JP2001309524A - Bus bar and jointing structure therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bus bar which has excellent workability and is capable of facilitating visual confirmation of a jointing condition. SOLUTION: Bus bars 2, 3 includes rising sections 4, 5 almost rising on a printed circuit board. The lower ends of the rising sections 4, 5 of the bus bars 2, 3 are inserted into a common hole 6 in the printed circuit board 1. The outer faces 4A, 5A of the mutual rising sections 4, 5 are disposed so as to face each other. The rising section 4 is formed with a protrusion 11, and the lower ends of the rising sections 4, 5 are soldered 9 to the printed circuit board 1. A clearance corresponding to the amount of the protrusion 11 is formed between the rising sections 4, 5. By soldering the printed circuit board 1 to the bus bars 2, 3 under this condition, it is possible to visually confirm the finishing condition of the soldering 9 between the rising sections 4, 5 from the above the printed circuit board 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bus bar for electrically connecting circuit portions of a circuit board.

[0002]

Generally, a conductive pattern for electrically connecting electronic components is formed on a circuit board. Usually, in this type of circuit board, the conductive pattern is formed by etching or printing a thin copper foil, but depending on the circuit configuration, a large current may be locally applied to the circuit portion. Therefore, there is a risk that the conductive pattern formed by the thin copper foil may be broken. For this reason,
In such a place where there is a risk of disconnection, the circuit portions of the conductive pattern are partially connected by a bus bar made of a conductive metal material instead of a copper foil. Further, the bus bar is fixed at the same time as the electrical connection by soldering with the lower end inserted into the circuit board, and the bus bar fixed to the circuit board in this manner is attached to the circuit board in a state of contact with the circuit board. It stands almost perpendicular to it.

In order to connect a plurality of bus bars to a circuit board and electrically connect the bus bars, as shown in FIG. 5, bus bars 101 and 102 are fixedly connected to a circuit board 100 at intervals. These bus bars 101 and 102 are connected to the circuit board 10
The connection is made by the zero conductive pattern 103. In this case, the voltage drop increases as much as the bus bars 101 and 102 are separated,
In addition, there is a problem that a dead space where components cannot be installed is present between the bus bars 101 and 102.

To solve the problem of the voltage drop and the problem of the space on the circuit board, there is a connection structure shown in FIG. 6, in which one bus bar 101 is connected and fixed to the circuit board 100. The other bus bar 104 is fixed to the bus bar 101 with screws 105, and only one bus bar 101 is connected and fixed to the circuit board 100. Therefore, the bus bar 101 is hardly restricted by the space on the circuit board 100. , 104 directly connect each other,
There is no problem of voltage drop.

However, the connection structure shown in FIG. 6 has a problem that the use of screws increases the number of parts and the number of work steps for screw tightening, resulting in an increase in cost.

Accordingly, the present invention solves the above problems,
In a connection structure for connecting a plurality of bus bars to a circuit board and electrically connecting the bus bars to each other, an object of the invention is to provide a bus bar excellent in workability and capable of easily confirming a connection state visually and a connection structure thereof.

[0007]

According to a first aspect of the present invention, there is provided a bus bar having an upright portion for electrically connecting circuit portions of a circuit board and having an upright portion on the circuit board. Another bus bar is provided with a projection which comes into contact with the outer surface of the upright portion.

According to the above configuration, since the projection of the upstanding portion comes into contact with the upstanding portion of another bus bar, an interval corresponding to the projection is formed between the upstanding portions, and the state of the solder under the upstanding portion can be confirmed from this interval.

According to a second aspect of the present invention, the projection is formed by extruding a part of the upright portion.

According to the above configuration, the projection can be easily formed by extrusion and can be provided integrally with the upright portion.

According to a third aspect of the present invention, there is provided a bus bar for electrically connecting circuit portions of a circuit board and having an upright portion standing on the circuit board, wherein a lower portion of the upright portion and an upper portion of the lower portion have the upright portion. A step portion is formed on the inner surface side of the portion.

According to the above configuration, an interval corresponding to the step is formed between the upright portions, and the state of the solder under the upright portion can be confirmed from the interval.

According to a fourth aspect of the present invention, in the connection structure of a bus bar having an upright portion standing up on the circuit board for electrically connecting the circuit portions of the circuit board, a lower end of the upright portion of the paired busbars Are inserted into the common hole of the circuit board, the outer surfaces of the upright portions are arranged to face each other, and a space forming portion that forms a space between the outer surfaces of the upright portions is provided. It is soldered to the circuit board.

