JPH06109786A - Surface electrometer - Google Patents

Surface electrometer

Info

Publication number
JPH06109786A
JPH06109786A JP25947892A JP25947892A JPH06109786A JP H06109786 A JPH06109786 A JP H06109786A JP 25947892 A JP25947892 A JP 25947892A JP 25947892 A JP25947892 A JP 25947892A JP H06109786 A JPH06109786 A JP H06109786A
Authority
JP
Japan
Prior art keywords
circuit board
impedance conversion
stage
circuit
surface electrometer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP25947892A
Other languages
Japanese (ja)
Inventor
Toshiyuki Sekiya
利幸 関谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP25947892A priority Critical patent/JPH06109786A/en
Publication of JPH06109786A publication Critical patent/JPH06109786A/en
Withdrawn legal-status Critical Current

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Abstract

PURPOSE:To provide a compact and highly precise surface electrometer capable of protecting a signal from a receiving electrode against the interference of an electrical signal for driving a physical vibration means. CONSTITUTION:A receiving electrode faced to a measurement object, a physical vibration means to cause the fluctuation of field distribution intensity between the electrode and the object with the elapse of time, an initial-stage impedance conversion circuit for sending a micro-amount of current induced in the electrode to a post-stage as detected voltage, are respectively formed on a printed circuit board 5, thereby constituting a surface electrometer. In this case, the range of the initial-stage impedance conversion circuit formed on the board 5 is covered with an insulation sheet 16 made out of an insulation sheet body 19 applied with conductive paint 20.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、物体の表面電位を非接
触で測定する表面電位計に関するもので、例えば複写機
等の電子写真装置において、感光体の表面電位を計測す
るために搭載する表面電位計に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface electrometer for measuring the surface potential of an object in a non-contact manner, which is mounted on an electrophotographic apparatus such as a copying machine for measuring the surface potential of a photoconductor. It relates to a surface electrometer.

【0002】[0002]

【従来の技術】非接触型の表面電位計としては、対象物
と受信電極の間に導電性の振動物体を置き、それにより
受信電極への電気力線入射量を振動させて電界強度を調
べるいわゆるチョッパー方式、また、受信電極自体を物
理的に振動させ、対象物体と受信電極の間の電界分布を
振動させて電界強度を調べる振動容量方式等が考案され
ている。ここではチョッパー方式についてさらに詳細に
説明するが、振動容量型においても信号受信処理に関し
ては全く同様である。
2. Description of the Related Art As a non-contact type surface electrometer, a conductive vibrating object is placed between an object and a receiving electrode, and the amount of electric force rays incident on the receiving electrode is vibrated to examine the electric field strength. A so-called chopper method, a vibrating capacitance method in which the receiving electrode itself is physically vibrated, and the electric field distribution between the target object and the receiving electrode is vibrated to check the electric field strength have been devised. Here, the chopper method will be described in more detail, but the same applies to the signal receiving process even in the vibration capacitance type.

【0003】図7は従来のチョッパー方式の表面電位計
の概要を示す要部斜視図である。1は対象物からの電気
力線を受信する受信電極、2は対象物から受信電極1へ
入射する電気力線をチョッピングする音叉、3は受信電
極に誘起される微弱な交流信号をインピーダンス変換す
るための増幅素子、4は音叉に振動を与える圧電素子、
5は回路基板、6は圧電素子4への駆動信号,受信信号
及び電源を接続するコネクタ、7は電気力線の入射方
向、8はチョッピング方向を示す。
FIG. 7 is a perspective view of a main part showing an outline of a conventional chopper type surface electrometer. Reference numeral 1 is a receiving electrode for receiving electric force lines from the object, 2 is a tuning fork for chopping electric lines of force incident on the receiving electrode 1 from the object, and 3 is impedance conversion of a weak AC signal induced in the receiving electrode. For amplification, 4 is a piezoelectric element that gives vibration to the tuning fork,
Reference numeral 5 is a circuit board, 6 is a connector for connecting a drive signal, a reception signal and a power source to the piezoelectric element 4, 7 is an incident direction of a line of electric force, and 8 is a chopping direction.

