JPH0583964U - Transparent tablet - Google Patents

Abstract

(57) [Abstract] [Purpose] Transparent tablet whose manufacturing process is improved [Constitution] A transparent tablet in which the transparent conductive film is electrically connected to the transparent conductive film using the same material as the transparent conductive film.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a transparent tablet.

2. Description of the Related Art Recently, microcomputers have been used in various devices, and a tablet (also called a touch switch, a touch panel, a flat switch) that is an information input unit and a display that is an output unit are included in the device. It is installed. In addition to traditional keyboards, tablets include transparent tablets that can be mounted on the display.

With a transparent tablet, you can input data by pressing the surface of the tablet with your finger or pen while looking at the display screen, so the input operation is simple, and the display and tablet can be integrated into a single unit to save space. It is becoming more common and the usage is increasing.

The transparent tablet is formed by disposing two transparent electrode substrates A and B having a transparent conductive film on at least one surface such that the transparent conductive films face each other, and an external force is applied to the transparent electrode substrate. Since the transparent conductive films on the transparent electrode substrates A and B come into contact with each other only at the open portions to operate as a switch, it is possible to select a menu on the display screen or input a figure, for example.

[0005]

[Prior Art]

 A configuration example of a conventional transparent tablet is shown in FIG. However, in this figure, only a part of the configuration is shown for simplification. In an actual tablet, there are a plurality of transparent conductive films and circuits on each transparent electrode substrate A and B, and a corresponding number of contact terminals are provided. The parts are provided on the substrate C (the same applies to the following figures).

[0006]

By the way, since the contact terminal portion is often provided on one surface of the substrate C (for example, the tablet upper surface side), the transparent conductive films 1 and 5 on the substrates A and B are not provided. , Respectively on the opposite side with respect to substrate C 1. The transparent conductive film 1 on the upper substrate A is electrically connected to the contact terminal portion 4 through the circuit 2 and the anisotropic conductive film 3. On the other hand, the transparent conductive film 5 on the lower substrate B is first electrically connected to the circuit 8 provided on the lower side of the substrate C through the circuit 6 and the anisotropic conductive film 7, and then on the substrate C. It is electrically connected to the contact terminal portion 10 provided on the upper side of the substrate C through the provided hole 9 (so-called through hole). In the conventional transparent tablet, the circuits 2 and 6 are provided on the substrates A and B, respectively, and the step of providing the circuit is required in addition to the step of patterning the transparent conductive film, and the steps are complicated. Further, the above-mentioned through-hole method is difficult to manufacture and has a problem in reliability.

[0007]

[Device configuration]

 The present invention has been made in view of the above circumstances, and a first object thereof is to omit at least one of the circuits 2 and 6 or to improve a forming method thereof to simplify the process. The second purpose is to electrically connect the contact terminal portion of the substrate C and the transparent conductive film on the substrate on the side opposite to the surface on which the terminal portion is provided, without using the through hole method. It is to provide transparent tablets that are easy to manufacture and have improved reliability.

Embodiments of the present invention will be described below with reference to the drawings.

An embodiment of the present invention is shown in FIG. The transparent conductive film 1 on the upper substrate A is electrically connected to the contact terminal portion 4 through the circuit 2 and the (anisotropic) conductive film 3. On the other hand, the circuit 6 on the lower substrate B is formed simultaneously with the transparent conductive film 5 in the step of patterning the transparent conductive film, and the transparent conductive film 5 and the circuit 6 are integrated. The transparent conductive film 5 is electrically connected to the circuit 8 below the substrate C through the circuit 5 and the (anisotropic) conductive film 7, and then electrically connected to the contact terminal portion 10 through the through hole 9. It In this embodiment, the step of newly providing the circuit 6 is unnecessary, and the steps are simplified. It should be noted that instead of the circuit 6, the circuit 2 may be provided by the same method, or both the circuit 6 and the circuit 2 may be provided by the same method.

Another embodiment of the present invention is shown in FIG. The transparent conductive film 1 on the upper substrate A is electrically connected to the contact terminal portion 4 through the circuit 2 and the (anisotropic) conductive film 3. On the other hand, the circuit 6 on the lower substrate B is formed simultaneously with the transparent conductive film 5 in the patterning process of the transparent conductive film, and the transparent conductive film 5 and the circuit 6 are integrated. The transparent conductive film 5 is electrically connected to the circuit 11 on the upper substrate A through the circuit 6 and the (anisotropic) conductive film 7, and then electrically connected to the contact terminal portion 10 through the (anisotropic) conductive film 12. Through, there is no need for through holes. In addition to simplifying the process of newly providing the circuit 6, since the through hole is not required, the manufacturing is simple and the reliability is improved. Here, the anisotropic conductive film refers to conductive particles (such as nickel plated with gold) dispersed in a resin that exhibits adhesiveness when heat and pressure are applied. By adding them, the circuits are electrically connected to each other and the circuits and the substrates are bonded to each other.

In this embodiment, the circuits are connected to each other by the anisotropic conductive film, but the structure is such that the non-conductive adhesive layer is placed in the part where there is no circuit, and the connection is anisotropic. The conductive film may be used, or the circuit itself may be provided with an adhesive property for connection. An anisotropic conductive film is preferably used in terms of ease of manufacture and reliability.

