JPH0581722U - Electronic circuit inspection jig - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] To facilitate the positioning of surface mount electronic components and to ensure that their lead terminals come into contact with the probe of the inspection jig. [Structure] A plurality of guide grooves 13 are provided in a guide block 12 at the same pitch as the lead terminals 6 of the circuit board 2, and a probe 5 is arranged on the lower end side of the guide grooves 13. By inserting the lead terminal 6 of the circuit board 2 directly into the guide groove 13 and further pressing the lead terminal 6 below the groove 13,
The lead terminal 6 can surely come into contact with the probe 5 by the guide. Since the contactor 7 at the tip of the probe 5 is supported by the spring 19, all the lead terminals 6 can be reliably brought into contact with the probe 5 by the elasticity of the spring.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a jig for inspecting an electronic component in which lead terminals are led out at a constant pitch, and more particularly to a jig that includes a probe that comes into contact with the lead terminal and that makes contact between the lead terminal and the probe.

[0002]

[Prior Art]

 Generally, it is necessary to inspect the electronic circuit formed on the surface-mounted electronic component by some method. For that purpose, an inspection circuit or an inspection device is provided in advance outside, and this is connected to the circuit board, and the inspection is performed according to various inspection items. Particularly in recent years, there are many high-density surface mount electronic components, the circuit becomes complicated, and the number of lead terminals to be led out is also increasing. Therefore, as one of the conditions for stably inspecting the electronic circuits of these electronic parts, how smoothly and poorly contact the lead terminals from the circuit board and the leads of the external inspection circuit, etc. The issue is how to connect so that the above does not occur.

FIG. 4 is a conceptual diagram illustrating a method of inspecting a surface mount electronic component having a lead array, for example. That is, the inspection jig 1 for inspecting surface-mounted electronic components includes a guide 3 for positioning and fixing the circuit board 2 in at least two corners of the circuit board 2, and a fixing to which the guide 3 is fixed. It is composed of a plate 4 and a plurality of probes 5 provided upright on the fixed plate 4. The probes 5 are arranged in a pattern that is equal to the distance between the lead terminals 6 provided on both sides of the circuit board 2 and the pitch of the lead terminals 6. Further, the probe 5 is configured such that the contactor 7 at the tip thereof can be vertically slid through a spring (not shown). Further, the circuit board 2 of the surface mount electronic component described above is generally provided with a lead array 8 as shown in FIG. 5 (A). The lead array 8 is composed of a prism 10 made of an insulating material in which a plurality of grooves 9 are formed on three sides, and the U-shaped lead terminal 6 is press-fitted into the groove 9 to form a U-shaped side. Are soldered to the circuit board 2. As described above, by soldering the lead array 8 to the main circuit board 2'other than the above as shown in FIG. 5B, the pitch deviation between the lead terminals is prevented, and the reflow process is performed. The soldering work can be done easily.

When inspecting the surface mount electronic component described above, the circuit board 2 is positioned by inserting the circuit board 2 into the guide 3 of FIG. 4, and at the same time the lead terminal 6 and the probe 5 are inserted. The lead terminals 6 come into contact with the contactors 7 of the probe 5 erected on the fixing plate 4 because the arrangement patterns of and are matched in advance. At this time, the contact 7 descends downward due to the weight of the circuit board 2 against the spring described above, and even if the contact surface of the lead terminal 6 is slightly displaced in the vertical direction, the elasticity of the spring is reduced. Since the force absorbs the above deviation, all the contacts with the probe 5 are contacted, and no contact failure occurs.

[0005]

[Problems to be solved by the device]

 However, in the conventional inspection jig 1, for example, the edge of the circuit board 2 hits the guide 3 and the circuit board 2 is inclined due to the variation in the outer shape of the surface mount type electronic component. Sometimes it was inserted as it was, and each time it had to be reinserted, which required time for alignment. Further, when the circuit board 2 is pressed downward against the spring pressure of the probe 5 and inserted into the guide 3, when the spring pressure of the probe 5 is restored, the spring pressure varies, or the inside of the guide 3 Since the circuit board 2 may be fixed in an inclined state due to being caught on a wall surface, it often causes a contact failure.

The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to insert the surface mount type electronic component into the inspection jig. It is an object of the present invention to provide a jig for inspecting a surface mount type electronic component, which facilitates insertion into a jig and does not cause defective contact with the jig.

