JPH06122996A - Method for forming electrodeposited film and device thereof - Google Patents
Method for forming electrodeposited film and device thereofInfo
- Publication number
- JPH06122996A JPH06122996A JP29791092A JP29791092A JPH06122996A JP H06122996 A JPH06122996 A JP H06122996A JP 29791092 A JP29791092 A JP 29791092A JP 29791092 A JP29791092 A JP 29791092A JP H06122996 A JPH06122996 A JP H06122996A
- Authority
- JP
- Japan
- Prior art keywords
- electrodeposition
- resistance value
- film
- voltage
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電着膜の形成方法及び
その実施に使用する電着膜の形成装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrodeposition film forming method and an electrodeposition film forming apparatus used for carrying out the method.
【０００２】[0002]
【従来の技術】電着膜は、導電性の被塗膜物及び電極を
電着液に浸し、該被塗膜物及び電極間に電圧を印加する
ことにより被塗膜物表面に形成される。例えば、プリン
ト配線板の製造過程において、レジスト材として電着膜
を形成する場合には、プリント配線板全面に形成された
銅の表面に、過去の経験による電着条件にて電着膜を形
成し、この電着膜をフォトレジストとして銅のパターン
を形成する。このとき、電着膜が所定の膜厚で形成され
ていることを、電着膜形成後、膜厚測定を行って確認し
ていた。この形成されたプリント配線板の電着膜厚を確
認するための膜厚測定方法として、従来は、高周波測定
法，重量測定法等が行われていた。前者の高周波測定法
は、渦電流変化によるコイルの微小なインピーダンス変
化を測定することにより、プリント配線基板に形成され
た膜厚を測定する方法である。この方法を以下に説明す
る。まず、形成された電着膜の一部を除去して銅面を露
出し、この銅面上に厚み既知のフイルムを載置して渦電
流値を測定する。次に、幾種類かの厚みのフィルムを載
置して渦電流値を測定し、膜厚及び渦電流値の校正曲線
を求める。そして、電着膜の除去部分近辺の電着膜の渦
電流値を測定し、前記校正曲線によりその電着膜の膜厚
を求めることができる。また、後者の重量測定法は、電
着前後のプリント配線板の重量変化を測定する方法であ
り、既知の電着膜比重とプリント配線板面積とから膜厚
を求めることができる。2. Description of the Related Art An electrodeposition film is formed on the surface of an object to be coated by immersing a conductive object to be coated and an electrode in an electrodeposition liquid and applying a voltage between the object to be coated and the electrode. . For example, when forming an electrodeposition film as a resist material in the manufacturing process of a printed wiring board, the electrodeposition film is formed on the surface of copper formed on the entire surface of the printed wiring board under the electrodeposition conditions based on past experience. Then, a copper pattern is formed using this electrodeposition film as a photoresist. At this time, it was confirmed by measuring the film thickness after forming the electrodeposition film that the electrodeposition film was formed with a predetermined film thickness. Conventionally, as a film thickness measuring method for confirming the electrodeposition film thickness of the formed printed wiring board, a high frequency measuring method, a weight measuring method and the like have been performed. The former high-frequency measuring method is a method of measuring a film thickness formed on a printed wiring board by measuring a minute impedance change of a coil due to an eddy current change. This method will be described below. First, a part of the formed electrodeposition film is removed to expose the copper surface, and a film having a known thickness is placed on the copper surface to measure the eddy current value. Next, a film having several kinds of thickness is placed, the eddy current value is measured, and a calibration curve of the film thickness and the eddy current value is obtained. Then, the eddy current value of the electrodeposition film near the removed portion of the electrodeposition film is measured, and the film thickness of the electrodeposition film can be obtained from the calibration curve. The latter weight measurement method is a method of measuring the weight change of the printed wiring board before and after electrodeposition, and the film thickness can be obtained from the known specific gravity of the electrodeposition film and the area of the printed wiring board.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、高周波
測定法は、上述したように電着膜を除去する必要がある
ことから破壊検査であり、渦電流値が電着膜の下地によ
り大きくばらつき、前記校正曲線が膜厚測定位置により
異なることから、膜厚測定位置近辺にて、その都度前記
校正曲線を求める必要があり、また測定精度を得るため
に多くの測定点を必要とするので、測定に多大な時間を
必要とする問題があった。また、重量測定法は煩雑で手
間がかかり、精度も悪いという問題があった。However, the high-frequency measurement method is a destructive test because it is necessary to remove the electrodeposition film as described above, and the eddy current value greatly varies depending on the base of the electrodeposition film. Since the calibration curve differs depending on the film thickness measurement position, it is necessary to obtain the calibration curve near the film thickness measurement position each time, and many measurement points are required to obtain measurement accuracy. There was a problem that required a great deal of time. In addition, there is a problem that the weight measurement method is complicated, laborious, and inaccurate.
