JPH0585052U - Connection structure of terminals in module - Google Patents

Abstract

(57) [Abstract] [Purpose] To reduce the size of a module by forming protrusions on the upper and lower surfaces of the module and exposing the terminals on the top surface of the protrusion. [Structure] A protrusion 1a is formed on the upper and lower surfaces of a module 1, and a terminal 3 is exposed on a top surface 1b of the protrusion 1a.
A conductive plate 9 is arranged on the substrate 8. The module 1 is inserted into the opening of the case and the board 8 is screwed into the opening of the case. As a result, the terminals 3 of the module 1 are connected to the substrate 8
Is electrically connected to the conductive plate 9.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a terminal connection structure in a module in which electric parts are sealed with resin.

[0002]

[Prior Art]

 Conventionally, as a means for installing terminals in this type of module, there is, for example, the technique disclosed in Japanese Utility Model Laid-Open No. 2-106868. The terminals are lead terminals that are fixed to the substrate and sealed with a sealing resin. The terminal projects laterally from the sealing resin.

[0003]

[Problems to be solved by the device]

 The terminal in the above-mentioned conventional technique projects laterally from the module. When connecting the terminal to another module, a female connector that fits the male terminal must be installed in the other module. When connecting the terminal and the female connector, a horizontal space is required to install the terminal and the female connector. Therefore, there is a problem that the entire module becomes large.

[0004]

[Means for Solving the Problems]

 The terminal connection structure in the module according to the present invention is a module in which electric components and terminals are sealed with a resin and a board or a module. By arranging the module exposing the terminals and a substrate or a module having a conductive plate in contact with the terminals of the module, the lateral occupancy area of the terminal connecting portion is small, and the module can be miniaturized. Is provided.

[0005]

Embodiment Hereinafter, a preferred embodiment of a terminal connecting structure in a module according to the present invention will be described in detail with reference to FIGS. 1, 2 and 3.

Reference numeral 1 denotes a resin molded component module, in which an electrical component 2, a terminal 3, a lead frame 4, a bonding wire 5, and a substrate 6 of the electrical component are sealed with resin. The module 1 has a plurality of protrusions 1a formed on the upper surface or the lower surface, and the connecting portion 3a of the terminal 3 is exposed from the top surface 1b of the protrusion 1a. The module 1 is inserted and fitted in the opening 7a of the case 7, the opening 7a is closed by the substrate 8, and fixed in the case 7. The shape of the protrusion 1a is, for example, a trapezoid having a top surface 1b. The electric component 2 is a semiconductor element such as a chip component, and is mounted on the substrate 6, the terminal 3 or the lead frame 4 in the module 1.

The terminal 3 is for electrically connecting to the conductive plate 9 of the substrate 8 or a module (not shown), and is made of a plate-shaped conductive member. In the terminal 3, the connecting portion 3a at one end is exposed from the top surface 1b of the protrusion 1a, and the connecting portion 3a is bent along the top surface 1b. The connecting portion 3a may have a shape only slightly exposed from the top surface 1b. The lead frame 4 has a function as a terminal.

The bonding wire 5 is a conducting wire that connects the terminal 3 and the electric component 2. A board 6 in the module 1 has an electric component 2 and a lead frame 4 mounted thereon. The case 7 is a cover for the module 1 and the substrate 8. The board 8 has a conductive plate 9 in contact with each connection part 3 a of the terminal 3 and an electric component 10. The substrate 8 is screwed to the lower surface of the case 7 via the module 1. The conductive plate 9 is composed of a conductive pattern printed on the substrate 8 or a flat conductive member. The electric component 10 is an electronic element such as an IC.

The present invention has the above-mentioned structure, and its operation will be described in detail below. When connecting the terminal 3 of the module 1 and the conductive plate 9 of the substrate 8, the module 1 is inserted into the opening 7a of the case 7, and the opening 7a is closed by the substrate 8 and screwed. The connection portion 3a of each terminal 3 is pressed against the conductive plate 9 of the substrate 8 by bending the top surface 1b of the protrusion 1a. Then, the semiconductor integrated circuit of the module 1 is electrically connected to the electric circuit of the substrate 8. The connection portion 3a and the conductive plate 9 are held in an electrically connected state by placing the module 1 on the substrate 8 and sandwiching the module 1 between the substrate 8 and the case 7.

Therefore, according to the present invention, when electrically connecting the module 1 and the substrate 8, a lateral space and a connector are unnecessary. Thus, the space occupied by the module 1 and the board 8 as a whole can be reduced, and the module 1 and the board 8 can be downsized. Further, according to the present invention, when the module 1 and the substrate 8 are electrically connected, the work of soldering the terminal 3 to the conductive plate 9 is unnecessary, so that the soldering failure and the soldering work can be eliminated.

In the present invention, another module may be used instead of the substrate 8 to connect a plurality of modules (not shown).

[0012]

[Effect of the device]

 The terminal connection structure in the module according to the present invention is such that a protrusion is formed on the upper surface or the lower surface of the module, the terminal is exposed on the top surface of the protrusion, and the terminal and another module or a substrate are arranged. The structure is such that it is connected to the conductive plate, a connector and a laterally occupied space for installing the connector are not required, and the entire module can be downsized. Further, according to the present invention, by placing the module on the board, the module and the board can be electrically connected, and the work of soldering the terminal to the conductive plate is not required, resulting in a defective soldering. , And soldering work can be eliminated.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is an enlarged sectional view of an essential part showing an embodiment of the present invention.

FIG. 3 is an enlarged perspective view with a partial cross section showing an embodiment of the module of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 module 1a protrusion 1b top surface 2,10 electric parts 3 terminal 3a connection part 8 substrate 9 conductive plate

Claims (1)

[Scope of utility model registration request] 1. In a structure for electrically connecting a module in which electric parts and terminals are sealed with a resin and a substrate or a module, a projection is formed on at least one surface, and the terminal is exposed on a top surface of the projection. A terminal connection structure in a module, comprising: a module; and a substrate or a module having a conductive plate that contacts the terminal of the module.