JPH06104297A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To attach adhesive resin on the entire back face of a semiconductor chip and to secure a complete adhesion by applying the film-like orientable adhesive resin to the back face of a semiconductor wafer and by cutting the oriented adhesive resin accurately at partitioning places. CONSTITUTION:Orientable adhesive resin 5 is applied to a semiconductor wafer 1 and then the semiconductor wafer is diced to divide it into discrete semiconductor chips 1a. By using such material as liquid crystal polymer and thermoplastic resin for the orientable adhesive resin 5, the orientable adhesive resin can easily be applied and oriented vertically to the semiconductor wafer 1. When dividing the wafer into the discrete semiconductor chips 1a, a dicing saw 6 is used and the wafer 1 is cut from a front surface. At that time, the wafer 1 is cut until midway in the depth. The cutting depth is such that while the wafer 1 is cut by the dicing saw 6, the semiconductor chips 1a are kept in a body without being separated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device characterized by a method of connecting a semiconductor chip divided from a semiconductor wafer to a lead frame.

[0002]

2. Description of the Related Art As a method of connecting a semiconductor chip to a lead frame, there is a method of using an adhesive resin. Then, there are the following three types of methods of using this adhesive resin.

First, after applying the liquid adhesive resin dissolved in an organic solvent or the like to a portion of the lead frame on which the semiconductor chip is mounted, the semiconductor chip is placed and then the adhesive resin is applied. Is a method of curing.

Secondly, the adhesive resin in the form of a semi-cured film without using an organic solvent is cut into the size of a semiconductor chip to be mounted, the film is placed on a lead frame, and the film is placed on the lead frame. A semiconductor chip is placed and heated to melt and cure the adhesive resin, and the adhesive resin is connected.

As a third method, there is a method in which a film-shaped adhesive resin is attached to a semiconductor wafer and then cut into semiconductor chips. The third method will be described below with reference to the drawings. FIG. 3 is a cross-sectional view showing a conventional semiconductor device manufacturing method in which a resin film is attached to a wafer and, after dicing, is pushed up by push-up pins to be divided into chips. The operation will be described below.

First, the semiconductor wafer 1 is diced.
Before making a notch, a film-like adhesive resin 2 is attached to the back surface of the semiconductor wafer 1. Next, semiconductor chip 1
When cut into a, the push-up pin 3 pushes up and the adhesive resin 2 is cut at the same time. Then, the semiconductor chip 1a is adsorbed on the adsorption collet 4, the semiconductor chip 1a is placed on a lead frame, and heated to melt and cure the adhesive resin.

[0007]

However, the above-mentioned conventional method has the following problems.

In the first conventional method of applying a liquid adhesive resin to a lead frame with a nozzle, in order to wet the entire back surface of the semiconductor chip, it is necessary to devise a nozzle shape or the like. There is a method of preparing a nozzle for each when the size changes. In addition, when heat-cured, the contained organic solvent may evaporate and evaporate, which may cause voids inside.

The second conventional method, in which a film-shaped adhesive resin cut to the size of a semiconductor chip is placed on a lead frame, is difficult to be placed accurately at that position, and a positional shift easily occurs. .

The third conventional method, in which a film-like adhesive resin is attached to a semiconductor wafer and then cut into semiconductor chips, compensates for the drawbacks of the second method. There is no fear of misalignment between 1a and the adhesive resin 2. In addition, the film-like adhesive resin 2 does not contain an organic solvent, and thus voids do not occur therein. However, in the third method, when the semiconductor wafer 1 to which the film-shaped adhesive resin 2 is attached is divided and cut into the semiconductor chips 1a, it is necessary to cut the film-shaped adhesive resin 2 as well. If the adhesive resin 2 is not cut and the semiconductor wafer 1 is cut halfway,
When the semiconductor chip 1a is divided thereafter, as shown in FIG. 3, the adhesive resin 2 to be attached to each semiconductor chip 1a
Peeled off, and the adhesion cannot be secured when connecting the lead frame. Alternatively, a part of the adhesive resin 2 to be bonded to the adjacent semiconductor chip 1a may remain excessively on one semiconductor chip 1a. However, when the adhesive resin 2 is cut, there is a problem that the film-shaped adhesive resin 2 adheres to the cutting blade (dicing blade), and the cutting blade causes clogging due to the adhesive resin to significantly reduce workability. there were.

