JPH06123604A - Bending sensor - Google Patents
Bending sensorInfo
- Publication number
- JPH06123604A JPH06123604A JP4294646A JP29464692A JPH06123604A JP H06123604 A JPH06123604 A JP H06123604A JP 4294646 A JP4294646 A JP 4294646A JP 29464692 A JP29464692 A JP 29464692A JP H06123604 A JPH06123604 A JP H06123604A
- Authority
- JP
- Japan
- Prior art keywords
- signal processing
- bending
- strain sensor
- unit
- processing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Measurement Of Force In General (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、測定対象の曲がり具
合を検出する曲げセンサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bending sensor for detecting the degree of bending of a measuring object.
【０００２】[0002]
【従来の技術】人体の関節等に装着され、装着部の曲げ
量を検出する曲げセンサが知られている。図１１は、従
来の曲げセンサの概略構成を示している。同図におい
て、１００は屈曲部に装着される歪みゲージ部である。
この歪みゲージ部１００は、ポリエステルフィルム等の
十分な絶縁性と可撓性とを有する長尺薄板状のベース部
材１０１と、このベース部材１０１の表面にＵ字状にパ
ターン形成されるＮｉ‐Ｃｒ（ニッケルクロム）等の抵
抗体１０２とから構成されている。2. Description of the Related Art There is known a bending sensor which is mounted on a joint of a human body and detects a bending amount of a mounting portion. FIG. 11 shows a schematic configuration of a conventional bending sensor. In the figure, reference numeral 100 is a strain gauge portion mounted on the bent portion.
This strain gauge portion 100 is a long thin plate-like base member 101 having sufficient insulation and flexibility such as a polyester film, and a Ni-Cr pattern formed in a U shape on the surface of the base member 101. And a resistor 102 such as (nickel chrome).
【０００３】そして、歪みゲージ部１００の基端部に
は、抵抗体１０２の各端部がシールドされたリード線１
０３に各々接続されている。さらに、このリード線１０
３は、信号処理部１０４に接続される。この信号処理部
１０４は、図１２に示すように、固定抵抗Ｒ1，Ｒ2，Ｒ
3と抵抗体１０２に対応する抵抗Ｒｇとから成るホイー
トストンブリッジの検出回路を有しており、検流計Ａが
その抵抗変化に応じて変化する電流を検出するようにな
っている。また、温度変化や湿度変化に応じて抵抗値が
変化するため、調整用の半固定抵抗Ｒａが抵抗Ｒｇと直
列に設けられている。At the base end of the strain gauge section 100, the lead wire 1 in which each end of the resistor 102 is shielded
03, respectively. Furthermore, this lead wire 10
3 is connected to the signal processing unit 104. As shown in FIG. 12, the signal processing unit 104 includes fixed resistors R 1 , R 2 , and R.
It has a detection circuit of a Wheatstone bridge composed of 3 and a resistance Rg corresponding to the resistor 102, and the galvanometer A detects a current which changes according to the resistance change. Further, since the resistance value changes according to the temperature change and the humidity change, the semi-fixed resistance Ra for adjustment is provided in series with the resistance Rg.
【０００４】このような構成により、歪みゲージ部１０
０が図示ＣＶ（図１１参照）のように曲がると、この曲
げ量に応じて抵抗体１０２の抵抗値、すなわち抵抗Ｒｇ
が変化する。この抵抗変化は検流計Ａによって電流変化
として検出され、これにより曲げセンサ装着部の曲げ量
が検出される。With such a configuration, the strain gauge section 10
When 0 bends like the CV shown in FIG. 11 (see FIG. 11), the resistance value of the resistor 102, that is, the resistance Rg
Changes. This resistance change is detected as a current change by the galvanometer A, and the bending amount of the bending sensor mounting portion is detected by this.
【０００５】[0005]
【発明が解決しようとする課題】ところで、上述した従
来の曲げセンサでは、測定対象に装着される歪みゲージ
部１００と検出回路を有する信号処理部１０４とがリー
ド線１０３を介して分離して構成されている。このた
め、検出信号はリード線１０３のたわみによる抵抗変化
等のノイズの影響を受け易いという欠点がある。また、
装着時の曲げ動作がリード線１０３によって阻害され易
いため、操作性が悪く、装着位置の自由度が低いという
欠点がある。また、従来の曲げセンサでは、歪みゲージ
部１００とリード線１０３、リード線１０３と信号処理
部１０４の各接続点をそれぞれ半田付けにより接合して
いるため、生産性が悪く、また強度的も弱いという欠点
がある。また、従来の曲げセンサでは、温度変化や湿度
変化によって歪みゲージ部１００が伸縮すると、これに
伴って抵抗体１０２の抵抗Ｒｇが変化するため、その都
度、調整用抵抗Ｒａによって抵抗値を調整する必要があ
り、面倒である。By the way, in the above-mentioned conventional bending sensor, the strain gauge section 100 mounted on the object to be measured and the signal processing section 104 having the detection circuit are separated via the lead wire 103. Has been done. Therefore, there is a drawback that the detection signal is easily affected by noise such as resistance change due to the bending of the lead wire 103. Also,
Since the bending operation at the time of mounting is easily obstructed by the lead wire 103, there are disadvantages that the operability is poor and the degree of freedom of the mounting position is low. Further, in the conventional bending sensor, since the connection points of the strain gauge section 100 and the lead wire 103 and the connection point of the lead wire 103 and the signal processing section 104 are respectively joined by soldering, the productivity is poor and the strength is weak. There is a drawback that. Further, in the conventional bending sensor, when the strain gauge section 100 expands and contracts due to temperature change and humidity change, the resistance Rg of the resistor 102 changes accordingly. Therefore, the resistance value is adjusted by the adjustment resistance Ra each time. It is necessary and troublesome.
【０００６】この発明は、このような背景の下になされ
たもので、強度および生産性が向上すると共に、調整作
業が容易で操作性や装着性が良く、しかもノイズの影響
が少ない曲げセンサを提供することを目的としている。The present invention has been made under such a background, and a bending sensor having improved strength and productivity, easy adjustment work, good operability and wearability, and less affected by noise is provided. It is intended to be provided.
