JPH04162440A - Mounting structure and mounting method of tape carrier - Google Patents
Mounting structure and mounting method of tape carrierInfo
- Publication number
- JPH04162440A JPH04162440A JP28685490A JP28685490A JPH04162440A JP H04162440 A JPH04162440 A JP H04162440A JP 28685490 A JP28685490 A JP 28685490A JP 28685490 A JP28685490 A JP 28685490A JP H04162440 A JPH04162440 A JP H04162440A
- Authority
- JP
- Japan
- Prior art keywords
- base film
- tape
- wiring
- fixing
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000011888 foil Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 238000009751 slip forming Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims 2
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、フレキシブルプリンティラドサーキット等の
テープキャリアの実装構造および実装方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting structure and method for mounting a tape carrier such as a flexible printed circuit.
例えば液晶表示装置等における部品相互間の配線接続部
材として、合成樹脂等よりなる可撓性基材フィルム上に
配線を施してなるフレキシブルプリンティラドサーキッ
ト（以下、ＦＰＣという）が用いられている。特に液晶
表示装置における液晶表示パネルと、その駆動制御回路
基板との間には、ＬＳＩ等の液晶駆動用の半導体チップ
をＴＡＢ （Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄ
ｉｎｇ）方式等で実装したＦＰＣが用いられている。For example, a flexible printed circuit (hereinafter referred to as FPC), which is formed by wiring on a flexible base film made of synthetic resin or the like, is used as a wiring connection member between components in a liquid crystal display device or the like. In particular, in a liquid crystal display device, a semiconductor chip for driving the liquid crystal, such as an LSI, is installed between the liquid crystal display panel and its drive control circuit board using TAB (Tape Automated Bond).
An FPC implemented using a method such as ing) is used.
上記のようなＦＰＣは、例えば１つの半導体チップに対
する複数本の入出力用配線群を１単位とし、これをテー
プ状の基材フィルム上に連続的に多数形成していわゆる
テープキャリアを構成し、接続すべき部材にアウターリ
ードホンディング（以下、ＯＬＥという）を行うに当た
っては、テープ状の基材フィルムがら前記の配線群を１
単位毎に打ち抜いて分離し、非テープ状態でＯＬＢを行
っていた。そのため、ＯＬＥ工程の自動化が困難あるい
は、自動化しても生産効率が上がらない等の不具合があ
った。In the above FPC, for example, one unit is a group of input/output wirings for one semiconductor chip, and a large number of these are successively formed on a tape-shaped base film to constitute a so-called tape carrier. When performing outer lead bonding (hereinafter referred to as OLE) to the members to be connected, the above wiring group is attached to a tape-shaped base film.
Each unit was punched out and separated, and OLB was performed without tape. Therefore, there have been problems such as difficulty in automating the OLE process, or even with automation, production efficiency cannot be improved.
そこで、本出願人は先に特願平１−２２１２２８号にお
いて、前記の配線群を固定用テープにより基材フィルム
に固定することにより、配線群が１単位毎に打ち抜かれ
た後も、テープ状態のままでＯＬＢが行えるようにする
ことを提案した。Therefore, in Japanese Patent Application No. 1-221228, the present applicant previously proposed that by fixing the above-mentioned wiring group to the base film with a fixing tape, even after the wiring group was punched out unit by unit, the tape remained in the same state. We proposed that OLB can be performed as is.
第４図〜第６図はその一例を示すもので、図において１
はＦＰＣの基材フィルムであり、その基布オフィルム１
上に配線群２を形成すると共に、その配線群２のインナ
ーリード部にＬＳＩ等の液晶駆動用の半導体チップ３が
ＴＡＢ方式等により実装されている。Ｔは固定用テープ
で、その固定用テープＴは配線群２の上面および隣り合
う配線群２・２間の基材フィルム上面に連続的ムこ貼着
されている。Figures 4 to 6 show an example of this.
is the base film of FPC, and its base film 1
A wiring group 2 is formed thereon, and a semiconductor chip 3 for driving a liquid crystal such as an LSI is mounted on the inner lead portion of the wiring group 2 by a TAB method or the like. T is a fixing tape, and the fixing tape T is continuously stuck on the upper surface of the wiring group 2 and the upper surface of the base film between the adjacent wiring groups 2.
