JPH0587525B2 - - Google Patents
Info
- Publication number
- JPH0587525B2 JPH0587525B2 JP57101319A JP10131982A JPH0587525B2 JP H0587525 B2 JPH0587525 B2 JP H0587525B2 JP 57101319 A JP57101319 A JP 57101319A JP 10131982 A JP10131982 A JP 10131982A JP H0587525 B2 JPH0587525 B2 JP H0587525B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- polyphenylene ether
- ether
- epoxy
- reaction product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 claims description 38
- 229920000647 polyepoxide Polymers 0.000 claims description 38
- 239000007795 chemical reaction product Substances 0.000 claims description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 4
- 229920001955 polyphenylene ether Polymers 0.000 description 28
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 125000003700 epoxy group Chemical group 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- -1 poly(2,6-dichlorophenylene ether) Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical class C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
Description
本発明は、熱硬化性エポキシ樹脂組成物に係
る。特に本発明は電気特性に優た、特定のポリフ
エニレンエーテルとエポキシ樹脂との反応生成物
よりなる熱硬化性エポキシ樹脂組成物に係る。
エポキシ樹脂は優れた電気的性質を有するため
絶縁材料等に使用されている。例えば変圧器、ブ
スバーの絶縁封入、碍子、碍管、切換器、開閉器
等の製造に利用されている。しかし、最近エポキ
シ樹脂よりも、更に電気特性、例えば高周波数特
性の優れた材料が要求されている。本発明は電気
特性に優れた熱硬化性エポキシ樹脂組成物を経済
的に提供するものである。
一般式〔―Ar−Ｏ〕―
――
Ｈ（ここにＡ
ｒは２価の芳香族残基を示す。）であらわされる
ポリフエニルエーテルは、優れた電気特性を有す
る。
高周波電流を流した時の電力損失は次の式で表
わされる。
Ｗ＝ｋ・E2・ｆ・ε.tanδ
Ｗ：電力損失
ｋ：定数
Ｅ：電圧
ｆ：周波数
すなわち、電力損失はｆ，ε，tanδの積に比例
することになり、周波数ｆが大きくなると電力損
失は大きくなる。従つて高周波数用途にはε，
tanδの小さい材料が要求される。
エポキシ樹脂とポリ（２，６−ジメチルフエニ
レン−１，４−エーテル）の1MHzに於ける誘電
体損失角（tanδ）と誘電率（ε）はだいたい次の
値である。
The present invention relates to a thermosetting epoxy resin composition. In particular, the present invention relates to a thermosetting epoxy resin composition having excellent electrical properties and comprising a reaction product of a specific polyphenylene ether and an epoxy resin. Epoxy resins have excellent electrical properties and are used as insulating materials. For example, it is used in the manufacture of transformers, insulating enclosures for busbars, insulators, insulators, switches, switches, etc. However, recently there has been a demand for materials with even better electrical properties, such as high frequency properties, than epoxy resins. The present invention provides an economical thermosetting epoxy resin composition with excellent electrical properties. Polyphenyl ether represented by the general formula [-Ar-O]--H (where Ar represents a divalent aromatic residue) has excellent electrical properties. The power loss when high frequency current flows is expressed by the following formula. W = k・E 2・f・ε.tanδ W: Power loss k: Constant E: Voltage f: Frequency In other words, power loss is proportional to the product of f, ε, and tanδ, and as the frequency f increases, the power The losses will be large. Therefore, for high frequency applications, ε,
Materials with small tanδ are required. The dielectric loss angle (tan δ) and permittivity (ε) of epoxy resin and poly(2,6-dimethylphenylene-1,4-ether) at 1 MHz are approximately the following values.