【０００４】さらに、これらの方法では電着膜形成後に
膜厚を測定するため、膜厚異常を発見することはできる
が、膜厚異常のプリント配線基板を減少させることはで
きない。また、同じ電着条件であっても電着液の状態、
電気的外乱、被塗膜物の表面状態等により形成される膜
厚が異なるので、膜厚測定を頻繁に行う必要があり、そ
のために多くの時間を費やしていた。これらのことか
ら、プリント配線板に電着膜を形成する作製能率が低い
という問題があった。Further, in these methods, the film thickness is measured after the electrodeposition film is formed. Therefore, the abnormal film thickness can be detected, but the printed wiring board having the abnormal film thickness cannot be reduced. In addition, even under the same electrodeposition conditions, the state of the electrodeposition liquid,
Since the formed film thickness differs depending on the electrical disturbance, the surface condition of the coating object, etc., it is necessary to frequently measure the film thickness, and therefore a lot of time is spent. For these reasons, there is a problem that the manufacturing efficiency for forming an electrodeposition film on a printed wiring board is low.
【０００５】本発明は、かかる事情に鑑みてなされたも
のであり、電着膜形成中の電極及び被塗膜物間の抵抗値
を測定し、該抵抗値と比例関係を有する電着膜厚を求め
て、この結果から電着膜形成終了時を判断して電着を終
了させることにより、膜厚を測定しつつ、所望する膜厚
の電着膜を形成する方法及びその実施に使用する装置を
提供することを目的とする。The present invention has been made in view of the above circumstances, and measures the resistance value between the electrode and the object to be coated during formation of the electrodeposition film, and the electrodeposition film thickness having a proportional relationship with the resistance value. The method for forming an electrodeposition film having a desired film thickness while measuring the film thickness by determining the end of electrodeposition film formation from this result and terminating electrodeposition The purpose is to provide a device.
【０００６】[0006]
【課題を解決するための手段】本発明に係る電着膜の形
成方法は、電極及び被塗膜物間に電圧を印加して、前記
被塗膜物に電着膜を形成する方法において、前記電極及
び被塗膜物間の抵抗値を測定する過程と、所望する電着
膜の膜厚に対応する基準抵抗値及び測定した抵抗値を比
較する過程と、その比較結果に応じて前記電圧の印加を
停止する過程とを有することを特徴とする。A method for forming an electrodeposition film according to the present invention is a method for forming an electrodeposition film on an object to be coated by applying a voltage between an electrode and the object to be coated, A step of measuring the resistance value between the electrode and the coating object, a step of comparing the reference resistance value and the measured resistance value corresponding to the desired film thickness of the electrodeposition film, and the voltage according to the comparison result. And a step of stopping the application of.