[0007]

[Means for Solving the Problems]

 The gist of the present invention for achieving the above object is to provide a guide for determining the position of an electronic circuit formed on a substrate, and the lead terminal for contacting a plurality of lead terminals of the electronic circuit positioned by the guide. And a plurality of probes arranged at the same pitch, and in the above-mentioned electronic circuit inspection jig for inspecting the electronic circuit by a test device connected to the outside via the probe, the guide is It is characterized by comprising a plurality of parallel guide grooves formed at the same pitch as the lead terminals, and the probe being arranged at the lower end of the guide grooves. In addition, it is desirable that the probe includes a contact that elastically descends due to contact with the lead terminal.

[0008]

[Action]

 According to the present invention, the guide block is provided with a plurality of parallel guide grooves arranged at the same pitch as the lead terminals of the circuit board, and the probe is arranged at the end of the guide groove. The circuit board is positioned by inserting it into the guide groove, and if the lead terminal is also inserted along this guide groove, the tip of the lead terminal will automatically contact the probe at the end of the guide groove. It For this reason, no contact failure occurs between the lead terminal and the probe after positioning, and the lead terminal and the probe can be reliably brought into contact with each other. If the contactor at the tip of the probe is elastically lowered, the elasticity acting on the contactor ensures that all lead terminals come into contact with the probe.

[0009]

【Example】

 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an assembly perspective view of an inspection jig for surface-mounted electronic components according to the present invention. Note that this embodiment will be described by taking a circuit board on which electronic components are mounted as an example. That is, the inspection jig 11 of the present invention includes a guide block 12 having a plurality of guide grooves 13 into which the lead terminals 6 of the circuit board 2 are inserted, and the guide grooves 13 have the same pattern as the lead terminals 6. The probe insertion block 14 has the probe 5 inserted into the holes 15 formed at intervals equal to the pitch of the plurality of guide grooves 13, and the probe fixing block 16 having the probe 5 fixed thereto. ing. The pitch intervals of the probe 5, the hole 15, and the guide groove 13 are all the same as that of the lead terminal 6. Further, since the lead terminals 6 are formed on the opposite sides of the circuit board 2, the blocks are also formed correspondingly. In the inspection jig 11 thus configured, a plurality of lead wires 17 are previously soldered to the tip of the probe 5 which is fixed by penetrating the lower surface of the probe fixing block 16, and the other end is not shown. It is connected to the inspection circuit or the inspection device that is not installed, and the inspection is performed according to the necessary inspection items.

The three blocks described above are stacked as shown in FIG. 2 to form a pair of inspection jigs 11. 2A is a front view after the blocks are stacked, and FIG. 2B is a sectional view taken along line AA ′ of FIG. As is clear from the figure, the probe 5 fixed to the probe fixing block 16 has the upper portion of the flange 18 inserted into the hole 15 formed in the bottom of the groove 18 of the probe insertion block 14, and the probe 5 is fixed. The contactor 7 provided at the tip end of the is disposed in the groove 13 formed in the guide block 12. Then, as shown in a partially enlarged view of the probe 5 in FIG. 3, a spring 19 is arranged between the contact 7 and the flange 20, and the contact 7 can slide up and down against the spring 19. Is configured. Therefore, when the lead terminal 6 of the circuit board 2 is put on the contact 7 at the tip of the probe 5 through the groove 9 as shown by the dotted line in FIG. Therefore, it descends downward and is stopped at a position balanced with the spring 19.

As described above, according to the present invention, the lead terminals 6 formed on both sides of the surface-mounted electronic component to be inspected are inserted into the guide grooves 13 formed in the same pattern as the lead terminals 6. The electronic components are accurately positioned, and the problems described above are solved by guiding the outer shapes of conventionally implemented electronic components, for example, the circuit board 2 as in this embodiment. Moreover, the surface mountable circuit board 2 is generally provided with the lead array 8 as described with reference to FIG. 5, so that at least the arrangement of the lead terminals 6 is constant, and the guide grooves 13 corresponding to this are arranged. Positioning of the circuit board 2 by inserting is surely performed. Further, even when the lead array 8 is soldered to the circuit board 2, even a slight planar deviation of the lower surfaces of the lead terminals on both sides caused by the amount of solder and the solder temperature is absorbed by the spring 19 that elastically moves the contact 7. Therefore, the lead terminal 6 is brought into contact with the contact 7 of the probe 5 with a substantially uniform pressing force, so that no contact failure occurs. In consideration of the maximum number of lead terminals of the electronic circuit to be inspected, the above-mentioned plurality of guide grooves 13 are provided with a large number of guide grooves and probes in advance, and the interval between the right and left jigs facing each other is arbitrarily adjusted. By making it possible, it is possible to inspect large and small types of electronic components.