上記各単位毎の配線群２は、外形カットラインＬの位置
で基材フィルム１からカットされるが、カット後も固定
用テープＴにより基材フィルム１に連結された状態に保
持される。図中４は上記カットラインＬと固定用テープ
Ｔとの交差部において基材フィルムｌに予め形成したス
リットホールであり、前記カット時に該スリットポール
４の内側部分をカントしないようにするごとにより、固
定用テープＴの切断が防止され、基材フィルム１、に配
線群２が連結された状態に保持される。The wiring group 2 for each unit is cut from the base film 1 at the position of the external cut line L, but is maintained connected to the base film 1 by the fixing tape T even after cutting. 4 in the figure is a slit hole previously formed in the base film L at the intersection of the cut line L and the fixing tape T, and by preventing the inner part of the slit pole 4 from canting during the cutting, The fixing tape T is prevented from being cut, and the wiring group 2 is maintained connected to the base film 1.
丑記のように基材フィルム１に配線群２を連結した状態
に保持することにより、テープ状態のままでＯＬＢを行
うことができるものである。By keeping the wiring group 2 connected to the base film 1 as shown in ox, OLB can be performed in the tape state.
しかしながら、上記基材フィルム１の表面は平坦である
ため、隣り合う配線群２・２間の基材フィルム表面に固
定用テープＴが貼着しすらい。特に固定用テープＴの押
し付は力が弱かったり、温度が低い場合には充分な粘着
力が得られず、固定用テープＴの基材フィルム１と反対
側の面にセパレータ（剥離紙）ＴＩを有するものにあっ
ては、そのセパレータを剥がす際に、隣り合う配線群２
・２間の固定用テープＴが基材フィルム１がら剥がれる
おそれがあった。However, since the surface of the base film 1 is flat, the fixing tape T tends to stick to the surface of the base film between the adjacent wiring groups 2. In particular, if the pressing force of the fixing tape T is weak or the temperature is low, sufficient adhesive force may not be obtained. If the separator is peeled off, the adjacent wiring group 2
- There was a risk that the fixing tape T between the two would peel off from the base film 1.
そこで、固定用テープＴを強い圧力で基材フィルムに押
し付けたり、温度を高めると、基材フィルムに対する固
定用テープＴの粘着力は増大するが、固定用テープＴが
薄くなったり、前記のようなスリットホール４を設ける
ものにあっては、そのスリットホール４内に固定用テー
プＴが食い込んで、該ホール４の縁部等で固定用テープ
Ｔが切れる等のおそれがあった。Therefore, if the fixing tape T is pressed against the base film with strong pressure or the temperature is increased, the adhesive strength of the fixing tape T to the base film increases, but the fixing tape T becomes thinner or as described above. In the case where a slit hole 4 is provided, there is a risk that the fixing tape T will dig into the slit hole 4 and the fixing tape T will be cut at the edge of the hole 4 or the like.
本発明は上記従来の問題点に鑑みて提案されたもので、
隣り合う配線群２・２間の基材フィルム１上に固定用テ
ープを強固に貼着して打ち抜かれた配線群を基材フィル
ム１に連結した状態に確実に保持できるようにすること
を目的とする。The present invention was proposed in view of the above-mentioned conventional problems.
The purpose is to firmly adhere a fixing tape on the base film 1 between adjacent wiring groups 2 and 2, so that the punched wiring groups can be reliably held in a state connected to the base film 1. shall be.
上記の目的を達成するために本発明によるテープキャリ
アの実装構造および実装方法は、以下の構成としたもの
である。In order to achieve the above object, the tape carrier mounting structure and mounting method according to the present invention have the following configuration.