【0004】図8は図7に示した回路基板5を入れるシ
ールドケースの斜視図であり、9がそのシールドケー
ス、10は測定対象物からの電気力線を入射させる窓で
ある。
FIG. 8 is a perspective view of a shield case in which the circuit board 5 shown in FIG. 7 is inserted. Reference numeral 9 is the shield case, and 10 is a window through which the lines of electric force from the object to be measured are incident.

【0005】図9は回路基板5の上に構成される初段イ
ンピーダンス回路の概要を示す回路図である。図示のよ
うに入力抵抗11を20MΩとした電界効果トランジス
タ(以下、FETという)によるソースフォロア回路に
より、インピーダンス変換を行っている。
FIG. 9 is a circuit diagram showing an outline of a first-stage impedance circuit formed on the circuit board 5. As shown in the figure, impedance conversion is performed by a source follower circuit including a field effect transistor (hereinafter referred to as FET) having an input resistance 11 of 20 MΩ.

【0006】上記構成の表面電位計の動作を説明する。The operation of the surface electrometer having the above structure will be described.

【0007】まず、外部から供給される圧電素子駆動信
号により圧電素子4,及び音叉2が共鳴状態となり、矢
印8で示すチョッピング方向に物理的・機械的な振動を
起こす。すると、対象物からシールドケース9の窓10
を通過して受信電極1に入射する電気力線の量が振動に
合わせて増減する。これにより受信電極1と入力抵抗1
1に微弱な交流誘動電流が発生し、これが電圧信号とし
てFETゲートに印加される。FET回路はソースフォ
ロア回路となっているので、増幅度1のインピーダンス
変換が成されソースより電圧信号が出力される。この信
号がコネクタ6を通じて外部の信号処理回路(図示せ
ず)へ転送され後処理が行われる。この出力信号から表
面電位を最終的に導き出す方式はさまざまな方式が考案
されているが、ここでは主題でないので説明は行わな
い。この出力信号の大きさは対象物の電位の大きさに比
例するのでいかにS/N比の高い初段増幅信号を後処理
回路に伝達できるかが、表面電位計としての基本性能を
決定することになる。
First, the piezoelectric element 4 and the tuning fork 2 are brought into a resonance state by a piezoelectric element drive signal supplied from the outside, and a physical / mechanical vibration is generated in a chopping direction shown by an arrow 8. Then, the window 10 of the shield case 9 from the target object
The amount of the lines of electric force passing through and entering the receiving electrode 1 increases or decreases according to the vibration. As a result, the receiving electrode 1 and the input resistance 1
A weak AC induced current is generated at 1, and this is applied to the FET gate as a voltage signal. Since the FET circuit is a source follower circuit, impedance conversion with an amplification factor of 1 is performed and a voltage signal is output from the source. This signal is transferred to an external signal processing circuit (not shown) through the connector 6 for post-processing. Various methods have been devised for finally deriving the surface potential from the output signal, but since they are not the subject here, they will not be described. Since the magnitude of this output signal is proportional to the magnitude of the potential of the object, how to transmit the first-stage amplified signal with a high S / N ratio to the post-processing circuit determines the basic performance of the surface electrometer. Become.

