JPH0595075U - High current circuit board - Google Patents

High current circuit board

Info

Publication number
JPH0595075U
JPH0595075U JP4261992U JP4261992U JPH0595075U JP H0595075 U JPH0595075 U JP H0595075U JP 4261992 U JP4261992 U JP 4261992U JP 4261992 U JP4261992 U JP 4261992U JP H0595075 U JPH0595075 U JP H0595075U
Authority
JP
Japan
Prior art keywords
current circuit
conductor
rod
insulating substrate
shaped conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4261992U
Other languages
Japanese (ja)
Inventor
秀行 藤浪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP4261992U priority Critical patent/JPH0595075U/en
Publication of JPH0595075U publication Critical patent/JPH0595075U/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】 【構成】 所望の回路パターンに成形された棒状導体3
の両端部に、下面がその棒状導体3の下面と同等レベル
になるように偏平部4を設け、その偏平部4に下面側に
突出する円筒部5を形成して大電流用回路導体1とし、
この大電流用回路導体1を、円筒部5を絶縁基板2の穴
6に挿通して、絶縁基板1に固定した。 【効果】 大電流用回路導体の製作に高価な打抜き金型
を使用する必要がなく、大電流回路基板の製造コストを
大幅に低減できると共に、納期の短縮を図ることができ
る。偏平部は、その下面が、棒状導体の下面と同等レベ
ルとなるように形成されるので、絶縁基板上にセットす
るときの座りがよく、組立作業が容易である。
(57) [Summary] [Structure] Rod-shaped conductor 3 molded into a desired circuit pattern
A flat portion 4 is provided at both ends of the flat conductor 4 such that the lower surface thereof is at the same level as the lower surface of the rod-shaped conductor 3, and the flat portion 4 is provided with a cylindrical portion 5 projecting toward the lower surface to form the large-current circuit conductor 1. ,
The large current circuit conductor 1 was fixed to the insulating substrate 1 by inserting the cylindrical portion 5 into the hole 6 of the insulating substrate 2. [Effect] It is not necessary to use an expensive punching die for manufacturing the large-current circuit conductor, the manufacturing cost of the large-current circuit board can be significantly reduced, and the delivery time can be shortened. Since the lower surface of the flat portion is formed so as to be at the same level as the lower surface of the rod-shaped conductor, the flat portion has a good seat when set on the insulating substrate, and the assembling work is easy.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、電力用の大電流が流れる回路導体を有する大電流回路基板に関する ものである。 The present invention relates to a large current circuit board having a circuit conductor through which a large current for electric power flows.

【0002】[0002]

【従来の技術】[Prior Art]

従来のこの種の大電流回路基板は、信号電流回路用の銅箔よりかなり厚肉の銅 板を、金型を用いたプレス打抜き加工により所望の回路パターンに打抜き成形し 、その両端部に(必要に応じ中間部にも)バーリング加工等により下面側に突出 する円筒部を形成して、大電流用回路導体を製作し、この大電流用回路導体を、 その円筒部を絶縁基板の穴に挿通して、絶縁基板に固定することにより製造され ている(特開昭63−237495号公報)。なお大電流用回路導体の絶縁基板 への固定は接着あるいは半田付け等により行われている。 This type of conventional large-current circuit board is formed by punching a copper plate, which is considerably thicker than the copper foil for signal and current circuits, into a desired circuit pattern by press punching using a die, and A cylindrical portion protruding toward the lower surface side is formed by burring or the like (if necessary in the intermediate portion) to produce a large-current circuit conductor. It is manufactured by inserting it and fixing it to an insulating substrate (JP-A-63-237495). The high-current circuit conductor is fixed to the insulating substrate by adhesion or soldering.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

従来の大電流回路基板は、銅板からの打抜きにより大電流用回路導体を製作し ているため大電流用回路導体の製作に打抜き金型が必要であり、この金型がきわ めて高価であることから製造コストが高くなるだけでなく、金型の製作に期間が かかるため短納期の製品には対応できないという問題があった。また金型は1種 類の製品に1セット必要であるため、多品種少量生産には不向きであった。 本考案の目的は、上記のような従来技術の問題点に鑑み、製作に打抜き金型を 必要としない大電流回路基板を提供することにある。 Since the conventional large-current circuit board is manufactured by punching from a copper plate to manufacture a large-current circuit conductor, a punching die is required to manufacture the large-current circuit conductor, and this die is extremely expensive. Therefore, there is a problem that not only the manufacturing cost becomes high, but also it takes a long time to manufacture the mold, so that it is not possible to deal with a product with a short delivery time. Moreover, since one set of molds is required for each type of product, it was not suitable for high-mix low-volume production. An object of the present invention is to provide a high-current circuit board that does not require a punching die for manufacturing, in view of the above problems of the prior art.