【表】
ポリフエニレンエーテルのε，tanδは非常に小
さく、高周波用途に非常に好ましい材料である。
エポキシ樹脂にポリフエニレンエーテルを配合す
ると、エポキシ樹脂の電気特性は良くなることは
考えられる。我々は、ポリフエニレンエーテルを
均一にエポキシ樹脂に配合することについて種々
検討の結果、本発明に至つた。
本発明は、
Ａ 数平均分子量1000以下のポリフエニレンエー
テルと
Ｂ ビスフエノールとエピクロルヒドリンから合
成されるエポキシ樹脂プレポリマー
との反応生成物に硬化剤及び／又は硬化促進剤を
加えてなることを特徴とする熱硬化性エポキシ樹
脂組成物である。
エポキシ樹脂にポリフエニレンエーテルを溶解
し、ポリフエニレンエーテルのの末端水酸基とエ
ポキシ基を反応させる方法について検討した結
果、ポリフエニレンエーテルは分子量が小さくな
る程エポキシ樹脂に良く溶解し、末端水酸基とエ
ポキシ基との反応も起りやすく、均一に変性され
たエポキシ樹脂が得られることを発見した。好ま
しいポリフエニレンエーテルの分子量は、数平均
分子量で10000以下、好ましくは1000〜8000の低
重合体であつた。
本発明において使用されるポリフエニレンエー
テルは、一般式
〔―Ar−Ｏ〕――Ｈ
ここに、Arは二価の芳香族残基を示し、
ｎは５以上の整数を表わす。）
で表わされるポリフエニレンエーテル類であり、
それらの具体例としては、ポリ（２，６−ジメチ
ルフエニレン−１，４−エーテル）、ポリ（２−
メチル−６−エチルフエニレン−１，４−エーテ
ル）、ポリ（２，６−ジエチルフエニレン−１，
４−エーテル）、ポリ（２，６−ジクロルフエニ
レンエーテル）、ポリ（２−クロル−６−メチル
フエニレン−１，４−エーテル）、ポリ（２，６
−フエニルフエニレン−１，４−エーテル）、ポ
リ（２−メチル−６−ｎ−プロピレンフエニレン
−１，４−エーテル）、ポリ（フエニレン−１，
３−エーテル）等が挙げられる。ポリ（２，６−
ジメチルフエニレン−１，４−エーテル）が最も
広く使用されており、最も好ましい。
ポリフエニレンエーテルの末端は、片方が−
OH基であり、他方は、−Ｈ、−OH、あるいは他
の基であつても良い。
本発明に使用されるビスフエノールとエピクロ
ルヒドリンから合成されるエポキシ樹脂プレポリ
マーは１分子当り平均二個以上のエポキシ基
[Table] The ε and tan δ of polyphenylene ether are very small, making it a highly preferred material for high frequency applications.
It is conceivable that when polyphenylene ether is blended with epoxy resin, the electrical properties of the epoxy resin will be improved. As a result of various studies on uniformly blending polyphenylene ether into epoxy resin, we have arrived at the present invention. The present invention is characterized in that a curing agent and/or curing accelerator is added to the reaction product of A polyphenylene ether having a number average molecular weight of 1000 or less and B an epoxy resin prepolymer synthesized from bisphenol and epichlorohydrin. This is a thermosetting epoxy resin composition. As a result of investigating a method of dissolving polyphenylene ether in epoxy resin and reacting the terminal hydroxyl group of polyphenylene ether with the epoxy group, it was found that the smaller the molecular weight of polyphenylene ether, the better it dissolves in epoxy resin, and the terminal hydroxyl group It was discovered that the reaction between the epoxy group and the epoxy group is easy to occur, and a uniformly modified epoxy resin can be obtained. The preferred polyphenylene ether is a low polymer having a number average molecular weight of 10,000 or less, preferably 1,000 to 8,000. The polyphenylene ether used in the present invention has the general formula [-Ar-O]--H where Ar represents a divalent aromatic residue,
n represents an integer of 5 or more. ) are polyphenylene ethers represented by
Specific examples thereof include poly(2,6-dimethylphenylene-1,4-ether), poly(2-
methyl-6-ethylphenylene-1,4-ether), poly(2,6-diethylphenylene-1,
4-ether), poly(2,6-dichlorophenylene ether), poly(2-chloro-6-methylphenylene-1,4-ether), poly(2,6
-phenylphenylene-1,4-ether), poly(2-methyl-6-n-propylenephenylene-1,4-ether), poly(phenylene-1,
3-ether), etc. Poly(2,6-
dimethylphenylene-1,4-ether) is the most widely used and most preferred. One end of polyphenylene ether is −
One is an OH group, and the other may be -H, -OH, or another group. The epoxy resin prepolymer synthesized from bisphenol and epichlorohydrin used in the present invention has an average of two or more epoxy groups per molecule.
【式】結合を有するものである。
ビスフエノールとエピクロルヒドリンから合成
されるエポキシ樹脂プレポリマーは次の構造式を
有する。[Formula] has a bond. An epoxy resin prepolymer synthesized from bisphenol and epichlorohydrin has the following structural formula.