【０００７】本発明に係る電着膜の形成装置は、電極及
び被塗膜物間に電圧を印加して、前記被塗膜物に電着膜
を形成する装置において、前記電極及び被塗膜物間に印
加される電圧を測定する電圧計と、前記電極及び被塗膜
物間に供給される電流を測定する電流計と、これらの測
定結果から前記電極及び被塗膜物間の抵抗値を求め、所
望する電着膜の膜厚に対応する基準抵抗値及び求めた抵
抗値を比較する演算制御部と、該演算制御部から与えら
れた信号に基づき前記電圧の印加を停止する電圧印加停
止部とを備えることを特徴とする。The electrodeposition film forming apparatus according to the present invention is an apparatus for forming an electrodeposition film on an object to be coated by applying a voltage between the electrode and the object to be coated, A voltmeter that measures the voltage applied between objects, an ammeter that measures the current supplied between the electrode and the object to be coated, and the resistance value between the electrode and the object to be coated from these measurement results. And a calculation control unit for comparing the reference resistance value and the calculated resistance value corresponding to the desired film thickness of the electrodeposition film, and a voltage application for stopping the application of the voltage based on a signal given from the calculation control unit. And a stop portion.
【０００８】[0008]
【作用】本発明の電着膜の形成方法及びその装置では、
電着膜形成中の電極及び被塗膜物間の抵抗値を測定す
る。形成される電着膜の膜厚と前記抵抗値とは比例関係
にあることから、所望する膜厚に対応する抵抗値と測定
した抵抗値とを比較することにより、形成中の電着膜の
膜厚が監視でき、電着終了時を判断することができる。In the method and apparatus for forming an electrodeposition film of the present invention,
The resistance value between the electrode and the coating object during the formation of the electrodeposition film is measured. Since the film thickness of the electrodeposition film to be formed and the resistance value are in a proportional relationship, by comparing the resistance value corresponding to the desired film thickness with the measured resistance value, The film thickness can be monitored and the end of electrodeposition can be determined.
【０００９】[0009]
【実施例】以下、本発明をその実施例を示す図面に基づ
き具体的に説明する。図１は、本発明装置の構成を模式
的断面図を共に示したブロック図である。図中、11は電
着槽であり、その内部に電着液４が収容され、被塗膜物
２及び電極板１，１が電着液４中に浸されている。被塗
膜物２は、表面が全部又は部分的に導電性物質、例えば
金属，導電性高分子等で覆われている。電極板１は、例
えば鉄，銅，ニッケル，クロム等の金属からなり、電着
液４は、アクリル樹脂が主体のバインダ樹脂と、カルボ
キシル基，アミノ基等のキャリア基と、重合性のモノマ
ー樹脂とを組み合わせたポジタイプのフォトレジスト用
のものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the drawings showing the embodiments. FIG. 1 is a block diagram showing a schematic cross-sectional view of the configuration of the device of the present invention. In the figure, 11 is an electrodeposition tank, in which the electrodeposition liquid 4 is contained, and the material 2 to be coated and the electrode plates 1, 1 are immersed in the electrodeposition liquid 4. The surface of the coating object 2 is wholly or partially covered with a conductive substance such as a metal or a conductive polymer. The electrode plate 1 is made of a metal such as iron, copper, nickel or chromium, and the electrodeposition liquid 4 is a binder resin mainly composed of an acrylic resin, a carrier group such as a carboxyl group or an amino group, and a polymerizable monomer resin. It is for a positive type photoresist which is a combination of.
【００１０】電着槽11には、その側面に、電着槽11の側
壁よりも低い仕切り壁を隔てて温度調節槽11a が配設さ
れており、温度調節槽11a 内には電着液４が収容されて
いる。電着槽11及び温度調節槽11a 内に収容された電着
液４は、仕切り壁と同一の高さに液面を有している。温
度調節器８のヒータ部が温度調節槽11a 内の電着液４中
に浸され、温度調節槽11a 内の電着液４を所定温度に調
節する。また、循環管路、ポンプ及びフィルタを備える
電着液循環手段９が、循環管路を介して電着槽11の側面
下部と温度調節槽11a の低部との間に連結されている。
ポンプで電着液４を温度調節槽11a から電着槽11へ導入
することにより、電着槽11内の電着液４の上層は仕切り
壁を越えて温度調節槽11a へ流入し、温度調節槽11a 内
で温度調節されて循環し、電着液４全体の温度を調節す
るようになっている。また、電着液４は循環管路途中に
配されたフィルタを通過し、電着液４中に混入される不
純物を取り除いている。The electrodeposition tank 11 is provided with a temperature control tank 11a on the side surface thereof with a partition wall lower than the side wall of the electrodeposition tank 11, and the electrodeposition liquid 4 is placed in the temperature control tank 11a. Is housed. The electrodeposition liquid 4 contained in the electrodeposition tank 11 and the temperature control tank 11a has a liquid surface at the same height as the partition wall. The heater part of the temperature controller 8 is immersed in the electrodeposition liquid 4 in the temperature control tank 11a to adjust the electrodeposition liquid 4 in the temperature control tank 11a to a predetermined temperature. Further, an electrodeposition liquid circulating means 9 including a circulation pipe, a pump and a filter is connected between the lower part of the side surface of the electrodeposition bath 11 and the lower portion of the temperature control bath 11a via the circulation pipe.
