the sprayed pressurized water is not satisfactorily discharged from the IC mold surface, a water film is formed on the IC mold surface, or abrasive grains are attached,
There is a drawback that the cleaning effect by the pressurized water jet is reduced by the water film and the abrasive grains.

The present invention is an IC which solves such drawbacks.
It is a technical object to provide a mold cleaning device.

[0007]

The gist of the present invention will be described with reference to the accompanying drawings.

[0008] A cleaning device for an IC mold, comprising a carrying part 2 for carrying the IC mold 1 and a cleaning member spraying part 3 for spraying a cleaning member containing abrasive particles to a desired portion of the IC mold 1. It is a thing.

An IC mold cleaning apparatus characterized in that it comprises a carrying section 2 for carrying the IC mold 1 upright and a cleaning member spraying section 3 for spraying a cleaning member onto the IC mold 1. It is related.

Further, in the IC mold cleaning apparatus according to claim 2, a cleaning member spraying section 3 for cleaning the right side edge A of the IC package 1'is provided on the front surface or the back surface of the IC mold 1, and the cleaning is performed. An IC is provided by providing a moving mechanism for vertically moving the cleaning part of the member spraying part 3, and providing the cleaning member spraying part 3 with a rotating mechanism 4 so that the cleaning part by the cleaning member spraying part 3 can be changed. The present invention relates to a cleaning device for an IC mold, characterized in that the upper edge C of the package 1'is also configured to be washable.

Further, in the IC mold cleaning apparatus according to claim 2, two cleaning member spraying parts 3 for cleaning the right and left side edges A and B of the IC package 1'on the front surface or the back surface of the IC mold 1. And a moving mechanism for vertically moving the cleaning portion of the cleaning member spraying section 3 are provided, and the two cleaning member spraying sections 3 are provided with a rotating mechanism 4 to clean by the two cleaning member spraying sections 3. The upper and lower side edge portions C and D of the IC package 1 ′ can be cleaned by arranging the parts variably, and the interval changing mechanism 5 for changing the distance between the two cleaning member jetting parts 3 is provided. The present invention relates to an IC mold cleaning device.

[0012]

The operation of the invention according to claim 1 will be described.

Since abrasive particles are present in the cleaning member, the cleaning power is increased and the cleaning member is sprayed only on a desired portion of the IC mold 1, and the IC package 1'is not sprayed with the cleaning member. No damage to package 1 '.

The operation of the invention according to claim 2 will be described.

Since the IC mold 1 is conveyed in an upright state, the cleaning member sprayed from the cleaning member spraying unit 3 onto the IC mold 1 naturally flows down, and the cleaning member does not remain on the front and back surfaces of the IC mold 1.

The operation of the invention according to claim 3 will be described.

While moving the cleaning portion of the cleaning member spraying unit 3 in the vertical direction by the moving mechanism, the cleaning member from the cleaning member spraying unit 3 cleans the right side edge A of one IC package 1 ', and the transport unit 2 The IC mold 1 is conveyed by a predetermined amount, and the left side edge portion B of the IC package 1'is washed in the same manner.

The cleaning member injection part 3 is rotated by the rotating mechanism 4 to change the cleaning part, and the IC mold 1 is transferred by the transfer part 2 while the upper edge C and the lower edge of the IC package 1 '. Wash D.

The operation of the invention according to claim 4 will be described.

The right and left edges A and B of one IC package 1'are cleaned by the cleaning member from the cleaning member spraying unit 3 while vertically moving the cleaning parts of the two cleaning member spraying units 3 by the moving mechanism. Then, a predetermined amount of the IC mold 1 is carried by the carrying unit 2, and the right and left edges A and B of the IC package 1 ′ adjacent to the IC package 1 ′ are washed in the same manner.
Similarly, the right and left edges A and B of all the IC packages 1'arranged side by side are cleaned.

Subsequently, the two cleaning member injection parts 3 are rotated by the rotating mechanism 4 to change the cleaning part, and while the IC mold 1 is transferred by the transfer part 2, all the IC packages 1 arranged side by side. The upper edge portion C and the lower edge portion D of the'are washed.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawings show one embodiment of the present invention, and the structure of this embodiment is as follows.

A cleaning device comprising a carrying section 2 for carrying the IC mold 1 in an upright state, and a cleaning section spraying section 3 for spraying pressurized water containing abrasive grains in the IC mold 1. One set on the front side as the cleaning member spraying unit 3 for cleaning the right and left side edges A and B on the front and back sides of the IC package 1'on the front and back sides, one set on the back side, a total of two sets 4 nozzles 6AD, 6BC, 6 ' AD, 6'BC is provided, and a moving mechanism for vertically moving the cleaning portions of the four nozzles 6AD, 6BC, 6'AD, 6'BC is provided, and the four nozzles 6AD, 6BC, 6'AD, 6 are provided. 'The BC is equipped with the rotation mechanism 4 and the four nozzles 6AD, 6BC, 6'
By variably providing the cleaning portion by AD, 6'BC, the upper and lower side edge portions C, D of the IC package 1'can also be configured to be cleaned, and the pair of nozzles 6AD and 6BC on the front surface side
The distance varying mechanism 5 for varying the distance between the nozzles and the pair of nozzles 6'AD and 6'BC on the back side is provided.

