JPH0611587Y2 - Light receiving device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a light receiving device used for a light receiving unit of a remote control device for home electric appliances and other products.

<Prior Art> In a conventional light receiving device, for example, as shown in FIG. 9, a chip component 2 such as a resistor is mounted on a soldering surface 1a of a double-sided substrate 1, and a light receiving element 3 having low heat resistance is mounted on a non-soldering surface 1b. And the signal processing integrated circuit component 4 and the like are mounted. The light receiving element 3 is arranged on a metal pedestal 5 provided around and above the integrated circuit component 4 for electromagnetic shielding, positioning, and holding with the integrated circuit component 4.

Further, the shield case 6 for electromagnetically shielding the double-sided substrate 1, the light receiving element 3 and the like comprises a shield case body 7 and a back cover 8 which are separately formed from each other. Was fixed by bending the engaging claw 9 of the shield case body 7.

In the figure, 10 is a terminal for electrically connecting the double-sided board 1 to the outside, 11 is a protrusion for holding the double-sided board 1, 12 is a foot for holding the shield case 6 on the external board, 13
Is a projection for retaining the foot 12.

<Problems to be Solved by the Invention> In the above-mentioned conventional technique, the light receiving element 3 needs to be mounted on the non-soldered surface 1b because the package material has low heat resistance. A pedestal 5 for electromagnetically shielding the integrated circuit component 4 is required, and a back cover 8 is additionally required. for that reason,
When the number of parts increases, the assembly time becomes long, and the cost becomes high, there are problems.

Therefore, the present invention can reduce the number of parts,
It is an object of the present invention to provide a light receiving device that can reduce the assembly time and is inexpensive.

<Means for Solving Problems> A means for solving problems according to the present invention is, as shown in FIGS. 1 to 6, a light receiving element 21 and a lead pin 28 of the light receiving element 21.
Is soldered upright from the non-soldered surface (back surface) 23a, the lead pins 28 are bent, and the light receiving portion of the light receiving element 21 is arranged in the placement hole 22; and the light receiving element 2
1 and the shield case S that houses the circuit board 23 and electromagnetically shields the shield case S. The shield case S covers the back surface of the light receiving portion of the light receiving element 21, and faces the light receiving portion toward the circuit board 23. The back cover 26 is formed by extending a part of the shield case S that is pressed and fixed.

<Operation> In the above means for solving the problem, the lead pin 28 of the light receiving element 21 is inserted from the non-soldering surface 23a of the circuit board 23 and protrudes from the surface of the soldering surface 23b.
Solder the tip of the by using dipping or the like. Therefore, the package of the light receiving element 21 does not come into contact with the solder, and an inexpensive resin having low heat resistance can be used as the package resin.

When the lead pin 28 is bent so that the light receiving element 21 approaches the circuit board 23, the light receiving portion of the light receiving element 21 is inserted into the placement hole 22 of the circuit board 23, and the light receiving portion penetrates the circuit board 23. The circuit board 23 can be made to absorb a part of the thickness of the light receiving element 21 by being arranged in the arrangement hole 22. Next, the circuit board 23 is fitted in the shield case S, the back cover 26 is bent in the direction of the circuit board 23, and the back surface of the light receiving element 21 of the light receiving element 21 is pressed and fixed toward the circuit board 23 by the back cover 26. As a result, the space between the light receiving element 21 and the back cover 26 is eliminated, and the thickness of the entire device can be reduced. Further, since the shield case S is completed by bending the back cover 26, the number of parts and the assembling time can be reduced, and the cost is reduced.

<Embodiment> An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a vertical sectional side view showing an embodiment of a light receiving device of the present invention, FIG. 2 is a side view showing a method of mounting a light receiving element, and FIG. 3 is a plan view showing a mounting state of components, and FIG. Is also a front view of the shield case, FIG. 5 is a side view of the shield case, and FIG. 6 is the same as B- of FIG.
It is a B line sectional view.

As shown in the figure, the light receiving device of the present invention has a straight lead pin type light receiving element 21 and a single-sided circuit board 23 having a hole 22 for arranging the light receiving element 21. A shield case main body 25 for electromagnetically shielding the peripheral component 24 and a back cover 26 are provided, and the back cover 26 is formed by extending a part of the shield case main body 25.

The lead pin 28 of the light receiving element 21 has an insertion hole 2 formed in the circuit board 23 as shown in FIGS. 1 and 2.
9 is inserted from the direction of the non-soldering surface 23a, and the lead pin 28 is bent after soldering, so that the light receiving element 21 has the light receiving lens 21a arranged in the arranging hole 22 in the direction of the soldering surface 23b. To be done.

Further, as shown in FIGS. 1 and 3, the peripheral component 24 includes an integrated circuit component (IC) 31 for signal processing and a chip resistor 3.
It consists of 2 mag. In the figure, 33 is a terminal for connecting an electric circuit on the circuit board 23 and an external circuit (not shown), 3
Reference numeral 4 is a protective resin for the integrated circuit component 31, and 35 is solder.

The shield case body 25 is composed of a metal plate arranged from the side piece 23c of the circuit board 23 toward the soldering surface 23b, and a recess 37 is formed on the upper surface 25a of the shield case body 25. In the hole 38 formed in the center of the
a is inserted.

