JPS59153119A - Magnetic encoder - Google Patents

Abstract

PURPOSE:To make the configuration compact and to improve productivity and reliability, by providing a magnetism-sensitive element part and a signal processing part on one substrate, and forming an electric connecting circuit part between both parts as a unitary body with the magnetism-sensitive element part, thereby omitting soldered lead wires. CONSTITUTION:An insulating substrate 11 is a sheet of glass, whose surface is finished as a mirror surface. On the upper surface of the substrate, a magnetism- sensitive element part 12A, an electric connecting circuit part 12B, and a soldering-terminal through-hole part 12C are formed by evaporating and etching technologies using a magnetism sensitive material such as Permalloy. On the back surface of the insulating substrate 11, a soldering through-hole part 13A which is continued from the soldering-terminal through-hole part 12C, a conductor part 13B constituting a part of a signal processor, and a soldering terminal part 13C are simultaneously formed together with the upper surface by evaporating and etching technologies using a magnetism sensitive material. A terminal of an IC package 13D is connected to the soldering terminal part 13C. External lead wires are connected to the soldering-terminal through-holes parts 12C and 13A. Thus the electric circuits are formed on one sheet of the insulating substrate 11.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a magnetic encoder, and particularly to a magnetic encoder in which a magnetic sensing section and a signal processing section are provided on one substrate.

[Prior art]

A magnetic encoder detects and processes changes in the electrical resistance of a magnetically sensitive element using a signal processing circuit, and outputs a digital electrical signal corresponding to the movement of a member to be detected. The magnetic encoder that detects the rotation of the motor is as shown in Figure 1.
A base body 2 is attached to the fixed end of the motor l, and a magnetic sensing part 4 and a signal processing part 5 are provided on an insulating substrate 3 attached to the base body 2, and a flexible printed board or the like is used to electrically connect the two. It has a fixing part soldered to the glue M6'. This insulating substrate 3, magnetically sensitive section 4, and signal processing section 5
The mechanical and electrical relationships will be explained in detail with reference to FIGS. 2 to 4. The magnetically sensitive part 4 includes a mirror insulating substrate 4A, a magnetically sensitive element part 4B made of a magnetically sensitive material such as permalloy, and a conductive wire part 4.
C. For soldering, the terminal portion 4D is formed by vapor deposition and etching techniques. On the insulating substrate 3, by thick film printing technology, a resistance element 5C is formed on the conductor parts 5A, 5B, ', a soldering terminal part 5D, 5E, and a star hole part 5F for double-sided connection are formed, and the soldering pad is formed on the part 5E. IC bag cage 5G ψ1
The signal processing section 5 of the hybrid IC is constructed by combining the 14 children. Then, the magnetic sensing section 4 is attached to the insulating substrate 3, and the terminal section 4D and the signal processing section 5 are soldered, and the terminal section 5D is electrically connected to the lead wire 60 of a flexible printed board or the like by soldering. Eight.

The rotating part is constructed by attaching the entire magnetic drum 8 to the end of the rotating shaft 7, making the magnetized surface 8A of the magnetic drum 8 rotate in parallel with the magnetic sensing element part 4BK, and generating a magnetic field by rotating the magnetic drum 875. The configuration is such that the electrical resistance of the magnetically sensitive element portion 4B changes with a change in .

In such a magnetic encoder, changes in the electrical resistance of the magnetic sensing element section 4B are detected by the signal processing section 5, and the n1 digital electrical signal is soldered to the terminal/through hole section 5HK via the external lead wire 9. and lead it out of the cover 10.

However, the fixed part of this magnetic encoder is the magnetically sensitive part 4.
A lead wire 6 is interposed to electrically connect the No. 4m processing section 5 to the terminal section 5, and the area for soldering the lead wire 6 is the same as the area for forming the terminal sections 4D, 5D, and 5E. must be secured on the magnetically sensitive section 4 and the insulating substrate 3. For this reason, the magnetically sensitive portion 4 and the insulating substrate 3 have become stiff, which has been an obstacle to miniaturization of the structure. Producing the grooved magnetic sensing part 4 and the signal processing part 5 separately and then combining them together and soldering the lead wires 6 completely reduces productivity, and the presence of soldered parts makes it difficult to improve the reliability of the product. It had become an obstacle for

[Purpose of the invention]

Therefore, an object of the invention is to provide a magnetic encoder suitable for miniaturization, improved productivity, and improved reliability.