By introducing the electrodeposition liquid 4 from the temperature control tank 11a into the electrodeposition tank 11 with a pump, the upper layer of the electrodeposition liquid 4 in the electrodeposition tank 11 flows over the partition wall into the temperature control tank 11a to control the temperature. The temperature of the electrodeposition liquid 4 as a whole is adjusted by circulating the temperature in the bath 11a. Further, the electrodeposition liquid 4 passes through a filter arranged in the middle of the circulation pipe to remove impurities mixed in the electrodeposition liquid 4.
【００１１】直流電源３は電圧，電流量が調節可能であ
り、その陽極には被塗膜物２が電流計５を介して接続さ
れ、陰極には後述する電圧印加停止部10を介して被塗膜
物２の両側に配された電極板１，１が接続される。電流
計５は、電源３から流れる電流量を測定するためのもの
である。そして、電源３により電極板１，被塗膜物２間
に電位差が与えられて電荷の授受が行われ、電流は被塗
膜物２から電極板１，１へ、そして電圧印加停止部10へ
流れる。電圧印加停止部10は、後述する演算制御部７か
ら入力される信号に基づいて電着終了を実行するもので
あり、通電状態を遮断状態にする機器、例えばリレーが
用いられる。The DC power supply 3 is capable of adjusting the voltage and the amount of current, the object to be coated 2 is connected to the anode through an ammeter 5, and the cathode is covered via a voltage application stopping portion 10 described later. The electrode plates 1, 1 arranged on both sides of the coating material 2 are connected. The ammeter 5 is for measuring the amount of current flowing from the power supply 3. Then, a potential difference is applied between the electrode plate 1 and the coating object 2 by the power source 3 to transfer charges, and a current is transferred from the coating object 2 to the electrode plates 1, 1 and to the voltage application stopping portion 10. Flowing. The voltage application stopping unit 10 executes the end of electrodeposition based on a signal input from the arithmetic control unit 7 described later, and is a device that brings the energized state into a cutoff state, such as a relay.
【００１２】一方、電圧計６は、電極板１，被塗膜物２
間の電圧を測定するためのものであり、電極板１，被塗
膜物２間に接続されている。この電圧計６及び前記電流
計５夫々からの信号は演算制御部７へ入力される。演算
制御部７は、電圧計６及び前記電流計５からの入力信号
により抵抗値Ｒを演算し、電着終了を判断するものであ
り、演算制御部７には抵抗値Ｒを求めるための演算式Ｒ
＝ｆ（Ｉ，Ｅ）、及び比較基準値Ｒ0 が与えられてい
る。ここで、Ｒは抵抗，Ｉは電流，Ｅは電圧を示す。比
較基準値Ｒ0 は、所望する電着膜の膜厚に対応させた設
定値であり、以下のように予め設定される。On the other hand, the voltmeter 6 includes an electrode plate 1, a coating object 2
It is for measuring the voltage between them, and is connected between the electrode plate 1 and the coating object 2. The signals from the voltmeter 6 and the ammeter 5 are input to the arithmetic and control unit 7. The calculation control unit 7 calculates the resistance value R based on the input signals from the voltmeter 6 and the ammeter 5, and determines the end of electrodeposition. The calculation control unit 7 calculates the resistance value R. Formula R
= F (I, E) and the comparison reference value R 0 are given. Here, R is resistance, I is current, and E is voltage. The comparison reference value R 0 is a set value corresponding to the desired film thickness of the electrodeposition film, and is set in advance as follows.