Details will be described below.

A pair of guide rails 8 and 8'having a channel groove formed above the base 7 are laterally provided with a predetermined space L therebetween.

The distance L is set to the upper guide rail 8
Is configured to be variable by moving it up by an appropriate means.

A notched window portion 9 is formed at an appropriate position on the lower guide rail 8 '.

Further, at predetermined positions of the base 7, four rotating bodies 11 having a rotating wheel 10 provided at the upper end are assembled in a set so as to face each other.

As shown in FIGS. 4 and 5, the rotating wheel 10 of the pair of rotating bodies 11 is rotated at the position of the notch window 9 on the front and back of the IC mold 1, and both rotating wheels 10 are IC. Mold 1
Are placed opposite to each other with a gap passing through.

Rotating wheel 10 located on the front side of the IC mold 1.
Is the rotating wheel 10 with a large diameter on the upper side, the rotating wheel 10 with a small diameter on the lower side, and the rotating wheel 10 located on the back side of the IC mold 1 is the rotating wheel with a large diameter on the lower side and the rotating wheel with a small diameter on the upper side. Is 10.

Therefore, as shown in FIG. 4, the IC mold 1 is stably conveyed while being mounted on the upper surface of the rotating wheel 10 having a large diameter on the back side.

It should be noted that all the rotating wheels 10 (rotating bodies 11) are rotated in synchronization by a drive mechanism (not shown), and the amount of rotation, the rotating direction, the rotating timing and time are controlled by an appropriate control mechanism. To be done.

The nozzle 6 will be described.

The nozzle 6 includes a nozzle 6AD, a nozzle 6BC,
It is composed of four nozzles 6′AD and 6′BC, the nozzles 6AD and 6BC are located on the front side of the IC mold 1, and the nozzles 6′A and 6′BC are located on the back side of the IC mold 1.
These four nozzles 6 are arranged in a state of being inclined at a predetermined angle with respect to the IC mold 1.

The nozzles 6AD and 6'AD are connected by a first connecting rod 12 having a shape as shown in FIG. 6, and the nozzles 6'A and 6'BC are similarly connected by a second connecting rod.
Connected by 13.

The first connecting rod 12 and the second connecting rod 13 are integrally constructed so as to be vertically movable by a moving mechanism (not shown), and the first connecting rod 12 and the second connecting rod 13 are mutually connected. A cylinder device 14 (a cylinder device for the first connecting rod 12 is not shown) as an interval varying mechanism 5 is independently movable in the vertical direction in FIG.

The first connecting rod 12 and the second connecting rod 13 are integrally rotatable by a drive motor as the rotating mechanism 4 by 90 °.

The nozzle 6AD and the nozzle 6'BC in the drawing, and the nozzle 6BC and the nozzle 6'AD are arranged so that their injection positions are slightly displaced so as not to collide with each other.

The nozzle 6 is constructed so that pressurized water containing abrasive grains is jetted from the tip of the nozzle 6.

Reference numeral 15 is a supply portion of the IC mold 1, and 16 is an I
The take-out parts 17, 18 of the C mold 1 are an inlet part and an outlet part where a water flow film is formed.

Since this embodiment has the above-mentioned structure, the following operational effects are exhibited.

First, the IC mold 1 is inserted between the guide rails 8 and 8'from the left side in FIG. 5 (see FIG. 7).

Nozzle 6AD (6'AD) and nozzle 6BC
The distance to (6′BC) is set to a predetermined distance by moving the first connecting rod 12 and the second connecting rod 13 independently by the cylinder device 14.

By the moving mechanism, the first connecting rod 12 and the second connecting rod
By moving 13 as a unit, the nozzles 6AD, 6'AD,
6BC and 6'BC are moved downwards and the IC at the most advanced position
The right and left edges A and B of the package 1'are cleaned (the circles in FIG. 7 indicate the injection positions of the nozzles 6AD and 6BC).

Subsequently, the IC mold 1 is conveyed to the right by a predetermined amount, and similarly, the nozzles 6AD, 6'AD, 6BC, 6'BC are also conveyed.
Is moved upward and the right and left edges A and B of the second IC package 1 ′ are washed.

In this way, all ICs up to the nth
Cleaning of the left and right edges A and B of the package 1'is completed (the IC mold 1 in this case is intermittently transferred).

