JPH06102828B2 - Strip coating device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an apparatus for forming a film on a strip by vacuum deposition or ion plating, and particularly divides a vapor flow forming chamber and a film forming chamber. The present invention relates to improvement of the opening of a partition plate.

[Prior Art] FIG. 5 shows a typical configuration of a wide vapor deposition apparatus or an ion plating apparatus. In this device, a device main body 11 in a vacuum atmosphere is vertically divided by a partition plate 12, a vapor flow forming chamber 13 is formed in the lower part, and a film forming chamber 14 is formed in the upper part. In the vapor flow forming chamber 13, a water-cooled integrated copper crucible 15 containing a metal material M for vapor deposition such as aluminum, tin, or titanium is arranged in the lower part, and an electron gun 16 and a trajectory of an electron beam from the electron gun 16 are arranged on a side portion. A control means 17 such as a biaxial deflection coil for controlling the is provided. Furthermore, the hood 18 is arranged above the crucible 15,
An electrode 19 is arranged above the hood 18. The electrode 19 is connected to the positive electrode side of the DC power source 19, and the crucible 15 is connected to the negative electrode side. The partition plate 12 has an opening 12a, and the strip S runs in the film forming chamber 14.

In this vapor deposition apparatus, the vapor deposition metal material M in the crucible 15 is heated and melted by the electron beam from the electron gun 16, and the vapor flow thereof is attached to the strip S through the opening 12a of the partition plate 12 to form a film. To do. In this case, the film thickness distribution of the film formed on the strip S in the plate width direction has a problem that the center is thick and both sides are thin. In order to solve this problem, the width of the crucible 15 is set to the strip plate S.
It is proposed to be larger than the width of
Japanese Unexamined Patent Publication (Kokai) No. 62-70576), this method has a problem that the yield is deteriorated and cannot be said to be a good countermeasure. Furthermore, when a sublimable substance such as chromium is vapor-deposited by ion plating, the discharge is not always uniform, and the film thickness in the part centered on the arc spot becomes thicker, which causes a problem that the film thickness becomes uneven. there were. In order to solve this problem, measures such as changing the electron beam heating method have been considered, but it is difficult to solve by such measures alone due to the heat capacity of the heating object, and Measures were desired.

[Technical Problem to be Solved by the Invention] The present invention has been made in view of the above circumstances, and an object of the present invention is to open an opening when a film is formed on a wide strip or a long strip. (EN) Provided is a strip plate film forming apparatus capable of making the film thickness uniform by varying the area.

[Means for Solving the Problem] That is, the present invention provides a strip plate film forming apparatus for depositing a metal on a running strip plate to form a film on the strip plate surface.
An apparatus body in which a chamber for forming a film forming vapor stream and a chamber for adhering the vapor flow to a strip plate to form a film are formed separately.
A partition plate provided with an opening that divides the vapor flow forming chamber and the film forming chamber and guides the vapor flow from the vapor flow forming chamber to the film forming chamber, and the opening of the partition plate in the width direction of the strip plate. A plurality of opening / closing plates which are arranged along the strip and are slidable in the longitudinal direction of the strip, means for measuring the film thickness distribution of the film formed on the strip in the width direction of the strip, and an output signal from this measuring means. An opening / closing plate drive means for slidingly operating each of the opening / closing plates based on the above to adjust the opening area of the opening in the opening, and a film forming apparatus for a strip plate.

According to this apparatus, the film distribution in the width direction of the strip plate is detected, and the area of the opening is appropriately adjusted in response to this, thereby making the film thickness distribution in the width direction of the strip plate uniform. This makes it possible to deal with the film thickness distribution in which the film thickness at the central portion is large and the film thicknesses on both sides are small, and it is also possible to cope with fluctuations in the film thickness due to abnormal discharge.

[Examples] Hereinafter, the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of a strip film forming apparatus according to the present invention, and FIG. 2 is a schematic view thereof. In this device, a device body 11 to be in a vacuum atmosphere is vertically divided by a partition plate 12, a vapor flow forming chamber 13 is formed in the lower part, and a film forming chamber 14 is formed in the upper part. In the steam flow forming chamber 13,
A water-cooled integrated copper crucible 15 containing a metal material M for vapor deposition of aluminum, tin, titanium or the like is arranged in the lower part, and an electron gun 16 and a biaxial deflection coil for controlling the trajectory of the electron beam from the electron gun are arranged on the side parts. A control means 17 is provided. Further, a hood 18 is arranged above the crucible 15 and an ionization electrode 19 is arranged above the hood 18 (see FIG. 3). DC power supply
The electrode 19 is connected to the positive electrode side of 20, and the crucible 15 is connected to the negative electrode side. A strip S is running in the film forming chamber 14. The partition plate 12 has an opening 12a, and a plurality of opening / closing plates 21 ... Are arranged along the width direction of the strip on the downstream side (right side in the drawing) of the opening 12a in the strip traveling direction. These opening / closing plates 21 are slidable along the longitudinal direction (traveling direction) of the strip S. Each of these opening / closing plates 21 is an opening / closing plate driving means 22.
The opening / closing plate driving means 22 slides each opening / closing plate 21 on the opening along the longitudinal direction (traveling direction) of the strip S. The opening / closing plate driving means 22 is connected to each film thickness detector 23. Each film thickness detector 23 detects the film thickness at a predetermined position in the width direction of the strip S, and outputs the detected film thickness signal to the opening / closing plate driving means 22, and the opening / closing plate driving means 22 outputs the signal. The opening / closing plate 21 is driven based on the signal. That is, when the film thickness is large, the opening area is adjusted by moving the opening portion in the closing direction, and when the film thickness is thin, moving the opening portion in the opening direction.

