JPH0590100A - Electronic part - Google Patents

Abstract

PURPOSE:To provide an electronic part which can be positioned when being automatically mounted on a printed board and can sharply improve the mounting rate. CONSTITUTION:This part is equipped with a capacitor body 11 a with a built-in capacitor element 12, a pair of lead wires 16, which are led out of the capacitor element 12, and an insulating plate 15, which performs the insulation between the capacitor body 11a and a printed board, and the insulating plate 15 is provided with a pair of through holes 17, which allow a pair of lead wires 16 pierce themselves to outside, and besides the interval between the center lines of these through holes 17 in a pair and the interval between the center lines of the lead wires 16 in a pair are made different, whereby the lateral backlash between the capacitor body 11a and an insulating plate 15 is removed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a chip type aluminum electrolytic capacitor surface-mounted on a printed circuit board.

[0002]

2. Description of the Related Art With the recent progress in high-density packaging technology for electronic equipment, electronic parts are rapidly becoming chips.

A conventional chip-type aluminum electrolytic capacitor, which is an electronic component of this type, is constructed as shown in FIGS. 3 and 4. That is, the metal case 2a made of aluminum that constitutes the main body 2 in which the capacitor element 1 is built-in.
Is a bottomed cylindrical shape, and the capacitor element 1
A pair of lead electrodes 3 are led out from. Further, the opening of the metal case 2a is sealed by the sealing body 4,
An insulating plate 5 is arranged on the opening side of the metal case 2a. Then, the pair of lead electrodes 3 penetrates the inside of the sealing body 4, and the end faces thereof are exposed to the insulating plate 5 through the opening of the metal case 2a. Further, the insulating plate 5 is provided with a pair of through holes 6 and a storage recess 7 is provided continuously with the pair of through holes 6. Further, lead wires 8 having flat end portions are connected to the pair of lead electrodes 3, respectively, and these lead wires 8 penetrate a pair of through holes 6 provided in the insulating plate 5,
Moreover, the tip end thereof is bent along the bottom surface of the insulating plate 5 and is housed in the housing recess 7.

[0004]

In the conventional chip type aluminum electrolytic capacitor described above, the through hole 6 formed in the insulating plate 5 is used.
Is set to be larger than the diameter of the lead wire 8, and when the main body 2 of the chip-type aluminum electrolytic capacitor and the insulating plate 5 are combined, the diameter of the lead wire 8 on the main body 2 side is insulated from the insulation. If the through holes 6 provided in the plate 5 have the same diameter, it is difficult to combine the main body 2 and the insulating plate, and this is a major factor causing frequent insertion failure of the lead wire 8 especially in mass production automatic equipment. It is a thing.

Therefore, in the above-mentioned conventional chip-type aluminum electrolytic capacitor, in order to eliminate such a cause of failure, the diameter of the through hole 6 provided in the insulating plate 5 is set larger than the diameter of the lead wire 8, Through hole 6 of lead wire 8
The insertion was done smoothly.

However, when the diameter dimension of the through hole 6 provided in the insulating plate 5 is set larger than the diameter dimension of the lead wire 8 as described above, the presence of a gap between the through hole 6 and the lead wire 8 causes Lateral "backlash" will occur between the body 2 and the insulating plate 5 of the chip-type aluminum electrolytic capacitor. If such "backlash" occurs, when chip-type aluminum electrolytic capacitors are surface-mounted on a printed circuit board by an automatic mounting machine, the chip-type aluminum electrolytic capacitors cannot be positioned properly, and the mounting rate drops significantly. Had.

The present invention solves the above-mentioned conventional problems. When electronic components are automatically mounted on a printed circuit board, the electronic components can be reliably positioned and the mounting rate can be greatly improved. It is intended to provide an electronic component.

[0008]

To achieve the above object, an electronic component according to the present invention comprises an electronic component body containing a component element, a pair of lead wires led out from the component element,
An insulating plate that insulates between the electronic component body and the printed circuit board is provided, and a pair of through holes that penetrate the pair of lead wires and lead out to the outside are provided in the insulating plate, and the pair of through holes. And the distance between the center lines of the pair of lead wires is different.

[0009]

According to the above structure, the electronic component body containing the component element, the pair of lead wires led out from the component element, and the insulating plate for insulating between the electronic component body and the printed circuit board are provided. The insulating plate is provided with a pair of through holes for penetrating the pair of lead wires to be led out to the outside, and an interval between center lines of the pair of through holes and an interval between center lines of the pair of lead wires. Therefore, in the state where the insulating plate is combined with the electronic component body, the pair of lead wires abut on the inner walls of the pair of through holes, and between the pair of lead wires and the pair of through holes. The formed voids are located in mutually opposite directions, that is, in the right direction and the left direction.Therefore, even if the insulating plate tries to move laterally with respect to the electronic component body, the lead wire does not contact the inner wall of the through hole. Abutting Ri, therefore the movement is blocked, the position of the lateral "play" is no longer an insulating plate between the electronic component body and the insulating plate is securely fixed. Accordingly, when the electronic component is surface-mounted on the printed circuit board by the automatic mounter, the electronic component can be surely positioned, so that the mounting rate can be significantly improved.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. In FIG. 1 and FIG. 2, reference numeral 11 denotes a metal case made of aluminum which constitutes a capacitor body 11a in which a chip-type aluminum electrolytic capacitor element 12 is built. The metal case 11 has a bottomed cylindrical shape, and the capacitor element 12 A pair of lead electrodes 13 are led out from. The opening of the metal case 11 is sealed by a sealing body 14 made of rubber which is an elastic material, and the opening of the metal case 11 insulates the printed circuit board from the capacitor body 11a. An insulating plate 15 is provided. Then, the pair of lead electrodes 13 penetrates the inside of the sealing body 14, and the end faces are exposed to the insulating plate 15 through the opening of the metal case 11, and the pair of lead electrodes 13 has a tip portion. A pair of flat lead wires 16 are connected.

