JPH06111388A - Method and mold for forming optical disk substrate - Google Patents
Method and mold for forming optical disk substrateInfo
- Publication number
- JPH06111388A JPH06111388A JP26136892A JP26136892A JPH06111388A JP H06111388 A JPH06111388 A JP H06111388A JP 26136892 A JP26136892 A JP 26136892A JP 26136892 A JP26136892 A JP 26136892A JP H06111388 A JPH06111388 A JP H06111388A
- Authority
- JP
- Japan
- Prior art keywords
- outer peripheral
- punch
- substrate
- mold
- optical disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、光ディスク基板の作成
方法及び成形金型に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming an optical disk substrate and a molding die.
【0002】[0002]
【従来の技術】従来における光ディスク基板の作成方法
としては、以下に述べるような各種の方法がある。ま
ず、第一の従来例として、特開昭57−131524号
公報に「ビデオディスクの製造方法」なるタイトルで開
示されているものがある。これは、金型を最終外径寸法
よりも大きめに形成し、外周部に無記録部を設けて成形
した後、所定の外形形状となるようにトリミングを行
い、これにより外周部の歪及び平面度等の影響が基板両
面に現れることがないようにして光ディスクの形成を行
っている。2. Description of the Related Art There are various conventional methods for producing an optical disk substrate as described below. First, as a first conventional example, there is one disclosed in Japanese Patent Application Laid-Open No. 57-131524, entitled "Method for manufacturing video disc". This is because the mold is formed to be larger than the final outer diameter, the outer peripheral part is provided with a non-recording part, and then the mold is trimmed to obtain a predetermined outer shape. The optical disc is formed so that the influence of the degree or the like does not appear on both sides of the substrate.
【0003】また、第二の従来例として、特開昭63−
99932号公報に「光ディスク用基板の製造方法」な
るタイトルで開示されているものがある。これは、金型
の注入ノズル又は外周リングに基板押し上げ段差を形成
し、光硬化性樹脂硬化物をはがす際に、注入ノズル又は
外周リングを主空間に対して相対的に軸方向に移動させ
ることにより、内径及び外径の精度、厚さ精度の優れた
光ディスク基板を高速かつ簡易に作成するものである。A second conventional example is Japanese Patent Laid-Open No. 63-
There is one disclosed in Japanese Patent No. 99932 under the title of "Method for manufacturing optical disk substrate". This is to form a step for pushing up the substrate on the injection nozzle of the mold or the outer peripheral ring, and to move the injection nozzle or the outer peripheral ring in the axial direction relative to the main space when the cured photocurable resin is peeled off. Thus, an optical disk substrate having excellent inner diameter and outer diameter accuracy and thickness accuracy can be easily produced at high speed.
【0004】[0004]
【発明が解決しようとする課題】第一の従来例の場合、
成形を行った後にトリミング加工をしなければならず面
倒である。また、第二の従来例の場合、光硬化樹脂を利
用した2P法による成形法であり、製造コストが高いと
いう問題がある。しかも、この場合、金型の中央部に設
けられた注入ノズルから流動してきた樹脂が、キャビテ
ィー内に突き出ている外周リングにより自由な流動が阻
害されるため、歪の発生が避けられない。In the case of the first conventional example,
Trimming must be done after molding, which is troublesome. Further, in the case of the second conventional example, the molding method is a 2P method using a photocurable resin, and there is a problem that the manufacturing cost is high. Moreover, in this case, since the resin flowing from the injection nozzle provided in the center of the mold is prevented from freely flowing by the outer peripheral ring protruding into the cavity, the occurrence of strain is unavoidable.