【0008】[0008]

【発明が解決しようとする課題】近年、装置の小型化へ
の要求が広い分野において高まっている中で、例えば複
写機に搭載される表面電位計に対しても、設置スペース
の問題から一層の小型,薄型化が求められている。小型
化を行う上で最も大きな問題となるのは圧電素子4およ
び音叉2を共鳴させる機械的な振動発生のための駆動信
号が受信電極1からの信号に混入する割合が増加するこ
とである。測定対象物からの入力信号分と駆動信号から
の混入分は当然周波数が同一であるため、それらを分離
することは難しく、計測精度の低下を引き起こす。
In recent years, demands for downsizing of devices have been increasing in a wide range of fields, and even for a surface electrometer mounted on a copying machine, for example, due to the problem of installation space, it is more important. It is required to be small and thin. The biggest problem in miniaturization is that the ratio of the drive signal for generating mechanical vibration that causes the piezoelectric element 4 and the tuning fork 2 to resonate into the signal from the receiving electrode 1 increases. Since the input signal component from the measurement object and the mixed component from the drive signal have the same frequency as a matter of course, it is difficult to separate them and the measurement accuracy is degraded.

【0009】駆動信号の混入経路は空中からの直接入
射、基板表面を通じた導電経路、及び基板上絶縁物の帯
電による間接入射が主に考えられている。この中でも基
板上絶縁物の帯電による影響は高性能電位計を実現する
上では無視できない量であり、特に初段増幅回路近くの
レジストでの間接入射が問題となりやすい。しかしなが
ら、初段増幅回路の入力部は濕度などによるインピーダ
ンス低下が発生すると純信号分の低下をまねくため、レ
ジストによるオーバーコートが必須構成である。
The driving signal mixing paths are mainly considered to be direct incidence from the air, a conductive path through the surface of the substrate, and indirect incidence by charging an insulator on the substrate. Among these, the effect of charging the insulator on the substrate is an amount that cannot be ignored in realizing a high-performance electrometer, and in particular, indirect incidence on the resist near the first-stage amplifier circuit tends to be a problem. However, when the impedance of the input circuit of the first-stage amplifier circuit decreases due to the frequency, etc., it causes a decrease in the amount of a pure signal, and therefore an overcoat with a resist is essential.

【0010】図10は入力部回路パターンの概要を示す
説明図である。ハッチングをした符号12の部分はシー
ルドを示し、13は印刷抵抗、14は回路パターンラン
ド、一点鎖線で囲んだ符号15の部分はレジスト部を示
している。
FIG. 10 is an explanatory diagram showing an outline of the input circuit pattern. The hatched portion 12 is a shield, 13 is a printed resistor, 14 is a circuit pattern land, and 15 is a resist portion surrounded by an alternate long and short dash line.

【0011】一般に入力抵抗は10M〜100MΩと高
抵抗にする必要があるため、図10に示すように入力抵
抗部の印刷は梯子状に形成される。そのため入力部の中
で占める面積割合が高く、レジスト表面を介した間接混
入の殆どは初段インピーダンス変換回路の入力抵抗部分
からとなっている。
Generally, since the input resistance needs to be as high as 10 M to 100 MΩ, the printing of the input resistance portion is formed in a ladder shape as shown in FIG. Therefore, the area ratio in the input portion is high, and most of the indirect mixing through the resist surface is from the input resistance portion of the first-stage impedance conversion circuit.

【0012】この発明は、上記従来技術の問題点を解消
するために成されたもので、受信電極からの信号に物理
的振動手段を駆動する電気信号が混入することを防止し
た小型、高精度の表面電位計を提供することを目的とす
るものである。
The present invention has been made in order to solve the above-mentioned problems of the prior art, and is small in size and highly accurate in which signals from the receiving electrodes are prevented from being mixed with electrical signals for driving the physical vibrating means. The purpose of the present invention is to provide a surface electrometer.

