JPH0587851U - DIN connector mounting structure - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a mounting structure for a DIN connector, which prevents the molten solder from largely spreading from the joint between the case and the DIN connector, and does not cause a defective appearance or a defective joint. [Structure] The DIN connector 20 is a case 10 for electronic equipment.
An insertion portion 23 to be inserted into the insertion through hole 12 formed in
A fitting portion formed at the upper end of the insertion portion and fitted in the insertion through hole, and a large diameter portion 2 formed at the upper end of the fitting portion.
1 and is attached to the surface of the electronic device case 10 by melting the ring solder 35 attached to the fitting portion 22. Then, C along the periphery of each of the insertion through holes 12 and 12 along the circumference thereof.
A V-shaped groove 15 is formed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a DIN connector mounting structure in which a DIN connector is mounted on an electronic device case using ring solder.

[0002]

[Prior Art]

 As shown in FIG. 6, the DIN connector attached to the electronic device case usually has an insertion portion 43 to be inserted into a circular insertion through hole 32 formed in the electronic device case 30, and the insertion portion 43. It has a circular fitting portion 42 formed at the upper end and fitted into the insertion through hole 32, and a large diameter portion 41 formed at the upper end of the fitting portion 42, and is attached to the fitting portion 42. By melting the ring solder 35, the ring solder 35 is attached to the surface of the electronic device case 30.

At the lower end of the DIN connector 40, there are provided three terminal portions 44 that are inserted into the contact portions provided on the circuit board arranged in the electronic device case. Two of them (for grounding) are opposed to each other, and the other one is arranged between the two terminal portions.

[0004]

[Problems to be solved by the device]

 In the above-described DIN connector mounting structure, when the ring solder mounted on the DIN connector is melted, the molten solder flows on the surface of the case as shown in FIG. 5, and from the joint between the case and the DIN connector. There is a possibility that the phenomenon of large spread may occur, resulting in poor appearance and poor joints.

In view of the above point, the present invention provides a DIN connector mounting structure that prevents the molten solder from largely spreading from the joint between the case and the DIN connector, and that does not easily cause a poor appearance or a poor joint. The purpose is to provide.

[0006]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, the mounting structure of the DIN connector according to the present invention has an insertion portion to be inserted into an insertion through hole formed in a case for electronic equipment and an insertion portion formed at an upper end of the insertion portion. A fitting portion to be fitted into the through hole and a large-diameter portion formed at the upper end of the fitting portion are provided. By melting the ring solder fitted to the fitting portion, the electronic device case of A DIN connector adapted to be mounted on the surface is used, and a ring-shaped or C-shaped concave groove is formed around the insertion hole of the electronic device case along the insertion hole. I am trying.

[0007]

[Action]

 In the DIN connector mounting structure according to the present invention configured as described above, when the ring solder mounted on the DIN connector is melted, the molten solder flows out to the surface of the case to some extent, but around the insertion through hole. Since the concave groove is provided in the concave groove, the flow destination of the molten solder stops in the concave groove.

Therefore, it is possible to avoid the situation where the molten solder largely spreads out from the joint between the case and the DIN connector, and as a result, the appearance defect and the joint defect are reduced.

Further, since the molten solder does not largely flow out, there is an advantage that the connection strength between the case and the DIN connector and the assembly strength are improved.

[0010]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a DIN connector, a ring solder, and a case for electronic equipment used in a DIN connector mounting structure according to the present invention.

The DIN connector 20 is formed in an insertion through hole 12 described later formed in the electronic device case 10 and an insertion portion 23 formed at the upper end of the insertion portion 23 and fitted into the insertion through hole 12. The fitting case 22 and the large-diameter portion 21 formed on the upper end of the fitting section 22 are melted, and the ring solder 35 mounted on the fitting section 22 is melted to thereby form the electronic device case. It is designed to be attached to the surface of 10.

The electronic device case is used, for example, for an RF modulator, and two insertion through holes 12 are formed at both ends of the upper surface thereof at regular intervals.