According to the above configuration, since the projection of the upstanding portion comes into contact with the upstanding portion of another bus bar, an interval corresponding to the projection is formed between the upstanding portions. If the circuit board and the bus bar are soldered in this state, The state of the solder between the standing portions can be visually confirmed from above the circuit board. Furthermore, conventionally, in the large current circuit section,
I am using a large busbar to conduct current,
According to the present invention, a current can flow using a circuit portion such as a conductive pattern of a circuit board, so that the size of a bus bar can be reduced and cost can be reduced.

According to a fifth aspect of the present invention, the space forming portion is a projection provided on an outer surface of the upright portion.

According to the above configuration, by contacting the tip of the projection with the outer surface of the other standing portion, an interval corresponding to the projection is formed between the standing portions.

According to a sixth aspect of the present invention, the space forming portion is a projection provided on an outer surface of the upright portion.

According to the above configuration, the projection can be easily formed by extrusion molding, and can be provided integrally with the upright portion.

Further, in the invention according to claim 7, the interval forming portion is a step portion formed at a lower portion of the upright portion and an upper portion of the lower portion is located on an inner surface side of the upright portion.

According to the above configuration, a space corresponding to the step is formed between the upright portions. When the circuit board and the bus bar are soldered in this state, the state of the solder between the upright portions is visually checked from above the circuit board. it can.

[0021]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 and 2
1 shows a first embodiment of the present invention. As shown in FIG. 1, reference numeral 1 denotes a circuit board on which electronic components (not shown) are mounted, and circuit portions of the circuit board 1 are connected by bus bars 2 and 3. These busbars 2 and 3 are formed by plating a surface of a flat metal plate such as copper having excellent conductivity. One side of each of the bus bars 2, 3 is provided with an upright portion 4, 5 erected substantially perpendicular to the circuit board 1.
And a horizontal portion substantially parallel to the circuit board,
Terminal portions 7, 8 to be inserted into the common hole 6 of the circuit board 1 are provided at the lower ends of the upright portions 4, 5, and when the outer surfaces 4A, 5A of the upright portions 4, 5 are arranged facing each other, With the terminal portions 7 and 8 inserted and arranged in the holes 6, soldering is performed from the lower surface side of the circuit board 1 by a flow soldering device (not shown), and the terminal portions 7 and 8 are soldered to the circuit board 1 by solder 9. And is electrically connected to the circuit section. The other sides (not shown) of the bus bars 2 and 3 are fixed to the circuit portion of the circuit board 1 by soldering and are electrically connected to the circuit portion. The other side of the bus bar can be connected to another circuit board.

In such a connection structure between the bus bars 2 and 3, at least one of the upright portions 4 of the bus bar 2 is provided with a projection 11 serving as an interval forming portion.
Is partially extruded and is formed so as to protrude from the outer surface 4A. Then, the protrusion 11 is brought into contact with the upright portion 5 to form an interval of the protrusion 11 between the upright portions 4 and 5. In this state, when the lower surface of the circuit board 1 comes into contact with the molten solder by the flow soldering device, the hole 6 is formed. The solder 9 rises from the gap between the terminal portions 7 and 8 by capillary action, and at the same time, the solder 9 rises between the upright portions 4 and 5, and the rise of the solder can be visually recognized from the gap between the upright portions 4 and 5. And the finished state of the solder 9 can be confirmed.

As described above, according to the present embodiment, in the bus bar 2 having the upright portions 4 that are electrically connected between the circuit portions of the circuit board 1 and rise up on the circuit board 1, On the outer surface 4A of the portion 4, the upright portion 5 of another bus bar 3 is provided.
Since the projections 11 contacting the outer surface 5A of the bus bar 3 are provided, the projections 11 of the upright portions 4 abut against the upstanding portions 5 of the other bus bars 3, so that an interval of 11 minutes is formed between the upstanding portions 4 and 5. Thus, the state of the solder 9 below the upright portions 4 and 5 can be confirmed.

Further, as described above, in the present embodiment, claim 2
Accordingly, since the protrusion 11 is formed by extruding a part of the upright portion 4, the protrusion 11 can be easily formed by extrusion and can be provided integrally with the upright portion 4.