[Summary of the invention]

In order to achieve this object, the present invention provides a magnetic encoder in which a magnetically sensitive element part and a signal processing part are provided on a substrate, and a magnetically sensitive element part, this magnetically sensitive element part, and the signal processing part are provided on one substrate. All the electrical connection circuit parts connecting the magnetically sensitive element part are formed integrally with the material for forming the magnetically sensitive element part, and the magnetically sensitive part is formed on the substrate on which the signal processing part is provided, and the electrical connection circuit part between the magnetically sensitive part and the signal processing part is Soldering aims to reduce the size, improve productivity, and improve reliability by eliminating lead wires.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 5 to 7.

A single glass plate with a mirror-finished surface is used as the insulating substrate 11, and as shown in FIG. A terminal through-hole portion 12C is formed for soldering with the electrical connection circuit portion 12B. As shown in FIG. 6, on the back side of the insulating substrate 11, the same magnetically sensitive material is deposited using vapor deposition and etching techniques. Hall'f! A13A, the signal processing part -1~'(il-), the conductor part 13B, and the soldering terminal part 13C are formed.The soldering part is the terminal part 13C.
The terminals of the IC package 13D are coupled to the terminals of the IC package 13D. The electric resistance element 13E is formed simultaneously by vapor deposition and etching techniques using the magnetically sensitive material for a low resistance value of about IKΩ, and a surface-mounted resistor for a higher resistance value. The external lead wire is soldered to the terminal/through hole portion 12C.

13A, and an electric circuit shown in FIG. 7 is formed on the ± sides of one insulating substrate 11.

In this way, a single insulating substrate 1 is formed with a magnetic sensing element section, a signal processing section, and an electrical connection circuit section connecting them.
1 is attached to the base body to form a fixed part, and is combined with the slightly rotating part to form a magnetic encoder, as in the conventional case.

According to such a magnetic encoder, the magnetically sensitive section and the signal processing section are formed on one insulating substrate, and the electrical connection circuit section connecting the magnetically sensitive section and the signal processing section is formed with the magnetically sensitive element section. Since they are formed at the same time using the same method, there is no need to solder lead wires between the magnetic sensing part and the signal processing part.
It becomes possible to downsize, improve productivity, and improve reliability. Also,
Productivity is further improved by forming the electrical resistance element constituting a part of the signal processing section at the same time as the magnetic sensing element section using the same method.

〔Effect of the invention〕

As described above, according to the present invention, the magnetically sensitive element section and the signal processing section are provided on the first substrate, and the electrical connection circuit section between the two sections is formed integrally with the magnetically sensitive element section and soldered. Since the lead wire is eliminated, it has the effect of reducing size, productivity, and reliability.

[Brief explanation of drawings]

Figures 1 to 4 show conventional magnetic encoders.
Fig. 1 is a longitudinal sectional front view of the whole, Fig. 2 is a front view of the main part of the fixed part, Fig. 3 is a rear view of the same, and Fig. 4 is an electrical connection diagram.
Figures 5 to 7 show the W1 encoder according to the present invention. Figure 5 is a front view of the main part of the fixed part, Figure 6 is a rear view of the same, and Figure 7 is an electrical connection diagram. . 11... Insulating substrate, 12A... Magnetic sensing element section, 12B... Electrical connection circuit section, 13
B...Conductor part constituting the IS part of the signal processing section, 13D...The same IC package, 13E...
...The same electric resistance element. ¥l Hard sweet potato 2 mouth A grass 3 Figure ND R $4 eye 1 ・[ , li $ni mouth 1zc flower 7 eye

Claims (1)

[Scope of Claims] 1. In a magnetic encoder in which a magnetic sensing section and a signal processing section are provided on a substrate, a magnetic sensing element section and an electrical connection between the magnetic sensing element section and the signal processing section are provided on one substrate. 1. A magnetic encoder characterized in that a connection circuit section is integrally formed of the material for forming the magnetically sensitive element section. 2. In claim 1, the electrical connection circuit section includes a part of an electrical resistance element constituting the signal processing section, and the electrical resistance element is electrically connected by the material forming the magnetically sensitive element section. A magnetic encoder characterized in that it is formed integrally with a circuit section.