【０００７】[0007]
【課題を解決するための手段】上に述べた課題を解決す
るために、請求項１記載の発明は、測定対象に装着さ
れ、装着部の屈曲に応じて抵抗値が変化する歪みセンサ
部と、この歪みセンサ部に接続され、該歪みセンサ部の
抵抗値の変化に応じた検出信号を出力する信号処理部と
を具備して成る曲げセンサにおいて、前記信号処理部を
多層構造とし、この信号処理部の層間に前記歪みセンサ
部の一端を挿入し積層させ、該歪みセンサ部と該信号処
理部とを一体構造にしたことを特徴としている。In order to solve the above-mentioned problems, the invention according to claim 1 is a strain sensor part which is mounted on a measuring object and whose resistance value changes according to the bending of the mounting part. A bending sensor comprising a signal processing unit connected to the strain sensor unit and outputting a detection signal according to a change in resistance value of the strain sensor unit, wherein the signal processing unit has a multilayer structure, One feature is that one end of the strain sensor unit is inserted between the layers of the processing unit and laminated, and the strain sensor unit and the signal processing unit are integrated.
【０００８】また、請求項２記載の発明は、測定対象に
装着され、装着部の屈曲に応じて抵抗値が変化する歪み
センサ部と、この歪みセンサ部に接続され、該歪みセン
サ部の抵抗値の変化に応じた検出信号を出力する信号処
理部とを具備して成る曲げセンサにおいて、前記信号処
理部を多層構造とし、この信号処理部の少なくとも２層
を端部より延長し、これら延長した層によって前記歪み
センサ部の一端を挟持させて該歪みセンサ部と該信号処
理部とを一体構造にしたことを特徴としている。According to a second aspect of the present invention, a strain sensor unit, which is mounted on a measuring object and whose resistance value changes according to bending of the mounting unit, and a strain sensor unit connected to the strain sensor unit, are connected to the strain sensor unit. In a bending sensor including a signal processing unit that outputs a detection signal according to a change in a value, the signal processing unit has a multi-layered structure, and at least two layers of the signal processing unit are extended from an end, and these extensions are provided. It is characterized in that one end of the strain sensor unit is sandwiched between the layers and the strain sensor unit and the signal processing unit are integrated.
【０００９】また、請求項３記載の発明は、測定対象に
装着されるベース部材に、装着部の屈曲に応じて抵抗値
がそれぞれ変化する４個の抵抗体を配置した歪みセンサ
部と、これら抵抗体の抵抗値の変化に応じた検出信号を
出力する信号処理部とを具備して成る曲げセンサであっ
て、前記４個の抵抗体がホイートストンブリッジ回路を
構成していることを特徴としている。Further, the invention according to claim 3 is a strain sensor part in which four resistance elements, each of which has a resistance value that changes according to the bending of the mounting part, are arranged on a base member mounted on a measurement object, and these strain sensor parts. A bending sensor including a signal processing unit that outputs a detection signal according to a change in resistance value of a resistor, wherein the four resistors form a Wheatstone bridge circuit. .
【００１０】また、請求項４記載の発明は、測定対象に
装着され、装着部の屈曲に応じて抵抗値が変化する歪み
センサ部と、この歪みセンサ部に接続され、該歪みセン
サ部の抵抗値の変化に応じた検出信号を出力する信号処
理部とを具備して成る曲げセンサにおいて、前記歪みセ
ンサ部の端部を前記信号処理部の片側面に重ねると共
に、前記歪みセンサ部の端部に形成された端子と前記信
号処理部の端子とを所定の接続具を介して電気的に接続
したことを特徴としている。According to a fourth aspect of the present invention, a strain sensor unit mounted on a measuring object, the resistance value of which changes according to the bending of the mounting unit, and the strain sensor unit connected to the strain sensor unit, In a bending sensor including a signal processing unit that outputs a detection signal according to a change in a value, an end of the strain sensor unit is overlapped with one side surface of the signal processing unit, and an end of the strain sensor unit is provided. It is characterized in that the terminal formed in the above and the terminal of the signal processing section are electrically connected via a predetermined connecting tool.
【００１１】[0011]
【作用】請求項１記載の発明によれば、歪みセンサ部と
信号処理部とが一体構造になり、従来のように、歪みセ
ンサ部と信号処理部との間にリード線等を半田付け等に
よって介装する必要がなくなる。According to the first aspect of the invention, the strain sensor section and the signal processing section have an integrated structure, and a lead wire or the like is soldered between the strain sensor section and the signal processing section as in the prior art. Eliminates the need for intervention.
【００１２】また、請求項２記載の発明によれば、歪み
センサ部と信号処理部とが一体構造になり、請求項１記
載の発明と同様、歪みセンサ部と信号処理部との間にリ
ード線等を半田付け等によって介装する必要がなくな
る。According to the second aspect of the invention, the strain sensor section and the signal processing section have an integrated structure, and like the invention of the first aspect, a lead is provided between the strain sensor section and the signal processing section. It is not necessary to interpose wires or the like by soldering or the like.
【００１３】また、請求項３記載の発明によれば、検出
信号に対する温度変化や湿度変化による抵抗体の抵抗変
化の影響が互いに打ち消される。これにより、使用の都
度、調整用抵抗等によって抵抗値を微調整する必要が極
めて少なくなる。According to the third aspect of the invention, the influence of the resistance change of the resistor due to the temperature change or the humidity change on the detection signal is canceled out. As a result, it is extremely unnecessary to finely adjust the resistance value with the adjusting resistor or the like each time it is used.
【００１４】また、請求項４記載の発明によれば、歪み
センサ部と信号処理部とが一体構造になり、請求項１ま
たは請求項２記載の発明と同様、歪みセンサ部と信号処
理部との間にリード線等を半田付け等によって介装する
必要がなくなる。According to the invention described in claim 4, the strain sensor section and the signal processing section have an integrated structure, and similarly to the invention described in claim 1 or 2, the distortion sensor section and the signal processing section are integrated. There is no need to interpose a lead wire or the like between them by soldering or the like.
【００１５】[0015]
【実施例】以下、図面を参照して、この発明の実施例に
ついて説明する。 Ａ：第１実施例 図１はこの発明の第１実施例による曲げセンサを表側か
ら見た平面図である。この図において、１は歪みゲージ
部である。この歪みゲージ部１はベース材と２層の抵抗
パターンからなる両面構造になっており、各層には、Ｕ
字状に幾重にも折り曲げられた抵抗体のパターンがエッ
チングによりそれぞれ２箇所に形成されている。なお、
この抵抗パターンは、スパッタリング、蒸着等の方法で
形成しても良い。すなわち、同図に見られる表側の層に
は、抵抗体Ｒｔ1，Ｒｔ2がパターン形成され、図２に示
す裏側の層には、抵抗体Ｒｂ1，Ｒｂ2がそれぞれパター
ン形成されている。Embodiments of the present invention will be described below with reference to the drawings. A: First Embodiment FIG. 1 is a plan view of a bending sensor according to a first embodiment of the present invention viewed from the front side. In this figure, 1 is a strain gauge part. This strain gauge section 1 has a double-sided structure consisting of a base material and a two-layer resistance pattern.