【００１３】図２は、本実施例における抵抗値Ｒ及び膜
厚の関係を表すグラフであり、縦軸は膜厚（μｍ），横
軸は抵抗値（Ω）を示す。グラフから明らかなように、
抵抗値Ｒ及び電着膜の膜厚は比例関係にあり、この関係
式から所望の膜厚に対応する比較基準値Ｒ0 を設定す
る。演算制御部７は、このように設定された比較基準値
Ｒ0 と測定された抵抗値Ｒとを比較し、その結果に基づ
く信号を前記電圧印加停止部10へ入力するようになって
いる。FIG. 2 is a graph showing the relationship between the resistance value R and the film thickness in this embodiment, where the vertical axis represents the film thickness (μm) and the horizontal axis represents the resistance value (Ω). As you can see from the graph,
The resistance value R and the film thickness of the electrodeposited film are in a proportional relationship, and the comparison reference value R 0 corresponding to the desired film thickness is set from this relational expression. The arithmetic control unit 7 compares the comparison reference value R 0 set in this way with the measured resistance value R, and inputs a signal based on the result to the voltage application stopping unit 10.
【００１４】図３は、この装置を使用して被塗膜物に電
着膜を形成する手順を示すフローチャートである。被塗
膜物２及び電極板１，１に電圧を印加して、被塗膜物２
の表面に電着膜を形成し、その膜厚を制御する実施手順
を、図３に基づいて説明する。FIG. 3 is a flow chart showing the procedure for forming an electrodeposition film on an object to be coated using this apparatus. By applying a voltage to the object to be coated 2 and the electrode plates 1 and 1, the object to be coated 2
An implementation procedure for forming an electrodeposition film on the surface of and controlling the film thickness will be described with reference to FIG.
【００１５】まず、電着液４中に、基板寸法 100mm×10
0mm の被塗膜物２を浸し、電源３をＯＮ状態にして50ｍ
Ａの電流を被塗膜物２に供給する（ステップＳ２１）。
これにより電極板１，被塗膜物２間に電位差が与えられ
て電荷の授受が行われ、被塗膜物２表面に電着膜が形成
される。このとき、電流計５及び電圧計６で測定された
電流値Ｉ及び電圧値Ｅに対応する信号が、経時的に演算
制御部７へ入力される（ステップＳ２２）。演算制御部
７には上述したように、演算式Ｒ＝ｆ（Ｉ，Ｅ）、及び
比較基準値Ｒ0 が与えられている。First, the substrate size is 100 mm × 10 in the electrodeposition liquid 4.
Dip 0 mm of coating object 2 and turn on power supply 3 to 50 m
The current of A is supplied to the coating object 2 (step S21).
As a result, an electric potential difference is applied between the electrode plate 1 and the coating object 2 to transfer charges, and an electrodeposition film is formed on the surface of the coating object 2. At this time, signals corresponding to the current value I and the voltage value E measured by the ammeter 5 and the voltmeter 6 are input to the arithmetic control unit 7 over time (step S22). As described above, the arithmetic control unit 7 is provided with the arithmetic expression R = f (I, E) and the comparison reference value R 0 .
