JPH0586313B2 - - Google Patents
Info
- Publication number
- JPH0586313B2 JPH0586313B2 JP22880785A JP22880785A JPH0586313B2 JP H0586313 B2 JPH0586313 B2 JP H0586313B2 JP 22880785 A JP22880785 A JP 22880785A JP 22880785 A JP22880785 A JP 22880785A JP H0586313 B2 JPH0586313 B2 JP H0586313B2
- Authority
- JP
- Japan
- Prior art keywords
- holder
- heat source
- leads
- rod
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22880785A JPS6289569A (ja) | 1985-10-16 | 1985-10-16 | 半田付け加工装置におけるicパツケ−ジ押圧装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22880785A JPS6289569A (ja) | 1985-10-16 | 1985-10-16 | 半田付け加工装置におけるicパツケ−ジ押圧装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6289569A JPS6289569A (ja) | 1987-04-24 |
JPH0586313B2 true JPH0586313B2 (es) | 1993-12-10 |
Family
ID=16882160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22880785A Granted JPS6289569A (ja) | 1985-10-16 | 1985-10-16 | 半田付け加工装置におけるicパツケ−ジ押圧装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6289569A (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677810B2 (ja) * | 1986-09-26 | 1994-10-05 | パイオニア株式会社 | 光ビ−ムハンダ付け装置 |
CN103551693B (zh) * | 2013-10-31 | 2015-08-12 | 深圳市卓茂科技有限公司 | 一种智能热风拆焊系统 |
-
1985
- 1985-10-16 JP JP22880785A patent/JPS6289569A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6289569A (ja) | 1987-04-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7409730B2 (ja) | レーザリフロー装置 | |
CN111785752B (zh) | 主板返修方法 | |
CN107359134B (zh) | 一种利用激光实现bga芯片返修的方法和装置 | |
JPH0760933B2 (ja) | 電子デバイスの表面実装方法 | |
KR20170140479A (ko) | 릴-투-릴 레이저 리플로우 방법 | |
US5741410A (en) | Apparatus for forming spherical electrodes | |
JPH0541351B2 (es) | ||
US4788403A (en) | Apparatus for automatic soldering | |
KR102228432B1 (ko) | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 | |
JPH0586313B2 (es) | ||
JPS60234768A (ja) | レ−ザ−半田付装置 | |
JPH0580304B2 (es) | ||
KR101818918B1 (ko) | 레이저 리플로우 방법 및 이의 방법으로 제조된 기판구조체 | |
KR20170140477A (ko) | 레이저 리플로우 방법 및 이의 방법으로 제조되는 기판구조체 | |
JPH0818125B2 (ja) | レーザはんだ付け装置 | |
JPH0239649Y2 (es) | ||
JPH0785515B2 (ja) | はんだ付装置 | |
TW202034413A (zh) | 電子部件的回流及返工裝置 | |
JPH0230136Y2 (es) | ||
JP3364540B2 (ja) | チツプ部品のボンデイングステツプでのリードフレーム加圧押え機構 | |
CN220838423U (zh) | 一种led倒装芯片的激光焊接设备 | |
JPH0539826Y2 (es) | ||
JPH06268367A (ja) | 電子部品の光ビーム加工装置 | |
Lau et al. | Multi-spot excimer laser soldering for fine pitch SMD | |
CN117117059A (zh) | 一种led倒装芯片固晶、激光焊接及点胶的工艺方法 |