【化】
ｎは０〜20の範囲で使用される。更にビスフエ
ノールＡ、テトラブロムビスフエノールＡとエピ
クロルヒドリンから合成される代表的なエポキシ
樹脂は次の構造式を有する。[Chemical formula] n is used in the range of 0 to 20. Further, a typical epoxy resin synthesized from bisphenol A, tetrabromobisphenol A and epichlorohydrin has the following structural formula.
【化】
上式においてｍに対してｎの数を相対的に大き
くすると難燃性は増加する。
本発明の特徴の一つである数平均分子量10000
以下のポリフエニレンエーテルを用いる利点は次
の通りである。
(1) ポリフエニレンエーテルがエポキシ樹脂に溶
解しやすい。従つてポリフエニレンエーテルの
末端基とエポキシ基を反応させる時に、溶剤等
の添加を不用にできる。
(2) エポキシ樹脂の成形時の粘度を低くでき、成
形しやすくなる。本発明の反応生成物（変性エ
ポキシ樹脂）に更に硬化剤、硬化促進剤等を添
加して成形に使用する時に、種々の成形法があ
るが注型、塗布等ではエポキシ樹脂の粘度が適
度であることが必要である。数平均分子量
10000以上の高重合度のポリフエニレンエーテ
ルを用いた場合には、高粘度になるため、成形
時に高温に加熱することが必要になり、エポキ
シ基の硬化時間の調節が困難になるかあるいは
溶剤を加えなければならななくなる。数平均分
子量10000以下のポリフエニレンエーテルを用
いた場合には粘度調節が容易になり成形しやす
くなる。
(3) ポリフエニレンエーテルの分子量が小さくな
ると、末端水酸基当りの分子量も小さくなり、
末端水酸基がエポキシ基と反応することによ
り、ポリフエニレンエーテルとエポキシ樹脂が
より均一に相溶できる。
本発明の反応生成物（変性エポキシ樹脂）は、
エポキシ樹脂とポリフエニレンエーテル、更に必
要に応じて触媒を加え、加熱撹拌することにより
得られる。ポリフエニレンエーテルの末端水酸基
数に対して多量のエポキシ基数の存在下で、触媒
を加えて加熱撹拌して均一に溶解反応させる。触
媒としては、第３級アミン、第４級アンモニウム
塩、例えば、ジメチルベンジルアミン、トリエチ
ルベンジルアンモニウムクロライド等が使用でき
る。
又、ポリフエニレンエーテルとエポキシ化合物
の共通溶媒を加えて加熱撹拌することもできる。
クロロホルム、トリクロロエチレン、ニトロペン
ゼン等が溶媒として使用できる。クロロホルム、
トリクロロエチレンを使用して、これ等溶媒の沸
点以上に加熱する場合には耐圧容器を用いて反応
させる。クロロホルム溶液として反応物が得られ
れば、それがそのまま絶縁紙等を製造するための
プリブレグ製造用に使用できる。
エポキシ化合物／ポリフエニレンエーテルの比
が小さくなると、共通溶媒を添加するか、あるい
は混練温度を高くして反応させる。共通溶媒を添
加しない場合には、合成樹脂混練用ニーダー、あ
るいは押出機等で混練反応させることができる。
本発明の反応生成物（変性エポキシ樹脂）を使
用するには、反応生成物（変性エポキシ樹脂）
に、硬化剤、硬化促進剤、追加のエポキシ樹脂、
溶剤等を添加して使用する。
硬化剤としては、第一級、第二級アミンとそれ
等の化合物、酸無水物、ポリアミド、第三級アミ
ン、アミン塩、三フツ化ホウ素、ジシアンジアミ
ド等が使用できる。
メタフエニレンジアミン、ジアミノフエニルメ
タン及びその誘導体、ベンジジン誘導体等が使用
できる。
本発明の反応生成物（変性エポキシ樹脂）の好
ましい組成は、ポリフエニレンエーテル70〜５重
量部、エポキシ樹脂30〜95重量部であ。組成は反
応生成物（変性エポキシ樹脂）の成形法、使用目
的等により異なり、適宜選択される。
本発明の反応生成物（変性エポキシ樹脂）は、
従来使用されてきたエポキシ樹脂の用途分野に広
く使用できるが、特に電気特性の良好な点を生か
した電気部品分野、電気絶縁材料や電機部品の注
型、電子部品の封入、埋込、含浸等に良好に使用
できる。又、ガラス繊維、ポリアミド繊維、ポリ
イミド繊維、ポリエステル繊維、炭素繊維、紙、
マイカ等と共に使用することもできる。
実施例
次の物質を使用した。
エポキシ化合物：ビスフエノールＡとエピクロル
ヒドリンを主原料として製造されたエポキ
シ当量が450〜500のエポキシ樹脂
ポリフエニレンエーテル（以下PPEと略称）：数
平均分子量が5000のポリ（２，６−ジメチ
ルフエニレン−１，４−エーテル）
エポキシ化合物60重量部、PPE40重量部、トリ
エチルアンモニウムクロライド0.1重量部を混合
し、180℃で６時間撹拌してPPEとエポキシ化合
物を反応させた。
上記反応生成物 40重量部
エポキシ樹脂 40重量部
ジアミノジフエニルメタン 20重量部
を均一に混合して溶解し、約100℃に加熱した後
注型して、硬化させた。得られた注型品の1MHz
に於ける誘電率と誘電正接を測定した。[Chemical formula] In the above formula, when the number of n is increased relative to m, the flame retardance increases. One of the features of the present invention is a number average molecular weight of 10,000
The advantages of using the following polyphenylene ethers are as follows. (1) Polyphenylene ether easily dissolves in epoxy resin. Therefore, when reacting the terminal group of polyphenylene ether with the epoxy group, it is not necessary to add a solvent or the like. (2) The viscosity of the epoxy resin can be lowered during molding, making it easier to mold. When the reaction product (modified epoxy resin) of the present invention is further added with a curing agent, a curing accelerator, etc. and used for molding, there are various molding methods, but the viscosity of the epoxy resin is not suitable for casting, coating, etc. It is necessary that there be. number average molecular weight
When polyphenylene ether with a high degree of polymerization of 10,000 or more is used, it becomes highly viscous and requires heating to high temperatures during molding, making it difficult to control the curing time of the epoxy group or using solvents. will have to be added. When polyphenylene ether having a number average molecular weight of 10,000 or less is used, the viscosity can be easily controlled and molding becomes easier. (3) As the molecular weight of polyphenylene ether decreases, the molecular weight per terminal hydroxyl group also decreases,