【0013】[0013]

【課題を解決するための手段】このため、この発明に係
る表面電位計は、測定対象物に対向する受信電極、該受
信電極と測定対象物の間の電界分布強度を時間的に変動
させる物理的振動手段、および前記受信電極に誘起され
る微少電流を検出電圧として後段に送るための初段イン
ピーダンス変換回路を回路基板上に形成した表面電位計
であって、前記回路基板に形成した初段インピーダンス
変換回路の範囲を絶縁シートでカバーし、該絶縁シート
の上にシールド部材を重ねてカバーして成る構成、或
は、回路基板はアルミナ基板により形成し、前記初段イ
ンピーダンス変換回路の入力抵抗は前記物理的振動手段
を設置する回路基板の面とは逆の面に印刷した厚膜抵抗
体により形成し、前記回路基板をレジスト部材または絶
縁シートを介してシールドケース内に取付けして成る構
成によって、前記の目的を達成しようとするものであ
る。
Therefore, the surface electrometer according to the present invention is a physical unit that temporally changes the intensity of the electric field distribution between the receiving electrode facing the measuring object and the receiving electrode and the measuring object. Is a surface electrometer formed on a circuit board by a dynamic vibration means and a first-stage impedance conversion circuit for sending a minute current induced in the receiving electrode as a detection voltage to a subsequent stage, the first-stage impedance conversion circuit formed on the circuit board. The circuit area is covered with an insulating sheet, and a shield member is overlaid on the insulating sheet, or the circuit board is formed of an alumina substrate, and the input resistance of the first stage impedance conversion circuit is the physical resistance. Formed by a thick film resistor printed on the surface opposite to the surface of the circuit board on which the dynamic vibrating means is installed, and the circuit board is shielded through a resist member or an insulating sheet. The mounting and comprising a configuration in Rudokesu, is intended to achieve the above object.

【0014】[0014]

【作用】以上の構成により、回路基板に形成した初段イ
ンピーダンス変換回路の範囲は、絶縁シートと更にその
上に重ねたシールド部材によってカバーされているため
に、或は初段インピーダンス変換回路の入力抵抗は前記
物理的振動手段を設置する回路基板の面とは逆の面に印
刷した厚膜抵抗体により形成し回路基板をレジスト部材
または絶縁シートを介してシールドケース内に取付けし
て成る構成によって、物理的振動手段を駆動する電気信
号が初段インピーダンス変換回路へ直接混入、或は帯電
による間接混入することを防止でき、受信電極からの信
号に物理的振動手段を駆動する電気信号が混入すること
がなく、小型、高精度の表面電位計を構成することがで
きる。
With the above construction, the range of the first-stage impedance conversion circuit formed on the circuit board is covered by the insulating sheet and the shield member further stacked thereon, or the input resistance of the first-stage impedance conversion circuit is The physical vibrating means is formed by a thick film resistor printed on the surface opposite to the surface of the circuit board, and the circuit board is mounted in a shield case through a resist member or an insulating sheet. It is possible to prevent the electric signal for driving the mechanical vibrating means from directly mixing into the first-stage impedance conversion circuit or indirectly mixing by charging, and the electric signal for driving the physical vibrating means does not mix with the signal from the receiving electrode. A small and highly accurate surface electrometer can be configured.

【0015】[0015]

【実施例】以下、この発明に係る表面電位計を実施例に
より説明する。
EXAMPLES The surface electrometer according to the present invention will be described below with reference to examples.

【0016】図1は第1実施例の特徴ある要部を示す要
部断面図であり、前記従来の表面電位計と同一または相
当部分は同一符号で示し重複説明を省略する。なお図示
以外の構成は前記従来の表面電位計等の構成に準じてい
る。
FIG. 1 is a sectional view showing an essential part of the first embodiment, and the same or corresponding parts as those of the conventional surface electrometer are designated by the same reference numerals and their duplicate description will be omitted. The structure other than that shown is based on the structure of the conventional surface electrometer.

