JPH06100067A - Holder for electronic part - Google Patents

Abstract

PURPOSE:To enable electronic parts to be held on a holder appropriately and enable them, after removal from the holder, to be easily mounted on a circuit substrate. CONSTITUTION:A layer of electroconductive adhesive 14 is formed on a surface of a carrier 12. Each of electronic parts 16 is stuck and held on the carrier 12 in a manner of having only the external electrodes of the electronic part 16 in contact with the electroconductive adhesive 16. The electronic part 16, when removed from the carrier 12, is separated in such a manner as to leave the electroconductive adhesive 14 sticking to the external electrodes. After removal, the electronic part 16 is connected with a circuit substrate electrically and mechanically by the electroconductive adhesive 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component holder, and more particularly to an electronic component holder such as a carrier tape or tray for holding an electronic component provided with an external electrode.

[0002]

2. Description of the Related Art A conventional electronic component holder 1 is shown in FIG.
There are a magazine 2 shown in FIG. 7, a carrier tape 3 shown in FIG. 18, a tray 4 shown in FIG. Retaining portions 5a, 5b and 5c of these electronic component holders 1
Has been designed with some allowance for the dimensions of the electronic component 6 so that a gap for easily inserting and removing the electronic component 6 is formed.

[0003]

In such a conventional electronic component holder 1, since the holders 5a, 5b and 5c have a margin, the holders 5a, 5b,
The electronic component 6 vibrates in 5b and 5c, and FIG.
As shown in FIG. 18B or FIG. 18B, the electronic parts 6 cannot be taken out because they are caught in the holding portions 5a and 5b, and as shown in FIG. 18C or FIG. There was the problem of becoming irregular. Such a problem was particularly remarkable when the size of the electronic component 6 was reduced.

When the size of the electronic component 6 is small, the pattern 8 on the circuit board 7 shown in FIG. 20 is also small, so that it is difficult to fix the electronic component 6 to the pattern 8 with solder 9 or the like. there were. Therefore, a main object of the present invention is to provide an electronic component holder capable of appropriately holding a small electronic component in a holding portion and easily mounting the taken-out electronic component on a circuit board.

[0005]

According to the present invention, in an electronic component holder having a holding portion for holding an electronic component provided with an external electrode, peeling is possible at least in a portion of the holding portion where the external electrode contacts. Thus, the electronic component holder is characterized in that the conductive adhesive is applied and the electronic component is adhered to the holding portion by the conductive adhesive.

[0006]

For example, the external electrodes of the electronic component are adhered by the conductive adhesive applied to the holding portion of the electronic component holder,
The electronic component is fixed to the holder. Then, when the electronic component is taken out, the conductive adhesive is peeled from the holding portion, so that the electronic component is taken out in a state where the conductive adhesive is attached to the external electrodes. Therefore, the electronic component may be electrically and mechanically connected to the pattern of the circuit board by the conductive adhesive.

[0007]

According to the present invention, since the electronic component is adhered by the conductive adhesive in the holding portion, a small electronic component can be appropriately held in the holding portion, and the electronic component is electrically conductive by the adhesive. Since it can be taken out with the adhesive attached, electronic parts can be easily mounted on the circuit board by using the conductive adhesive.

The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of the embodiments with reference to the drawings.

[0009]

EXAMPLE An electronic component holder 10 of this example shown in FIG.
Includes a belt-shaped carrier 12, and a conductive adhesive 14 is formed on the surface of the carrier 12. This carrier 12
Has a width substantially the same as the length L of the electronic component 16 in the vertical direction. When the electronic components 16 are attached and held on the carrier 12, in this embodiment, the adjacent electronic components 16 are attached so as to contact each other. At this time, only the external electrode 18 comes into contact with the conductive adhesive 14 as shown in FIG.

When the electronic component 16 is peeled off from the carrier 12, as shown in FIG. 3, a part of the conductive adhesive 14 is peeled off while being attached to the external electrode 18. The separated electronic component 16 is directly placed on the pattern 22 on the circuit board 20 as shown in FIG. Therefore, the conductive adhesive 14 is melted and cured by, for example, heat treatment, and the electronic component 16 is fixed onto the circuit board 20.