The back cover 26 is a plate-like member arranged in the direction of the non-soldered surface 23a of the circuit board 23, and one side thereof is integrally connected to the shield case body 25. Then, another end 26a of the back cover 26 is bent to form a shield wall between the light receiving element 21 and the terminal 33, and another end 26b orthogonal to the end 26a is provided with the light receiving element 21 and the integrated circuit component 31. It becomes a shield wall with. Further, the back cover 26 is provided with the light receiving element 21.
It abuts against the back surface 21b of the and holds it.

Then, the shield case body 25 and the back cover 2 before assembly
6, a back cover 26 is formed by extending one of the side surfaces of the shield case main body 25 downward as shown in FIGS. 4 to 6. A shield case S having a shape as shown in FIG. 1 is formed by bending this along the line A-A, and the shield case S shields the electromagnetic field within the one-dot chain line in FIG.

In the figure, 40 is a protrusion for holding the circuit board, 41 is an engaging claw for the back cover 26, 42 is a foot for attaching the shield case body 25 to another board (not shown), and 43 is a detachment of the foot 42. The protrusion 44 is a protrusion 4 when the back cover 26 is bent.
3 is a notch for escaping, 45 is a shield case main body 25
It is a hole for making it easy to bend the back cover 26 and the back cover 26 along the line AA.

A method of arranging the components on the circuit board 23 in the above configuration will be described. First, the light receiving element 21 is vertically mounted on the circuit board 23 from the non-soldered surface 23a using an insert machine or the like. At this time, if there are other leaded components, they can be mounted at the same time. Then, soldering is performed by depping or the like. At this time, even if the package resin of the light receiving element 21 has low heat resistance, since the light receiving element 21 is of the straight lead pin type, soldering can be performed without any problem.

After that, by bending the lead pin 28 of the light receiving element 21, the light receiving element 21 can be placed in the light receiving element placement hole 22. Therefore, part of the thickness of the light receiving element 21 is absorbed by the circuit board 23, and the entire thickness can be reduced, and the circuit board 23 can be single-sided, thus eliminating the need for a conventional metal pedestal and reducing the number of working steps. It is possible to reduce the cost and reduce the cost.

Next, a method of assembling the shield case S will be described. First,
The circuit board 23 on which the light receiving element 21 and the like are mounted is attached to the shield case body 25. Then, the shield case S is completed by bending along the line AA in FIG. 5 and bending the engaging claw 41.

At this time, since one end of the portion to be the back cover 26 is bent, the shield wall 26a between the light receiving element 21 and the terminal 33 and the shield wall 26b between the light receiving element 21 and the integrated circuit component 31 are simultaneously formed. .

That is, since the shield case body 25 and the back cover 26 are integrally formed, the process of assembling the shield case S can be shortened and the cost can be reduced.

It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

For example, as shown in FIGS. 7 and 8, a double-sided circuit board is used as the circuit board 23, and the copper foil 4 on the non-soldered surface 23a thereof is used.
If 6 is a grounding pattern on the entire surface, holes 2 for arranging light receiving elements
The back cover 26 other than the portion covering the back surface side of 2 is unnecessary, and it is not necessary to cover the entire circuit board 23. Therefore, according to this structure, the non-soldered surface of the circuit board 23
A tall component (capacitor, etc.) 47 can be mounted on 23a. At this time, when the engaging claw 41 is bent and then brought into contact with the earth pattern 46, the entire shield case S becomes the earth potential.

<Effect of Device> As is apparent from the above description, according to the present invention, the lead pin of the light receiving element is bent to arrange the light receiving portion in the hole for arranging the circuit board, and the back surface of the light receiving portion covers part of the shield case. It is covered with a back cover formed to extend and pressed and fixed. Therefore, a part of the thickness of the light receiving element can be absorbed by the circuit board, and since there is no space between the light receiving element and the back cover, the thickness of the entire device can be reduced. Also, you can complete the shield case just by bending the back cover,
The number of parts can be reduced and the assembly time can be shortened, and the cost can be reduced.

Furthermore, because the lead pins of the light receiving element are soldered upright from the back surface (non-soldered surface) of the circuit board, the package of the light receiving element does not touch the solder during soldering. Therefore, heat resistance as a package resin It is possible to use cheap ones with low cost.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view showing an embodiment of the light receiving device of the present invention,
FIG. 2 is a side view showing the method of mounting the light receiving element, FIG. 3 is a plan view showing the mounting state of the components, FIG. 4 is a front view of the same shield case, and FIG. 5 is a side view of the same shield case. 6 is a sectional view taken along the line BB of FIG. 4, FIG. 7 is a longitudinal sectional view showing another embodiment of the light receiving device of the present invention, FIG. 8 is a front view of the same shield case, and FIG. FIG. 6 is a vertical sectional side view showing a conventional light receiving device. 21: light receiving element, 21a: light receiving lens, 22: hole for receiving light receiving element, 23: circuit board, 23a: non-soldered surface, 23b: soldered surface, 24: peripheral parts, 25: shield case body, 26: back Lids, 26a, 26b: shield walls, 28: lead pins, 31: integrated circuit parts, 33: terminals, 41: engaging claws, S: shield case.

Claims (1)

[Scope of utility model registration request] 1. A light-receiving element, a circuit board in which lead pins of the light-receiving element are soldered upright from the back surface, and the lead pins are bent to arrange a light-receiving portion of the light-receiving element in an arrangement hole, and the light-receiving element. And a shield case for accommodating the circuit board and electromagnetically shielding the shield case, the shield case covering the back surface of the light receiving portion of the light receiving element, and pressing and fixing the light receiving portion toward the circuit board. A light-receiving device comprising a back cover formed by extending a part of the above.