【0017】5は回路基板であり、18は基板本体、1
7は配線パターン,印刷抵抗及びレジストを含んだ回路
形成層を示している。16は絶縁シートであり、絶縁シ
ート本体19の上に導電塗料20を塗布して形成されて
いる。26は基板をシールドケース9に固定するビスで
あり、このビス26により絶縁シート本体19上の導電
塗料面29はシールド電位に接続される。
5 is a circuit board, 18 is a board body, 1
Reference numeral 7 indicates a circuit forming layer including a wiring pattern, a printing resistor and a resist. Reference numeral 16 denotes an insulating sheet, which is formed by applying a conductive coating material 20 on the insulating sheet main body 19. Reference numeral 26 is a screw for fixing the substrate to the shield case 9, and the conductive paint surface 29 on the insulating sheet body 19 is connected to the shield potential by the screw 26.

【0018】図2は、第1実施例の絶縁シートの概要を
示す平面図であり、21は受信電極用、22は音叉駆動
信号引き出し用、23は増幅素子用、24はコネクタ用
のそれぞれ切り抜き穴を示している。この絶縁シート1
6を図1の断面図に示すように回路基板5の上に設置す
ることにより、圧電素子、音叉を駆動する信号が直接初
段増幅回路入力部に入ることを、また、レジスト部に一
旦帯電して混入することを防止でき、S/N比が向上す
る。
FIG. 2 is a plan view showing the outline of the insulating sheet of the first embodiment. 21 is a cutout for receiving electrodes, 22 is a tuning fork drive signal extraction, 23 is an amplifying element, and 24 is a connector. Shows a hole. This insulation sheet 1
By installing 6 on the circuit board 5 as shown in the cross-sectional view of FIG. It can be prevented from being mixed in and the S / N ratio is improved.

【0019】(第2実施例)前述の第1実施例では、入
力抵抗部を音叉,増幅素子等が乗った回路基板の上面に
構成した例であるが、第2実施例は入力抵抗部を回路基
板5の下面側に形成してある。
(Second Embodiment) The first embodiment described above is an example in which the input resistance portion is formed on the upper surface of the circuit board on which the tuning fork, the amplifying element, etc. are mounted. It is formed on the lower surface side of the circuit board 5.

【0020】図3は回路パターンの概要を示す説明図で
ある。
FIG. 3 is an explanatory view showing the outline of the circuit pattern.

【0021】回路基板5上面の回路パターンは図3に示
すように、受信電極1用のランドから直ちにスルーホー
ルを通して下面に行き、下面で従来例と同様な梯子型の
抵抗を印刷形成してある。
As shown in FIG. 3, the circuit pattern on the upper surface of the circuit board 5 immediately goes from the land for the receiving electrode 1 to the lower surface through the through hole, and a ladder-type resistor similar to the conventional example is printed and formed on the lower surface. .

【0022】抵抗パターンを下面に形成したことによ
り、上面においては入力部のレジスト面積が従来より縮
少される。また回路基板5の下面に形成される抵抗部分
に対応する上面はシールド面となっているために、駆動
信号の混入は直接入射混入,間接入射混入とも微少とな
る。
By forming the resistance pattern on the lower surface, the resist area of the input portion on the upper surface is reduced as compared with the conventional case. Further, since the upper surface corresponding to the resistance portion formed on the lower surface of the circuit board 5 is a shield surface, the mixing of the drive signal is minimal in both direct incident mixing and indirect incident mixing.

【0023】但し、回路基板5の下面において、抵抗印
刷部がシールドケース9とショートする恐れがある場
合、例えばレジスト厚が薄い、抵抗値調整によるトリミ
ングで露出部があるなどの場合、さらには回路部分とシ
ールドケース9との間の容量が問題となる場合には、図
4の平面図に示す絶縁シート19の厚みを最適化して、
図5の断面図に示すように回路基板5の下面に敷き、シ
ールドケース9に固定することによって駆動信号の混入
と、シールドケース9へのショートを防止することがで
きる。
However, on the lower surface of the circuit board 5, if there is a risk that the resistance printed portion may short-circuit with the shield case 9, for example, if the resist thickness is thin, or if there is an exposed portion due to trimming by resistance value adjustment, the circuit is further When the capacitance between the portion and the shield case 9 becomes a problem, the thickness of the insulating sheet 19 shown in the plan view of FIG. 4 is optimized,
As shown in the cross-sectional view of FIG. 5, by laying it on the lower surface of the circuit board 5 and fixing it to the shield case 9, it is possible to prevent mixing of drive signals and short circuit to the shield case 9.