【0005】また、一般に射出成形により光ディスクの
成形を行う場合、ディスク状のキャビティー周辺部に充
填された樹脂原料には原料の射出による圧力が伝わりに
くいことによって、また、樹脂の流動が外周リングによ
り阻害されることによって、成形基板の外周部ではヒゲ
などの形状不良の発生や歪の残留が生じ、しかも、外周
部では情報記録のためのピットや案内溝の転写性が急激
に低下する。In general, when an optical disk is molded by injection molding, the resin raw material filled in the peripheral portion of the disk-shaped cavity is hard to transmit the pressure due to the injection of the raw material, and the resin flow is caused by the outer ring. As a result, the shape defects such as whiskers and residual distortion occur in the outer peripheral portion of the molded substrate, and the transferability of pits and guide grooves for recording information sharply deteriorates in the outer peripheral portion.
【0006】[0006]
【課題を解決するための手段】請求項1記載の発明で
は、光ディスク用の成形基板の最終外径よりも成形金型
のキャビティー面の内径を大きく形成し、前記成形基板
を成形する前記成形金型内に前記最終外径を決定する外
周抜きパンチを配設し、この外周抜きパンチの端面が前
記成形金型のキャビティー面と一致するように設定した
後、キャビティー内に成形体原料を充填し、充填完了後
の保圧工程の間にパンチ駆動手段により前記外周抜きパ
ンチを押し出して前記成形基板の外径を決定した。According to a first aspect of the present invention, the molding is performed in which the inner diameter of the cavity surface of the molding die is formed to be larger than the final outer diameter of the molding substrate for the optical disk. An outer peripheral punch for determining the final outer diameter is arranged in the mold, and after setting the end surface of the outer peripheral punch to coincide with the cavity surface of the molding die, the raw material for the molded body is placed in the cavity. Was filled, and the outer peripheral punching punch was extruded by the punch driving means during the pressure-holding process after the filling was completed to determine the outer diameter of the molded substrate.
【0007】請求項2記載の発明では、成形金型内に、
光ディスク用の成形基板の最終外径よりも大きな径を有
する円形状のキャビティー面を形成し、前記最終外径を
決定する位置に外周抜きパンチを形成し、この外周抜き
パンチを駆動制御するパンチ駆動手段を設けた。According to the second aspect of the invention, in the molding die,
A punch that forms a circular cavity surface having a diameter larger than the final outer diameter of a molded substrate for an optical disc, forms an outer peripheral punch at a position that determines the final outer diameter, and drives and controls the outer peripheral punch. Drive means were provided.
【0008】[0008]
【作用】請求項1記載の発明においては、光ディスク基
板を成形することにより、従来の方法で成形した基板と
比較して外周部においても歪を抑え、良好な情報記録面
の転写性の維持が達成された高精度の外径寸法をもった
成形基板を、後工程を増やすことなく得ることが可能と
なる。According to the first aspect of the present invention, by molding the optical disk substrate, distortion is suppressed even in the outer peripheral portion as compared with the substrate molded by the conventional method, and good transferability of the information recording surface can be maintained. It is possible to obtain a molded substrate having the achieved highly accurate outer diameter dimension without increasing the number of subsequent steps.
【0009】請求項2記載の発明においては、外周抜き
パンチを備えた成形金型を用いて、成形用樹脂をキャビ
ティー内に充填させた後、外周部に位置する外周抜きパ
ンチを作動させることにより、精度が高く、偏心量の少
ない光ディスク基板を作成することが可能となる。According to the second aspect of the present invention, a molding die having an outer peripheral punch is used to fill the molding resin into the cavity, and then the outer peripheral punch located at the outer peripheral portion is operated. As a result, it is possible to manufacture an optical disk substrate with high accuracy and a small amount of eccentricity.