By reacting the terminal hydroxyl group with the epoxy group, the polyphenylene ether and the epoxy resin can be more uniformly miscible. The reaction product (modified epoxy resin) of the present invention is
It can be obtained by adding an epoxy resin, polyphenylene ether, and a catalyst if necessary, and heating and stirring. In the presence of a large amount of epoxy groups relative to the number of terminal hydroxyl groups of polyphenylene ether, a catalyst is added and heated and stirred to uniformly dissolve and react. As the catalyst, tertiary amines and quaternary ammonium salts such as dimethylbenzylamine and triethylbenzylammonium chloride can be used. Alternatively, a common solvent for polyphenylene ether and epoxy compound may be added and stirred with heating.
Chloroform, trichloroethylene, nitropenzene, etc. can be used as a solvent. Chloroform,
When trichlorethylene is used and heated above the boiling point of the solvent, the reaction is carried out using a pressure vessel. If the reactant is obtained as a chloroform solution, it can be used as it is for producing prepregs for producing insulating paper and the like. When the ratio of epoxy compound/polyphenylene ether becomes small, a common solvent is added or the kneading temperature is increased to cause the reaction. When a common solvent is not added, the kneading reaction can be carried out using a synthetic resin kneading kneader, an extruder, or the like. To use the reaction product (modified epoxy resin) of the present invention, the reaction product (modified epoxy resin)
In addition, curing agent, curing accelerator, additional epoxy resin,
Use with addition of solvent etc. As the curing agent, primary and secondary amines and their compounds, acid anhydrides, polyamides, tertiary amines, amine salts, boron trifluoride, dicyandiamide, etc. can be used. Metaphenylenediamine, diaminophenylmethane and its derivatives, benzidine derivatives, etc. can be used. A preferred composition of the reaction product (modified epoxy resin) of the present invention is 70 to 5 parts by weight of polyphenylene ether and 30 to 95 parts by weight of epoxy resin. The composition varies depending on the molding method of the reaction product (modified epoxy resin), the purpose of use, etc., and is appropriately selected. The reaction product (modified epoxy resin) of the present invention is
It can be used in a wide range of applications for conventionally used epoxy resins, but especially in the field of electrical components that take advantage of its good electrical properties, casting of electrical insulating materials and electrical components, and encapsulation, embedding, and impregnation of electronic components. It can be used well. In addition, glass fiber, polyamide fiber, polyimide fiber, polyester fiber, carbon fiber, paper,
It can also be used with mica etc. Examples The following materials were used. Epoxy compound: Epoxy resin with an epoxy equivalent of 450 to 500, produced using bisphenol A and epichlorohydrin as main raw materials Polyphenylene ether (hereinafter abbreviated as PPE): Poly(2,6-dimethylphenylene) with a number average molecular weight of 5000 -1,4-ether) 60 parts by weight of the epoxy compound, 40 parts by weight of PPE, and 0.1 part by weight of triethylammonium chloride were mixed and stirred at 180°C for 6 hours to react the PPE and the epoxy compound. The above reaction product 40 parts by weight epoxy resin 40 parts by weight diaminodiphenylmethane 20 parts by weight were uniformly mixed and dissolved, heated to about 100° C., then cast and cured. 1MHz of the obtained cast product
The dielectric constant and dielectric loss tangent were measured.
