JPH06109763A - Emulation probe - Google Patents

Abstract

PURPOSE:To provide an emulation probe allowing an application to the target LSI of a standard operating procedure(SOP) package having a small terminal pitch, and further allowing an easy manufacture at low cost. CONSTITUTION:This probe has a flat cable 3, a connector 2 for connecting one end of the cable 3 to an in-circuit emulator 21 and the probe end section of a flexible board 5 connected to the other end of the cable 3 via a freely detachable connector 4. Also, the the flexible board 5 has an electrode soldered and fixed in such a way as superposed on an electrode suitable for an SOP type package LSI terminal formed on a target system board 22. As the flexible board 5 is provided with an electrode soldered for connection to the electrode on the target system (board) 22, wiring and an electrode used even for a small pitch terminal can be easily manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microcomputer development tool, and more particularly to an emulation probe for connecting a development support device such as an in-circuit emulator to a target system. Regarding

[0002]

2. Description of the Related Art In the development of a microcomputer, development of both hardware and software is often done in parallel, and in this case, the development support system for the microcomputer plays an important role. Generally, debugging software including the target system is performed by connecting an external device (in-circuit emulator and control station) to the target system.

An emulation probe for a flat package, which is the object of the present invention, connects an in-circuit emulator (hereinafter referred to as ICE) to a substrate (target system) on which an LSI to be developed is mounted. Signals are exchanged between the target system and the target system via this emulation probe.

FIG. 5 is a side view showing a conventional emulation probe and related equipment. In the figure, connector 2
Is a connecting portion between the ICE 21 and an emulation probe (hereinafter abbreviated as probe) 11, and a signal from the ICE 21 is transmitted to the probe 11 through this connector 2. The dummy chip 12 is configured by embedding a conductor 13 on the side surface of an insulator having a rectangular parallelepiped shape. Conductor 13
Target system 22 to be developed
It contacts each of the terminals of the socket 24 mounted on it. The connection between the probe 11 and the target system 22 is made by inserting the dummy chip 12 into the socket 24.

FIG. 6A is a view of the socket 24 as seen from above. Inside the socket 24, conductors 25 are arranged at a pitch matching the conductors 13 of the dummy chip 12, and each of the conductors can be soldered to the electrodes 23 of the substrate to which the LSI shown in FIG. 6B is to be connected. To the outside as a terminal.

[0006]

The conventional emulation probe described above has a structure in which a dedicated socket having the same shape as the LSI and a dummy chip connected to the socket are used to connect to the turquet system (board). Has become. However, since the socket and the dummy chip have a structure in which conductors are embedded in the insulator as many as the terminals of the LSI, the mold used for manufacturing requires extremely high precision. For this reason, the smaller the pitch between the terminals of the target LSI, the more difficult it becomes to manufacture a mold for the socket and the dummy chip that match this, and the further the terminal pitch becomes smaller, the more difficult the manufacture becomes. There is also a problem that the price becomes expensive. Further, there is a problem that even if the LSI is directly mounted on the target system (board) after completion of debugging, it cannot be done unless the socket is removed.

[0007]

An emulation probe for a flat package of the present invention is used for connecting an in-circuit emulator and a target system (board) on which an LSI for developing on-chip software is to be mounted, and a cable. And a means for connecting one end of the cable to the in-circuit emulator, a means for connecting the other end of the cable to the probe tip and a probe tip, and the probe tip is a thin and flexible flexible printed wiring board. The surface of the board, which is connected to the target system board, has electrodes having the same pitch as the terminals of the LSI to be mounted on the board.

In the emulation probe of the present invention, the probe tip is made of a thin and flexible printed wiring board, and electrodes having the same pitch as the terminals of the LSI to be mounted on the target board are provided on both surfaces of the board. Have.

[0009]

The present invention will be described below with reference to the drawings. FIG. 1 is a side view showing a state in which an in-circuit emulator (ICE) and a target system (board) are connected by an emulation probe for a flat package according to an embodiment of the present invention. In the figure, the emulation probe 1 of the present invention is composed of an ICE 21 and a flat cable 3.
A connector 2 for connecting one end of the cable 3, a cable 3, and a flexible substrate 5 forming a probe tip connected to the other end of the cable 3 by a detachable connector 4.