即ち、本発明によるテープキャリアの実装構造は、テー
プキャリアの基材フィルム上に複数単位連続的に形成さ
れた配線群を、１単位毎に基材フ′ イルムから打ち抜
いて実装するに当たり、その配線群と、隣り合う配線群
間の基材フィルム上とに固定用テープを貼着することに
より、配線群が基材フィルムから１単位毎に打ち抜かれ
た後も、配線群が基材フィルム上に固定されるようにし
たものにおいて、隣り合う配線群間の基材フィルム上に
金属箔パターンを形成し、その金属箔パターンを介して
上記固定用テープを基材フィルム上に貼着するようにし
たことを特徴とする。That is, in the mounting structure of the tape carrier according to the present invention, when a plurality of wiring groups continuously formed on the base film of the tape carrier are punched out from the base film one unit at a time, the wiring is mounted. By attaching a fixing tape to the wiring group and the base film between adjacent wiring groups, the wiring group will remain on the base film even after the wiring groups are punched out unit by unit from the base film. In the device that is fixed, a metal foil pattern is formed on the base film between adjacent wiring groups, and the fixing tape is pasted onto the base film through the metal foil pattern. It is characterized by
また本発明によるテープキャリアの実装方法は、テープ
キャリアの基材フィルム上に複数単位連続的に形成され
た配線群を、１単位毎に基材フィルムから打ち抜いて実
装するに当たり、隣り合う配線群間の基材フィルム上に
形成した金属箔パターンと上記配線群とに固定用テープ
を貼着することにより、上記配線群が１単位毎に打ち抜
かれた後も、各配線群が基材フィルム上に固定されたテ
ープ状態でアウターリードボンディングを行うようにし
たことを特徴とする。Furthermore, in the mounting method of a tape carrier according to the present invention, when a plurality of wiring groups continuously formed on a base film of a tape carrier are punched out from the base film one unit at a time, there is a gap between adjacent wiring groups. By attaching a fixing tape to the metal foil pattern formed on the base film and the wiring group, each wiring group will remain on the base film even after the wiring groups are punched out unit by unit. A feature is that outer lead bonding is performed with the tape fixed.
上記の本発明によるテープキャリアの実装構造によれば
、隣り合う配線群間の基材フィルム上に金属箔パターン
を形成したことにより、その金属箔パターンを介して固
定用テープを基材フィルム上に強固に貼着することが可
能となる。According to the mounting structure of the tape carrier according to the present invention, a metal foil pattern is formed on the base film between adjacent wiring groups, so that the fixing tape is attached to the base film through the metal foil pattern. It becomes possible to adhere firmly.
また本発明によるテープキャリアの実装方法によれば、
基材フィルム上に形成した金属箔パターンを介して固定
用テープを基材フィルム上に強固に貼着され、配線群が
１単位毎に打ち抜かれた後も、該配線群が基材フィルム
上に固定されたテープ状態でアウターリードボンディン
グを連続的に行うことが可能となる。Further, according to the tape carrier mounting method according to the present invention,
The fixing tape is firmly attached to the base film through the metal foil pattern formed on the base film, and even after the wiring groups are punched out unit by unit, the wiring groups remain on the base film. Outer lead bonding can be performed continuously with the tape fixed.
［実施例］
第１図は本発明によるテープキャリアの実装構造の一実
施例を示す平面図、第２図はその要部の拡大平面図、第
３図は断面図であり、前記第４図〜第６図と同一の機能
を有する部材には同一の符号を付して再度の説明を省略
する。[Example] Fig. 1 is a plan view showing an embodiment of the mounting structure of a tape carrier according to the present invention, Fig. 2 is an enlarged plan view of the main part thereof, and Fig. 3 is a cross-sectional view, and Fig. 4 is similar to the above-mentioned Fig. 4. - Members having the same functions as those in FIG. 6 are denoted by the same reference numerals and repeated explanations will be omitted.
図示例は隣り合う配線群２・２間の基材フィルム１上に
、金属箔パターン５を設け、その金属箔パターン５を介
して前記固定用テープＴを基材フィルム１上に貼着した
ものである。In the illustrated example, a metal foil pattern 5 is provided on the base film 1 between adjacent wiring groups 2 and 2, and the fixing tape T is pasted onto the base film 1 via the metal foil pattern 5. It is.
上記金属箔パターン５の形状は、図示例に限らすストラ
イブ状、マトリックス状、ヘタパターンその他適宜であ
る。The shape of the metal foil pattern 5 is limited to the illustrated example, and may be a stripe shape, a matrix shape, a irregular pattern, or other suitable shapes.
また金属箔パターン５の材質は、銅その他適宜であり、
好ましくは配線群２と同材質のものを用い、その配線群
２を形成する際に同時に形成するとよい。Further, the material of the metal foil pattern 5 is copper or other appropriate material.