The peeling of the electronic component 16 from the carrier 12 and the mounting of the electronic component 16 on the circuit board 20 are the same for the electronic component holders 10 of the other embodiments, so the description thereof will be omitted below. An electronic component holder 10 of another embodiment shown in FIG. 5 is the electronic component holder 10 shown in FIG.
The electronic component 16 is similar to the carrier 12
In order to make it easy to take out the electronic component 16 from the above, the electronic components 16 are attached at a constant interval.

An electronic component holder 1 of another embodiment shown in FIG.
0 also includes a band-shaped carrier 12, and the width of the carrier 12 is almost the same as the length L of the electronic component 16 in the vertical direction. In addition, on the surface of the carrier 12, electronic components 16 are arranged at regular intervals.
The conductive adhesive 14 having the same width as the width W is formed.
Further, the feed hole 24 is provided between the adjacent conductive adhesives 14.
Is provided. The electronic component 16 includes the conductive adhesive 14
It is attached to the surface of the carrier 12 so that only the external electrode 18 comes into contact with the carrier.

An electronic component holder 1 of another embodiment shown in FIG.
Even in the case of 0, the conductive adhesive 1 is formed on the belt-shaped carrier 12.
In this embodiment, the width of the carrier 12 is almost the same as the length L of the electronic component 16 in the vertical direction, and the conductive adhesive 1 is applied only to the widthwise ends of the surface of the carrier 12.
4 is given. In addition, in the center of the surface of the carrier 12, feed holes 24 are provided at regular intervals longer than the width W of the electronic component 16. The electronic component 16 has a feed hole 2
It is attached to the carrier 12 so as not to overlap 4.
At this time, only the external electrodes 18 are brought into contact with the conductive adhesive 14.

An electronic component holder 1 of another embodiment shown in FIG.
0 includes a strip-shaped carrier 12 having a width substantially the same as the length L of the electronic component 16 in the vertical direction, and conductive adhesive having the same length as the width W of the electronic component 16 is provided on both ends in the width direction of the surface of the carrier 12. The agent 14 is formed at regular intervals. Further, in the center of the surface of the carrier 12, feed holes 24 are provided alternately with the conductive adhesive 14. The electronic component 16 has an external electrode 18
Carrier 1 so that only one contacts the conductive adhesive 14.
It is attached to the surface of 2.

An electronic component holder 1 of another embodiment shown in FIG.
Reference numeral 0 includes a band-shaped carrier 12 having a width larger than the length L of the electronic component 16 in the vertical direction, and feed holes 24 are provided at both ends in the axial direction of the surface of the carrier 12 at regular intervals. Further, two conductive adhesives 14 having the same length as the width W of the electronic component 16 are formed near the inside of the feed hole 24. The electronic component 16 is attached to the surface of the carrier 12 so that only the external electrodes 18 are in contact with the conductive adhesive 14.

An electronic component holder 10 of another embodiment shown in FIG. 10 includes a wide carrier 12. A plurality of conductive adhesives 14 are formed on the surface of the carrier 12 in the vertical direction and the horizontal direction in the same size as the main surface of the electronic component 16. The electronic component 16 is attached on the carrier 12 so that only the external electrodes 18 are in contact with the conductive adhesive 14.

In an electronic component holder 10 of another embodiment shown in FIG. 11, a recess 26 slightly larger than or equivalent to the electronic component 16 is provided on one main surface of the carrier 12, and the bottom surface of the recess 26 is also provided. As shown in FIG.
As can be seen from (B), the conductive adhesive 14 is formed, and the electronic component 16 is attached to the bottom surface of the recess 26 so that only the external electrode 18 contacts the conductive adhesive 14. When the electronic component 16 is held, a strip-shaped lid 28 having a width substantially the same as the width of the carrier 12 is formed on the carrier 12.

An electronic component holder 10 of another embodiment shown in FIG. 12 includes a carrier 12 similar to a conventional tray, and one main surface of the carrier 12 has a plurality of recesses 26 in the vertical and horizontal directions. It is provided. Further, as can be seen from FIG. 12B, the conductive adhesive 14 is formed on both ends of the bottom surface of the recess 26, and the electronic component 16 includes the external electrode 18
Only the bottom of the recess 26 is affixed so that only the contact with the conductive adhesive 14.