【００１６】演算制御部７へ入力された電流値Ｉ及び電
圧値Ｅから抵抗値Ｒを求め、比較基準値Ｒ0 と比較して
（ステップＳ２４）、Ｒ＜Ｒ0 の場合には、再度、電流
計５及び電圧計６から入力された信号を基に抵抗値Ｒを
算出し、比較設定値Ｒ0 と比較する。一方、Ｒ≧Ｒ0 の
場合には、電着終了の信号を電圧印加停止部10へ出力す
る（ステップＳ２５）。電圧印加停止部10は電着終了の
信号を入力し、電源３をＯＦＦ状態にする（ステップＳ
２６）。The resistance value R is obtained from the current value I and the voltage value E input to the arithmetic control unit 7, and is compared with the comparison reference value R 0 (step S24). If R <R 0 , then again. The resistance value R is calculated based on the signals input from the ammeter 5 and the voltmeter 6, and is compared with the comparison setting value R 0 . On the other hand, when R ≧ R 0 , a signal indicating the completion of electrodeposition is output to the voltage application stopping unit 10 (step S25). The voltage application stopping unit 10 inputs a signal indicating the completion of electrodeposition and turns off the power supply 3 (step S
26).
【００１７】図４は電着膜形成開始からの抵抗値Ｒの変
化を示したグラフであり、縦軸は抵抗値Ｒ、横軸は時間
を示している。算出された抵抗値Ｒが、比較設定値Ｒ0
と等しい又は比較設定値Ｒ0 より大きい値を示した時点
を電着終了時点とする。以上の如く、被塗膜物２表面に
形成される電着膜を、形成段階において所望する膜厚に
制御することができる。FIG. 4 is a graph showing the change of the resistance value R from the start of the electrodeposition film formation, where the vertical axis shows the resistance value R and the horizontal axis shows the time. The calculated resistance value R is the comparison setting value R 0
Is set to a value equal to or larger than the comparison set value R 0, and the time when electrodeposition is completed is set. As described above, the electrodeposition film formed on the surface of the coating object 2 can be controlled to have a desired film thickness in the forming step.
【００１８】また、このような電着膜の形成にかかる様
々な外的要因、例えば前述した電気的外乱を考慮して比
較基準値Ｒ1 ，Ｒ2 を設定し、抵抗値Ｒ≧Ｒ1 ，Ｒ≧Ｒ
2 を判定後、一定期間経過して電着膜終了時間と判断す
る方法もある。このとき、比較基準値Ｒ1 ，Ｒ2 は所望
する電着膜厚における抵抗値Ｒ0 よりも小さい値を設定
する。図５は、抵抗値Ｒ≧比較基準値Ｒ1 を判断後、所
定時間ｔを経過した時点で電着終了の信号を出力した場
合の、電着膜形成開始からの抵抗値Ｒの変化を示したグ
ラフである。また、図６は、抵抗値Ｒ≧比較設定値Ｒ2
を判断後、抵抗値Ｒの所定変化量ｒを超過した時点で電
着終了の信号を出力した場合の、電着膜形成開始からの
抵抗値Ｒの変化を示したグラフである。この方法以外に
も、電圧Ｅ，電流値Ｉの所定量を変化させた後に電着終
了の信号を出力する方法でも良い。Further, the comparative reference values R 1 and R 2 are set in consideration of various external factors relating to the formation of such an electrodeposition film, for example, the above-mentioned electrical disturbance, and the resistance values R ≧ R 1 and R ≧ R
There is also a method of determining the end time of the electrodeposition film after a certain period has elapsed after determining 2 . At this time, the comparison reference values R 1 and R 2 are set to values smaller than the resistance value R 0 at the desired electrodeposition film thickness. FIG. 5 shows a change in the resistance value R from the start of the electrodeposition film formation when the signal of the electrodeposition completion is output when the predetermined time t has passed after the judgment of the resistance value R ≧ the comparison reference value R 1. It is a graph. Further, FIG. 6 shows that the resistance value R ≧ the comparison set value R 2
6 is a graph showing a change in the resistance value R from the start of the electrodeposition film formation when a signal indicating the end of electrodeposition is output when the predetermined change amount r of the resistance value R is exceeded after the judgment of. Other than this method, a method of outputting a signal indicating the completion of electrodeposition after changing the predetermined amounts of the voltage E and the current value I may be used.