In this device, the electron beam from the electron gun 16 causes the metallic material M
Are heated to form a vapor stream, which is collected in the hood 18, ionized by the electrode 19, and adheres to the strip S through the opening 12a to form a film.

Here, the effectiveness of being able to control the film thickness by changing the opening area of the opening was confirmed using the following numerical model.

In the above equation, m: Evaporation amount density distribution α: Vertical angle at which the vapor deposition material scatters m ₀ : Vertical vapor density of the vapor p: Vapor pressure of vapor at temperature T M: Molecular weight of vapor n : Directional parameter for evaporation T: Temperature of evaporated material.

Using this numerical model, assuming that the crucible surface temperature is uniform,
W (width of strip) = 500 mm, H (distance from surface of metal material to strip) = 0.9 W, crucible size 500 × 150 mm, slit opening 246 × 510 mm, and n = 1 for numerical analysis. At this time, the ratio of the maximum film thickness and the minimum film thickness in the width direction of the strip was 1.36. On the other hand, as shown in Fig. 4, the area of the partition plate opening
D ₁ = 510mm, D ₂ = 165mm, D ₃ = 180mm, d ₁ = 246mm, d ₂ = 11
When adjusted to 0 mm, the maximum and minimum film thickness ratio was 1.04.

Further, under the same conditions as in the above numerical analysis of W = 500 mm and H = 450 mm, aluminum was vapor-deposited under the conventional fixed opening area (opening 246 × 510 mm) and the opening size shown in FIG. As a result, the ratio of the maximum film thickness to the minimum film thickness was 1.4 in the conventional case, but in the present invention, the film thickness ratio was improved to 1.05, confirming the effectiveness of the present invention.

[Effects of the Invention] As described above, according to the present invention, when vapor deposition or ion plating is performed on a wide strip or a long strip, the thickness of the central portion tends to be large and the thickness of both sides tends to be small. Even if the film thickness fluctuates due to abnormal discharge, the size and shape of the opening are changed accordingly, so that a uniform film thickness can be stably obtained in the width direction of the strip plate. is there.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a strip film forming apparatus of the present invention, FIG. 2 is a schematic view of the apparatus, and FIG. 3 shows an opening / closing plate attached to an opening of a partition plate and a mechanism for opening and closing the opening / closing plate. Explanatory drawing, 4th
FIG. 5 is a diagram showing the size and shape of the opening used in the embodiment of the present invention, and FIG. 11 …… Device body, 12 …… Partition plate, 12a …… Opening part, 13…
… Vapor flow forming chamber, 14 …… Film forming chamber, 15 …… Water cooling integrated copper crucible, 16 …… Electron gun, 17 …… Control means, 18 …… Hood, 19 …… Ionizing electrode, 20 …… DC power supply, 21 ... Open / close plate, 22 ... Open / close plate driving means, 23 ... Film thickness detector

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Kibe 1-2-1, Marunouchi, Chiyoda-ku, Tokyo Inside Nippon Steel Tube Co., Ltd. (72) Koji Matsui 1-2-1, Marunouchi, Chiyoda-ku, Tokyo Nihon Steel Pipe Co., Ltd. (56) Reference JP-A-62-270772 (JP, A) JP-A-62-290868 (JP, A)

Claims (1)

[Claims] Claim: What is claimed is: 1. A strip film coating apparatus for depositing a metal on a running strip to form a coating on the surface of the strip. A chamber for forming a vapor stream for film formation, and a vapor stream attached to the strip. The device main body is divided into a chamber for film formation and a partition with an opening for dividing the vapor flow forming chamber and the film forming chamber and guiding the vapor flow from the vapor flow forming chamber to the film forming chamber. A plate, a plurality of opening / closing plates that are arranged in the opening of the partition plate along the width direction of the strip and are slidable in the longitudinal direction of the strip, and a film formed on the strip in the width direction of the strip. A means for measuring the film thickness distribution, and an opening / closing plate driving means for slidingly operating the respective opening / closing plates based on an output signal from the measuring means to adjust the opening area of the openings in the openings. Strip plate film forming device.