JPH06109764A - Semiconductor measurement device with probe card - Google Patents

Abstract

PURPOSE:To provide a semiconductor measurement device having a probe card, capable of freely changing the arrangement of probe needles via a simple means, and further provide a semiconductor measurement device having a probe card, capable of freely changing the number of probe needles. CONSTITUTION:Regarding a semiconductor measurement device fitted with a probe card 10 having a plurality of arrayed probe needles 24, the card 10 has needle seats 18 laid between the opposite frame members 14 and 15 of a frame body 12 in such a way as movable in parallel along the lengthwise direction of the members 14 and 15. Each of the seats 18 has a slidable support section 22 at both ends for sliding motion along the frame members 14 and 15, and further has a rail 20 with both ends supported on two slidable support sections 22 and a needle block 26 mounted on the rail 20 in such a way as slidable thereon. Also, the probe needles 24 are laid on the needle block 26. The block 26 is preferably provided in such a way as freely mounted on and demounted from the rail 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor measuring device equipped with a probe card in which a large number of probe needles are arranged.
More specifically, a probe card improved so as to easily adapt the placement of the probe needles corresponding to a sample in which the measurement points to be brought into contact with the probe needles are dispersed in an arbitrary placement pattern is provided. Semiconductor measuring device.

[0002]

2. Description of the Related Art A conventional semiconductor measuring device equipped with a probe card in which a large number of probe needles are arranged, for example, TDD.
In the probe card used in the B (Time Dependence Dielectric Breakdown) measuring device, a large number of probe needles are fixed to a predetermined position of the probe card in a predetermined arrangement, and from there, it can be easily attached to other parts of the probe card. It is not movable.

Here, the TDDB device is a device for measuring how the electrical insulation of a sample changes according to the elapsed time, for example, I formed on a semiconductor wafer.
It is used to efficiently test the change over time of the electrical insulation of electronic circuit dies such as C and LSI. General TDDB
Automatically or manually contact the probe needles provided on the probe card with the electrodes of each die, and test the electrical insulation characteristics of each die with an external tester connected to the probe needles. This is a device for identifying the determined die. A probe card is, for example, a card in which a large number of conductive probe needles are arranged in accordance with the arrangement of electrodes so as to connect the electrodes of each die to a test circuit. The probe needle is a probe needle that contacts the electrodes of each die in the probe card and connects the electrodes to the test circuit.

[0004]

In the conventional semiconductor measuring device, the above-mentioned TDDB device will be described as an example.
The probe needle provided on the probe card is an arrangement of electrodes to be measured on each die formed on the semiconductor wafer,
That is, they were fixed in an arrangement according to the arrangement pattern of the electrodes. However, since the number and arrangement of the electrodes of the die formed on the semiconductor wafer are various, depending on the application of the semiconductor device of the final product, therefore, a large number of probe needles should be arranged according to the electrode arrangement of the semiconductor wafer. It was necessary to separately prepare a probe card for each semiconductor wafer to be measured.

It is necessary to prepare a probe card according to the number of electrodes and the electrode arrangement pattern of each semiconductor wafer.
The cost is high, the management of the probe card is difficult, and the measurement time is long because the probe card is replaced. Therefore, there has been a demand for the realization of a semiconductor measuring device equipped with a probe card capable of freely changing the number of probe needles and the arrangement pattern thereof. In view of the above demands, an object of the present invention is to first provide a semiconductor measuring device provided with a probe card in which the arrangement of probe needles can be freely changed by a simple means, and second, the probe needles are provided. It is an object of the present invention to provide a semiconductor measuring device equipped with a probe card whose number can be freely changed.

[0006]

In order to achieve the above first object, the semiconductor measuring device according to the present invention is a semiconductor measuring device provided with a probe card in which a plurality of probe needles are arranged. , A needle receiving base that is movably installed in a longitudinal direction of the frame member between mutually facing frame members of a frame forming the probe card, and the needle receiving base is attached to the frame member at both ends thereof. A rail having slide supporting portions each sliding along the rail, and a rail whose both ends are supported by two slide supporting portions, and a needle block attached to the rail so as to be slidable along the rail. And the probe needle is provided on the needle block.

The present invention can be applied to a semiconductor measuring device provided with a probe card in which a plurality of probe needles are arranged, and its measuring application is not limited. The probe needle used in the semiconductor measuring device according to the present invention is a conventionally known probe needle, and the semiconductor measuring device itself excluding the probe card has the same structure as the conventional semiconductor measuring device.
In the present invention, the number of needle receiving bases is not limited, and a desired number of needle receiving bases can be installed on the frame of the probe card by increasing the size of the frame. Also,
There is no limitation on the number of needle blocks to be mounted on one needle receiving base, and by increasing the length of the needle receiving base, a desired number of needle blocks can be mounted on one needle receiving base. .