【0010】[0010]
【実施例】本発明の一実施例を図面に基づいて説明す
る。本実施例では、光ディスク基板の作成方法を、射出
成形法に基づいて作成する場合について述べる。まず、
成形金型の全体構成について述べる。左右両側には金型
1,2が対向配置されており、これら両方の金型1,2
に挾まれた領域はキャビティーAの空間部とされてい
る。前記金型1の中央部には、成形体原料としての樹脂
(後述する樹脂9)が射出できるようにスプル3が形成
されている。また、前記金型1のキャビティーA側の面
は、円形状をなすキャビティー面1aとされている。こ
のキャビティー面1aの内径は光ディスク用の成形基板
4の最終外径rよりも大きな径を有した形となってい
る。さらに、前記キャビティー面1a内の前記成形基板
4の最終外径rを決定する位置には、外周抜きパンチ5
が配設されている。これら外周抜きパンチ5はパンチ駆
動手段としてのパンチ駆動源6により駆動制御され、金
型1内から外部に突出して移動できるようになってい
る。この場合、外周抜きパンチ5の一端面は、前記キャ
ビティー面1aに表出した形となっており、その円形状
をなすキャビティー面1aの外周より内側に円環状のご
く細い幅をもった面として存在している。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a case where the optical disc substrate is produced based on the injection molding method will be described. First,
The overall structure of the molding die will be described. The molds 1 and 2 are arranged on the left and right sides so as to face each other.
The area sandwiched between the two is the space of the cavity A. A sprue 3 is formed in the center of the mold 1 so that a resin (a resin 9 described later) as a raw material for the molded body can be injected. The surface of the mold 1 on the side of the cavity A is a circular cavity surface 1a. The inner diameter of the cavity surface 1a is larger than the final outer diameter r of the molded substrate 4 for an optical disc. Further, at the position that determines the final outer diameter r of the molded substrate 4 within the cavity surface 1a, the outer peripheral punch 5 is provided.
Is provided. The outer peripheral punch 5 is driven and controlled by a punch driving source 6 as a punch driving means, and can be moved so as to project from the inside of the die 1 to the outside. In this case, one end surface of the outer peripheral punch 5 has a shape exposed to the cavity surface 1a, and has a circular narrow width inside the outer periphery of the circular cavity surface 1a. It exists as a surface.
【0011】また、前記金型2のキャビティー面2aの
外周領域には、前記成形金型4を作成する際の外周部取
り外し用のエジェクタピン7が設けられている。さら
に、前記金型1,2の対向するキャビティー面1a,2
aの外周領域には、成形時の樹脂9の流出を防止するた
めの突起8が円周状に形成されている。Further, an ejector pin 7 for removing the outer peripheral portion when the molding die 4 is formed is provided in the outer peripheral area of the cavity surface 2a of the die 2. Further, the cavity surfaces 1a and 2 of the molds 1 and 2 which face each other.
A protrusion 8 for preventing the resin 9 from flowing out at the time of molding is circumferentially formed in the outer peripheral region of a.
【0012】このような構成において、射出成形法によ
り光ディスク基板を作成する方法について説明する。ま
ず、図2(a)において、両方の金型1,2を接近させ
型締めし、これによりキャビティーAの空間を形成す
る。その一方で、外周抜きパンチ5は未駆動の状態とし
ておき、成形体原料となる樹脂9をスプル3から射出す
る。この場合、樹脂9の射出圧は、最終外径寸法よりも
大きめに設定したキャビティー面1aの外周部の突起8
付近まで十分充填できるような圧力を設定しておく。A method of forming an optical disk substrate by the injection molding method in such a structure will be described. First, in FIG. 2A, both molds 1 and 2 are brought close to each other and clamped to form a space of the cavity A. On the other hand, the outer peripheral punch 5 is left undriven, and the resin 9 as the raw material for the molded body is injected from the sprue 3. In this case, the injection pressure of the resin 9 is set to be larger than the final outer diameter dimension, and the projection 8 on the outer peripheral portion of the cavity surface 1a is set.
Set the pressure so that it can be filled up to the vicinity.