A pair of through holes 17 are formed in the insulating plate 15.
And a storage recess 18 is provided continuously with the pair of through holes 17. Then, the pair of lead wires 16 penetrate through the pair of through holes 17 provided in the insulating plate 15,
Further, the flat portion at the tip thereof is bent along the bottom surface of the insulating plate 15 and is housed in the housing recess 18. In this case, the relationship between the pair of lead wires 16 and the pair of through holes 17 is such that the distance between the center lines of the pair of through holes 17 is smaller than the distance between the center lines of the pair of lead wires 16. As a result, when the insulating plate 15 is combined with the capacitor body 11a, the pair of lead wires 16 come into contact with the outside of the inner walls of the pair of through holes 17, so that the pair of lead wires 16 and the pair of through wires 16 penetrate. A void 19 formed between the hole 17 and
20 will be located in mutually opposite directions, that is, rightward and leftward. Therefore, the capacitor body 11
Even if the insulating plate 15 attempts to move laterally with respect to a, the lead wire 16 abuts on the outer side of the inner wall of the through hole 17 so that the movement is prevented.

The operation of the above structure will be described below. When the chip type aluminum electrolytic capacitor is surface-mounted on a printed circuit board by an automatic mounting machine, a pair of flat lead wires 16 are reflow soldered to the printed circuit board. In this case, the chip type aluminum electrolytic capacitor is mounted on the printed circuit board. When mounting, the mounting position is determined by the outer shape of the insulating plate 15. At this time, according to one embodiment of the present invention, when the capacitor body 11a and the insulating plate 15 are combined, the lead wire 16 abuts on the outer side of the inner wall of the through hole 17 and the capacitor body 11a and the insulating plate 15 are connected. Since the "backlash" in the horizontal direction between the two is eliminated, the capacitor body 11a and the insulating plate 15 in the chip type aluminum electrolytic capacitor are integrated and the position where the insulating plate 15 is placed is accurately determined. Will be done. As a result, the pair of flat lead wires 16 can be accurately placed at the position to be soldered on the printed circuit board.
High-efficiency automatic mounting is possible without causing mounting misalignment.

In the above embodiment, the insulating plate 15 is provided on the capacitor body 11a by making the distance between the center lines of the pair of through holes 17 smaller than the distance between the center lines of the pair of lead wires 16. The case where the pair of lead wires 16 are brought into contact with the outside of the inner wall of the pair of through holes 17 when combined is described. However, contrary to the above-described one embodiment, between the center lines of the pair of through holes 17. When the insulating plate 15 is combined with the capacitor body 11a by making the distance wider than the distance between the center lines of the pair of lead wires 16,
Even if the pair of lead wires 16 are brought into contact with the inner side of the inner walls of the pair of through holes 17, the same operational effect as that of the above-described embodiment is obtained.

Further, in the above-mentioned one embodiment, the chip type aluminum electrolytic capacitor is explained as an example of the electronic component, but the present invention is not limited to the electrolytic capacitor and the above structure is applied to other electronic components. It goes without saying that you can do it.

[0015]

As described above, according to the electronic component of the present invention, the electronic component main body containing the component element, the pair of lead wires led out from the component element, the electronic component main body and the printed circuit board are provided. An insulating plate for insulating between the insulating plate, the insulating plate is provided with a pair of through holes for penetrating the pair of lead wires to the outside, and the distance between the center lines of the pair of through holes and the pair of through holes. Since the distance between the center lines of the lead wires is different, in the state where the insulating plate is combined with the electronic component body, the pair of lead wires abut on the inner walls of the pair of through holes, and the pair of lead wires. The voids formed between the pair of through holes and the pair of through holes are located in mutually opposite directions, that is, in the right direction and the left direction. Therefore, even if the insulating plate tries to move laterally with respect to the electronic component body, , Lead wire is through hole By abutting the inner wall, therefore the movement is blocked, the position of the lateral "play" is no longer an insulating plate between the electronic component body and the insulating plate is securely fixed. Accordingly, when the electronic component is surface-mounted on the printed circuit board by the automatic mounter, the electronic component can be surely positioned, so that the mounting rate can be significantly improved.

[Brief description of drawings]

FIG. 1 is a cutaway front view of a chip type aluminum electrolytic capacitor showing an embodiment of the present invention.

FIG. 2 is a perspective view of the same chip type aluminum electrolytic capacitor.

FIG. 3 is a cutaway front view of a conventional chip type aluminum electrolytic capacitor.

FIG. 4 is a perspective view of the same chip type aluminum electrolytic capacitor.

[Explanation of symbols]

 11a Capacitor body 12 Capacitor element 14 Sealing body 15 Insulating plate 16 A pair of lead wires 17 A pair of through holes

Claims (1)

[Claims] 1. An electronic component body containing a component element, a pair of lead wires led out from the component element, and an insulating plate for insulating between the electronic component body and a printed circuit board. The plate is provided with a pair of through holes that penetrate the pair of lead wires and lead out to the outside, and the distance between the center lines of the pair of through holes and the distance between the center lines of the pair of lead wires are made different. Electronic parts characterized by the following.