【0004】[0004]

【課題を解決するための手段】[Means for Solving the Problems]

上記目的を達成するため本考案は、所望の回路パターンに成形された棒状導体 の少なくとも両端部に、下面がその棒状導体の下面と同等のレベルとなるように 偏平部を設け、その偏平部に下面側に突出する円筒部を形成して大電流用回路導 体とし、この大電流用回路導体を、前記円筒部を絶縁基板の穴に挿通して、絶縁 基板に固定したことを特徴とするものである。 偏平部は棒状導体の圧潰加工等により形成することができ、円筒部は従来同様 バーリング加工等により形成することができる。円筒部は内面にネジを形成して ネジタップとして使用する場合もある。 In order to achieve the above object, the present invention provides a flat portion on at least both ends of a rod-shaped conductor formed into a desired circuit pattern so that the lower surface is at the same level as the lower surface of the rod-shaped conductor. A large current circuit conductor is formed by forming a cylindrical portion projecting to the lower surface side, and the large current circuit conductor is fixed to the insulating substrate by inserting the cylindrical portion into the hole of the insulating substrate. It is a thing. The flat portion can be formed by crushing the rod-shaped conductor and the like, and the cylindrical portion can be formed by burring as in the conventional case. The cylindrical part may be used as a screw tap by forming a screw on the inner surface.

【0005】[0005]

【作用】[Action]

この大電流回路基板は、大電流用回路導体として銅板ではなく銅線、銅棒など を所要長に切断した棒状導体を使用しているため、金型を用いることなく、屈曲 成形により所望の回路パターンの大電流用回路導体を得ることが可能である。 また棒状導体の両端部に(必要に応じ中間部にも)設けた偏平部は、その下面 が所望の回路パターンに成形された棒状導体の下面と同等のレベルになるように 形成されるので、絶縁基板上にセットするときの座りがよく、従来の銅板製の大 電流用回路導体と同様に取り扱うことができ、絶縁基板への固定も従来と同様に 行える。 なお偏平部の下面側に円筒部を突出させ、これを絶縁基板の穴に挿通すること は従来と同様である。 This high-current circuit board uses not a copper plate but a rod-shaped conductor obtained by cutting a copper wire, a copper rod, etc., into a required length as a circuit conductor for high-current, so that a desired circuit can be formed by bending without using a mold. It is possible to obtain a circuit conductor for a large current of the pattern. Further, the flat portions provided at both ends of the rod-shaped conductor (and also in the intermediate portion if necessary) are formed so that the lower surface thereof is at the same level as the lower surface of the rod-shaped conductor molded into a desired circuit pattern. It sits well when set on an insulating substrate, and can be handled in the same way as conventional copper plate high-current circuit conductors, and can be fixed to an insulating substrate in the same manner as before. Incidentally, it is the same as the conventional method that the cylindrical portion is projected on the lower surface side of the flat portion and is inserted into the hole of the insulating substrate.

【0006】[0006]

【実施例】【Example】

以下、本考案の実施例を図面を参照して詳細に説明する。 図1ないし図3は本考案の一実施例を示す。図において、1は大電流用回路導 体、2は絶縁基板である。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 3 show an embodiment of the present invention. In the figure, 1 is a large-current circuit conductor, and 2 is an insulating substrate.

【0007】 大電流用回路導体1は、断面円形の棒状導体3からなり、この棒状導体3を所 望の回路パターンに屈曲成形し、その両端部に、下面がその棒状導体3の下面と 同等のレベルとなるように偏平部4を形成し、かつ、その偏平部4に下面側に突 出する円筒部5を形成したものである。The large-current circuit conductor 1 is composed of a rod-shaped conductor 3 having a circular cross section. The rod-shaped conductor 3 is formed by bending into a desired circuit pattern, and the lower surface is equal to the lower surface of the rod-shaped conductor 3 at both ends thereof. The flat portion 4 is formed so as to be at the level, and the flat portion 4 is formed with the cylindrical portion 5 projecting to the lower surface side.

【0008】 棒状導体3は銅線、銅棒などを所要長に切断することにより得ることができ、 また断面が円形であるため、屈曲成形により所望の回路パターンに容易に成形す ることができる。また偏平部4は棒状導体3の端部を偏平に圧潰することにより 容易に形成することができる。さらに円筒部5は従来同様バーリング加工等によ り形成することができる。大電流用回路導体1の表面には必要に応じ半田合金ま たはスズ等のメッキを施す。The rod-shaped conductor 3 can be obtained by cutting a copper wire, a copper rod, or the like into a required length, and since the cross-section is circular, it can be easily formed into a desired circuit pattern by bending. .. The flat portion 4 can be easily formed by flatly crushing the end portion of the rod-shaped conductor 3. Further, the cylindrical portion 5 can be formed by burring or the like as in the conventional case. If necessary, the surface of the large-current circuit conductor 1 is plated with solder alloy or tin.