As shown in detail in FIG. 2, the shape of the insertion through hole 12 is an oval shape, and the insertion through hole 12 has a pair of narrow sides on the side peripheral portion of the oval insertion through hole 12. The recesses 14 are formed so as to face each other, and the cross-sectional outer shape of the fitting portion 22 of the DIN connector 20 is an oval shape corresponding to the insertion through hole 14 as shown in detail in FIG.

A C-shaped groove 15 in this example is formed around each of the insertion through holes 12 and 12 so as to extend along the insertion through holes 12.

In the DIN connector mounting structure of the present embodiment having such a configuration, when the ring solder 35 mounted on the DIN connector 20 is melted, the molten solder H is generated as shown in FIG. Although it flows out to some extent on the surface of the case, since the concave groove 15 is provided around the insertion through hole 12, the flow destination of the molten solder H stops in the concave groove 15.

Therefore, a situation in which the molten solder H largely spreads out from the joint portion between the case 10 and the DIN connector 20 is avoided, and as a result, appearance defects and joint defects are reduced.

Further, since the molten solder does not largely flow out, there is an advantage that the joint strength and the assembly strength between the case 10 and the DIN connector 20 are improved.

In addition, the insertion through hole 12 has an oval shape, a recess 14 is formed on the outer periphery thereof, and the cross-sectional outer shape of the fitting portion 22 of the DIN connector 20 is the insertion through hole 12 described above. Since it has an oval shape corresponding to, when the ring solder 35 mounted on the DIN connector 20 is melted, the molten solder H does not flow too much to the back surface side of the case 10, and the outer circumference of the DIN connector 20 is prevented. Turn around often. This also makes it possible to reduce defective joints between the case 10 and the DIN connector 20.

Moreover, since the cross-sectional outer shape of the fitting portion 22 of the DIN connector 20 has an oval shape corresponding to the insertion through hole 12, the DIN connector 20 can be easily positioned with respect to the case 10 in the rotational direction. Therefore, the problem that the terminal portion 24 cannot be attached to the circuit board does not occur.

[0020]

[Effect of the device]

 As is clear from the above description, according to the DIN connector mounting structure of the present invention, since the groove is provided around the insertion through hole of the case, when the ring solder is melted, the melted solder is mixed with the case. Although it flows out to some extent on the surface, a groove is formed around the insertion through hole, so that the flow destination of the molten solder stops in the groove. Therefore, a situation in which the molten solder largely spreads out from the joint portion between the case and the DIN connector is avoided, and as a result, appearance defects and joint defects are reduced. Further, since the molten solder does not largely flow out, there is an advantage that the joint strength and the assembly strength between the case and the DIN connector are improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a DIN connector mounting structure according to the present invention.

FIG. 2 is a partial plan view of the case of the embodiment shown in FIG.

3A and 3B are views provided for explaining the operation of the embodiment shown in FIG.

FIG. 4 is a perspective view showing a fitting portion of the DIN connector of the embodiment shown in FIG.

FIG. 5 is a diagram provided for explaining the operation of a conventional DIN connector mounting structure.

FIG. 6 is an exploded perspective view showing an example of a conventional DIN connector mounting structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electronic device case 12 Insertion through hole 14 Recessed portion 15 Recessed groove 20 DIN connector 21 Large diameter portion 22 Fitting portion 23 Insertion portion 24 Terminal portion 35 Ring solder

Claims (1)

[Scope of utility model registration request] 1. An insertion portion to be inserted into an insertion through hole formed in an electronic device case, a fitting portion formed at an upper end of the insertion portion and fitted into the insertion through hole, and a fitting portion of the fitting portion. A mounting structure for a DIN connector, which has a large-diameter portion formed at an upper end and is adapted to be mounted on the surface of the electronic device case by melting ring solder mounted on the fitting portion, A mounting structure for a DIN connector, characterized in that a ring-shaped or C-shaped recessed groove is formed around the insertion through hole of the electronic device case so as to extend along the insertion through hole.