Preferably, it is made of the same material as the wiring group 2 and formed at the same time as the wiring group 2 is formed.
固定用テープＴば、本例においては配線群の０ＬＢ端子
を他の部材に導電接続するための異方性導電膜（異方性
導電接着剤）を、隣り合う配線群間にも延長して連続的
に設けることにより、カット後の配線群の保持に兼用し
たものであるが、上記のような導電接続用の導電膜とは
別に設けてもよい。その場合、固定用テープＴの材質は
、可撓性を有し、粘着性を有するものであれば適宜であ
り、例えば、ポリイミド、ポリエステルなどの樹脂や布
、ガラス繊維布などでできたテープを用いることができ
る。In this example, the fixing tape T is an anisotropic conductive film (anisotropic conductive adhesive) for conductively connecting the 0LB terminal of a wiring group to another member, and is also extended between adjacent wiring groups. By providing it continuously, it also serves to hold the wiring group after cutting, but it may be provided separately from the conductive film for conductive connection as described above. In that case, the fixing tape T may be made of any material as long as it is flexible and adhesive; for example, a tape made of resin such as polyimide or polyester, cloth, glass fiber cloth, etc. Can be used.
上記ようなテープキャリアを実装するに当たっては、配
線群２を１単位毎に前記カットラインＬで打ち抜いて各
配線群のＯＬＢ端子を接続すべき部材にボンディングす
るもので、その際、各配線群２は固定用テープＴにより
前記金属箔パターンを介して基材フィルム１上に強固に
固定される。In mounting the tape carrier as described above, each wiring group 2 is punched out along the cut line L and the OLB terminal of each wiring group is bonded to the member to be connected. is firmly fixed onto the base film 1 with the fixing tape T via the metal foil pattern.
そして、その固定されたテープ状態で連続的にＯＬＢ工
程に導き、スリットホール４内で固定用テープＴをカッ
トしてボンディングするもので、上記の作業を連続的に
行うことができると共に、容易に自動化することが可能
となる。Then, the fixed tape state is continuously guided to the OLB process, and the fixing tape T is cut and bonded within the slit hole 4.The above operations can be performed continuously and easily. It becomes possible to automate.
なお上記実施例においては、金属箔パターンを隣り合う
配線群間の１箇所にのみ設けたが、２箇所以上設けてそ
れぞれ固定用テープを貼着することもある。In the above embodiment, the metal foil pattern was provided only at one location between adjacent wiring groups, but it may be provided at two or more locations and fixing tapes may be attached to each.
以上説明したように本発明によれば、隣り合う配線群間
の基材フィルム上に金属箔パターンを形成し、その金属
箔パターンを介して固定用テープを基材フィルム上に貼
着するようにしたから、固定用テープが強固に貼着され
、配線群をテープ状の基材フィルムから打ち抜いた後も
基材フィルムに確実に固定することが可能となり、テー
プ状態のままで容易かつ迅速にリードボンディングを行
うことができる。特に上記配線群のインナーリード部に
半導体チップをボンディングするものにあっては、その
インナーリードボンディングからアウターリードボンデ
ィングまでを、配線群をテープ状態に確実に保持した状
態で行うことができるものである。As explained above, according to the present invention, a metal foil pattern is formed on a base film between adjacent wiring groups, and a fixing tape is attached onto the base film through the metal foil pattern. As a result, the fixing tape is firmly attached, and even after the wiring group is punched out from the tape-shaped base film, it can be securely fixed to the base film, and it can be easily and quickly led while still in the tape state. Bonding can be performed. Particularly when bonding a semiconductor chip to the inner lead portion of the wiring group, the process from inner lead bonding to outer lead bonding can be performed while the wiring group is securely held in a tape state. .
第１図は本発明によるテープキャリアの実装構造の一実
施例を示す平面図、第２図はその要部の拡大平面図、第
３図はその断面図、第４図は従来のテープキャリアの実
装構造の一例を示す平面図、第５図はその要部の拡大平
面図、第６図はその断面図である。
１は基材フィルム、２は配線群、３は半導体チップ、４
はスリットホール、５は金属箔パターン、Ｔは固定用テ
ープ、Ｌはカットライン。Fig. 1 is a plan view showing an embodiment of the mounting structure of a tape carrier according to the present invention, Fig. 2 is an enlarged plan view of its main parts, Fig. 3 is a sectional view thereof, and Fig. 4 is a plan view of a conventional tape carrier. A plan view showing an example of the mounting structure, FIG. 5 is an enlarged plan view of the main part thereof, and FIG. 6 is a sectional view thereof. 1 is a base film, 2 is a wiring group, 3 is a semiconductor chip, 4
is a slit hole, 5 is a metal foil pattern, T is a fixing tape, and L is a cut line.
