JPH06107832A - Easily bondable and coatable polyehylene terephthalate resin base and its production - Google Patents

Abstract

PURPOSE:To provide the title base which sufficiently adheres to an insulating resin applied thereto by coating a polyethylene terephthalate resin base with a primer resin having good adhesive ness. CONSTITUTION:A polyethylene terphthalate resin base 1 is coated with a primer 2 comprising 100 pts.wt. polyester resin, 10-70 pts.wt. vinyl chloride-vinyl acetate copolymer, and 5-40 pts.wt. polyurethane resin, thus giving the title base. A conductive pattern 3 is formed on this base, which is then coated with an insulating resin 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of subjecting a substrate made of a polyethylene terephthalate resin to an easy-adhesion coating, and an easily-adhesive-coated polyethylene terephthalate resin substrate produced by the method. Particularly, the present invention relates to a method for producing an easily adhesive coating polyethylene terephthalate resin film for producing a flexible printed circuit by providing a wiring pattern and further coating an insulating resin, and an easily adhesive coating polyethylene terephthalate resin film obtained by the method.

[0002]

2. Description of the Related Art Conventionally, a polyethylene terephthalate resin film has a weak adhesive force with other resins, and when the polyethylene terephthalate resin film is coated with another resin, the resin surface is previously subjected to an easy adhesion treatment. Was there. Usually, when the polyethylene terephthalate resin film is subjected to an easy adhesion treatment, the surface of the polyethylene terephthalate resin film is obtained by passing the polyethylene terephthalate resin film so that it is immersed in an aqueous polyester resin tank before being stretched. It was designed to be easily adhered. In addition, if the polyethylene terephthalate film is subjected to corona discharge treatment,
Plasma processing was performed.

[0003]

In recent years, a circuit pattern film in which a polyethylene terephthalate film surface is subjected to an easy-adhesion treatment, a conductive circuit pattern is formed on the polyethylene terephthalate film surface, and an insulating resin is applied thereon, that is, a so-called flexible printed circuit. Are used in various electronic products.

However, the conventional polyethylene terephthalate film easy-adhesion treatment has a drawback in that the adhesiveness to the insulating resin applied thereon is not sufficient and peeling easily occurs. Therefore, in order to sufficiently adhere the polyethylene terephthalate resin base material and the insulating resin applied thereon, the present invention applies a primer resin having good adhesion to the polyethylene terephthalate resin base material to facilitate adhesion coating polyethylene terephthalate. An object of the present invention is to provide a method for producing a resin substrate and an easily adhesive coating polyethylene terephthalate resin substrate produced by the method.

[0005]

In order to solve the above-mentioned problems, the present invention provides a polyethylene terephthalate resin substrate with 10 to 10 parts by weight of a vinyl chloride / vinyl acetate copolymer per 100 parts by weight of a polyester resin. A method for producing an easily adhesive coating polyethylene terephthalate resin substrate, which comprises applying a primer containing 70 parts by weight and 5 to 40 parts by weight of a polyurethane resin. The mixing ratio of the resin of the primer is more preferably 30 to 50 parts by weight of a vinyl chloride / vinyl acetate copolymer and 10 to 30 parts by weight of a polyurethane resin with respect to 100 parts by weight of a polyester resin. .

In the formulation of the above-mentioned primer, if the vinyl chloride / vinyl acetate copolymer is used in a large amount, blocking becomes difficult, but on the contrary, the adhesiveness becomes poor, and 70 parts by weight of the vinyl chloride / vinyl acetate copolymer is added. If it exceeds, a problem arises in the adhesiveness to both the polyethylene terephthalate resin substrate and the insulating resin. If it is less than 10 parts by weight, blocking cannot be prevented.

The polyethylene terephthalate resin base material is preferably subjected to corona treatment or plasma treatment in advance in order to further improve the adhesiveness. As the form of the polyethylene terephthalate resin base material used in the present invention, a film, a plate or the like can be applied. From the viewpoint of heat resistance and dimensional stability, it is desirable to use a biaxially stretched product.

The easily adhesive coating polyethylene terephthalate resin substrate obtained by the method of the present invention is preferably used for flexible printed circuits. Such flexible printed circuits include, for example, those shown in the sectional views of FIGS. 1, 2, 3, and 4. In the figure, 1 is a base material, 2 is a primer, 3 is a conductive pattern, and 4, 5 and 6 are insulating resins.

There are roughly two methods for forming the conductive pattern 3, one of which is a conductive material made of powder such as silver, nickel, copper and graphite, short fibers or scales. Is a method of forming a conductive ink by dispersing it in a binder of a resin such as an epoxy resin or a polysiloxane resin in a desired pattern by silk screen printing or the like. The other is a method in which a metal such as aluminum, copper, or silver is vapor-deposited or electroless-plated on the base material 1 to form a film, and this is patterned into a desired pattern by a photoetching method.