【表】
結果は上表の如く、本発明の注型品は低い誘電
率、誘電正接を有し、他の各種物性は未変性エポ
キシ樹脂とほぼ等しく高周波電気部品に適した材
料であつた。[Table] The results are as shown in the table above, and the cast product of the present invention had a low dielectric constant and dielectric loss tangent, and other physical properties were almost equal to those of unmodified epoxy resin, making it a material suitable for high-frequency electrical parts.
Claims (1)
エーテルと Ｂ ビスフエノールとエピクロルヒドリンから合
成されるエポキシ樹脂プレポリマー との反応生成物に硬化剤及び／又は硬化促進剤を
加えてなることを特徴とする熱硬化性エポキシ樹
脂組成物。[Scope of Claims] 1. A curing agent and/or curing accelerator is added to the reaction product of A. a polyphenyl ether with a number average molecular weight of 10,000 or less and B. an epoxy resin prepolymer synthesized from bisphenol and epichlorohydrin. A thermosetting epoxy resin composition characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10131982A JPS58219217A (en) | 1982-06-15 | 1982-06-15 | Modified epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10131982A JPS58219217A (en) | 1982-06-15 | 1982-06-15 | Modified epoxy resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58219217A JPS58219217A (en) | 1983-12-20 |
| JPH0587525B2 true JPH0587525B2 (en) | 1993-12-17 |
Family
ID=14297484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10131982A Granted JPS58219217A (en) | 1982-06-15 | 1982-06-15 | Modified epoxy resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58219217A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4912172A (en) * | 1987-09-03 | 1990-03-27 | General Electric Company | Compositions comprising polyphenylene ethers, polyepoxides and aluminum or zinc diketone salt |
| US5141791A (en) * | 1988-10-11 | 1992-08-25 | General Electric Company | Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom |
| US5213886A (en) * | 1989-02-17 | 1993-05-25 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
| US5162450A (en) * | 1989-02-17 | 1992-11-10 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
| US5834565A (en) * | 1996-11-12 | 1998-11-10 | General Electric Company | Curable polyphenylene ether-thermosetting resin composition and process |
| US6197898B1 (en) | 1997-11-18 | 2001-03-06 | General Electric Company | Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent |
| US6576718B1 (en) | 1999-10-05 | 2003-06-10 | General Electric Company | Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) |
| WO2003027167A1 (en) * | 2001-09-20 | 2003-04-03 | Asahi Kasei Chemicals Corporation | Functionalized polyphenylene ether |
| US7439310B2 (en) | 2006-07-06 | 2008-10-21 | Asahi Kasei Chemicals Corporation | Polyphenylene ether modified by reaction with cresol novolac epoxy resin |
| JP6119392B2 (en) * | 2013-04-12 | 2017-04-26 | Dic株式会社 | Modified polyarylene ether resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5252991A (en) * | 1975-09-26 | 1977-04-28 | Hitachi Chem Co Ltd | Process for preparing novel vinyl copolymers |
-
1982
- 1982-06-15 JP JP10131982A patent/JPS58219217A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5252991A (en) * | 1975-09-26 | 1977-04-28 | Hitachi Chem Co Ltd | Process for preparing novel vinyl copolymers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58219217A (en) | 1983-12-20 |
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