The number of rails provided on the needle pedestal is not particularly limited as long as the needle block can be mounted on the rails so as to slide along the rails. For example, one strip of flat plate is used as a rail, a through hole having a cross section that matches the outer shape of the rail is provided in the needle block, and the rail is pierced through the needle block so that the rail slides along the rail. It is also possible to mount a needle block on the track so that it can move. The cross-sectional shape of the rail can be circular, elliptical, rectangular, or any other shape, and the shape of the sliding portion of the needle block with respect to the rail is also set accordingly.

In order to achieve the above-mentioned second object, the above-mentioned semiconductor measuring device is characterized in that the needle block is detachably attached to the rail.

[0010]

As described above, by providing the probe needle on the needle block which is slidable along the rail, the X- which forms one direction of the probe card, for example, the surface of the probe card.
It is possible to move the position of the probe needle in the X direction on the Y plane. Further, since a rail is provided between the frame members that form the probe card and are opposed to each other, the needle pedestal that is movably installed in the longitudinal direction of the frame member is provided.
It is possible to move the position of the probe needle in the Y direction of the probe card by translating the needle holder. Therefore, on the XY plane forming the surface of the probe card, it is possible to move the plurality of probe needles in the X and Y directions and arrange them in a desired arrangement. Further, since the needle block holding the probe needles can be freely attached and detached from the rail, it is possible to arrange a desired number of probe needles on the probe card.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in more detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a probe card of a semiconductor measuring device according to the present invention.
FIG. 2 is a front view of the probe card shown in FIG. 1. Probe card 10 used in the semiconductor measuring device according to the present invention
Is provided between the frame body 12 formed in a rectangular shape and the frame lateral members 14 and 15 facing each other of the frame body 12, and the frame lateral member 1
A large number of needle receiving bases 18 slidable along guide portions 16 respectively provided on inner edge portions of 4, 15 which face each other.
It consists of and. The lateral frame member 15 is detachably attached to the frame body 12.

As shown in FIG. 3, the needle receiving base 18 has sliding supporting portions 22, 22 at both ends in the longitudinal direction thereof, respectively.
Both ends are supported by the sliding support portion 22 and are arranged parallel to each other and parallel to the surface of the frame body 2
It is formed from circular rails 20, 20 of a book. The two rails 20 and 20 support a large number of needle blocks 26 between the two rails 20, and can slide and move in the longitudinal direction of the rail 20. Note that FIG. 3A is a plan view of the slide support portion 22, and FIG. 3B is a perspective view thereof.
Further, FIG. 4 is a perspective view of the needle block 24.

The sliding support portion 22 is formed so as to be supported by the frame lateral members 14 and 15 and to be slidably movable along a guide portion 16 provided on the inner edge of the frame lateral members 14 and 15. ing. FIG. 5 shows the state in which the sliding support portion 22 is supported by the frame lateral member 14 in FIG.
6 is an enlarged perspective view of a portion "a". In the present embodiment, as shown in FIG. 5, the sliding support portion 22 is formed in a "U" shape and extends horizontally from the base end portion 28. By sandwiching the frame lateral members 14, 15 between the existing two upper and lower leg portions 30, 32, the frame lateral members 14, 15 are supported by the frame lateral members 14, 15, and the guide portion 1 is provided.
6 is configured to be slidable. Further, the upper leg portion 30 of the slide support portion 22 is provided with a threaded hole that penetrates through the slide support portion 22. Member 14,
It can be fixed at a desired position on 15. Note that it is not always necessary to fix the sliding support portion with a fixing screw as in the present embodiment, and for example, the two leg portions 30 and 32 can be slid but are formed at intervals such that they do not move easily. By doing so, it is possible to replace the fixing means with screws.

As shown in FIG. 4, the needle block 26 has a width slightly longer than the interval between the rails 20 and has receiving grooves 36 formed of semicircular recesses on both widthwise side surfaces thereof. The needle block 26 is slidably supported by the two rails in such a manner that the receiving grooves 36, 36 are fitted between the two rails 20, 20. Further, the needle block 26
The needle block 26 is retained at an arbitrary position on the rail 20 so that the needle block 26 can be locked by the cooperation between the rail receiving groove 36 and the two rails 20, that is, the friction between the surface of the rail 20 and the surface of the receiving groove 36. be able to. Preferably, a material with a large friction coefficient,
The frictional force between the rail 20 and the needle block 26 can be appropriately increased by using, for example, a rubber or plastic material.

The shape of the receiving groove 36 should be determined according to the shape of the rail 20. For example, when the rail 20 has a prism shape, the receiving groove has a groove cross section corresponding to the prism shape. For example, when the rail 20 has a regular triangular cross section, the cross section of the groove is formed in a V shape having an apex angle of 60 °. Needle block 26
As shown in FIG. 4, the probe needle 24
Is equipped with. The probe needle 24 extends downward from the lower surface of the needle block 26, contacts the electrode or the like to be measured at its tip, and its upper portion penetrates the needle block 26 and can be connected to a lead wire 39 coming from the outside. It constitutes the terminal 38. The probe needle 24 has a shape bent at a right angle in order to reduce the impact when the probe needle is used.