【００１９】なお、上述の実施例では、演算制御部７に
て算出され比較されるパラメータとして、抵抗値Ｒを用
いているが、これに限るものではなく、抵抗値Ｒから導
かれるものであれば良い。In the above-mentioned embodiment, the resistance value R is used as the parameter calculated and compared by the arithmetic control unit 7, but the present invention is not limited to this, and the resistance value R may be derived. Good.
【００２０】また、本実施例で用いられる電源３は、パ
ルス電流を供給する機能を有するものであっても良い。
これにより、凹凸状の電着膜表面のエッジ部分に集中す
る電流を拡散させて、膜厚を均一にすることができる。
また、本実施例で用いられる温度調節器８は、水，油，
気体等の温度媒体により間接的に電着液４の温度調節を
行うタイプのものであっても良い。The power supply 3 used in this embodiment may have a function of supplying a pulse current.
As a result, it is possible to diffuse the current concentrated on the edge portion of the surface of the electrodeposited film having irregularities and make the film thickness uniform.
Further, the temperature controller 8 used in this embodiment is
It may be of a type in which the temperature of the electrodeposition liquid 4 is indirectly controlled by a temperature medium such as gas.
【００２１】[0021]
【発明の効果】以上のように、本発明の電着膜の形成方
法及びその装置においては、電着膜形成中の電極及び被
塗膜物間の抵抗値を測定し、この結果から電着膜形成終
了時を判断して電着を終了させるので、膜厚を測定しつ
つ、所望する膜厚の電着膜を形成することができる等、
本発明は優れた効果を奏するものである。As described above, in the method and apparatus for forming an electrodeposition film of the present invention, the resistance value between the electrode and the object to be coated during the formation of the electrodeposition film is measured, and from this result, the electrodeposition film is formed. Since the electrodeposition is terminated by judging the end of film formation, it is possible to form an electrodeposited film having a desired film thickness while measuring the film thickness.
The present invention has excellent effects.
【図１】本発明装置の構成を模式的断面図を共に示した
ブロック図である。FIG. 1 is a block diagram showing a schematic cross-sectional view of the configuration of the device of the present invention.
【図２】本実施例における抵抗値Ｒ及び膜厚の関係を表
すグラフである。FIG. 2 is a graph showing a relationship between a resistance value R and a film thickness in this example.
【図３】本発明方法により被塗膜物に電着膜を形成する
手順を示すフローチャートである。FIG. 3 is a flow chart showing a procedure for forming an electrodeposition film on an object to be coated by the method of the present invention.
【図４】本実施例における電着膜形成開始からの抵抗値
Ｒの変化を示したグラフである。FIG. 4 is a graph showing a change in resistance value R from the start of electrodeposition film formation in this example.
【図５】本実施例における電着膜形成開始からの抵抗値
Ｒの変化を示したグラフである。FIG. 5 is a graph showing changes in resistance value R from the start of electrodeposition film formation in this example.
【図６】本実施例における電着膜形成開始からの抵抗値
Ｒの変化を示したグラフである。FIG. 6 is a graph showing a change in resistance value R from the start of electrodeposition film formation in this example.
１ 電極板 ２ 被塗膜物 ３ 電源 ４ 電着液 ５ 電流計 ６ 電圧計 ７ 演算制御部 ８ 温度調節器 ９ 電着液循環手段 10 電圧印加停止部 11 電着槽 1 electrode plate 2 coated object 3 power supply 4 electrodeposition liquid 5 ammeter 6 voltmeter 7 arithmetic control unit 8 temperature controller 9 electrodeposition liquid circulation means 10 voltage application stop unit 11 electrodeposition tank
フロントページの続き (72)発明者 上田 由一 大阪府大阪市中央区安土町二丁目３番13号 大阪国際ビル ミノルタカメラ株式会社 内Front page continuation (72) Inventor Yuichi Ueda 2-33 Azuchi-cho, Chuo-ku, Osaka-shi, Osaka, Osaka International Building Minolta Camera Co., Ltd.