As a material for forming a circuit, at least one of the substrates A and B is made of the same material as that of the transparent conductive film, but for the other substrate, conductive particles (silver, gold, copper, graphite, I) are used. One or two or more of (TO etc.) dispersed in a resin or a metal film can be used.

As the transparent conductive film, an ITO film formed by a PVD method such as a sputtering method, a vacuum deposition method, an ion plating method, a coating method, a printing method or the like is preferably used.

Of the substrates A and B, the substrate on the side to which an external force is applied in order to operate as a switch needs to be flexible, and the substrate material is a polyester film, a polycarbonate film, or a polyether monkey having a thickness of 75 to 400 μm. A phon film, a polysulfone film, a polyarylate film, and a glass plate having a thickness of 200 to 400 μm are preferably used. The material of the substrate on the other side is not particularly limited. The substrate C is preferably flexible in connecting to an external circuit, and a polyester film, a polyimide film, a polyarylate film or the like is preferably used as a substrate material.

Further, the present invention is not limited to the matrix type transparent tablet shown in the embodiment, but can be applied to an analog type transparent tablet.

[Submission date] June 25, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction content]

An embodiment of the present invention is shown in FIG. The transparent conductive film 1 on the upper substrate A is electrically connected to the contact terminal portion 4 through the circuit 2 and the (anisotropic) conductive film 3. On the other hand, the circuit 6 on the lower substrate B is formed at the same time as the transparent conductive film 5 in the step of patterning the transparent conductive film, and the transparent conductive film 5 and the circuit 6 are integrated. The transparent conductive film 5 is electrically connected to the lower circuit 8 of the substrate C through the circuit 6 and the (anisotropic) conductive film 7, and then electrically connected to the contact terminal portion 10 through the through hole 9. Be touched. In the present embodiment, the step of newly providing the circuit 6 becomes unnecessary, and the steps are simplified. The circuit 2 may be provided in the same method instead of the circuit 6, or both the circuit 6 and the circuit 2 may be provided in the same method.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

In this embodiment, the circuits are connected to each other by the anisotropic conductive film. However, an adhesive layer made of a resin that exhibits adhesiveness when heat and pressure are applied . circuit portion and non-circuit portion of the connection portion of one of the substrates is coated, and the thickness of the adhesive layer is in the like thicker construction in thin non-circuit portion in the circuit portion, the heat and pressure in the connecting portion By adding, the circuits may be electrically connected to each other and the circuits and the substrates may be bonded to each other . Alternatively, by using a material in which conductive particles are dispersed in a resin that exhibits adhesiveness by applying heat and pressure, form a circuit on one of the substrates and apply heat and pressure to the connection part. Therefore, the conduction and the adhesion of the circuits may be simultaneously performed . An anisotropic conductive film is preferably used in terms of ease of production and reliability.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction content]

The circuit is formed on at least one of the substrates A and B by using the same material as that of the transparent conductive film . On other substrates , it is formed by using one or more kinds of conductive particles (silver, gold, copper, graphite, ITO, etc.) dispersed in resin , metal film, metal foil, etc. However, a structure in which these materials are laminated may be used .

[Brief description of drawings]

FIG. 1 is a diagram for explaining an outline of a conventional transparent tablet.

FIG. 2 is a view for explaining the outline of the transparent tablet of the present invention.

FIG. 3 is a view for explaining the outline of another type of transparent tablet of the present invention. In each figure, a plan view and a cross-sectional view taken along lines A and b are shown from the top.

[Explanation of symbols]

 1, 5 Transparent conductive film 2, 6, 8, 11 Circuit 3, 7, 12 Anisotropic conductive film 4, 10 Contact terminal 9 Through hole

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[Procedure amendment]

[Submission date] June 25, 1992

[Procedure amendment 4]

[Document name to be amended] Statement

[Name of item to be corrected] Figure 3

[Correction method] Change

[Correction content]

FIG. 3 is a view for explaining the outline of another type of transparent tablet of the present invention. In each figure, a plan view and a cross-sectional view taken along lines a 1 and b 2 are shown from the top.

Claims (2)

[Scope of utility model registration request] 1. A portion in which two transparent electrode substrates A and B each having a transparent conductive film provided on at least one surface are arranged so that the transparent conductive films face each other, and an external force is applied to the transparent electrode substrate. In the transparent tablet in which the transparent conductive films on the transparent electrode substrates A and B are in contact with each other to operate as a switch, the transparent conductive film on at least one of the transparent electrode substrates and the substrates other than A and B above. And a transparent conductive film which is provided so as to be electrically connected to the transparent conductive film directly or on the same substrate as the transparent conductive film when electrically connected to the circuit. A transparent tablet, which is electrically connected to a circuit on the other substrate through a circuit of the same material. 2. Two transparent electrode substrates A and B, each having a transparent conductive film provided on at least one surface, are arranged such that the transparent conductive films face each other, and the substrates A and B are also provided.
Besides, there is a substrate C provided with a contact terminal portion for contacting with an external circuit, and the transparent conductive films on the transparent electrode substrates A and B come into contact with each other to operate as a switch only at a portion where an external force is applied to the transparent electrode substrate. In the transparent tablet, the transparent conductive film on one of the substrates A and the circuit provided on the other substrate B are electrically connected, and the circuit on the substrate B and the substrate C are further connected.
By electrically connecting with the circuit provided above,
A transparent tablet, wherein the transparent conductive film on the substrate A is electrically connected to a contact terminal portion with an external circuit through a circuit on the substrate B.