Claims (2)
的に形成された配線群を、１単位毎に基材フィルムから
打ち抜いて実装するに当たり、その配線群と、隣り合う
配線群間の基材フィルム上とに固定用テープを貼着する
ことにより、配線群が基材フィルムから１単位毎に打ち
抜かれた後も、配線群が基材フィルム上に固定されるよ
うにしたものにおいて、隣り合う配線群間の基材フィル
ム上に金属箔パターンを形成し、その金属箔パターンを
介して上記固定用テープを基材フィルム上に貼着するよ
うにしたことを特徴とするテープキャリアの実装構造。(1) When mounting a plurality of wiring groups continuously formed on the base film of a tape carrier by punching them out of the base film unit by unit, the base material between the wiring group and adjacent wiring groups is used. By pasting a fixing tape on the film, even after the wiring group is punched out from the base film one unit at a time, the wiring group is fixed on the base film. A mounting structure for a tape carrier, characterized in that a metal foil pattern is formed on a base film between wiring groups, and the fixing tape is adhered onto the base film via the metal foil pattern.
的に形成された配線群を、１単位毎に基材フィルムから
打ち抜いて実装するに当たり、隣り合う配線群間の基材
フィルム上に形成した金属箔パターンと上記配線群とに
固定用テープを貼着することにより、上記配線群が１単
位毎に打ち抜かれた後も、各配線群が基材フィルム上に
固定されたテープ状態でアウターリードボンディングを
行うようにしたことを特徴とするテープキャリアの実装
方法。(2) In punching out and mounting a plurality of wiring groups continuously formed on the base film of the tape carrier from the base film one unit at a time, the wiring groups formed on the base film between adjacent wiring groups. By attaching a fixing tape to the metal foil pattern and the wiring group, even after the wiring groups are punched out unit by unit, each wiring group remains in the tape state fixed on the base film as an outer lead. A tape carrier mounting method characterized by performing bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28685490A JP2897402B2 (en) | 1990-10-24 | 1990-10-24 | Tape carrier, method of manufacturing tape carrier, and method of mounting tape carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28685490A JP2897402B2 (en) | 1990-10-24 | 1990-10-24 | Tape carrier, method of manufacturing tape carrier, and method of mounting tape carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04162440A true JPH04162440A (en) | 1992-06-05 |
| JP2897402B2 JP2897402B2 (en) | 1999-05-31 |
Family
ID=17709890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28685490A Expired - Fee Related JP2897402B2 (en) | 1990-10-24 | 1990-10-24 | Tape carrier, method of manufacturing tape carrier, and method of mounting tape carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2897402B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000054323A1 (en) * | 1999-03-11 | 2000-09-14 | Seiko Epson Corporation | Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device |
| JP2005107438A (en) * | 2003-10-02 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Manufacturing method of semiconductor device for plasma display device |
| KR20180007664A (en) | 2016-07-13 | 2018-01-23 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate holder and plating apparatus using the same |
-
1990
- 1990-10-24 JP JP28685490A patent/JP2897402B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000054323A1 (en) * | 1999-03-11 | 2000-09-14 | Seiko Epson Corporation | Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device |
| KR100404997B1 (en) * | 1999-03-11 | 2003-11-10 | 세이코 엡슨 가부시키가이샤 | Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device |
| US6744120B1 (en) | 1999-03-11 | 2004-06-01 | Seiko Epson Corporation | Flexible interconnect substrate of a tape-shaped semiconductor device, semiconductor device and circuit board |
| JP2005107438A (en) * | 2003-10-02 | 2005-04-21 | Matsushita Electric Ind Co Ltd | Manufacturing method of semiconductor device for plasma display device |
| KR20180007664A (en) | 2016-07-13 | 2018-01-23 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate holder and plating apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2897402B2 (en) | 1999-05-31 |
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