【0013】次に、図2(b)に示すように、充填工程
後の樹脂9がまだ流動性を保持した状態にある保圧工程
中に、例えば、油圧を利用したパンチ駆動源6により外
周抜きパンチ5を、光ディスク用の成形基板4の領域と
その外側の円環部の領域とに分断できるように、対向す
るキャビティー面2aまで前進される。このようにして
保圧工程を完了させる。外周部の歪の影響を受けず、外
周部まで情報記録面が良好に転写されると共に、外径寸
法精度の優れた成形基板4を作成することができる。Next, as shown in FIG. 2 (b), during the pressure-holding step in which the resin 9 is still in a fluid state after the filling step, for example, by the punch drive source 6 utilizing hydraulic pressure, The punch 5 is advanced to the opposing cavity surface 2a so that it can be divided into a region of the molded substrate 4 for the optical disk and a region of the annular portion outside thereof. In this way, the pressure holding process is completed. It is possible to produce the molded substrate 4 which is not affected by the distortion of the outer peripheral portion and which is excellent in transferring the information recording surface to the outer peripheral portion and has excellent outer diameter dimensional accuracy.
【0014】その後、樹脂9が冷却、固化した後、金型
1,2を解放し、ロボット等を用いてその成形された成
形基板4を取り出すと共に、外周部に残存した円環体
(外周リング)10をエジェクタピン7を突出させるこ
とにより取り外す。Then, after the resin 9 has cooled and solidified, the molds 1 and 2 are released, and the formed molded substrate 4 is taken out by using a robot or the like, and at the same time, the ring-shaped body remaining on the outer peripheral portion (outer peripheral ring) is removed. ) 10 is removed by protruding the ejector pin 7.
【0015】上述したように、成形基板4は、外周リン
グ10等の物理的障害の影響を受けることなく、外周抜
きパンチ5内で流動した樹脂9の部分でのみ成形できる
ため、これにより作成される成形基板4は、その外周部
においても歪の影響を受けず、その外周部まで情報記録
面を良好に転写することができる。しかも、この場合、
成形基板4は、外周抜きパンチ5により正確に切り出さ
れているため、外径寸法の精度も向上させることができ
る。As described above, the molded substrate 4 can be molded only on the portion of the resin 9 that has flowed in the outer peripheral punch 5 without being affected by physical obstacles such as the outer peripheral ring 10, and is thus formed. The molded substrate 4 according to the present invention is not affected by the distortion even in the outer peripheral portion thereof, and the information recording surface can be excellently transferred to the outer peripheral portion. And in this case,
Since the molded substrate 4 is accurately cut out by the outer peripheral punch 5, the accuracy of the outer diameter dimension can be improved.
【0016】[0016]
【発明の効果】請求項1記載の発明は、光ディスク用の
成形基板の最終外径よりも成形金型のキャビティー面の
内径を大きく形成し、前記成形基板を成形する前記成形
金型内に前記最終外径を決定する外周抜きパンチを配設
し、この外周抜きパンチの端面が前記成形金型のキャビ
ティー面と一致するように設定した後、キャビティー内
に成形体原料を充填し、充填完了後の保圧工程の間にパ
ンチ駆動手段により前記外周抜きパンチを押し出して前
記成形基板の外径を決定したので、従来の方法で成形し
た基板と比較して外周部においても歪を抑え、良好な情
報記録面の転写性の維持が達成された高精度の外径寸法
をもった成形基板を、後工程を増やすことなく得ること
ができるものである。According to the first aspect of the present invention, the inner diameter of the cavity surface of the molding die is formed to be larger than the final outer diameter of the molding substrate for the optical disc, and the molding substrate is molded in the molding die. An outer peripheral punch for determining the final outer diameter is provided, and after setting the end surface of the outer peripheral punch to coincide with the cavity surface of the molding die, the raw material for the molded body is filled in the cavity. Since the outer diameter punch of the formed substrate was determined by pushing out the outer peripheral punch by the punch driving means during the pressure holding step after the completion of filling, distortion was suppressed even in the outer peripheral portion compared to the substrate formed by the conventional method. It is possible to obtain a molded substrate having a highly accurate outer diameter dimension in which good transferability of the information recording surface is maintained, without increasing the number of subsequent steps.