【0024】(第3実施例)図6は本発明の第3実施例
の要部断面図である。
(Third Embodiment) FIG. 6 is a sectional view of the essential parts of a third embodiment of the present invention.

【0025】第3実施例は、回路基板5の上にまず絶縁
シート本体19を、そして絶縁シート本体19の上に導
電性シート27を重ねた構成に特徴があり、他の構成は
前記実施例に準じている。そして前記実施例と同様の効
果を有している。
The third embodiment is characterized in that the insulating sheet body 19 is first placed on the circuit board 5, and then the conductive sheet 27 is placed on the insulating sheet body 19. According to. And it has the same effect as the above-mentioned embodiment.

【0026】[0026]

【発明の効果】以上説明したように、この発明によれ
ば、回路基板に形成した初段インピーダンス変換回路の
範囲は、絶縁シートと更にその上に重ねたシールド部材
によってカバーされているために、或は初段インピーダ
ンス変換回路の入力抵抗は前記物理的振動手段を設置す
る回路基板の面とは逆の面に印刷した厚膜抵抗体により
形成し回路基板をレジスト部材または絶縁シートを介し
てシールドケース内に取付けして成る構成によって、物
理的振動手段を駆動する電気信号が初段インピーダンス
変換回路への直接混入、或は帯電による間接混入するこ
とを防止でき、受信電極からの信号に物理的振動手段を
駆動する電気信号が混入することがなく、小型、高精度
の表面電位計を提供することができる。
As described above, according to the present invention, since the range of the first-stage impedance conversion circuit formed on the circuit board is covered by the insulating sheet and the shield member further stacked thereon, The input resistance of the first stage impedance conversion circuit is formed by a thick film resistor printed on the surface opposite to the surface of the circuit board on which the physical vibrating means is installed, and the circuit board is placed in a shield case through a resist member or an insulating sheet. With the configuration configured to be attached to, it is possible to prevent the electric signal for driving the physical vibrating means from being directly mixed into the first-stage impedance conversion circuit or indirectly mixed by charging, and the physical vibrating means is added to the signal from the receiving electrode. It is possible to provide a small-sized and high-precision surface electrometer without mixing of an electric signal for driving.

【図面の簡単な説明】[Brief description of drawings]

【図1】 第1実施例の要部断面図である。FIG. 1 is a sectional view of an essential part of a first embodiment.

【図2】 第1実施例の絶縁シートの平面図である。FIG. 2 is a plan view of the insulating sheet of the first embodiment.

【図3】 第2実施例の回路パターン説明図である。FIG. 3 is an explanatory diagram of a circuit pattern according to a second embodiment.

【図4】 第2実施例の絶縁シートの平面図である。FIG. 4 is a plan view of an insulating sheet according to a second embodiment.

【図5】 第2実施例の要部断面図である。FIG. 5 is a sectional view of an essential part of a second embodiment.

【図6】 第3実施例の要部断面図である。FIG. 6 is a cross-sectional view of essential parts of a third embodiment.

【図7】 従来の表面電位計の要部斜視図である。FIG. 7 is a perspective view of a main part of a conventional surface electrometer.

【図8】 従来の表面電位計のシールドケースの斜視図
である。
FIG. 8 is a perspective view of a shield case of a conventional surface electrometer.

【図9】 初段インピーダンス回路の回路図である。FIG. 9 is a circuit diagram of a first-stage impedance circuit.

【図10】 従来の表面電位計の入力部回路パターン説
明図である。
FIG. 10 is an explanatory diagram of an input portion circuit pattern of a conventional surface electrometer.