Subsequently, the drive motor as the rotating mechanism 4 is operated, the first connecting rod 12 and the second connecting rod 13 are integrally rotated by 90 °, and the state shown in FIG. 6 is obtained. The first connecting rod 12 and the second connecting rod 13 are operated independently by the operation of the device 14, and the distance between the first connecting rod 12 and the second connecting rod 13, that is, the nozzle 6AD (6'AD) and the nozzle 6BC (6 '). BC) is set to a predetermined interval.

This state is shown in FIG. 8, and the mark ● in FIG. 8 is the injection position of the nozzles 6AD and 6BC after being set at a predetermined interval.

In this state, the IC mold 1 is continuously conveyed to the left in FIG. 8, and accordingly, the nozzles 6AD, 6'A.
The upper and lower edge portions C and D of the IC package 1 ′ arranged in parallel by D, 6BC and 6′BC are continuously washed.

The state after completion of this cleaning is the state of FIG. 9, and subsequently, the IC mold 1 is conveyed to the right, the IC mold 1 is taken out from the take-out section 16, and the next IC is taken out.
The mold 1 is conveyed to a predetermined position, the first connecting rod 12 and the second connecting rod 13 are integrally rotated back by 90 °, and the nozzle 6AD (6 '
The interval between AD) and 6BC (6'BC) is set to a predetermined interval, and the operation similar to the above is repeated from the state of FIG.

The range of cleaning, that is, how many mm from the outer edge of the IC package 1 to the outside, the cleaning is determined by appropriately setting the opening diameter of the nozzle 6.

As described above, in this embodiment, the IC mold 1 can be cleaned extremely efficiently, and the nozzle 6 of this embodiment is of a type that sprays only on a desired portion.
Since it is a type that does not eject anything (because it is a so-called aiming type, not a so-called whole-faced type), there is no fear of damaging the IC package 1 ′ even if abrasive particles are mixed into the cleaning member (hence, the resin-made abrasive type). It is possible to use hard alumina or ceramic abrasive particles that have high cleaning power instead of particles.) And the cleaning effect can be reliably obtained as much as there are abrasive particles. Therefore, cleaning with water without abrasive particles is not possible. It is possible to remove even burrs that were possible.

[0053]

Since the present invention is constructed as described above, an IC
Good cleaning of only the desired part is possible without damaging the package, and water and abrasive grains naturally flow down from the outer surface of the IC mold, forming a water film on the outer surface of the IC mold, and attaching abrasive grains. Therefore, effective cleaning can be performed, and only the outer peripheral edge of the IC package, which is the most desired part, can be efficiently cleaned.

As described above, the desired effect is exhibited.

[Brief description of drawings]

FIG. 1 is an overall front view of this embodiment.

FIG. 2 is a front view of a main part of this embodiment.

FIG. 3 is a plan view of a main part of this embodiment.

FIG. 4 is a side view of the AA instruction line in FIG.

FIG. 5 is a front view of a main part of this embodiment.

FIG. 6 is a perspective view of a main part of this embodiment.

FIG. 7 is an operation explanatory view of the present embodiment.

FIG. 8 is an operation explanatory diagram of the present embodiment.

FIG. 9 is an operation explanatory view of the present embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC mold 1'IC package 2 Transport part 3 Cleaning member injection part 4 Rotation mechanism 5 Spacing variable mechanism A Right side edge B Left side edge C Upper side edge D Lower side edge

Claims (4)

[Claims] 1. A transport unit for transporting an IC mold and the I
An IC mold cleaning device comprising: a cleaning member spraying unit that sprays a cleaning member containing abrasive particles onto a desired portion of a C mold. 2. A cleaning device for an IC mold, comprising: a carrying part for carrying the IC mold in an upright state, and a cleaning member spraying part for spraying a cleaning member onto the IC mold. 3. The cleaning device for an IC mold according to claim 2, wherein a cleaning member spraying unit for cleaning the right edge of the IC package is provided on the front surface or the back surface of the IC mold, and the cleaning member spraying unit is cleaned. An upper edge of the IC package can be cleaned by providing a moving mechanism for moving the part in the vertical direction, and providing the cleaning member injection part with a rotating mechanism so that the cleaning part by the cleaning member injection part can be changed. An IC mold cleaning device characterized by being configured. 4. The IC mold cleaning apparatus according to claim 2, wherein two cleaning member spraying units for cleaning the right and left side edges of the IC package are provided on the front surface or the back surface of the IC mold, and the cleaning member spraying unit. Of the IC package by providing a moving mechanism for vertically moving the cleaning portion of the unit, and providing a rotating mechanism for the two cleaning member ejecting portions so that the cleaning portions by the two cleaning member ejecting portions are variably provided. An IC mold cleaning apparatus characterized in that upper and lower side edge portions are also configured to be washable, and a distance varying mechanism for varying a distance between the two cleaning member ejecting portions is provided.