JP2526223Y2 - DIN connector mounting structure - Google Patents

DIN connector mounting structure

Info

Publication number
JP2526223Y2
JP2526223Y2 JP3621092U JP3621092U JP2526223Y2 JP 2526223 Y2 JP2526223 Y2 JP 2526223Y2 JP 3621092 U JP3621092 U JP 3621092U JP 3621092 U JP3621092 U JP 3621092U JP 2526223 Y2 JP2526223 Y2 JP 2526223Y2
Authority
JP
Japan
Prior art keywords
din connector
case
hole
mounting structure
din
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3621092U
Other languages
Japanese (ja)
Other versions
JPH0587852U (en
Inventor
崇嗣 松留
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP3621092U priority Critical patent/JP2526223Y2/en
Publication of JPH0587852U publication Critical patent/JPH0587852U/en
Application granted granted Critical
Publication of JP2526223Y2 publication Critical patent/JP2526223Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、電子機器用ケースにD
INコネクタをリング半田を用いて取り付けるようにさ
れたDINコネクタの取付構造に関する。
The present invention relates to a case for electronic equipment.
The present invention relates to a DIN connector mounting structure in which an IN connector is mounted using ring solder.

【0002】[0002]

【従来の技術】電子機器用ケースに取り付けられるDI
Nコネクタは、通常、図6に示される如くに、電子機器
用ケース30に形成された円形の挿入透孔32に挿入さ
れる挿入部43と、この挿入部43の上端に形成されて
上記挿入透孔32に嵌め込まれる円形の嵌合部42と、
この嵌合部42の上端に形成された大径部41とを有
し、上記嵌合部42に装着されるリング半田35を溶融
させることにより、電子機器用ケース30の表面に取り
付けられるようにされている。
2. Description of the Related Art DI mounted on a case for electronic equipment
As shown in FIG. 6, the N-connector usually has an insertion portion 43 inserted into a circular insertion through-hole 32 formed in the electronic device case 30 and an upper end of the insertion portion 43 to form the insertion portion. A circular fitting portion 42 fitted into the through hole 32,
A large-diameter portion 41 is formed at the upper end of the fitting portion 42, and the ring solder 35 attached to the fitting portion 42 is melted to be attached to the surface of the electronic device case 30. Have been.

【0003】なお、DINコネクタ40の下端部には、
電子機器用ケース内に配される回路基板に設けられたコ
ンタクト部に挿着される3本の端子部44が設けられて
おり、これらのうちの2本(アース用)は対向せしめら
れ、他の一本はそれら2本の端子部の中間位置に配され
ている。
[0003] At the lower end of the DIN connector 40,
Three terminal portions 44 are provided which are inserted into contact portions provided on a circuit board provided in the electronic device case, and two of them (for grounding) are opposed to each other. Is disposed at an intermediate position between the two terminal portions.

【0004】[0004]

【考案が解決しようとする課題】上述したDINコネク
タの取付構造においては、DINコネクタに装着された
リング半田を溶融させると、溶融半田が挿入透孔32と
嵌合部42の隙間からケース裏側に流れて出てしまった
り、DINコネクタの外周に充分に回らないことがあ
り、ケースとDINコネクタとの接合不良を生じるおそ
れがあった。
In the above-described DIN connector mounting structure, when the ring solder mounted on the DIN connector is melted, the molten solder flows from the gap between the insertion through hole 32 and the fitting portion 42 to the back of the case. In some cases, the case may flow out or may not sufficiently rotate around the outer periphery of the DIN connector, which may result in poor connection between the case and the DIN connector.

【0005】また、ケースの挿入透孔とDINコネクタ
の嵌合部がいずれも円形とされているので、ケースに対
するDINコネクタの回転方向の位置決めが難しく、D
INコネクタを挿入しても端子部が回路基板に挿着でき
ないといった問題もあった。
In addition, since the insertion hole of the case and the fitting portion of the DIN connector are both circular, it is difficult to position the DIN connector with respect to the case in the rotational direction, and the DIN connector is difficult to rotate.
There is also a problem that the terminal cannot be inserted into the circuit board even when the IN connector is inserted.

【0006】かかる点に鑑み本考案は、溶融半田がケー
ス裏側に流れて出てしまったり、DINコネクタの外周
に充分に回らない事態を低減でき、ケースとDINコネ
クタとの接合不良を生じるおそれがなく、しかも、ケー
スに対するDINコネクタの回転方向の位置決めを容易
に行うことができるようにされたDINコネクタの取付
構造を提供することを目的とする。
In view of the above, the present invention can reduce the situation where the molten solder flows out to the back side of the case and does not sufficiently reach the outer periphery of the DIN connector. It is another object of the present invention to provide a DIN connector mounting structure that can easily position the DIN connector with respect to the case in the rotational direction.

