JPH0598469A - Method for perforating metallic sheet by etching - Google Patents

Abstract

PURPOSE:To prevent the dropping of the scrapped part, to smooth the operation of an etching device and further to easily recover the scrapped part by sticking a self-adhesive tape to the upper surface of a metallic sheet, applying a resist on the lower surface and etching the sheet from below. CONSTITUTION:A self-adhesive tape 4 is stuck to the upper surface of a metallic sheet 1, and a resist 2 is applied on the lower surface at the region other than the profile of the hole. A liq. etchant 6 is sprayed from below to dissolve the profile to part the scrapped part 7 from the sheet 1. The tape 4 is then released and removed along with the scrapped part 7 to obtain a perforated metallic sheet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for punching a thin metal plate by etching.

[0002]

2. Description of the Related Art For example, a laminated glass 1 shown in Japanese Utility Model Laid-Open No. 3-78030 is one in which a thin metal plate 2 is sandwiched between two plate glasses 3 and 4, and a large number of holes 2a are formed in the thin metal plate 2. There is.

Since the holes 2a ... Can be freely shaped and can form a cut-out-like pattern, the laminated glass 1 can be a kind of decorative plate having a great design. When the above holes 2a ... Are processed by a punching method, it is difficult to handle the burr and it is difficult to draw a fine pattern. Therefore, the etching (acid corrosion) method is adopted for fine processing.

2 (a) and 2 (b) are explanatory views of a conventional method for forming holes by etching. FIG. 2 (a) shows a thermosetting resin or a photocurable resin resist (hereinafter referred to as "resin") above and below the thin metal plate 100. , (Referred to simply as “resist”) 101 ... Is applied (patterned), and an etching solution such as ferric chloride is sprayed from above and below while being horizontally conveyed on the conveyor rollers 102.

Except where it is protected by the resist 101, the thin metal plate 100 is acid-corroded to reduce its thickness, and a large hole becomes apparent later. In the etching method of FIG. 2 (a), since a large volume of the hole is melted, the etching liquid is significantly deteriorated, and so-called etching cost is increased.

Therefore, the scrap recovery method shown in FIG. 2B is being adopted as an alternative method. That is, the thin metal plate 1
00, the groove portions 103A, 103 for cutting
The resists 101 ... Are applied to the portions excluding B and etched. Since only the grooves 103A and 103B are melted,
The hole portion is recovered as the scrap portion 104, and the etching liquid is less deteriorated.

[0007]

However, the above-mentioned FIG.
In the scrap recovery method (b), the groove 103A and the groove 1
Due to the difference in the completion time of melting of 03B, the scrap portion 103 inclines as shown by the imaginary line C while a part of the scrap is attached to the metal thin plate 100, and then the scrap portion 103 collides with the conveyor roller 102, and There is an inconvenience that the thin plate 100 is deformed, scratched, pushed, and the like, and a countermeasure against it is required.

[0008]

According to the present invention, in order to meet the above requirements, an adhesive tape is attached to the upper surface of a thin metal plate, a resist is applied to the lower surface, and etching is performed from below.
The separated scrap portion is supported by adhesive tape, so it does not fall off. After that, when the adhesive tape is peeled off, the scrap portion can be removed together with the adhesive tape.

[0009]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

1 (a) to 1 (e) are process diagrams relating to the method of punching by etching according to the present invention. In FIG. 1 (a), for example, the lower surface of a thin metal plate 1 made of stainless steel and having a thickness of 0.3 mm. Then, a pattern (pattern) that follows the contour of the hole is formed by heat or photocurable resin resist 2. The width of the groove 3 between the resists 2 and 2 is preferably 0.3 to 0.5 mm.

Next, as shown in FIG. 1 (b), the adhesive tape 4 is attached to one surface of the thin metal plate 1 to complete the pretreatment.

As shown in FIG. 1 (c), the resist 2 and the metal thin plate 1 with the adhesive tape 4 are horizontally conveyed on the conveyor rollers 5 of the etching apparatus, and the ferric chloride or the like is fed only from below. The etching liquid 6 is jetted upward.

The etching liquid 6 dissolves only the groove portions 3 ... Which are not protected by the resist 2, and as a result, the scrap portion 7 is separated from the thin metal plate 1 as shown in FIG. However, since the scrap portion 7 is stopped by the adhesive tape 4, there is no fear of falling off.

In this state, extracted from the etching device,
As shown in FIG. 1E, when the adhesive tape 4 is peeled off, the adhesive tape 4 is attached to the scrap parts 7, 7 and picked up.

The remaining thin perforated metal sheet 1 may be formed by removing the resist 2 on the lower surface in the next step.

The above-mentioned adhesive tape 4 has such an adhesive force that the scrap portion 7 can be suspended and held in the state of FIG. 1D, and after the FIG. The adhesive strength is not so strong that the part 7 can be peeled off. Specifically, the adhesive strength defined by the 180 ° shear peeling test (JIS Z 0237) is 50%.
It is desirable to select from the range of g / 20 mm to 150 g / 20 mm.

[0017]

As described above, according to the present invention, the adhesive tape prevents the scrap portion from falling off during the etching process. Interference with the roller does not occur. Therefore, according to the method of the present invention, the smooth operation of the etching apparatus can be maintained and the scrap portion can be easily collected.

[Brief description of drawings]

FIG. 1 is a process diagram of a method for forming holes by etching according to the present invention.

FIG. 2 is an explanatory diagram of a conventional method for forming holes by etching.

[Explanation of symbols]

1 ... Metal thin plate, 2 ... Resist, 4 ... Adhesive tape, 6 ... Etching liquid, 7 ... Scrap part.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroaki Watanabe 2-12-1, Minatomachi, Joetsu City, Niigata Prefecture Japan Stainless Co., Ltd. Naoetsu Works

Claims (1)

[Claims] 1. An adhesive tape is attached to one surface of an upper surface of a thin metal plate, while a resist is applied to a lower surface of the lower metal plate except a contour of a hole, and an etching solution is sprayed from below to form the above contour of the thin metal plate. A method for punching a thin metal plate by etching, characterized in that the scrap portion is removed together with the adhesive tape by separating the scrap portion from the thin metal plate by melting the portion and then peeling off the adhesive tape.