As described above, according to the present embodiment, the bus bar having the upright portions 4 and 5 that are electrically connected between the circuit portions of the circuit board 1 and that stand up substantially perpendicular to the circuit board 1 is provided. In the connection structure 2, 3, the bus bars 2, 3 forming a pair
Are inserted into the common hole 6 of the circuit board 1 and the outer surfaces 4A and 5A of the upright portions 4 and 5 are arranged to face each other, and the upright portion 4 is located between the outer surfaces 4A and 5A. Protrusions 11, which are space forming portions, are formed on the upright portions 4, 5
Is soldered to the circuit board 1 so that the projections 11 of the upstanding portions 4 abut against the upstanding portions 5 of the other bus bars 3, so that an interval of 11 projections is formed between the upstanding portions 4 and 5. By soldering the circuit board 1 and the bus bars 2 and 3 in this state, the finished state of the solder 9 between the upright portions 4 and 5 can be visually confirmed from above the circuit board 1. In this case, the finished state of the solder 9 can be visually observed from both sides of the upright portions 4 and 5 in the width direction. Further, the upright portions 4 and 5 can be more closely connected to the solder 9, so that the voltage drop can be reduced and the efficiency can be improved.

As described above, in the present embodiment, claim 5
In response to the above, since the interval forming portion is the projection 11 provided on the outer surface 4A of the upright portion 4, by contacting the tip of the projection 11 with the outer surface 5A of the other upright portion 5, the interval between the upright portions 4 and 5 is obtained. Protrusion 11
Minute intervals can be formed.

As described above, in this embodiment, claim 6
Accordingly, since the projection 11 is formed by extruding a part of the upright portion 4, the projection 11 can be easily formed by extrusion and can be provided integrally with the upright portion 4.

Further, as an effect of the embodiment, claim 4
In this method, the solder is supplied from the lower surface side of the circuit board 1 by a blow soldering device, and the terminal portions 7 and 8 are soldered 9 to the circuit board 1 at the hole 6 portions. Automation is possible, and the state of the solder 9 by automatic soldering can be easily confirmed visually between the upright portions 4 and 5.

FIG. 3 shows a second embodiment of the present invention. The same parts as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted. A step portion 12 is formed by bending the lower portion of the upright portion 4 at two places so that the upper portion of the upright portion 4 is located on the inner surface side of the upright portion 4 as compared with the terminal portion 7 which is the lower portion of the upright portion 4. The hole 6
Is formed in a size that can be inserted in a state where the terminal portions 7 and 8 are overlapped.

Therefore, when the terminal portions 7 and 8 which are overlapped are inserted and arranged in the holes 6 and the lower surface of the circuit board 1 is brought into contact with the molten solder by the flow soldering device in this state, the holes 6 and the terminal portions 6 and 6 are formed.
7, the solder 9 rises due to the capillary phenomenon, and at the same time, the solder 9 rises between the upright portions 4 and 5. This solder rise can be visually recognized from the gap between the upright portions 4 and 5.
You can check the finished state of

As described above, according to the present embodiment, in the bus bar 2 having the upright portion 4 that electrically connects the circuit portions of the circuit board 1 and rises on the circuit board 1,
Since the step 12 is formed below the standing portion 4 and located above the lower portion on the inner surface side of the standing portion 4, an interval corresponding to the step 12 is formed between the standing portions 4 and 5. From this interval, the state of the solder under the upright portions 4 and 5 can be confirmed.

As described above, in the present embodiment, in accordance with the seventh aspect, the interval forming portion is formed at a lower portion of the upright portion 4 and an upper portion of the step portion 12 located above the lower portion on the inner surface side of the upright portion 4. Therefore, a space corresponding to the step portion 12 is formed between the upright portions 4 and 5. When the circuit board 1 and the bus bars 2 and 3 are soldered in this state, the upright portions 4 and 5 are placed from above the circuit board 1. The state of the solder 9 between the five can be visually confirmed.

FIG. 4 shows a third embodiment of the present invention. The same parts as those in the above embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted. The two upright portions 4 are provided with the two protrusions 11, 11 and the upright portions 5, 5 of the other busbars 3A, 3A are arranged side by side, and their terminal portions 8, 8 are inserted into the holes 6, and the respective busbars 3A, 3A The protrusions 11, 11 abut against the outer surfaces 5A, 5A of the upright portions 5, 5,
An interval is formed between the upright portions 4, 5, and 5 of one bus bar 2 and the other bus bars 3A, 3A.

Therefore, the protrusions 11, 11 are brought into contact with the upright portions 5, 5, so that a space of 11 minutes is formed between the upright portions 4, 5, 5 and, in this state, the lower surface of the circuit board 1 is formed by the flow soldering apparatus. Is in contact with the molten solder, the holes 6 and the terminals 7, 8
The solder 9 rises due to the capillary phenomenon from the gap between the solder 9 and the solder 9 at the same time rises between the upright portions 4, 5 and 5, and this solder rise can be visually recognized from the gap between the upright portions 4, 5 and 5,
The finished state of the solder 9 can be confirmed.