The pattern of the resistor, which is bent into a letter shape in multiple layers, is formed at two locations by etching. In addition,
This resistance pattern may be formed by a method such as sputtering or vapor deposition. That is, the resistors Rt 1 and Rt 2 are patterned on the front layer shown in FIG. 2, and the resistors Rb 1 and Rb 2 are patterned on the back layer shown in FIG.
【００１６】また、これら抵抗体Ｒｔ1，Ｒｔ2，Ｒ
ｂ1，Ｒｂ2は、歪みゲージ部１の基端部に一体形成され
る信号処理部２に接続され、信号処理部２内の実装部品
（後述する）と共に検出回路を構成している。この検出
回路は、図３に示すように、抵抗体Ｒｔ1，Ｒｔ2，Ｒｂ
1，Ｒｂ2によるホイートストンブリッジ回路を構成して
おり、検流計Ａによってこれら抵抗体Ｒｔ1，Ｒｔ2，Ｒ
ｂ1，Ｒｂ2の抵抗変化に応じて変化する電流が検出され
るようになっている。また、調整用の半固定抵抗Ｒａが
抵抗体Ｒｔ1と直列に設けられている。なお、検流計Ａ
の部分の電流を増幅することによって、曲げ角を電流と
して検出するように構成しても良い。すなわち、信号処
理部２は、ブリッジを構成すると共に増幅回路としても
機能するよう構成できる。Further, these resistors Rt 1 , Rt 2 , R
b 1 and Rb 2 are connected to the signal processing unit 2 integrally formed at the base end of the strain gauge unit 1 and constitute a detection circuit together with mounting components (described later) in the signal processing unit 2. As shown in FIG. 3, this detection circuit includes resistors Rt 1 , Rt 2 , Rb.
1 and Rb 2 form a Wheatstone bridge circuit, and the galvanometer A connects these resistors Rt 1 , Rt 2 , R
A current that changes according to the resistance change of b 1 and Rb 2 is detected. Further, a semi-fixed resistor Ra for adjustment is provided in series with the resistor Rt 1 . In addition, galvanometer A
The bending angle may be detected as a current by amplifying the current in the portion. That is, the signal processing unit 2 can be configured to configure a bridge and also function as an amplifier circuit.
【００１７】次に、図４は図１に示す矢視Ｂ−Ｂ′によ
る曲げセンサの断面図である。以下、この図を参照し、
同曲げセンサの断面構造について説明する。すなわち、
歪みゲージ部１は、ポリイミドから成るベースフィルム
１ａを核とし、その上下面には、抵抗体Ｒｔ1，Ｒｔ2，
Ｒｂ1，Ｒｂ2のパターンを構成するＮｉ‐ＣｒまたはＣ
ｕ‐Ｎｉ等の金属箔１ｂ1，１ｂ2がそれぞれ形成されて
いる。さらに、これら金属箔１ｂ1，１ｂ2の表面は、そ
れぞれカバーレイ１ｃ1，１ｃ2により被覆されている。
なお、こうした歪みゲージ部１の積層構造は、ポリイミ
ド樹脂の熱圧着あるいはエポキシ接着剤により形成され
る。FIG. 4 is a sectional view of the bending sensor taken along the line BB 'shown in FIG. Below, refer to this figure,
The sectional structure of the bending sensor will be described. That is,
The strain gauge portion 1 has a base film 1a made of polyimide as a core, and resistors Rt 1 , Rt 2 ,
Ni-Cr or C constituting the pattern of Rb 1 and Rb 2
Metal foils 1b 1 and 1b 2 of u-Ni or the like are formed, respectively. Further, the surfaces of these metal foils 1b 1 and 1b 2 are covered with coverlays 1c 1 and 1c 2 , respectively.
In addition, such a laminated structure of the strain gauge portion 1 is formed by thermocompression bonding of a polyimide resin or an epoxy adhesive.
【００１８】また、上記積層構造を有した歪みゲージ部
１の一端は延長され、これが信号処理部２を貫通してい
る。信号処理部２は、この歪みゲージ部１の延長された
部分を上下よりリジット層２ａ1，２ａ2（銅箔Ｃで被覆
されている）で挟み、接着剤Ｒを介し圧着積層して構成
されている。そして、表面をレジストＲＪで被覆したこ
れらリジット層２ａ1，２ａ2には、検出回路を構成する
各種部品Ｐ1，Ｐ2，……（調整用抵抗Ｒａ等）が表面実
装されている。Further, one end of the strain gauge section 1 having the above-mentioned laminated structure is extended, and this extends through the signal processing section 2. The signal processing unit 2 is formed by sandwiching the extended portion of the strain gauge unit 1 from above and below with the rigid layers 2a 1 and 2a 2 (covered with the copper foil C) and press-bonding and laminating with the adhesive R. ing. Then, various components P 1 , P 2 , ... (Adjustment resistor Ra, etc.) constituting the detection circuit are surface-mounted on these rigid layers 2a 1 , 2a 2 whose surfaces are covered with a resist RJ.
【００１９】さらに、信号処理部２には、上下方向に貫
通する幾つかのスルーホール（一部、貫通しないスルー
ホールを含む）Ｈが形成されている。これにより、スル
ーホールＨの外周に形成された銅箔Ｃｈを介し、リジッ
ト表面に形成された検出回路と、抵抗体Ｒｔ1，Ｒｔ2，
Ｒｂ1，Ｒｂ2を構成している金属箔１ｂ1，１ｂ2とが電
気的に接続されている。Further, the signal processing section 2 is formed with several through holes (including some through holes that do not penetrate) H that penetrate vertically. As a result, the detection circuit formed on the rigid surface via the copper foil Ch formed on the outer periphery of the through hole H and the resistors Rt 1 , Rt 2 ,
The metal foils 1b 1 and 1b 2 forming Rb 1 and Rb 2 are electrically connected.