【0007】[0007]

【課題を解決するための手段】上述の目的を達成すべ
く、本考案に係るDINコネクタの取付構造は、電子機
器用ケースに形成された挿入透孔に挿入される挿入部
と、この挿入部の上端に形成されて上記挿入透孔に嵌め
込まれる嵌合部と、この嵌合部の上端に形成された大径
部とを有し、上記嵌合部に装着されるリング半田を溶融
させることにより、上記電子機器用ケースの表面に取り
付けられるようにされたDINコネクタが用いられ、上
記電子機器用ケースに形成される挿入透孔の形状が小判
形とされるとともに、その外周に少なくとも一つの凹部
が形成され、かつ上記DINコネクタの嵌合部の断面外
形が上記挿入透孔に対応した小判形とされていることを
特徴としている。
In order to achieve the above-mentioned object, a DIN connector mounting structure according to the present invention includes an insertion portion inserted into an insertion hole formed in a case for an electronic device, and the insertion portion. And a large-diameter portion formed at the upper end of the fitting portion. The ring solder attached to the fitting portion is melted. Thereby, a DIN connector adapted to be attached to the surface of the electronic device case is used, and the shape of the insertion through hole formed in the electronic device case is made oval, and at least one It is characterized in that a concave portion is formed, and the cross-sectional outer shape of the fitting portion of the DIN connector is an oval shape corresponding to the insertion through hole.

【0008】[0008]

【作用】上述の如くの構成とされた本考案に係るDIN
コネクタの取付構造においては、DINコネクタに装着
されたリング半田を溶融させると、溶融半田がケース表
面に多少は流れ出るが、ケース裏面側に流れ出すぎるこ
とはなく、DINコネクタの外周によく回る。そのた
め、ケースとDINコネクタとの接合不良を生じるおそ
れがなくなる。しかも、DINコネクタの嵌合部の断面
外形が上記挿入透孔に対応した小判形とされているの
で、ケースに対するDINコネクタの回転方向の位置決
めを容易に行うことができ、従って、端子部が回路基板
に挿着できないといった問題も生じない。
The DIN according to the present invention having the structure described above is provided.
In the connector mounting structure, when the ring solder mounted on the DIN connector is melted, the molten solder slightly flows out to the front surface of the case, but does not flow out too much to the back surface of the case, and circulates around the outer periphery of the DIN connector. For this reason, there is no possibility that poor connection between the case and the DIN connector occurs. In addition, since the cross-sectional shape of the fitting portion of the DIN connector is an oval shape corresponding to the insertion through hole, the DIN connector can be easily positioned in the rotational direction with respect to the case. There is no problem that it cannot be inserted into the substrate.

【0009】[0009]

【実施例】以下、本考案の実施例を図面を参照しつつ説
明する。図1は本考案に係るDINコネクタの取付構造
に使用されるDINコネクタ,リング半田,電子機器用
ケースを示している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a DIN connector, a ring solder, and a case for an electronic device used in the DIN connector mounting structure according to the present invention.

【0010】DINコネクタ20は、電子機器用ケース
10に形成された後述の挿入透孔12に挿入される挿入
部23と、この挿入部23の上端に形成されて上記挿入
透孔12に嵌め込まれる嵌合部22と、この嵌合部22
の上端に形成された大径部21とを有し、嵌合部22に
装着されるリング半田35を溶融させることにより、上
記電子機器用ケース10の表面に取り付けられるように
されている。
The DIN connector 20 has an insertion portion 23 inserted into an insertion hole 12 described later formed in the electronic device case 10, and is formed at an upper end of the insertion portion 23 and fitted into the insertion hole 12. The fitting portion 22 and the fitting portion 22
And a large-diameter portion 21 formed at the upper end of the case. The ring solder 35 mounted on the fitting portion 22 is melted to be attached to the surface of the electronic device case 10.

【0011】電子機器用ケースは、例えば、RFモジュ
レータ用のものであり、その上面の両端側にそれぞれ2
つの挿入透孔12,12が一定間隔を隔てて形成されて
いる。
The case for an electronic device is, for example, for an RF modulator, and two cases are provided at both ends of the upper surface thereof.
The two insertion through holes 12, 12 are formed at regular intervals.