[0012]

[Effect of the device]

 As described above, according to the present invention, the positioning based on the outer shape of the surface mount electronic component is not performed, but the lead terminal pattern of the electronic component is used as the positioning reference. Therefore, the electronic component is accurately positioned. At the same time, the positioning operation can be simplified and the contact failure can be prevented.

[Submission date] October 24, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction content]

The three blocks described above are stacked as shown in FIG. 2 to form a pair of inspection jigs 11. 2A is a front view after the blocks are piled up, and FIG. 2B is a sectional view taken along line AA ′ of FIG. As is apparent from the figure, the probe 5 fixed to the probe fixing block 16 has the upper end of the flange 18 inserted into the hole 15 formed in the bottom of the groove 18 of the probe insertion block 14, and the tip of the probe 5 is The contactor 7 provided in the section is arranged so as to be located in the groove 13 formed in the guide block 12. Then, as shown in a partially enlarged view of the probe 5 in FIG. 3, a spring 19 is arranged between the contact 7 and the flange 20 so that the contact 7 can slide up and down against the spring 19. It is configured. Therefore, as shown by the dotted line in FIG. 3, when the lead terminal 6 of the circuit board 2 is put on the contactor 7 at the tip of the probe 5 through the groove 9, the contactor 7 is moved downward by the weight of the circuit board 2. And is stopped at a position balanced with the spring 19. ☆ Supplemental deletion

[Submission date] March 6, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Item name to be amended] Scope of utility model registration request

[Correction method] Change

[Correction content] [Scope of utility model registration request]

1. A guide for deciding a position of an electronic circuit formed on a substrate, and a plurality of lead terminals arranged to be in contact with a plurality of lead terminals of the electronic circuit positioned by the guide and arranged at the same pitch. In the inspection jig of the electronic circuit for inspecting the electronic circuit by a test device connected to the outside through the probe, the guide is formed at the same pitch as the individual lead terminals. A jig for inspecting an electronic circuit, comprising a plurality of mutually parallel guide grooves, wherein the probe is arranged at a lower end portion of the guide grooves.

2. The jig for inspecting an electronic circuit according to claim 1, wherein the probe is provided with a contactor that is elastically lowered by contact with the lead terminal.

[Brief description of drawings]

FIG. 1 is an assembled perspective view of an inspection jig for a surface mount electronic component of the present invention.

2A and 2B are a front view and a sectional view of an inspection jig for a surface mount type electronic component of the present invention.

FIG. 3 is a partially enlarged view of a probe used in the present invention.

FIG. 4 is an assembled perspective view of an inspection jig in a conventional surface mount electronic component.

FIG. 5 is a perspective view of a lead array used for a circuit board;
It is and a partial side view.

[Explanation of symbols]

 1, 11 Inspection jig 2 Circuit board 3 Guide 5 Probe 6 Lead terminal 7 Contactor 12 Guide block 13 Guide groove 14 Probe insertion block 16 Probe fixing block 19 Spring

Claims (2)

[Reference number] 0031143-01 [Claims for utility model registration] 1. A guide for deciding a position of an electronic circuit formed on a substrate, and a plurality of lead terminals arranged to be in contact with a plurality of lead terminals of the electronic circuit positioned by the guide and arranged at the same pitch. In the inspection jig of the electronic circuit for inspecting the electronic circuit by a test device connected to the outside through the probe, the guide is formed at the same pitch as the individual lead terminals. A jig for inspecting an electronic circuit, comprising a plurality of mutually parallel guide grooves, wherein the probe is arranged at a lower end portion of the guide grooves. 2. The jig for inspecting an electronic circuit according to claim 1, wherein the probe is provided with a contactor that is elastically lowered by contact with the lead terminal.