【００２０】このような構成によれば、歪みゲージ部１
と信号処理部２とが一体構造になっているため、従来の
ように、これらを半田付けによってリード線等と接続す
る必要がなくなり、生産性および強度がアップする。ま
た、歪みゲージ部１と信号処理部２との間にリード線等
を介装させないので、検出信号に対するノイズの影響が
少なくなると共に、装着時の曲げ動作が阻害されず、操
作性が向上する。According to this structure, the strain gauge section 1
Since the signal processing unit 2 and the signal processing unit 2 have an integrated structure, it is not necessary to connect them to a lead wire or the like by soldering as in the conventional case, and productivity and strength are improved. Further, since no lead wire or the like is interposed between the strain gauge section 1 and the signal processing section 2, the influence of noise on the detection signal is reduced, and the bending operation at the time of mounting is not hindered, so that operability is improved. .
【００２１】また、検出回路を各抵抗体Ｒｔ1，Ｒｔ2，
Ｒｂ1，Ｒｂ2から成るホイートストンブリッジ回路（図
３参照）としているので、検出信号に対する温度変化や
湿度変化によるこれらの抵抗変化の影響は互いに打ち消
される。したがって、使用の都度、調整用抵抗Ｒａによ
って抵抗値を調整する必要が極めて少なくなり、使い勝
手が良くなる。Further, the detection circuit is provided with resistors Rt 1 , Rt 2 ,
Since the Wheatstone bridge circuit (see FIG. 3) composed of Rb 1 and Rb 2 is used, the influences of these resistance changes due to temperature changes and humidity changes on the detection signal are canceled each other. Therefore, it is not necessary to adjust the resistance value by the adjusting resistor Ra each time it is used, and the usability is improved.
【００２２】さらに、抵抗体Ｒｔ1，Ｒｔ2，Ｒｂ1，Ｒ
ｂ2を含む検出回路の作成にフレキシブルプリント配線
板の製造技術を適用することが可能になるので、生産性
がさらに向上し、製造コストの低減を図ることができ
る。Further, the resistors Rt 1 , Rt 2 , Rb 1 , R
Since it is possible to apply the manufacturing technique of the flexible printed wiring board to the production of the detection circuit including b 2 , it is possible to further improve the productivity and reduce the manufacturing cost.
【００２３】Ｂ：第２実施例 次に、図５に示す断面図を参照し、この発明の第２実施
例について説明する。同図において、図４に示した第１
実施例の各部と共通する部分には、同一の符号を付し、
その説明を省略する。また、この実施例が上記第１実施
例と異なる点は、歪みゲージ部１と信号処理部２とを一
体構造とする際の態様にある。B: Second Embodiment Next, a second embodiment of the present invention will be described with reference to the sectional view shown in FIG. In the figure, the first shown in FIG.
The same reference numerals are given to portions common to the respective portions of the embodiment,
The description is omitted. The difference of this embodiment from the first embodiment lies in the aspect in which the strain gauge section 1 and the signal processing section 2 are integrated.
【００２４】すなわち、図５に示すように、歪みゲージ
部１は信号処理部２を貫通させずに、その一端のカバー
レイ１ｃ1，１ｃ2を所定量剥しておく。一方、信号処理
部２は、銅箔２ｃの上下面をカバーレイ２ｄで被覆した
２枚の銅箔層（銅片面）２ｂ1，２ｂ2を、さらに上下か
らリジット層２ａ1，２ａ2で挟み、圧着した構造とす
る。また、これら銅箔層２ｂ1，２ｂ2の各一端を信号処
理部２の端部より所定量突出させ、これら突出部Ｄ1，
Ｄ2の互いに対向する面のカバーレイ２ｄを剥してお
く。That is, as shown in FIG. 5, the strain gauge section 1 does not penetrate the signal processing section 2, but the cover lays 1c 1 and 1c 2 at one end thereof are peeled off by a predetermined amount. On the other hand, the signal processing unit 2 further sandwiches two copper foil layers (copper one side) 2b 1 and 2b 2 in which the upper and lower surfaces of the copper foil 2c are covered with a cover lay 2d between the rigid layers 2a 1 and 2a 2 from above and below. The structure should be crimped. Further, one end of each of the copper foil layers 2b 1 and 2b 2 is made to protrude from the end of the signal processing unit 2 by a predetermined amount, and these protruding portions D 1 ,
The cover lays 2d on the surfaces of D 2 facing each other are peeled off.
【００２５】そして、図示ＩＮのように、カバーレイ１
ｃ1，１ｃ2を剥した歪みゲージ部１の一端を、信号処理
部２の突出部Ｄ1，Ｄ2で挟み、金属箔１ｂ1，１ｂ2と銅
箔２ｃとの接触面を図示せぬ導電インキを塗布した後圧
接する。こうして、歪みゲージ部１と信号処理部２とが
結合一体化され、歪みゲージ部１の抵抗体Ｒｔ1，Ｒ
ｔ2，Ｒｂ1，Ｒｂ2がスルーホールＨの銅箔Ｃｈを介し
て信号処理部２の検出回路と電気的に接続される。Then, as indicated by IN, the coverlay 1
One end of the strain gauge section 1 from which c 1 and 1c 2 are peeled off is sandwiched by the projecting portions D 1 and D 2 of the signal processing section 2, and the contact surface between the metal foils 1b 1 and 1b 2 and the copper foil 2c is not shown. After applying conductive ink, press contact. In this way, the strain gauge unit 1 and the signal processing unit 2 are combined and integrated, and the resistors Rt 1 and R of the strain gauge unit 1 are integrated.
t 2 , Rb 1 and Rb 2 are electrically connected to the detection circuit of the signal processing unit 2 via the copper foil Ch of the through hole H.
【００２６】このように、本実施例では、歪みゲージ部
１と信号処理部２との一体構造の態様が上記第１実施例
と異なるものの、第１実施例の場合と同様の作用効果が
得られる。As described above, in the present embodiment, although the aspect of the integrated structure of the strain gauge section 1 and the signal processing section 2 is different from that of the above-mentioned first embodiment, the same operational effect as in the case of the first embodiment can be obtained. To be
【００２７】Ｃ：第３実施例 次に、図６に示す断面図を参照し、この発明の第３実施
例について説明する。同図において、図４あるいは図５
に示した上記第１，第２実施例の各部と共通する部分に
は、同一の符号を付し、その説明を省略する。また、こ
の実施例も、歪みゲージ部１と信号処理部２とを一体構
造とする際の態様において、第１，第２実施例と異なっ
ている。C: Third Embodiment Next, a third embodiment of the present invention will be described with reference to the sectional view shown in FIG. In FIG. 4, FIG. 4 or FIG.