Claims (2)
前記被塗膜物に電着膜を形成する方法において、 前記電極及び被塗膜物間の抵抗値を測定する過程と、所
望する電着膜の膜厚に対応する基準抵抗値及び測定した
抵抗値を比較する過程と、その比較結果に応じて前記電
圧の印加を停止する過程とを有することを特徴とする電
着膜の形成方法。1. A voltage is applied between the electrode and the object to be coated,
In the method for forming an electrodeposition film on the coating object, a process of measuring a resistance value between the electrode and the coating object, and a reference resistance value and a measured resistance value corresponding to a desired film thickness of the electrodeposition film. A method for forming an electrodeposition film, comprising: a step of comparing values, and a step of stopping the application of the voltage according to the comparison result.
前記被塗膜物に電着膜を形成する装置において、 前記電極及び被塗膜物間に印加される電圧を測定する電
圧計と、前記電極及び被塗膜物間に供給される電流を測
定する電流計と、これらの測定結果から前記電極及び被
塗膜物間の抵抗値を求め、所望する電着膜の膜厚に対応
する基準抵抗値及び求めた抵抗値を比較する演算制御部
と、該演算制御部から与えられた信号に基づき前記電圧
の印加を停止する電圧印加停止部とを備えることを特徴
とする電着膜の形成装置。2. A voltage is applied between the electrode and the object to be coated,
In an apparatus for forming an electrodeposition film on the coating object, a voltmeter for measuring a voltage applied between the electrode and the coating object and a current supplied between the electrode and the coating object are measured. An ammeter to calculate the resistance value between the electrode and the coating object from these measurement results, and a calculation control unit that compares the resistance value and the reference resistance value corresponding to the desired film thickness of the electrodeposition film. And a voltage application stopping unit that stops the application of the voltage based on a signal given from the arithmetic control unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29791092A JPH06122996A (en) | 1992-10-08 | 1992-10-08 | Method for forming electrodeposited film and device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29791092A JPH06122996A (en) | 1992-10-08 | 1992-10-08 | Method for forming electrodeposited film and device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06122996A true JPH06122996A (en) | 1994-05-06 |
Family
ID=17852681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29791092A Pending JPH06122996A (en) | 1992-10-08 | 1992-10-08 | Method for forming electrodeposited film and device thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06122996A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196814A (en) * | 2005-01-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | Method for manufacturing planar coil |
| WO2009087637A2 (en) * | 2008-01-10 | 2009-07-16 | Elutex Ltd. | Manufacturing electrocoated medical devices, and quality control testing and validating thereof |
| KR20190103637A (en) * | 2018-02-28 | 2019-09-05 | 한국에너지기술연구원 | Forming method for thin film using cbd, forming apparatus for thin film and manufacturing method for cigs solar cell |
| CN112903794A (en) * | 2021-01-25 | 2021-06-04 | 杭州绿洁环境科技股份有限公司 | Heavy metal analyzer and coating management method, device, equipment and medium thereof |
-
1992
- 1992-10-08 JP JP29791092A patent/JPH06122996A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196814A (en) * | 2005-01-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | Method for manufacturing planar coil |
| WO2009087637A2 (en) * | 2008-01-10 | 2009-07-16 | Elutex Ltd. | Manufacturing electrocoated medical devices, and quality control testing and validating thereof |
| WO2009087637A3 (en) * | 2008-01-10 | 2010-05-14 | Elutex Ltd. | Manufacturing electrocoated medical devices, and quality control testing and validating thereof |
| KR20190103637A (en) * | 2018-02-28 | 2019-09-05 | 한국에너지기술연구원 | Forming method for thin film using cbd, forming apparatus for thin film and manufacturing method for cigs solar cell |
| CN112903794A (en) * | 2021-01-25 | 2021-06-04 | 杭州绿洁环境科技股份有限公司 | Heavy metal analyzer and coating management method, device, equipment and medium thereof |
| CN112903794B (en) * | 2021-01-25 | 2023-05-12 | 杭州绿洁科技股份有限公司 | Heavy metal analyzer and film plating management method, device, equipment and medium thereof |
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