[0011]

The present invention solves the above problems and has the following configuration. That is, a step of sticking a film-shaped orienting adhesive resin oriented vertically to a semiconductor wafer on the back surface of the semiconductor wafer, a step of making a cut in the middle of the semiconductor wafer according to the size of the semiconductor chip, and a semiconductor chip division At the same time, the method is characterized by including a step of breaking the film-like oriented adhesive resin into a chip state and a step of connecting a semiconductor chip having the film-like oriented adhesive resin to a lead frame.

[0012]

According to the present invention, with the above-described structure, the film-shaped orienting adhesive resin attached to the back surface of the semiconductor wafer can accurately cut the orienting adhesive resin from the dividing points even if the conventional chip dividing method is used. Since the adhesive resin is secured on the entire back surface, perfect adhesion can be easily secured when the semiconductor chip is connected to the lead frame.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be described with reference to.

FIG. 1 is a sectional view showing one step of this embodiment. FIG. 1 shows a state in which the orienting adhesive resin 5 is attached to the semiconductor wafer 1 and is diced to divide it into individual semiconductor chips 1a. By using a material such as a liquid crystal polymer or a thermoplastic resin for the orientation adhesive resin 5, it is possible to easily attach the orientation adhesive resin 5 in a state of being oriented vertically to the semiconductor wafer 1. After that, the dicing saw 6 is used to cut into individual semiconductor chips 1 a by making cuts from the surface of the semiconductor wafer 1. At this time, the depth of the cut is set to the middle of the semiconductor wafer 1, and the depth of the cut is a depth which is held by the dicing saw 6 so that the semiconductor chips 1a are not separated during the cutting of the semiconductor wafer 1. Never cut into the oriented adhesive resin 5. If the thickness of the semiconductor wafer 1 is about 600 μm, the depth of cut is 500 μm.
A depth of about 90% may be achieved in about m.

Next, FIG. 2 is a cross-sectional view showing one step of this embodiment, in which a semiconductor wafer 1 having a cut in the state of FIG.
Shows a state in which is divided into individual semiconductor chips 1a and removed. The semiconductor chip 1a is pushed up by the push-up pins 3 in a state where a cut is made in the semiconductor wafer 1 partway. At that time, the semiconductor wafer 1 is divided into chips. At the same time, the orientation adhesive resin 5 adhered to the semiconductor wafer 1 is vertically cut from the portion where the semiconductor chip 1a is divided due to its orientation. Therefore, the adhesive is completely secured for each semiconductor chip 1a. After that, the semiconductor chip 1a is adsorbed to the adsorption collet 4 and heated and melted on the mounted lead frame to be adhered.

[0016]

According to the present invention, in the connection of the semiconductor chip to the lead frame, the adhesion of all the semiconductor chips is improved, and at the same time, the same chip dividing method as the conventional one can be used at the time of manufacturing. It is extremely effective in practice.

[Brief description of drawings]

FIG. 1 is a sectional view showing a step of a method of manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a step in a method of manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a state in which a resin film is attached to a wafer and divided into chips in a conventional method for manufacturing a semiconductor device.

[Explanation of symbols]

 1 Semiconductor Wafer 1a Semiconductor Chip 2 Adhesive Resin 3 Push-up Pin 4 Adsorption Collet 5 Oriented Adhesive Resin 6 Dicing Saw

Claims (1)

[Claims] 1. A step of adhering a film-shaped orienting adhesive resin oriented vertically to a semiconductor wafer on the back surface of the semiconductor wafer, and a step of making a cut in the middle of the semiconductor wafer according to the size of a semiconductor chip, A step of splitting the film-shaped orientation adhesive resin into a chip state at the same time as dividing the semiconductor chip, and connecting a semiconductor chip having the film-shaped orientation adhesive resin to a lead frame. Of manufacturing a semiconductor device.