The same parts as those of the first and second embodiments described above are designated by the same reference numerals, and the description thereof will be omitted. In addition, this embodiment also differs from the first and second embodiments in the aspect when the strain gauge section 1 and the signal processing section 2 are integrated.
【００２８】すなわち、図６に示すように、歪みゲージ
部１は第１実施例の場合と同一構造とし、カバーレイ１
ｃ1，１ｃ2を所定量剥しておく。一方、信号処理部２
は、図示のような断面構造の２枚の銅箔層（銅両面）２
ｂ1′，２ｂ2′を圧接して構成する。また、第２実施例
と同様、銅箔層２ｂ1′，２ｂ2′の各一端を信号処理部
２の端部より突出させ、これら突出部Ｄ1，Ｄ2の対向面
のカバーレイ２ｄを剥しておく。That is, as shown in FIG. 6, the strain gauge section 1 has the same structure as in the first embodiment, and the coverlay 1
Peel off a predetermined amount of c 1 and 1c 2 . On the other hand, the signal processing unit 2
Is two copper foil layers (both sides of copper) 2 having a sectional structure as shown in the figure.
b 1 ′ and 2b 2 ′ are pressure-welded. Further, as in the second embodiment, one end of each of the copper foil layers 2b 1 ′ and 2b 2 ′ is projected from the end of the signal processing unit 2, and the cover lay 2d on the facing surface of these projected portions D 1 and D 2 is formed. Peel it off.
【００２９】そして、第２実施例と同様（図示ＩＮ）に
して歪みゲージ部１と信号処理部２とを結合一体化させ
る。これにより、歪みゲージ部１の抵抗体Ｒｔ1，Ｒ
ｔ2，Ｒｂ1，Ｒｂ2がスルーホールＨの銅箔Ｃｈを介し
て信号処理部２の検出回路と電気的に接続される。こう
して、本実施例においても、第１，第２実施例の場合と
同様の作用効果が得られることになる。Then, the strain gauge section 1 and the signal processing section 2 are combined and integrated as in the second embodiment (IN shown). Accordingly, the resistors Rt 1 and Rt of the strain gauge unit 1 are
t 2 , Rb 1 and Rb 2 are electrically connected to the detection circuit of the signal processing unit 2 via the copper foil Ch of the through hole H. In this way, also in the present embodiment, it is possible to obtain the same operational effects as in the first and second embodiments.
【００３０】Ｄ：第４実施例 次に、図７〜図９を参照し、この発明の第４実施例につ
いて説明する。これらの図において、図１〜図６に示し
た上記第１〜第３実施例の各部と共通する部分には、同
一の符号を付し、その説明を省略する。また、この実施
例も、歪みゲージ部１と信号処理部２とを一体構造とす
る際の態様が、第１〜第３実施例と異なっている。D: Fourth Embodiment Next, a fourth embodiment of the present invention will be described with reference to FIGS. In these figures, parts common to the parts of the first to third embodiments shown in FIGS. 1 to 6 are designated by the same reference numerals, and description thereof will be omitted. In addition, this embodiment also differs from the first to third embodiments in the aspect when the strain gauge section 1 and the signal processing section 2 are integrated.
【００３１】まず、図７に示す平面図において、歪みゲ
ージ部１の抵抗体Ｒｔ1，Ｒｔ2，Ｒｂ1，Ｒｂ2の各端子
Ｔ11〜Ｔ42は、歪みゲージ部１の表裏面で相対向するも
の同士が互いにずれた配置になるようパターン形成され
る。すなわち、抵抗体Ｒｔ1と抵抗体Ｒｂ1とが表裏面で
相対向しているとき、抵抗体Ｒｔ1の端子Ｔ11，Ｔ12と
抵抗体Ｒｂ1の端子Ｔ21，Ｔ22とがそれぞれ図示のよう
にずれた配置になる。そして、これら端子Ｔ11〜Ｔ42が
配置された歪みゲージ部１の端部は、カバーレイ１
ｃ1，１ｃ2を剥離し、さらにこの剥離した部分を抵抗体
の端子部分Ｅ11〜Ｅ42を除いてレジストＲＪで被覆す
る。そして、後の半田処理のために端子部分Ｅ11〜Ｅ42
にフラックスを塗布しておく。First, in the plan view shown in FIG. 7, the terminals T 11 to T 42 of the resistors Rt 1 , Rt 2 , Rb 1 and Rb 2 of the strain gauge section 1 are relatively opposed to each other on the front and back surfaces of the strain gauge section 1. Patterns are formed so that facing ones are displaced from each other. That is, when the resistor Rt 1 and the resistor Rb 1 face each other on the front and back sides, the terminals T 11 and T 12 of the resistor Rt 1 and the terminals T 21 and T 22 of the resistor Rb 1 are shown in the drawing. The arrangement is shifted like. The end portion of the strain gauge portion 1 where these terminals T 11 to T 42 are arranged is
C 1 and 1 c 2 are peeled off, and the peeled off portion is covered with a resist RJ except for the terminal portions E 11 to E 42 of the resistor. Then, the terminal portions E 11 to E 42 are provided for later soldering processing.
Apply flux to the.
【００３２】次に、図８に示すように、上記歪みゲージ
部１の端部と、その端子位置が一致するよう回路パター
ンが形成された信号処理部２とを重ね合わせ、信号処理
部２の端子位置に設けたスルーホール（図示略）と歪み
ゲージ部１の端子にコネクタＣｎの各ピンＰｎ1〜Ｐｎ6
を挿通することによって互いに結合し、一体構造とす
る。Next, as shown in FIG. 8, the end portion of the strain gauge portion 1 and the signal processing portion 2 on which a circuit pattern is formed so that the terminal positions thereof coincide with each other are overlapped, and the signal processing portion 2 Pins Pn 1 to Pn 6 of the connector Cn are attached to the terminals of the strain gauge unit 1 and through holes (not shown) provided at the terminal positions.
Are connected to each other by inserting them to form an integral structure.