【0012】この挿入透孔12の形状は、図2に詳細に
示される如くに、小判形とされるとともに、その小判形
の挿入透孔12の狭い方の幅をもつ側周部に一対の凹部
14が対向して形成され、かつ、DINコネクタ20の
嵌合部の断面外形が図4に詳細に示される如くに、上記
挿入透孔12に対応した小判形とされている。
As shown in detail in FIG. 2, the shape of the insertion through-hole 12 is formed in an oval shape, and a pair of narrow sides of the oval-shaped insertion through-hole 12 are formed in a side peripheral portion having a narrower width. The concave portions 14 are formed to face each other, and the cross-sectional shape of the fitting portion of the DIN connector 20 is formed in an oval shape corresponding to the insertion through hole 12 as shown in detail in FIG.

【0013】そして、上記挿入透孔12,12のそれぞ
れに沿うようにその周囲に本例ではC字状の凹溝15が
形成されている。
In this embodiment, a C-shaped groove 15 is formed around each of the insertion holes 12, 12.

【0014】このような構成とされた本実施例のDIN
コネクタの取付構造においては、挿入透孔12の形状が
小判形とされるとともに、その外周に凹部14が形成さ
れ、かつ上記DINコネクタ20の嵌合部22の断面外
形が上記挿入透孔12に対応した小判形とされているの
で、DINコネクタ20に装着されたリング半田35を
溶融させたとき、溶融半田Hが凹部14からケース10
の裏面側に流れ出すぎることはなく、DINコネクタ2
0の外周によく回る。それによって、ケース10の表面
と裏面に溶融半田Hを適量設けることができ、DINコ
ネクタ20を、ケース10表、裏面で固定することがで
きるので、ケース10とDINコネクタ20との接合不
良を低減できる。
The DIN of this embodiment having such a configuration is
In the connector mounting structure, the insertion through hole 12 has an oval shape, a concave portion 14 is formed on the outer periphery thereof, and the cross-sectional outer shape of the fitting portion 22 of the DIN connector 20 is in the insertion through hole 12. When the ring solder 35 attached to the DIN connector 20 is melted, the molten solder H flows from the recess 14
Of the DIN connector 2
It goes around the circumference of 0 well. As a result, a proper amount of the molten solder H can be provided on the front and back surfaces of the case 10, and the DIN connector 20 can be fixed on the front and back surfaces of the case 10, so that the joint failure between the case 10 and the DIN connector 20 is reduced. it can.

【0015】しかも、DINコネクタ20の嵌合部22
の断面外形が挿入透孔12に対応した小判形とされてい
ることから、ケース10に対するDINコネクタ20の
回転方向の位置決めを容易に行うことができ、従って、
端子部24が回路基板に挿着できないといった問題も生
じなくなる。
Further, the fitting portion 22 of the DIN connector 20
Is formed in an oval shape corresponding to the insertion through-hole 12, the DIN connector 20 can be easily positioned relative to the case 10 in the rotational direction.
The problem that the terminal portion 24 cannot be inserted into the circuit board does not occur.

【0016】それに加えて、DINコネクタ20に装着
されたリング半田35を溶融させると、従来においては
図5に示される如くに、ケース30とDINコネクタ4
0との接合部から溶融半田が大きく広がり出てしまう
が、本例では、図3に示される如くに、溶融半田Hがケ
ース10表面に多少は流れ出るが、挿入透孔12の周囲
に凹溝15が設けられているので、溶融半田Hの流れ先
は凹溝15内で止まる。
In addition, when the ring solder 35 mounted on the DIN connector 20 is melted, as shown in FIG.
In this example, the molten solder H slightly flows out of the surface of the case 10 as shown in FIG. 15 is provided, the flow destination of the molten solder H stops in the concave groove 15.

【0017】そのため、溶融半田Hがケース10とDI
Nコネクタ20との接合部から大きく広がり出てしまう
事態が回避され、その結果、外観不良や接合不良が低減
される。
Therefore, the molten solder H is transferred between the case 10 and DI.
It is possible to avoid a situation in which the connection portion and the N connector 20 are greatly spread, and as a result, poor appearance and poor connection are reduced.

【0018】また、溶融半田が大きく流れ出ないことか
ら、ケース10とDINコネクタ20との接合強度及び
組み立て強度が向上するという利点も得られる。
Further, since the molten solder does not flow out significantly, there is an advantage that the joining strength and the assembling strength between the case 10 and the DIN connector 20 are improved.