Examples of products using this conductive pattern 3 are circuits, printed wiring boards, hybrid integrated circuits, electrodes,
There are digitizers, liquid crystal display elements, circuit parts, capacitors (film capacitors, capacitor parts on integrated circuits), coils (inductance parts on integrated circuits), resistors, and the like. A photosensitive negative or positive type resin is used for the insulating resins 4, 5, and 6. Specifically, the negative type resin includes a resin composed of bisazide and a diene rubber and a combination thereof, a polyvinyl cinnamate resin,
Examples of the composition include a monomer having a polymerizable double bond, a thiol group or an epoxy group in the molecule, a prepolymer or an oligomer to which a photoreaction initiator is added, as a main component. More specifically, for example, urethane acrylates, polyester acrylates, polyfunctional acrylates such as epoxy acrylates, unsaturated polyesters, polyvinylpyrrolidone, etc. to which benzotriazoles, benzophenones, triethylamine, etc. are added as reaction initiators. is there.

Examples of the positive type resin include naphthoquinone azide type resin. These insulating resins 4, 5,
As the coating method of 6, the insulating resin 4, 5, 6 is coated with a resin solution diluted with an appropriate diluting solvent as required by roll coating, gravure coating, comma coating, spinner coating, silk screen printing or the like. . The coating thickness depends on the type of resin and the required insulation, but is usually 1-2.
00 μm (when dried). Visible rays or ultraviolet rays (UV) are used to cure the insulating resins 4, 5, and 6.

[0012]

Example 1 Polyester resin UE-3200
5 parts by weight (product name: manufactured by Unitika), 2 parts by weight of VAGH (product name: manufactured by Union Carbide), which is a vinyl chloride / vinyl acetate copolymer, 1 part by weight of an isophorone diisocyanate (IPDI) polyurethane resin. Were mixed to prepare a primer. A PET film (ICI, 125 μm thick) obtained by subjecting this primer to corona discharge treatment in advance.
m) was coated on the m) so that the coating amount was 0.8 g / m ² . This coating was dried in an oven at 80 ° C for 1 minute and then aged at 50 ° C for 4 days.

A circuit pattern was formed on the obtained easily-adhesive-coated PET film by using a silver paste. Further, a negative type photosensitive resin composed of bisazide and diene rubber was applied as an insulating resin on this, and the resin was cured by exposing it to light. PET film / easy-adhesion coating / conductive pattern obtained as described above, and PE
A peeling strength test, that is, a so-called cross-cut cellophane tape peeling test was performed on a portion having a layer structure of T film / easy-adhesion coating / insulating resin as follows. In order to cut the coating surface completely, but not the base material completely, make cuts with a knife on 11 squares × 11 horizontal grids at 1 mm intervals, and then cut with scotch tape (registered). Trademark: Nichiban Co., Ltd., 18 mm width) is attached, and when this is peeled off, N pieces out of 100 squares (0 ≦ N
≦ 100) If the grid is peeled off, remove this by N / 100
Evaluate. As a result of this peeling strength test, the PET film / easy-adhesion coating / conductive pattern, and the part consisting of the PET film / easy-adhesion coating / insulating resin layer constitution were all 100/100, and the adhesion of each layer was excellent. I found out.

[0014]

EFFECT OF THE INVENTION The polyethylene terephthalate resin base material having an easy-adhesion coating obtained by the present invention has good adhesion between the polyethylene terephthalate resin base material and the primer, and further, the primer and the insulating resin and conductive material applied on the primer. The adhesiveness with the sex pattern was also good. Therefore, the polyethylene terephthalate resin base material and the insulating resin applied thereon can be sufficiently adhered.

The easily-adhesive-coated polyethylene terephthalate resin substrate obtained by the present invention does not cause so-called blocking, which is a phenomenon in which a surface overlapping the easily-adhesive coating surface is adhered and hardened even when wound and stored.

[Brief description of drawings]

FIG. 1 shows a cross section of a flexible printed circuit.

FIG. 2 shows a cross section of another flexible printed circuit.

FIG. 3 shows a cross section of yet another flexible printed circuit.

FIG. 4 shows a cross section of yet another flexible printed circuit.

[Explanation of symbols]

 1 Base Material 2 Primer 3 Conductive Pattern 4, 5, 6 Insulating Resin

Claims (4)

[Claims] 1. A primer prepared by mixing 10 to 70 parts by weight of a vinyl chloride / vinyl acetate copolymer and 5 to 40 parts by weight of a polyurethane resin with 100 parts by weight of a polyester resin is coated on a polyethylene terephthalate resin substrate. A method for producing an easily-adhesive-coated polyethylene terephthalate resin substrate, which comprises: 2. The polyester resin 10 as the primer
The easily adhesive coating polyethylene terephthalate resin substrate according to claim 1, wherein 30 to 50 parts by weight of a vinyl chloride / vinyl acetate copolymer and 10 to 30 parts by weight of a polyurethane resin are blended with 0 part by weight. Method. 3. The method for producing an easily-adhesive-coated polyethylene terephthalate resin base material according to claim 1, wherein the polyethylene terephthalate resin base material has been previously corona-treated or plasma-treated. 4. An easily adhesive coating polyethylene terephthalate resin substrate produced by the method for producing an easily adhesive coating polyethylene terephthalate resin substrate according to claim 1.