【００３３】ここで、図９は図８の矢視Ｃ−Ｃ′による
断面図である。この図に示すように、信号処理部２は、
ベースフィルム２ａの上下面が銅箔２ｃで被覆された２
層のリジット２ｂ1″，２ｂ2″をレジストＲＪを介し圧
接して成っている。また、この信号処理部２に設けられ
たスルーホールＨ1〜Ｈ6と歪みゲージ部１の端子とは位
置合わせされ、コネクタＣｎの各ピンＰｎ1〜Ｐｎ6が挿
通されている。そして、この曲げセンサ全体が溶融半田
にディッピングされることにより、スルーホールＨ1〜
Ｈ6内が図示のように半田ＨＤで充填される。Here, FIG. 9 is a sectional view taken along the line CC 'of FIG. As shown in this figure, the signal processing unit 2 is
The upper and lower surfaces of the base film 2a are covered with the copper foil 2c 2
The rigid layers 2b 1 ″ and 2b 2 ″ are pressure-contacted via the resist RJ. Further, the terminal through-hole H 1 to H 6 and the strain gage unit 1 provided in the signal processing section 2 is aligned, the pins Pn 1 to PN 6 of the connector Cn is inserted. Then, the entire bending sensor is dipped in the molten solder, so that the through holes H 1 to
The inside of H 6 is filled with solder HD as shown.
【００３４】このような構成により、歪みゲージ部１の
抵抗体Ｒｔ1，Ｒｔ2，Ｒｂ1，Ｒｂ2の各端子Ｔ11〜Ｔ42
は、ピンＰｎ1〜Ｐｎ6を介して信号処理部２の検出回路
と電気的に接続されることになる。こうして、本実施例
においても、上記第１〜第３実施例の場合と同様の作用
効果が得られることになる。また、ピンの数は、例えば
６〜８本等適宜設定することが可能である。With this configuration, the terminals T 11 to T 42 of the resistors Rt 1 , Rt 2 , Rb 1 and Rb 2 of the strain gauge section 1 are formed.
Will be electrically connected to the detection circuit of the signal processing unit 2 via the pins Pn 1 to Pn 6 . In this way, also in the present embodiment, it is possible to obtain the same effects as those of the first to third embodiments. Further, the number of pins can be set appropriately, for example, 6 to 8.
【００３５】なお、上記第１〜第４実施例において、抵
抗体Ｒｔ1，Ｒｔ2，Ｒｂ1，Ｒｂ2の形成パターンを、図
１０に示すように、歪みゲージ部１の上下層で互いにず
らした位置になるようにすれば、歪みゲージ部１の耐折
特性が向上する。この場合、形成パターンの断面積や断
面の縦横比を上下層で互いに等しくする必要がある。In the first to fourth embodiments, the formation patterns of the resistors Rt 1 , Rt 2 , Rb 1 and Rb 2 are displaced from each other in the upper and lower layers of the strain gauge section 1 as shown in FIG. If it is set to the open position, the bending resistance of the strain gauge section 1 is improved. In this case, it is necessary to make the cross-sectional area of the formation pattern and the aspect ratio of the cross-section equal in the upper and lower layers.
【００３６】また、抵抗体Ｒｔ1，Ｒｔ2，Ｒｂ1，Ｒｂ2
のパターンをエッチングにより形成後、周囲に残留した
不要部分を除去（エッチアウト）せずに残しておけば、
センサの厚みをパターン部と等しくでき、リニアリテ
ィ、ヒステリシス等の電気的特性が良好となる。Further, the resistors Rt 1 , Rt 2 , Rb 1 , Rb 2
After forming the pattern of by etching, if you leave the unnecessary parts remaining around without removing (etch out),
The thickness of the sensor can be made equal to that of the pattern portion, and the electrical characteristics such as linearity and hysteresis are improved.
【００３７】[0037]
【発明の効果】以上説明したように、請求項１、請求項
２または請求項４記載の発明によれば、歪みセンサ部と
信号処理部とが一体構造になり、従来のように、歪みセ
ンサ部と信号処理部との間にリード線等を半田付け等に
よって介装する必要がなくなるので、生産性および強度
がアップする。また、リード線等が介在しないことか
ら、検出信号に対するノイズの影響が少なくなると共
に、装着時の曲げ動作が阻害されず、操作性や装着性が
向上する。また、請求項３記載の発明によれば、検出信
号に対する温度変化や湿度変化による抵抗体の抵抗変化
の影響が互いに打ち消されるので、使用の都度、調整用
抵抗等によって抵抗値を微調整する必要が極めて少なく
なり、使い勝手が良くなる。As described above, according to the first, second or fourth aspect of the present invention, the strain sensor section and the signal processing section have an integrated structure, and thus the strain sensor does not have the conventional structure. Since it is not necessary to interpose a lead wire or the like between the section and the signal processing section by soldering or the like, productivity and strength are improved. Further, since there is no lead wire or the like, the influence of noise on the detection signal is reduced, and the bending operation at the time of mounting is not hindered, and operability and mountability are improved. Further, according to the invention of claim 3, the influence of the resistance change of the resistor due to the temperature change or the humidity change on the detection signal is canceled out each other, so that it is necessary to finely adjust the resistance value by an adjusting resistor or the like each time it is used. Is extremely low, and usability is improved.
【図１】 この発明の第１実施例による曲げセンサを表
側から見た平面図である。FIG. 1 is a plan view of a bending sensor according to a first embodiment of the present invention viewed from the front side.
【図２】 同実施例による曲げセンサを裏側から見た平
面図である。FIG. 2 is a plan view of the bending sensor according to the embodiment when viewed from the back side.
【図３】 同実施例による曲げセンサに具備される検出
回路の構成を示す図である。FIG. 3 is a diagram showing a configuration of a detection circuit included in the bending sensor according to the embodiment.
【図４】 図１に示す矢視Ｂ−Ｂ′による曲げセンサの
断面図である。FIG. 4 is a sectional view of the bending sensor taken along the line BB ′ of FIG.
【図５】 この発明の第２実施例による曲げセンサの構
造を示す断面図である。FIG. 5 is a sectional view showing the structure of a bending sensor according to a second embodiment of the present invention.
【図６】 この発明の第３実施例による曲げセンサの構
造を示す断面図である。FIG. 6 is a sectional view showing a structure of a bending sensor according to a third embodiment of the present invention.
【図７】 この発明の第４実施例による曲げセンサの歪
みゲージ部の端部の構造を示す平面図である。FIG. 7 is a plan view showing a structure of an end portion of a strain gauge portion of a bending sensor according to a fourth embodiment of the present invention.