FIG. 2 is a plan view of the flexible substrate as seen from above. In the figure, the flexible substrate 5 forming the tip of the probe is a substrate made of a thin and flexible material, and has wiring inside, but it will not be broken or broken by some bending. The electrode 6 connected to the wiring is suitable for a small outline package (called SOP) which is a surface mounting package in which lead wires are drawn out only on two long sides of the four sides, and the terminal pitch is 0. It is very small, 5 mm. Electrode 6
In addition, there is no substrate between the electrodes, and there is a gap, and the electrode 23 and the electrode 23 on the target system (substrate) 2 shown in FIG. You can However, in the end, the electrodes 6 of the flexible substrate 5 are connected to the target substrate 2
It is fixed by soldering while being in contact with the electrode 23 on the upper surface 2. Considering that the flexible substrate 5 is a single substrate, it is possible to carry out fine wiring, and the electrodes 6 can also be wired at a fine pitch.

As described above, the emulation probe of the present invention can be easily manufactured by using the flexible substrate for connection with the target system substrate even when the terminal pitch of the target LSI is as small as SOP.

As described above, the emulation probe 1 of the present invention uses the flexible substrate 5 for connection with the target system 22 so that the LS of the target is
Even if the terminal pitch of I is as small as SOP, it can be easily created.

FIG. 4 is a side view for explaining the second embodiment of the present invention.

Generally, at the time of debugging, the emulation probe 1 is connected to the electrode 23 on which the LSI of the target system is to be mounted as shown in FIG. 1, but after the debugging is completed, the actual LSI is mounted on the target system. You may want to use it. In the emulation probe of the present invention, the flat cable 3 and the flexible substrate 7 can be separated by the connector. Also, since the electrodes of the flexible substrate 7 are on both sides, the L
The SI 10 can be mounted on this flexible substrate 7. In this way, the flexible substrate 7 that has already been connected to the target system 22 can be removed without removing it.
There is a merit that the system can be evaluated by mounting SI10.

[0015]

As described above, the emulation probe for a flat package according to the present invention is easier to manufacture as compared with the conventional dedicated socket for connection because the flexible substrate is used for the connection portion with the target system. The LSI can be applied to fine pitch LSIs, and the development cost can be reduced. Further, by mounting the LSI directly on the flexible substrate, there is an effect that evaluation of the LSI after debugging can be performed in the same target system.

[Brief description of drawings]

FIG. 1 is a side view showing a state in which an in-circuit emulator and a target system (board) are connected by an emulation probe according to an embodiment of the present invention.

2 is a plan view of the flexibel substrate (probe tip portion) of FIG. 1. FIG.

FIG. 3 is a plan view of electrodes on the target system (substrate) of FIG.

FIG. 4 is a side view showing a state in which a second embodiment of the present invention, a target system (board), and a target LSI are combined.

FIG. 5 is a side view for explaining a conventional emulation probe.

6A is a plan view of the socket of FIG. 5, and FIG. 6B is a plan view of electrodes on a target system (substrate).

[Explanation of symbols]

 1 Emulation Probe 2 Connector 3 Flat Cable 4 Connector 5 Flexible Board (Probe Tip) 6 Probe Electrode 7 Flexible Board of Example 2 21 In-Circuit Emulator 22 Target System (Board) 23 Electrode on Target System Board

Claims (3)

[Claims] 1. An emulation probe for a flat package for connecting between an in-circuit emulator and a target system (board) on which an LSI for which on-chip software is to be developed is to be mounted, one end of which is formed by connecting means. The probe has a cable connected to the in-circuit emulator and a probe tip connected to the other end of the gable, and the probe tip should be mounted on the target system (board). An emulation probe comprising a flexible printed wiring board in which electrodes are provided in accordance with electrodes having the same pitch as terminals of an LSI. 2. The emulation probe according to claim 1, wherein the electrode at the tip of the probe is fixed on the electrode of the target system (substrate) by soldering. 3. The electrode at the tip of the probe is provided on the upper surface of the substrate for soldering and fixing the electrode on the lower surface of the substrate for overlapping and fixing the electrode on the target system (base) by soldering. The emulation probe according to claim 1, comprising an electrode.