【0009】 本実施例の大電流回路基板は、上記のように形成した大電流用回路導体1を、 その円筒部5を絶縁基板2の穴6に挿通して、接着剤または半田付け等により絶 縁基板1に固定することにより、構成されるものである。The large-current circuit board of the present embodiment has the large-current circuit conductor 1 formed as described above, the cylindrical portion 5 of which is inserted into the hole 6 of the insulating substrate 2 by an adhesive or soldering. It is constructed by being fixed to the insulating substrate 1.

【0010】 図4および図5はそれぞれ本考案の他の実施例を示す。図4は大電流用回路導 体1として下面側を偏平にした断面ほぼ円形の棒状導体3を使用したものであり 、図5は大電流用回路導体1として断面ほぼ正方形の棒状導体3を使用したもの である。それ以外の構成は前記実施例と同様であるので、図3と同一部分には同 一符号を付して説明を省略する。4 and 5 each show another embodiment of the present invention. FIG. 4 shows a large-current circuit conductor 1 using a bar-shaped conductor 3 having a flat bottom surface and a substantially circular cross-section. FIG. 5 uses a large-current circuit conductor 1 having a substantially square-shaped bar-shaped conductor 3. It was done. The rest of the configuration is the same as that of the above-described embodiment, so the same parts as in FIG.

【0011】[0011]

【考案の効果】[Effect of the device]

以上説明したように本考案によれば、大電流用回路導体に棒状導体を使用した ことにより、大電流用回路導体の製作に高価な打抜き金型を使用する必要がなく なり、大電流回路基板の製造コストを大幅に低減できると共に、納期の短縮を図 ることができる。また棒状導体の少なくとも両端部に設けられた偏平部は、その 下面が棒状導体の下面と同等のレベルとなるように形成されるので、絶縁基板上 にセットするときの座りがよく、組立作業が容易である。さらに多品種少量生産 にも容易に対応できる。 As described above, according to the present invention, since the rod-shaped conductor is used for the large-current circuit conductor, it is not necessary to use an expensive punching die for manufacturing the large-current circuit conductor, and the large-current circuit board is eliminated. The manufacturing cost can be significantly reduced and the delivery time can be shortened. Also, since the flat parts provided on at least both ends of the rod-shaped conductor are formed so that the lower surface thereof is at the same level as the lower surface of the rod-shaped conductor, it sits well when set on the insulating substrate, and the assembly work is easy. It's easy. Furthermore, it is possible to easily handle high-mix low-volume production.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本考案の一実施例に係る大電流回路基板の一
部切開正面図。
FIG. 1 is a partially cutaway front view of a large current circuit board according to an embodiment of the present invention.

【図2】 図1の大電流回路基板の平面図。FIG. 2 is a plan view of the large current circuit board of FIG.

【図3】 図1のA−A線における断面図。FIG. 3 is a sectional view taken along line AA of FIG.

【図4】 本考案の他の実施例に係る大電流回路基板の
断面図。
FIG. 4 is a cross-sectional view of a large current circuit board according to another embodiment of the present invention.

【図5】 本考案のさらに他の実施例に係る大電流回路
基板の断面図。
FIG. 5 is a cross-sectional view of a large current circuit board according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1:大電流用回路導体 2:絶縁基板 3:棒状導体 4:偏平部 5:円筒部 6:穴 1: Circuit conductor for large current 2: Insulating substrate 3: Rod-shaped conductor 4: Flat part 5: Cylindrical part 6: Hole

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】所望の回路パターンに成形された棒状導体
の少なくとも両端部に、下面がその棒状導体の下面と同
等のレベルとなるように偏平部を設け、その偏平部に下
面側に突出する円筒部を形成して大電流用回路導体と
し、この大電流用回路導体を、前記円筒部を絶縁基板の
穴に挿通して、絶縁基板に固定したことを特徴とする大
電流回路基板。
1. A flat portion is provided at least at both ends of a rod-shaped conductor formed into a desired circuit pattern so that the lower surface is at the same level as the lower surface of the rod-shaped conductor, and the flat portion projects toward the lower surface. A large-current circuit board, wherein a cylindrical portion is formed as a large-current circuit conductor, and the large-current circuit conductor is fixed to the insulating substrate by inserting the cylindrical portion into a hole of the insulating substrate.
JP4261992U 1992-05-29 1992-05-29 High current circuit board Pending JPH0595075U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4261992U JPH0595075U (en) 1992-05-29 1992-05-29 High current circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4261992U JPH0595075U (en) 1992-05-29 1992-05-29 High current circuit board

Publications (1)

Publication Number Publication Date
JPH0595075U true JPH0595075U (en) 1993-12-24

Family

ID=12641042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4261992U Pending JPH0595075U (en) 1992-05-29 1992-05-29 High current circuit board

Country Status (1)

Country Link
JP (1) JPH0595075U (en)

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