【0019】[0019]

【考案の効果】以上の説明から明らかな如く、本考案に
係るDINコネクタの取付構造によれば、挿入透孔の形
状が小判形とされるとともに、その外周に凹部が形成さ
れ、かつ上記DINコネクタの嵌合部の断面外形が上記
挿入透孔に対応した小判形とされているので、DINコ
ネクタに装着されたリング半田を溶融させると、溶融半
田がケース表面に多少は流れ出るが、ケース裏面側に流
れ出すぎることはなく、DINコネクタの外周によく回
り、そのため、ケースとDINコネクタとの接合不良を
生じるおそれがなくなる。しかも、DINコネクタの嵌
合部の断面外形が上記挿入透孔に対応した小判形とされ
ているので、ケースに対するDINコネクタの回転方向
の位置決めを容易に行うことができ、従って、端子部が
回路基板に挿着できないといった問題も生じなくなる。
As is apparent from the above description, according to the DIN connector mounting structure according to the present invention, the insertion through hole has an oval shape, a concave portion is formed on the outer periphery thereof, and the DIN connector is provided. When the ring solder attached to the DIN connector is melted, some of the molten solder flows out to the case surface because the cross-sectional shape of the fitting portion of the connector is an oval shape corresponding to the insertion through hole. It does not flow too much to the side and goes around the outer periphery of the DIN connector well, so that there is no danger of poor connection between the case and the DIN connector. In addition, since the cross-sectional shape of the fitting portion of the DIN connector is an oval shape corresponding to the insertion through hole, the DIN connector can be easily positioned in the rotational direction with respect to the case. The problem that it cannot be inserted into the substrate does not occur.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案に係るDINコネクタの取付構造の一実
施例を示す分解斜視図。
FIG. 1 is an exploded perspective view showing an embodiment of a DIN connector mounting structure according to the present invention.

【図2】図1に示される実施例のケースの部分平面図。FIG. 2 is a partial plan view of the case of the embodiment shown in FIG.

【図3】図1に示される実施例の作用説明に供される
図。
FIG. 3 is a diagram which is used for describing the operation of the embodiment shown in FIG.

【図4】図1に示される実施例のDINコネクタの嵌合
部を示すための斜視図。
FIG. 4 is a perspective view showing a fitting portion of the DIN connector of the embodiment shown in FIG. 1;

【図5】従来のDINコネクタの取付構造の作用説明に
供される図。
FIG. 5 is a diagram which is used for describing the operation of a conventional DIN connector mounting structure.

【図6】従来のDINコネクタの取付構造の一例を示す
分解斜視図。
FIG. 6 is an exploded perspective view showing an example of a conventional DIN connector mounting structure.

【符号の説明】[Explanation of symbols]

10 電子機器用ケース 12 挿入透孔 14 凹部 15 凹溝 20 DINコネクタ 21 大径部 22 嵌合部 23 挿入部 24 端子部 35 リング半田 DESCRIPTION OF SYMBOLS 10 Electronic device case 12 Insert through hole 14 Depression 15 Depression groove 20 DIN connector 21 Large diameter part 22 Fitting part 23 Insertion part 24 Terminal part 35 Ring solder

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 電子機器用ケースに形成された挿入透孔
に挿入される挿入部と、この挿入部の上端に形成されて
上記挿入透孔に嵌め込まれる嵌合部と、この嵌合部の上
端に形成された大径部とを有し、上記嵌合部に装着され
るリング半田を溶融させることにより、上記電子機器用
ケースの表面に取り付けられるようにされたDINコネ
クタの取付構造において、 上記電子機器用ケースに形成される挿入透孔の形状が小
判形とされるとともに、その外周に少なくとも一つの凹
部が形成され、かつ上記DINコネクタの嵌合部の断面
外形が上記挿入透孔に対応した小判形とされていること
を特徴とするDINコネクタの取付構造。
1. An insertion part to be inserted into an insertion through hole formed in a case for an electronic device, a fitting part formed at an upper end of the insertion part and fitted into the insertion through hole, A DIN connector mounting structure having a large-diameter portion formed at the upper end and melting a ring solder mounted on the fitting portion, so as to be mounted on the surface of the electronic device case, The shape of the insertion hole formed in the electronic device case is an oval shape, at least one concave portion is formed on the outer periphery thereof, and the cross-sectional outer shape of the fitting portion of the DIN connector is formed in the insertion hole. A DIN connector mounting structure characterized by a corresponding oval shape.
JP3621092U 1992-04-30 1992-04-30 DIN connector mounting structure Expired - Lifetime JP2526223Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3621092U JP2526223Y2 (en) 1992-04-30 1992-04-30 DIN connector mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3621092U JP2526223Y2 (en) 1992-04-30 1992-04-30 DIN connector mounting structure

Publications (2)

Publication Number Publication Date
JPH0587852U JPH0587852U (en) 1993-11-26
JP2526223Y2 true JP2526223Y2 (en) 1997-02-19

Family

ID=12463394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3621092U Expired - Lifetime JP2526223Y2 (en) 1992-04-30 1992-04-30 DIN connector mounting structure

Country Status (1)

Country Link
JP (1) JP2526223Y2 (en)

Also Published As

Publication number Publication date
JPH0587852U (en) 1993-11-26

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