It should be noted that the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. For example, the shape of the bus bar can be appropriately selected, and the number of bus bars connected to one hole of the circuit board may be four or more. Further, the outer surface of the upright portion is a surface facing the upright portion of another bus bar. Further, the interval forming portion of the first and fourth aspects may be a member separate from the bus bar.

[0036]

According to a first aspect of the present invention, there is provided a bus bar having an upright portion which is electrically connected between circuit portions of a circuit board and which stands up on the circuit board. Since the projection is provided with an abutment on the outer surface of the upright portion, it is possible to provide a bus bar which is excellent in workability and can easily confirm the connection state visually.

According to the second aspect of the present invention, it is possible to provide a bus bar in which the protrusion is formed by extruding a part of the upright portion, and which is excellent in workability and in which the connection state can be easily visually confirmed. .

According to a third aspect of the present invention, there is provided a bus bar electrically connecting circuit portions of a circuit board and having an upright portion standing on the circuit board, wherein a lower portion of the upright portion and an upper portion of the lower portion have the upper portion. A bus bar which is formed with a step portion located on the inner surface side of the portion and which is excellent in workability and in which the connection state can be easily visually confirmed can be provided.

According to a fourth aspect of the present invention, there is provided a bus bar connection structure having an upright portion which is electrically connected between circuit portions of a circuit board and has an upright portion standing on the circuit board, wherein a lower end of the upright portion of the pair of busbars is provided. Are inserted into the common hole of the circuit board, the outer surfaces of the upright portions are arranged to face each other, and a space forming portion that forms a space between the outer surfaces of the upright portions is provided. A connection structure of a bus bar, which is soldered to the circuit board, is excellent in workability, and can easily confirm the connection state visually.

Further, the invention according to claim 5 provides a bus bar connection structure which is excellent in workability and in which it is easy to visually confirm the connection state, wherein the space forming portion is a projection provided on the outer surface of the upright portion. be able to.

Further, the invention according to claim 6 provides a bus bar connection structure in which the space forming portion is a projection provided on the outer surface of the upright portion, which is excellent in workability and allows the connection state to be easily visually checked. be able to.

According to a seventh aspect of the present invention, the space forming portion is a step formed at a lower portion of the upright portion and an upper portion from the lower portion is located on the inner surface side of the upright portion. Accordingly, it is possible to provide a bus bar connection structure in which the connection state can be easily confirmed.

[Brief description of the drawings]

FIG. 1 is a side view showing a first embodiment of the present invention.

FIG. 2 is a plan sectional view before soldering according to the first embodiment;

FIG. 3 is a side view showing a second embodiment of the present invention.

FIG. 4 is a plan sectional view showing a third embodiment of the present invention before soldering.

FIG. 5 is a side view showing a conventional example.

FIG. 6 is a side view showing another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Bus bar 3 Bus bar 3A Bus bar 4 Standing part 4A outer surface 5 Standing part 5A outer surface 9 Solder 11 Projection (space forming part) 12 step part (space forming part)

Claims (7)

[Claims] An electrical connection between circuit portions of a circuit board;
A bus bar having an upright portion standing on the circuit board, wherein a projection is provided on an outer surface of the upright portion to contact an outer surface of the upright portion of another bus bar. 2. The bus bar according to claim 1, wherein the projection is formed by extruding a part of the upright portion. 3. An electrical connection between circuit portions of a circuit board,
A bus bar having an upright portion standing on the circuit board, wherein a lower portion of the upright portion is formed with a step portion located above the lower portion on the inner surface side of the upright portion. 4. An electrical connection between circuit portions of a circuit board,
In the connection structure of a bus bar having an upright portion standing on the circuit board, a lower end of the upright portion of the bus bar forming a pair is inserted into a common hole of the circuit board, and outer surfaces of the upright portions are opposed to each other. A bus bar connection structure, wherein a space forming portion for forming a space between outer surfaces of the upright portions is provided in the upright portions, and a lower end of the upright portions is soldered to the circuit board. 5. The busbar connection structure according to claim 4, wherein said space forming portion is a projection provided on an outer surface of said upright portion. 6. The busbar connection structure according to claim 5, wherein the projection is formed by extruding a part of the upright portion. 7. The bus bar connection structure according to claim 4, wherein the space forming portion is a step formed below the upright portion and having an upper portion above the lower portion located on an inner surface side of the upright portion. .