The sliding support portion 2 on the side opposite to the leg portions 30 and 32
A hole into which the rail 20 is fitted is provided in the base end portion 28 of the rail 2, and the rail 20 is supported by the sliding support portion 22 by being fitted in the hole. At least one of the slide supporting portions 22 at both ends of the rail 20 is fitted with the rail 20 so as to be able to be pulled out, whereby the slide supporting portion 2 is provided.
2 can be easily removed from the rail 20.

In order to remove the needle block 26 from the needle receiving base 18, first, the fixing screw 34 is loosened to free the sliding support portion 22, and then the frame lateral member 1 which is removable.
5 is removed from the frame body 12, and the needle holder 18 is further attached to the frame body 1.
Separate from 2. One slide support portion 22 of the separated needle receiving base 18 is removed from the rail 20, and then the needle block 26 is moved in the direction of arrow V along the rail 20 as shown in FIG.
Slide and remove the needle blocks 26 until the desired number is reached. When increasing the number of needle blocks 26, the arrow W
Slide it in the direction of and insert it between the rails 20, 20.

With the above construction, the number of needle blocks 26 of one needle holder 18 is adjusted to a desired number, and then the needle blocks 26 are slid along the rails 20 in the X direction of FIG. Can be placed in the position. Further, the needle receiving base 18 in which the needle block 26 is arranged at a desired position is slid in the Y direction of FIG. 1 along the guide portion 16 provided on the inner edge portion of the frame lateral member 14 and arranged at the desired position. can do. By performing the above operation, an arbitrary number of probe needles 24 can be easily arranged in a desired arrangement pattern that matches the measurement position pattern of the sample to be measured.

FIG. 7 is a perspective view of a modified example 40 of the needle block. This needle block 40 is replaced with the semicircular receiving groove 36 of the needle block 26 described above, and two parallel circular shapes. It has through holes 42, 42. By passing the circular rail 20 through the through hole, the needle block 40 is
It can be slidably supported at a desired position on the zero.

[0020]

According to the present invention, the needle receiving base is installed between the opposing frame members of the frame forming the probe card so as to be translatable in the longitudinal direction of the frame member, and both ends of the needle receiving base are provided. A sliding support part that slides along a frame member, a rail whose both ends are supported by two sliding support parts, and a needle block attached to the rail so that it can slide along the rail. The probe card is improved so that the probe needle can be freely and easily arranged in an arbitrary arrangement by constructing the needle holder from the above and providing the probe needle on the needle block.
Further, by allowing the needle block to be detachably attached to the rail, the number of probe needles arranged on the probe card can be freely adjusted. In the semiconductor measuring device according to the present invention, by freely changing the number of screw probe needles and the arrangement pattern thereof, one probe card can be used for various measured samples in which measurement points are arranged in various patterns. It is possible to respond. Therefore, for example, it is not necessary to prepare a probe card according to the number of electrodes and the electrode arrangement pattern of each semiconductor wafer, and the time required for exchanging the probe card can be saved, so that the measurement time can be shortened accordingly. .

[Brief description of drawings]

FIG. 1 is a plan view of an example of a probe card of a semiconductor measuring device according to the present invention.

FIG. 2 is a front view of the probe card of FIG.

FIG. 3 (a) is a plan view of a needle holder.
(B) is a perspective view of the needle receiving base with all the needle blocks removed.

FIG. 4 is a perspective view of a needle block.

5 is a perspective view showing a sliding support portion of the needle receiving base shown in FIG.

FIG. 6 is an explanatory diagram showing a state when the needle block is removed from the needle receiving base.

FIG. 7 is a perspective view showing a modified example of the needle block.

[Explanation of symbols]

 10 Probe Card of Semiconductor Measuring Device According to the Present Invention 12 Frame 14 Frame Horizontal Member 15 Frame Horizontal Member Removable from Frame 16 Guide Part 18 Needle Cage 20 Rail 22 Sliding Support 24 Probe Needle 26 Needle Block 28 Base End Part 30, 32 Leg part 34 Fixing screw 36 Receiving groove 38 Wiring terminal 40 Modification of needle block 42 Through hole

Claims (2)

[Claims] 1. A semiconductor measuring device comprising a probe card in which a plurality of probe needles are arranged, wherein the probe card is provided between frame members facing each other of frame bodies forming the probe card. The needle receiving base is provided so as to be translatable in the longitudinal direction. The needle receiving base is provided at both ends thereof with slide supporting portions that slide along the frame member, and further, the two slide supporting units are provided. A rail whose both ends are supported by a rail, and a needle block mounted on the rail so as to be slidable along the rail, wherein the probe needle is provided in the needle block. A semiconductor measuring device equipped with a probe card. 2. The semiconductor measuring device with a probe card according to claim 1, wherein the needle block is detachably attached to the rail.