【0017】請求項2記載の発明は、成形金型内に、光
ディスク用の成形基板の最終外径よりも大きな径を有す
る円形状のキャビティー面を形成し、前記最終外径を決
定する位置に外周抜きパンチを形成し、この外周抜きパ
ンチを駆動制御するパンチ駆動手段を設けたので、成形
用樹脂をキャビティー内に充填させた後、外周部に位置
する外周抜きパンチを作動させることにより、精度が高
く、偏心量の少ない光ディスク基板を作成することがで
きるものである。According to a second aspect of the present invention, a circular cavity surface having a diameter larger than a final outer diameter of a molded substrate for an optical disk is formed in a molding die, and a position for determining the final outer diameter is formed. Since an outer peripheral punch is formed on the outer peripheral punch and a punch driving means for driving and controlling the outer peripheral punch is provided, by filling the molding resin into the cavity, the outer peripheral punch located on the outer peripheral portion is operated. It is possible to manufacture an optical disk substrate having high accuracy and a small amount of eccentricity.
【図1】本発明の一実施例である成形金型の構成を示す
縦断側面図である。FIG. 1 is a vertical sectional side view showing a configuration of a molding die that is an embodiment of the present invention.
【図2】光ディスク基板の作成方法を示す工程図であ
る。FIG. 2 is a process chart showing a method for producing an optical disc substrate.
1a キャビティー面 2a キャビティー面 4 成形基板 5 外周抜きパンチ 6 パンチ駆動手段 9 成形体原料 A キャビティー r 最終外径 1a Cavity surface 2a Cavity surface 4 Molded substrate 5 Peripheral punching punch 6 Punch driving means 9 Molded material A A cavity r Final outer diameter
Claims (2)
も成形金型のキャビティー面の内径を大きく形成し、前
記成形基板を成形する前記成形金型内に前記最終外径を
決定する外周抜きパンチを配設し、この外周抜きパンチ
の端面が前記成形金型のキャビティー面と一致するよう
に設定した後、キャビティー内に成形体原料を充填し、
充填完了後の保圧工程の間にパンチ駆動手段により前記
外周抜きパンチを押し出して前記成形基板の外径を決定
したことを特徴とする光ディスク基板の作成方法。1. An outer circumference for determining the final outer diameter in the molding die for molding the molding substrate, wherein the inner diameter of the cavity surface of the molding die is made larger than the final outer diameter of the molding substrate for the optical disk. A punching punch is disposed, and after setting the outer peripheral punching punch so that the end surface of the punch coincides with the cavity surface of the molding die, the cavity is filled with a raw material for a molded body,
A method for producing an optical disk substrate, characterized in that the outer diameter punch is pushed out by a punch driving means during a pressure-holding step after completion of filling to determine the outer diameter of the molded substrate.
も大きな径を有する円形状のキャビティー面を形成し、
前記最終外径を決定する位置に外周抜きパンチを形成
し、この外周抜きパンチを駆動制御するパンチ駆動手段
を設けたことを特徴とする成形金型。2. Forming a circular cavity surface having a diameter larger than the final outer diameter of a molded substrate for an optical disc,
A molding die, wherein an outer peripheral punch is formed at a position for determining the final outer diameter, and punch driving means for driving and controlling the outer peripheral punch is provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26136892A JPH06111388A (en) | 1992-09-30 | 1992-09-30 | Method and mold for forming optical disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26136892A JPH06111388A (en) | 1992-09-30 | 1992-09-30 | Method and mold for forming optical disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06111388A true JPH06111388A (en) | 1994-04-22 |
Family
ID=17360874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26136892A Pending JPH06111388A (en) | 1992-09-30 | 1992-09-30 | Method and mold for forming optical disk substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06111388A (en) |
-
1992
- 1992-09-30 JP JP26136892A patent/JPH06111388A/en active Pending
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