【図８】 同実施例による曲げセンサにおいて、歪みゲ
ージ部と信号処理部との結合部分を示す斜視図である。FIG. 8 is a perspective view showing a joint portion of a strain gauge unit and a signal processing unit in the bending sensor according to the embodiment.
【図９】 図８に示す矢視Ｃ−Ｃ′による曲げセンサの
断面図である。9 is a cross-sectional view of the bending sensor taken along the line CC ′ of FIG.
【図１０】 第１〜第４実施例において、抵抗体を上下
層で互いにずらして形成した歪みゲージ部の構造を示す
断面図である。FIG. 10 is a cross-sectional view showing a structure of a strain gauge portion formed by shifting resistors in upper and lower layers in the first to fourth embodiments.
【図１１】 従来の曲げセンサの概略構成を示す図であ
る。FIG. 11 is a diagram showing a schematic configuration of a conventional bending sensor.
【図１２】 従来の曲げセンサに具備される検出回路の
構成を示す図である。FIG. 12 is a diagram showing a configuration of a detection circuit included in a conventional bending sensor.
１……歪みゲージ部、１ａ，２ａ……ベースフィルム、
１ｂ1，１ｂ2……金属箔、１ｃ1，１ｃ2，２ｄ……カバ
ーレイ、２……信号処理部、２ａ1，２ａ2，２ｂ1″，
２ｂ2″……リジット層、２ｂ1，２ｂ2，２ｂ1′，２ｂ
2′……銅箔層、２ｃ，Ｃ，Ｃｈ……銅箔、Ｃｎ……コ
ネクタ、Ｈ，Ｈ1〜Ｈ6……スルーホール、Ｈｄ……半
田、Ｐ1，Ｐ2……表面実装部品、Ｐｎ1〜Ｐｎ6……ピ
ン、Ｒ……接着剤、Ｒｔ1，Ｒｔ2，Ｒｂ1，Ｒｂ2……抵
抗体、ＲＪ……レジスト、Ｔ11〜Ｔ42……端子1 ... Strain gauge part, 1a, 2a ... Base film,
1b 1, 1b 2 ...... metal foil, 1c 1, 1c 2, 2d ...... cover lay, 2 ...... signal processing unit, 2a 1, 2a 2, 2b 1 ",
2b 2 ″ ... Rigid layer, 2 b 1 , 2 b 2 , 2 b 1 ′, 2 b
2 '... copper foil, 2c, C, Ch ...... foil, Cn ... connector, H, H 1 ~H 6 ...... through hole, Hd ... solder, P 1, P 2 ... surface mounting component , Pn 1 to Pn 6 ... Pins, R ... Adhesives, Rt 1 , Rt 2 , Rb 1 , Rb 2 ... Resistors, RJ ... Resist, T 11- T 42 ... Terminals
Claims (4)
じて抵抗値が変化する歪みセンサ部と、この歪みセンサ
部に接続され、該歪みセンサ部の抵抗値の変化に応じた
検出信号を出力する信号処理部とを具備して成る曲げセ
ンサにおいて、 前記信号処理部を多層構造とし、この信号処理部の層間
に前記歪みセンサ部の一端を挿入し積層させ、該歪みセ
ンサ部と該信号処理部とを一体構造にしたことを特徴と
する曲げセンサ。1. A strain sensor unit which is mounted on a measuring object and whose resistance value changes according to the bending of the mounting unit, and a detection signal which is connected to this strain sensor unit and which changes in accordance with the resistance value of the strain sensor unit. In the bending sensor including a signal processing unit for outputting, the signal processing unit has a multilayer structure, one end of the strain sensor unit is inserted between layers of the signal processing unit, and the strain sensor unit and the strain sensor unit are stacked. A bending sensor having an integrated structure with a signal processing unit.
じて抵抗値が変化する歪みセンサ部と、この歪みセンサ
部に接続され、該歪みセンサ部の抵抗値の変化に応じた
検出信号を出力する信号処理部とを具備して成る曲げセ
ンサにおいて、 前記信号処理部を多層構造とし、この信号処理部の少な
くとも２層を端部より延長し、これら延長した層によっ
て前記歪みセンサ部の一端を挟持させて該歪みセンサ部
と該信号処理部とを一体構造にしたことを特徴とする曲
げセンサ。2. A strain sensor unit which is mounted on a measuring object and whose resistance value changes according to the bending of the mounting unit, and a detection signal which is connected to this strain sensor unit and which corresponds to the change of the resistance value of the strain sensor unit. In the bending sensor, the signal processing unit has a multi-layered structure, and at least two layers of the signal processing unit are extended from an end, and the extended layers form the strain sensor unit. A bending sensor in which one end is sandwiched and the strain sensor unit and the signal processing unit are integrated.
着部の屈曲に応じて抵抗値がそれぞれ変化する４個の抵
抗体を配置した歪みセンサ部と、これら抵抗体の抵抗値
の変化に応じた検出信号を出力する信号処理部とを具備
して成る曲げセンサであって、 前記４個の抵抗体がホイートストンブリッジ回路を構成
していることを特徴とする曲げセンサ。3. A strain sensor section in which four resistance bodies, each of which has a resistance value that changes according to the bending of the mounting section, are arranged on a base member mounted on a measurement target, and a resistance value change of these resistance bodies. A bending sensor comprising a signal processing unit for outputting a corresponding detection signal, wherein the four resistors form a Wheatstone bridge circuit.