The carrier 1 described in the above embodiment is used.
2 is formed of paper, plastic, metal, or the like. The material of the conductive adhesive 14 is Sn / P.
Solder such as b or Au / Sn, a conductive adhesive, an anisotropic conductive adhesive, or the like is used. Further, the conductive adhesive 14 may be formed on the surface of the carrier 12 in only one layer as shown in FIG. 13, or different kinds of conductive adhesives 14a and 14b may be formed in two layers as shown in FIG. You may form. In these cases, the conductive adhesive 14 can be formed by a thin film forming process such as screen printing or electrolytic / electroless plating, vapor deposition or sputtering. Further, as shown in FIG. 15, the conductive adhesive 14 may be attached with a thermally decomposable adhesive material 28a. Note that FIG.
When the conductive adhesives 14a and 14b are formed as described above, the conductive adhesives 14a and 14b attached to the electronic component 16 are alloyed by the heat treatment performed when the electronic component 16 is placed on the circuit board 20. It is preferable to do so.

The conductive adhesive 14 on the carrier 12 is also used.
As a method of attaching the electronic component 16 to the above, it is possible to use pressure bonding, thermocompression bonding, or a method of using a sticky conductive adhesive and sticking the adhesiveness. Further, as shown in FIG. 15, a method of using a thermally decomposable adhesive material 28b can be considered. Then, when the electronic component 16 is peeled from the carrier 12, in order to facilitate the adhesion of the conductive adhesive 14 to the electronic component 16, as shown in FIG. 16, silicon is provided between the carrier 12 and the conductive adhesive 14. A release agent 30 such as Further, instead of applying the release agent 30, a thermosetting or UV-curing adhesive material is applied, and when peeling, heating or UV irradiation is used to lose the adhesiveness, or a foaming adhesive material is applied, There is also a method of heat foaming and peeling.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is an illustrative view showing a state in which an electronic component is bonded to a carrier.

FIG. 3 is an illustrative view showing a state in which an electronic component is separated from a carrier.

FIG. 4 is an illustrative view showing a state where electronic components are mounted on a circuit board.

FIG. 5 is a perspective view showing another embodiment of the present invention.

FIG. 6 is a perspective view showing another embodiment of the present invention.

FIG. 7 is a perspective view showing still another embodiment of the present invention.

FIG. 8 is a perspective view showing another embodiment of the present invention.

FIG. 9 is a perspective view showing another embodiment of the present invention.

FIG. 10 is a perspective view showing still another embodiment of the present invention.

11A is a perspective view showing another embodiment of the present invention, and FIG. 11B is a sectional view taken along the line AA ′ of the embodiment of FIG.

12A is a perspective view showing another embodiment of the present invention, and FIG. 12B is a sectional view taken along line BB ′ of the embodiment of FIG.

FIG. 13 is an illustrative view showing a state where a conductive adhesive is formed on a carrier.

FIG. 14 is an illustrative view showing a state where a conductive adhesive is formed on a carrier.

FIG. 15 is an illustrative view showing a state where an adhesive and a conductive adhesive are formed on a carrier.

FIG. 16 is an illustrative view showing a state where a release agent and a conductive adhesive are formed on a carrier.

17A and 17B are cross-sectional views showing a conventional technique.

FIG. 18A is a perspective view showing a conventional technique,
(B) is a cross-sectional view of (A) viewed from the side, and (C) is a cross-sectional view of (A) viewed from above.

FIG. 19 (A) is a perspective view showing a conventional technique,
(B) is a cross-sectional view of (A) seen from above.

FIG. 20 is an illustrative view showing a state in which an electronic component is mounted on a circuit board according to a conventional technique.

[Explanation of symbols]

 10 ... Electronic component holder 12 ... Carrier 14 ... Conductive adhesive 16 ... Electronic component 18 ... External electrode 24 ... Feed hole

Claims (1)

[Claims] 1. An electronic component holder having a holding portion for holding an electronic component provided with an external electrode, wherein a conductive adhesive is applied to at least a portion of the holding portion that is in contact with the external electrode so as to be peelable. An electronic component holder, characterized in that an agent is applied and the electronic component is adhered to the holding portion by the conductive adhesive.