【符号の説明】[Explanation of symbols]

1 受信電極 2 音叉 3 増幅素子 4 圧電素子 5 回路基板 7 電気力線の入射方向 8 チョッピング方向 9 シールドケース 16 絶縁シート 17 回路基板の回路形成層 18 基板本体 19 絶縁シート本体 20 導電塗料 1 Receiving Electrode 2 Tuning Fork 3 Amplifying Element 4 Piezoelectric Element 5 Circuit Board 7 Incident Direction of Electric Force Line 8 Chopping Direction 9 Shielding Case 16 Insulating Sheet 17 Circuit Forming Layer of Circuit Board 18 Board Body 19 Insulating Sheet Body 20 Conductive Paint

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 測定対象物に対向する受信電極、該受信
電極と測定対象物の間の電界分布強度を時間的に変動さ
せる物理的振動手段、および前記受信電極に誘起される
微少電流を検出電圧として後段に送るための初段インピ
ーダンス変換回路を回路基板上に形成した表面電位計で
あって、前記回路基板に形成した初段インピーダンス変
換回路の範囲を絶縁シートでカバーし、該絶縁シートの
上にシールド部材を重ねてカバーして成ることを特徴と
する表面電位計。
1. A receiving electrode facing a measurement object, a physical vibrating means for temporally varying an electric field distribution intensity between the reception electrode and the measurement object, and a minute current induced in the reception electrode is detected. A surface electrometer in which a first-stage impedance conversion circuit for sending to the latter stage as a voltage is formed on a circuit board, and the range of the first-stage impedance conversion circuit formed on the circuit board is covered with an insulating sheet, A surface electrometer, which is formed by covering and covering a shield member.
【請求項2】 測定対象物に対向する受信電極、該受信
電極と測定対象物の間の電界分布強度を時間的に変動さ
せる物理的振動手段、および前記受信電極に誘起される
微少電流を検出電圧として後段に送るための初段インピ
ーダンス変換回路を回路基板上に形成した表面電位計で
あって、前記回路基板はアルミナ基板により形成し、前
記初段インピーダンス変換回路の入力抵抗は前記物理的
振動手段を設置する回路基板の面とは逆の面に印刷した
厚膜抵抗体により形成し、前記回路基板をレジスト部材
または絶縁シートを介してシールドケース内に取付けし
て成ることを特徴とする表面電位計。
2. A receiving electrode facing a measurement object, a physical vibrating means for temporally varying an electric field distribution intensity between the reception electrode and the measurement object, and a minute current induced in the reception electrode is detected. A surface electrometer in which a first-stage impedance conversion circuit for sending as a voltage to a subsequent stage is formed on a circuit board, wherein the circuit board is formed of an alumina substrate, and the input resistance of the first-stage impedance conversion circuit is the physical vibration means. A surface electrometer formed by a thick film resistor printed on the surface opposite to the surface of the circuit board to be installed, and the circuit board is mounted in a shield case via a resist member or an insulating sheet. .
JP25947892A 1992-09-29 1992-09-29 Surface electrometer Withdrawn JPH06109786A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25947892A JPH06109786A (en) 1992-09-29 1992-09-29 Surface electrometer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25947892A JPH06109786A (en) 1992-09-29 1992-09-29 Surface electrometer

Publications (1)

Publication Number Publication Date
JPH06109786A true JPH06109786A (en) 1994-04-22

Family

ID=17334642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25947892A Withdrawn JPH06109786A (en) 1992-09-29 1992-09-29 Surface electrometer

Country Status (1)

Country Link
JP (1) JPH06109786A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006162457A (en) * 2004-12-08 2006-06-22 Canon Inc Electric potential measuring device and image forming apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006162457A (en) * 2004-12-08 2006-06-22 Canon Inc Electric potential measuring device and image forming apparatus

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