じて抵抗値が変化する歪みセンサ部と、この歪みセンサ
部に接続され、該歪みセンサ部の抵抗値の変化に応じた
検出信号を出力する信号処理部とを具備して成る曲げセ
ンサにおいて、 前記歪みセンサ部の端部を前記信号処理部の片側面に重
ねると共に、前記歪みセンサ部の端部に形成された端子
と前記信号処理部の端子とを所定の接続具を介して電気
的に接続したことを特徴とする曲げセンサ。4. A strain sensor unit which is mounted on a measuring object and whose resistance value changes according to the bending of the mounting unit, and a detection signal which is connected to this strain sensor unit and which changes according to the resistance value of the strain sensor unit. In a bending sensor including a signal processing unit that outputs a signal, the end of the strain sensor unit is overlapped with one side surface of the signal processing unit, and the terminal and the signal formed at the end of the strain sensor unit are provided. A bending sensor characterized in that it is electrically connected to a terminal of a processing section through a predetermined connecting tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4294646A JP3036262B2 (en) | 1992-08-31 | 1992-11-02 | Bending sensor |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4-232493 | 1992-08-31 | ||
| JP23249392 | 1992-08-31 | ||
| JP4294646A JP3036262B2 (en) | 1992-08-31 | 1992-11-02 | Bending sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06123604A true JPH06123604A (en) | 1994-05-06 |
| JP3036262B2 JP3036262B2 (en) | 2000-04-24 |
Family
ID=26530491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4294646A Expired - Fee Related JP3036262B2 (en) | 1992-08-31 | 1992-11-02 | Bending sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3036262B2 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002098601A (en) * | 2000-09-26 | 2002-04-05 | Molten Corp | Shift force measuring device |
| JP2003083821A (en) * | 2001-09-13 | 2003-03-19 | Nec San-Ei Instruments Ltd | Non-inductive strain sensor and its measuring method |
| JP2009109337A (en) * | 2007-10-30 | 2009-05-21 | Minebea Co Ltd | Bend sensor |
| JP2010042235A (en) * | 2008-08-08 | 2010-02-25 | Epionics Medical Gmbh | Method and device for detecting parameter for characterization of kinetic sequence at human or animal body |
| JP2010243192A (en) * | 2009-04-01 | 2010-10-28 | A & D Co Ltd | Strain gauge and load cell |
| JP2010249782A (en) * | 2009-04-20 | 2010-11-04 | Minebea Co Ltd | Bending sensor |
| WO2017201721A1 (en) * | 2016-05-26 | 2017-11-30 | 深圳纽迪瑞科技开发有限公司 | Curvature radius measurer, electronic device and manufacturing method for curvature radius measurer |
| KR20180014928A (en) * | 2016-08-02 | 2018-02-12 | 연세대학교 산학협력단 | Apparatus and method for estimating deflection of artificial whisker |
| JP2019090720A (en) * | 2017-11-15 | 2019-06-13 | ミネベアミツミ株式会社 | Strain gauge |
| JP2019219312A (en) * | 2018-06-21 | 2019-12-26 | ミネベアミツミ株式会社 | Strain gauge |
| JP2022022448A (en) * | 2017-11-15 | 2022-02-03 | ミネベアミツミ株式会社 | Strain gauge |
| WO2022092206A1 (en) * | 2020-10-30 | 2022-05-05 | 日東電工株式会社 | Strain sensor module |
-
1992
- 1992-11-02 JP JP4294646A patent/JP3036262B2/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002098601A (en) * | 2000-09-26 | 2002-04-05 | Molten Corp | Shift force measuring device |
| JP2003083821A (en) * | 2001-09-13 | 2003-03-19 | Nec San-Ei Instruments Ltd | Non-inductive strain sensor and its measuring method |
| JP2009109337A (en) * | 2007-10-30 | 2009-05-21 | Minebea Co Ltd | Bend sensor |
| US7814801B2 (en) | 2007-10-30 | 2010-10-19 | Minebea Co., Ltd. | Bend sensor |
| JP2010042235A (en) * | 2008-08-08 | 2010-02-25 | Epionics Medical Gmbh | Method and device for detecting parameter for characterization of kinetic sequence at human or animal body |
| JP2010243192A (en) * | 2009-04-01 | 2010-10-28 | A & D Co Ltd | Strain gauge and load cell |
| JP2010249782A (en) * | 2009-04-20 | 2010-11-04 | Minebea Co Ltd | Bending sensor |
| WO2017201721A1 (en) * | 2016-05-26 | 2017-11-30 | 深圳纽迪瑞科技开发有限公司 | Curvature radius measurer, electronic device and manufacturing method for curvature radius measurer |
| CN108885085A (en) * | 2016-05-26 | 2018-11-23 | 深圳纽迪瑞科技开发有限公司 | The production method of radius of curvature measurement device, electronic equipment and radius of curvature measurement device |
| KR20180014928A (en) * | 2016-08-02 | 2018-02-12 | 연세대학교 산학협력단 | Apparatus and method for estimating deflection of artificial whisker |
| JP2019090720A (en) * | 2017-11-15 | 2019-06-13 | ミネベアミツミ株式会社 | Strain gauge |
| JP2022022448A (en) * | 2017-11-15 | 2022-02-03 | ミネベアミツミ株式会社 | Strain gauge |
| JP2019219312A (en) * | 2018-06-21 | 2019-12-26 | ミネベアミツミ株式会社 | Strain gauge |
| WO2019244990A1 (en) * | 2018-06-21 | 2019-12-26 | ミネベアミツミ株式会社 | Strain gauge |
| WO2022092206A1 (en) * | 2020-10-30 | 2022-05-05 | 日東電工株式会社 | Strain sensor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3036262B2 (en) | 2000-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7286370B2 (en) | Wired circuit board and connection structure of wired circuit board | |
| US6909354B2 (en) | Electronic pressure sensitive transducer apparatus and method for manufacturing same | |
| US5499442A (en) | Delay line device and method of manufacturing the same | |
| JP3036262B2 (en) | Bending sensor | |
| US20060231622A1 (en) | Printed circuit board with integral strain gage | |
| JPH057057A (en) | Flexible wiring board | |
| US11262256B2 (en) | Sensor elements on thin foil/films | |
| EP1622434B1 (en) | Circuit board for a hard disc drive | |
| JP6730106B2 (en) | Shunt resistor mounting structure and mounting board | |
| JP4260864B2 (en) | Road strain measurement device | |
| JP2004521501A (en) | Combined body composed of planar conductor members | |
| JPH0298680A (en) | Magnetic field detecting device | |
| JP2000340916A (en) | Printed wiring board | |
| JP4782354B2 (en) | Chip resistor and manufacturing method thereof | |
| JPS59153119A (en) | Magnetic encoder | |
| WO2021181898A1 (en) | Electronic apparatus and proximity sensor | |
| JPH0119413Y2 (en) | ||
| JP2001023477A (en) | Multi-directional input device | |
| JP4318820B2 (en) | Magnetic detection antenna | |
| US6903561B2 (en) | Circuitry for measuring mechanical stress impressed on a printed circuit board | |
| JP6999842B2 (en) | Thin film strain sensor and torque sensor using it | |
| JP2023161197A (en) | Load converter and load converter manufacturing method | |
| WO2006091188A1 (en) | Printed circuit board with integral strain gage | |
| CN117629469A (en) | Pressure sensor module and manufacturing method thereof | |
| JP2022072603A (en) | Strain sensor module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20000125 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313532 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080225 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090225 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |