JPH0579963B2 - - Google Patents

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention is a refractive index device comprising a structure in which a large number of refractive index distribution type cylindrical light transmitting bodies are arranged in parallel, and is used for optical transmission of images. The present invention relates to a method of manufacturing a rate distribution type optical transmitter array.

More specifically, by using a guide plate with a V-groove and an optical transmitter supply hopper, the refractive index distribution type cylindrical optical transmitters are continuously and accurately arranged side by side on the V-groove of the guide plate, and in this way. A plate member is bonded to the upper side of the optical transmitter array arranged in parallel to form a plate member with an optical transmitter array, and then another plate member is attached to the other side of the optical transmitter array of this plate member with an optical transmitter array. Either glue the plate members together or connect two plate members with optical transmitter rows together.
The present invention relates to a method of manufacturing a gradient index optical transmitter array, which includes a step of adhering two plate members and sandwiching an array of optical transmitters between two plate members.

[Conventional technology]

What has been attracting attention in recent years in the field of image transmission is
This is an optical transmission array that can obtain a 1-size erect image, and is used in the optical transmission part of image information in copying machines, facsimile machines, electronic blackboards, etc.

This optical transmitter array typically consists of, for example, FRPs joined at predetermined intervals by an intermediate member.
A structure in which a large number of cylindrical optical transmitters are precisely assembled in a row between two plate members made of (glass cloth resin laminate) etc., each end surface reaching from one surface to the other. have. Note that the optical transmission bodies incorporated in this optical transmission body array are made of cylindrical lenses or optical fibers.

A conventional method of assembling such an optical transmission body array will be described below with reference to the drawings.

9 to 11 show the main steps of a conventional method for assembling an optical transmitter array.

First, as shown in Fig. 9, place the surface plate 2 or vacuum chuck surface plate 3 on the table 1 of the grinding machine,
The plate members 4, 4-1, 4-2 are fixed thereon.
When fixing the plate member 4, in the case of a surface plate, the plate member 4 is fixed by adhesive, and in the case of a vacuum chuck surface plate, it is fixed by suction force to eliminate warpage.

Next, the surface of the plate member 4 is subjected to surface grinding using, for example, a grindstone 5 of a vertical shaft type surface grinder to finish one surface of the plate member to a predetermined flatness.

Plate member 4- subjected to surface grinding treatment in this way
As shown in FIG.
Place it on the surface plate 2 or vacuum chuck surface plate 3 placed above so that the surface 4-1a that has undergone the surface grinding process is facing up, and use the same method as in the surface grinding process described above to avoid warping. Fixed to.

Here, the intermediate member 7 is fixed to both ends of the plate member 4-1 with adhesive, and a predetermined number of cylindrical light transmitting bodies 8 are arranged in a row on the ground surface 4-1a. form a line.

Next, as shown in FIG. 11, the plate member 4-2 subjected to surface grinding in the same manner as described above is placed so that its ground surface 4-2a is superimposed on the optical transmission body array.
This is adhered to the intermediate member 7. At the time of this bonding, the adhesive resin is also impregnated and filled between the optical transmitter array and the plate member 4-2 and the gaps between the columnar optical transmitters 8 forming the optical transmitter array, and then dried.

Finally, by mirror-polishing both surfaces of each cylindrical light transmitting body 8 on which the end surfaces are located, each light transmitting body 8 is
Both end surfaces of the optical fibers are also mirror-polished to obtain an optical transmitter array.

[Problem that the invention seeks to solve]

In the conventional method of assembling an optical transmitter array as described above, the reference surface when arranging the cylindrical optical transmitters is the surface of the plate member. The smoothness of the surface is extremely important. However, the precision surface grinding process to obtain sufficient smoothness requires advanced technology and a lot of labor, and the cylindrical optical transmitters are assembled in one piece without using any guides for parallel installation. Book 1
Since they are arranged side by side on a plate member manually, it is very difficult to form accurate bales of optical transmitters, which is an obstacle to further improving workability, productivity, and assembly accuracy. I was getting used to it.

The present invention was made in view of these problems, and its purpose is to eliminate the above-mentioned work of manually arranging columnar optical transmitters one by one when they are arranged side by side, and to eliminate the need for precision surface grinding. It is an object of the present invention to provide a method for manufacturing an optical transmitter array in which even untreated plate members can be used as they are.

[Means for solving problems]

A method of manufacturing a refractive index distribution type optical transmission body array of the present invention that achieves the above object is to sandwich an optical transmission body array in which refractive index distribution type cylindrical transmission bodies are arranged in a row between two plate members. In the method of manufacturing a refractive index gradient optical transmission body array, a guide plate in which V grooves are arranged at a pitch equal to the diameter of the cylindrical optical transmission body, and a function of arranging and supplying the cylindrical optical transmission body. hoppers with edge portions are relatively arranged side by side, and V
A step of continuously moving a large number of the cylindrical light transmitting bodies on the groove to form a row of these cylindrical light transmitting bodies.
(a), a step (b) of bonding a plate member to the optical transmitter array formed on the guide plate, and a step (b) of adhering a plate member to the optical transmitter array obtained in step (b); or bonding two of the plate members with the optical transmitter array obtained in the step (b), and sandwiching the optical transmitter array between the two plate members; It is characterized by having the following.

In the method of the present invention, unlike the conventional method, a refractive index distribution type cylindrical optical transmission body (hereinafter simply referred to as an optical transmission body) is directly placed on a plate member that has been precisely polished to a smooth surface.
Instead of manually arranging the optical transmitters side by side, a guide plate with V-grooves arranged to correspond to the predetermined arrangement of the optical transmitters can be used, and the optical transmitters can be supplied onto the V-grooves using a simple operation. , the predetermined arrangement of the light transmission bodies according to the arrangement of the V-grooves can always be accurately obtained.
Furthermore, since this operation can be performed continuously and easily using the optical transmission body supply hopper, the present invention can improve workability, productivity, and assembly accuracy. Further, the guide plate can be used repeatedly, and it is possible to always obtain an array of optical transmitters with high alignment accuracy without variation.

Furthermore, in the method of the present invention, the alignment accuracy of the optical transmitters is automatically determined by the arrangement of the V-grooves of the guide plate, that is, the surface of the plate member is not used as a reference plane for alignment, as in the conventional method. Therefore, high smoothness is not required on the surface of the plate member, and precision surface grinding of the plate member can be omitted.

In addition, each of the optical transmission bodies arranged in parallel on the guide plate can be placed in a V-groove or temporarily fixed there as necessary.
The arrangement is not disturbed in the juxtaposition process and the adhesion process with the plate members after juxtaposition, and not only the workability of these processes is improved, but also the alignment accuracy of the optical transmission bodies is maintained throughout these processes.

Moreover, even when stacking bales in multiple stages, good workability, productivity, and assembly accuracy can be obtained in the same manner as described above.

Hereinafter, the method of the present invention will be explained in more detail using the drawings.

FIG. 1 is a schematic cross-sectional view of the main parts of an apparatus that can be used in the method of the present invention.

This device includes a guide plate 9 having a V-groove 9a arranged so as to correspond to the arrangement of cylindrical light transmitting chips 8 of a refractive index distribution type, and a guide plate 9 having a V-groove 9a arranged to correspond to the arrangement of cylindrical light transmitting chips 8, and a guide plate 9 having a V-groove 9a arranged to correspond to the arrangement of cylindrical light transmitting chips 8. Tip 8 to V groove 9
A supply hopper 10 for supplying to a.

The V-grooved guide plate 9 can be formed from a material such as metal such as iron or aluminum, and the pitch of the V-grooves 9a provided parallel to each other is matched to the diameter of the optical transmitter chip 8. The processing accuracy of the V-groove 9a is set to be sufficiently high in accordance with the predetermined arrangement accuracy of the optical transmitter chips 8. In addition, the V groove 9a
The surface is coated with Teflon or a commonly used mold release agent is applied to the surface to facilitate optical transmission after bonding the plate member and the optical transmitter chip on the guide plate, which will be described later. When removing the plate member with arrays of bodies from the guide plate, it is preferable to improve the releasability of the plate member with arrays of light transmitting bodies and the guide plate.

The supply hopper 10 includes a storage section that holds a large number of optical transmission chips 8 of a predetermined length arranged in the same direction, and a storage section provided at the bottom of the storage section that holds a large number of optical transmission chips 8 of a predetermined length so that one optical transmission chip 8 can pass through. A constricted diaphragm structure and a passage extending therefrom to a supply opening 11 for the light transmitting chips 8 to the guide plate 9 are formed. The sizes of these reservoirs, passages and supply ports are as follows:
It is matched to the length and width of a predetermined optical transmission chip 8.

Here, as the optical transmitter chips 8 supplied into the reservoir are discharged from the supply port 11, they are sequentially moved downward within the reservoir by the action of gravity. Furthermore, through the aperture structure, they are arranged in a line in the passage, and finally the gravity acting on each optical transmission chip 8 and the effect of the oblique angle of the passage combine to cause the chips to flow from the supply port 11 to the guide plate 9.
or into a groove formed by mutually adjacent light transmitting chips already arranged in parallel on the guide plate.
The supply port 11 has edges 12 and 13 at the front and rear in the moving direction (arrow) of the supply hopper 10, and the difference in height of these edges allows for smooth supply of the optical transmitter chip 8 with good directionality. Realized.

That is, the edge height of the edge 12 located on the rear side in the moving direction of the supply hopper 10 is V
The peak height of the top 8a of the chip 8 when the optical transmitter chip 8 is placed in the groove 9a, and the edge height of the edge 13 located on the front side in the moving direction of the supply hopper 10 are equal to the height of the V-groove 9a. top of mountain 9
It is adjusted to the height of a-1. Note that when stacking bales in two or more stages, these edges are adjusted as described below. With such a configuration of the edges 12 and 13, each optical transmitter chip 8 is pushed out only backward in the moving direction of the supply hopper 10 with good directionality and regulation, and is placed in the V-groove 9a.
Furthermore, the optical transmitter chip 8 once set in the V-groove 9a will not fly out from there.

Further, the supply hopper 10 is provided with a vibrator 14 for vibrating the supply hopper 10, which vibrates the supply hopper 10 before installing it on the guide plate 9, thereby causing the light transmitting material chips in the supply hopper 10 to vibrate. By eliminating clogging, disordered arrangement, etc. of the optical fiber chips 8, the arrangement state of the optical transmitter chips 8 in the supply hopper 10 can be made suitable for allowing them to flow out smoothly from the hopper 10. Note that during this vibration operation, the lid 1 must be placed on the supply port 11.
5, and by means such as closing it,
With the supply port 11 blocked, the optical transmission chip 8
It is better to prevent the liquid from spilling out of the supply hopper 11.

FIG. 2 is a view showing the supply hopper 10 installed on the guide plate 9, with FIG. 2A being a side view thereof and FIG. 2B being a plan view thereof.

The support portion of the supply hopper 10 is provided corresponding to the width of the V-grooved guide plate 9, and is installed on the guide plate 9 so as to sandwich the guide plate 9 from both sides, thereby allowing the support portion of the supply hopper 10 to V of supply port 11 and guide plate 9
Linearity with the groove 9a is achieved so that these directions coincide.

Note that the supply hopper 10 and the guide plate 9 are arranged so that, for example, the supply hopper 10 moves on the fixed guide plate 9, or the guide plate 9 moves with respect to the fixed supply hopper 11, or both. These are provided so that they can be moved relative to each other, such as moving, and the structure for moving these may be appropriately selected from those used in normal conveyance techniques.

Further, the supporting structure of the supply hopper 10 is not limited to the above-described structure, and the optical transmitter chip 8 is inserted into the V-groove 9a of the guide plate 9 in the state shown in FIG.
Any structure is possible as long as it can be supplied.

Next, a method of the present invention using an apparatus having such a configuration will be explained.

[Step (a)] First, cover 15 of supply port 11 of supply hopper 10
, put the required number of optical transmitter chips 8 of the same length into the supply hopper 10 in the same direction, and operate the vibrator 14 to give vibration to the supply hopper 10 to reduce the optical transmission inside the supply hopper 10. Align your body.

Next, the supply hopper 10 is placed on the V-groove of the guide plate 9, where the supply port 11 first supplies the optical transmitter chips 8, and the edge 1 is placed in front of the guide plate 9 in the direction of movement.
After opening the lid 15, the supply hopper 10 is moved in the direction in which the V grooves 9a are arranged. Then, the action of gravity and the lateral movement of the supply hopper 10 are linked, and the supply port 11
Due to the combined effect of the above-mentioned characteristic structure, the optical transmitter chips 8 are smoothly supplied one by one to the V-groove 9a, and these are accurately arranged in accordance with the arrangement of the V-groove 9a. Installed in parallel.

In addition, when the optical transmission element array is provided in several stages, the height of the edges 12 and 13 of the supply port 11 can be adjusted using a jig, etc., and the height of the edges 12 and 13 of the supply port 11 can be adjusted by using a jig or the like, and when one optical transmission element array is completed, , the height of the edge 12 is set to 2 adjacent to each other in the optical transmitter rows that have been arranged in parallel.
The height of the edges 13 should be adjusted to match the top height of the optical transmitter chips constituting the next row of grooves formed by the two optical transmitters when they are arranged, and the height of the edges 13 should be aligned first. The same operation as above can be repeated to match the height of the top of the optical transmitters constituting the completed optical transmitter array.
By placing the next stage of optical transmission bodies between two optical transmission bodies, it is possible to stack bales with high precision and excellent alignment accuracy.

In addition, if there is a risk that the array of optical transmitters that have been aligned will move and become disordered until the subsequent process of gluing and fixing the array of optical transmitters to the plate member is completed, do not place the array of optical transmitters on the guide plate. After temporarily fixing each optical transmitter chip, that is, adhering and fixing the optical transmitter array to the plate member, temporarily fix the optical transmitter chip by a means that allows the optical transmitter array to be easily removed from the guide plate without causing damage. It is best to keep it fixed. For this temporary fixing, for example, as shown in FIGS. 3A and 3B, adhesive tape 16 is placed on the edges provided at both ends of the V-groove 9a of the guide plate 9. There is a method in which both ends of the chip can be temporarily fixed by this. In this case, the adhesive tape (or adhesive layer) may be disposed at least in one location above the center line of the V-groove, or may be provided in a manner that divides the V-groove.

Another method is to use a vacuum chuck type guide plate 101 as the guide plate, as shown in FIGS. A temporary fixing method can be applied. As shown in FIG. 4, the vacuum chuck type guide plate 101 has a cross-sectional shape such as a rectangle that extends from the bottom to the surface of the guide plate halfway up the peak portion 9a-1 of each V-groove. The groove 102 may be cut across the entire V-groove. By doing so, rows of rectangular vacuum intake holes 102a are formed in the valley portions of the V-grooves.
Note that it is sufficient that the vacuum intake hole is disposed at least at one location above the center line of the V-groove. Further, the cross-sectional shape of the groove 102 of the intake hole does not necessarily have to be rectangular, and may be appropriately selected such as a U-shape.

Actually, when the optical transmitter chips 8 are arranged in the V-groove 9a of the guide plate using the vacuum suction hole 102a, an optical transmitter chip supply hopper 103 as shown in FIGS. 4E to 4G is used. The structure of the upper part of the hopper is similar to the above-described hopper, but the hopper used here has a vacuum adjustment part 104 at its lower part that works in conjunction with the upper part to open and close the vacuum intake hole 102a. This vacuum adjustment section 10
4 has a cross-sectional shape that just closes the intake hole groove 102, and this adjusting portion 104 closes the intake hole groove 1.
The air intake hole 102a opens only in the portion that does not enter the air hole 02, and vacuum air intake is effective. Therefore, by aligning the tip 104a of the adjusting section near the edge 13 of the optical transmitter supply port of the hopper so that the supply port portion 11 and the tip 104a of the vacuum adjusting section are interlocked, the optical transmitter chips 8 are already lined up. The air intake hole 102a is opened only in that portion, and the optical transmitter chip is reliably temporarily fixed by vacuum suction.

By temporarily fixing the optical transmitter chip 8 on the guide plate 9 or 101 in this way, more accurate parallel work can be performed and disturbances in the arrangement can be prevented. Effective when stacking transmission bodies in bales.

When the juxtaposition of the optical transmitter chips 8 is completed as described above and the optical transmitter array of the desired configuration is formed on the guide plate 9, the formed optical transmitter array and the plate member 4-1 are connected. Adhesion is performed.

[Step (b)] To bond and fix the plate member 4-1 and the optical transmitter array, a commonly used relatively low viscosity adhesive or the like is applied to the plate member 4-1 as shown in FIG. -1 and each optical transmitter chip 8 and the contact portion as well as the plate member 4.
-1 and each optical transmitter chip 8, and furthermore, a method of supplying and filling the gap 21 formed between each optical transmitter chip, drying and solidifying the aperture, and fixing them with adhesive, etc. This can be done by

Further, when there is only one row of optical transmitters, a method using an adhesive sheet using an apparatus as shown in FIG. 6 is convenient because it can omit various operations using adhesives.

That is, the double-sided adhesive sheet 19 is fed out via the roller 18 that moves in conjunction with the supply hopper 10, and is adhered to the light transmitting body array formed on the guide plate. Roller 1 of double-sided adhesive sheet 19
A release sheet 20 is integrated on the 8 side to prevent adhesive sheet 19 and roller 18 from adhering to each other. After adhering the adhesive sheet 19 to the optical transmitter array, the release sheet 20 is peeled off and the plate member 4-1 is adhered to the exposed adhesive surface.

[Step (c)] Once the plate member 4-1 with the optical transmitter is obtained as described above, it is removed from the V-grooved plate 9, and the intermediate member 7 is glued to the end as shown in FIG. Next, another plate member 4-2 is adhered to this plate member 4-1 with optical transmission body as shown in FIG. 7, and is sandwiched between the two plate members 4-1 and 4-2. Fix it.

As another method, as shown in FIG. 8, two plate members 4-1 with optical transmitters are glued together via a row of optical transmitters, and fixed by sandwiching between the two plate members 4-1. do. In addition, when bonding the plate members 4-1 with optical transmitters, for example, the plate members 4-1 in FIG.
2 to be bonded at this stage, as in the respective optical transmitter arrays bonded to 1-1 and 4-1-2.
It is preferable to make appropriate adjustments in the steps (a) and (b) so that the two optical transmitter arrays correspond to each other. Note that a commonly used adhesive may be used for bonding these.

Finally, the two surfaces on which the end faces of each optical transmitter chip are located are mirror polished to complete the optical transmitter array. Note that adhesive fixation can be made more reliable by using a clamp or the like.

〔Effect of the invention〕

As explained above, according to the present invention, by using a V-grooved guide plate when cylindrical light transmitting bodies are arranged side by side, the light transmitting bodies can be assembled by hand instead of the work of precision grinding the plate member surface in advance as in the past. Parallel installation is no longer necessary, and the alignment accuracy of the optical transmission bodies is also dramatically improved. Therefore, workability and production efficiency are greatly improved, and the quality of the optical transmission body array becomes high performance and stable.

〔Example〕

Hereinafter, the present invention will be explained in further detail with reference to Examples.

Example 1 Copolymer consisting of 80 mol% vinylidene fluoride and 20 mol% tetrafluoroethylene (refractive index n _D 1.400)
33 parts by weight of polymethyl methacrylate (refractive index n _D 1.492) obtained by continuous bulk polymerization, 33 parts by weight of methyl methacrylate monomer, 0.1 part by weight of benzyl dimethyl ketal, and 0.1 part by weight of hydroquinone at 80°C. Heat and pass through the kneading section to a diameter of 2.0mm.
The extruded fiber was extruded through a nozzle of
The fiber was passed through the center of a 400W high-pressure mercury lamp placed at equal intervals in a circle around the book, irradiated with light for about 5 minutes, and then pulled off with a nip roller at a speed of 20cm/min.

The diameter of the obtained fiber was 800 μm, and the refractive index distribution measured using an interfaco interference microscope was 1.460 at the center and 1.451 at the periphery, which decreased continuously from the center to the periphery. . Finally, this was cut into a predetermined length to obtain a gradient index lens chip.

The composition analysis of the obtained fiber by nuclear magnetic resonance (NMR) revealed that the core contained 33% by weight of a copolymer of vinylidene fluoride and tetrafluoroethylene, and the peripheral part contained 43% by weight. It was The residual content of methyl methacrylate monomer was 0.9% by weight overall.

Apart from this, an aluminum plate (326mm x 35mm)
One surface of the is NC machined, and it extends to the full extent of both ends in the direction perpendicular to the transverse direction, and is precisely parallel with a pitch equal to the diameter of the previously formed lens chip.
250 V-grooves were formed to obtain a guide plate with V-grooves.

Next, a large number of the previously formed lens chips are placed in the same direction into the supply hopper having the structure shown in FIG. After arranging the lens chips inside, the V-grooved guide plate obtained as described above was set at the bottom of this supply hopper in the positional relationship as described in detail above.

Next, the lid of the supply hopper was opened, and the hopper was automatically moved at a speed of 20 cm/s by a driving means (not shown) in a direction with the longer edge of the supply port facing forward relative to the guide plate. .

Then, lens chips were supplied one after another from the supply port of the supply hopper to the V-groove of the guide plate.

When the lens chips are arranged in all of the V-grooves, that is, when the first row of lens chips are arranged in parallel, close the cover of the supply port, and in this state, adjust the height of both edges of the supply port to the rows of lens chips arranged in parallel. After adjusting the height as described above according to the height of the second row of lens chips that are arranged in parallel with It was set so that it was located between the first and second lens chips.

Next, the lid was opened and the supply hopper was moved in the same manner as in the first stage. Then, a second row of lens chips was further formed between the lens chips of the first row, and a highly accurate bale stack was formed.

When the arrangement of lens chips is completed in this way, an aluminum plate member is placed on top of the row of lens chips, and the gaps between the plate member and the lens chips and the gaps between the lens chips are filled with black soft epoxy resin. After solidification, the bonding between the plate member and the lens chip array was completed.

Next, remove the plate member to which the two rows of lens chips are glued from the V-grooved guide plate, and glue intermediate members made of acrylic resin to both ends of this plate member with lenses using black soft epoxy resin. The intermediate member of the aluminum plate member of the same size was adhered with a black soft epoxy resin, and the gap between the plate member and the lens chip was also filled with the black soft epoxy resin and solidified.

Finally, the two surfaces on which the end surfaces of each lens chip were located were mirror-finished to obtain an optical transmitter array.

When we inspected the quality of a large number of optical transmitter arrays obtained by repeating the above operations, we found that the lens chips of each array were arranged with good precision on the plate member in accordance with the arrangement of the V grooves formed on the guide plate. They are arranged in parallel, and each optical transmission body array is
When we incorporated it into an MTF measuring device that uses 6.4 slit images per mm and evaluated its characteristics, the transmitted images were clear with good contrast, and had good resolution characteristics for each optical transmitter array. was obtained, and the light scattering around the lens periphery was also extremely small.

Example 2 First, two types of guide plates with optical transmitter rows were prepared in the same manner as in Example 1 except that only one stage of the optical transmitter row was formed. It was formed with care so that it would look as shown in the figure.

Next, after bonding an intermediate member to one of the obtained two types of plate members with optical transmitter rows, as shown in FIG. They were then glued together with black soft epoxy resin, and the gaps between each lens chip were also filled with black soft epoxy resin and allowed to solidify.

Finally, the two surfaces on which the end surfaces of each lens chip were located were mirror-finished to obtain an optical transmitter array.

When the quality of a large number of optical transmitter arrays obtained by repeating the above operations was inspected in the same manner as in Example 1, the lens chips of each array were found to be
They are arranged side by side with good alignment accuracy according to the arrangement of the V-grooves formed on the guide plate, and each optical transmitter array was incorporated into an MTF measurement device that uses 6.4 slit images per 1 mm to evaluate its characteristics. ,
In each of the optical transmitter arrays, the transmitted images had good contrast and clarity, good resolution characteristics were obtained, and light scattering around the lens was also very small.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view of the main parts of an apparatus that can be used in the method of the present invention. Figures 2A and B and Figures 3A and B are diagrams showing various aspects of the method of the present invention, with each figure A being a side view of the main part of the apparatus, and each figure B being a side view of the main part of the apparatus. FIG. 4A to 4D are views showing an example of an embodiment of a vacuum chuck type guide plate that can be used in the method of the present invention, FIG. 4A is a plan view thereof, FIG. 4B is a bottom view thereof, and FIG. FIG. 4C is a longitudinal sectional view thereof, and FIG. 4D is a side view thereof. Figure 4 E~
G is a diagram showing the method of the present invention using a vacuum chuck type guide plate, FIG. 4E is a plan view showing its usage state, FIG. 4F is a side view thereof, and FIG. 4G is a cross section thereof. It is a diagram. FIG. 5 is a side view of an assembly showing an example of step (b) of the method of the present invention, and FIG. 6 is a side view of an apparatus that can be used in another example of step (b) of the method of the present invention. FIG. 7 is a schematic cross-sectional view of the main parts, and FIGS. 7 and 8 are side views of the assembly showing step (c) of the method of the present invention. 9th
Figures 1 to 11 are schematic views of the assembly seen from the side, showing the main steps of the conventional method. 1... Grinding machine table, 2... Surface plate, 3... Vacuum chuck surface plate, 4, 4-1, 4-2, 4-1-
1, 4-1-2...Plate member, 4-1a, 4-2a
... Grinding surface, 5 ... Grindstone, 6 ... Workbench, 7 ...
Intermediate member, 8... Optical transmission chip, 8a... Chip top, 9... Guide plate, 9a... V
Groove, 9a-1... V groove top, 10... Supply hopper, 11... Supply port, 12, 13... Edge,
14... Vibrator, 15... Lid, 16... Adhesive tape, 18... Roller, 19... Double-sided adhesive sheet, 20... Release sheet, 21... Gap, 101
...Vacuum chuck type guide plate, 101a...
...Vacuum chuck type guide plate surface, 101b
...Back side of vacuum chuck type guide plate, 102
...Vacuum intake hole groove, 102a...Vacuum intake hole, 1
03... Optical transmission body chip supply hopper with vacuum adjustment section, 104... Vacuum adjustment section, 104a... Vacuum adjustment section tip, 105... Vacuum suction hose, 106
...Guide plate lid.

Claims (1)

[Claims] 1. A gradient index optical transmission array is manufactured by sandwiching an optical transmission array in which gradient index cylindrical optical transmission bodies are arranged in parallel between two plate members. In the method,
A guide plate in which V grooves are arranged at a pitch equal to the diameter of the cylindrical light transmitting body and a hopper having an edge portion having a function of arranging and supplying the cylindrical light transmitting body are relatively moved; Step (a) of arranging a large number of the cylindrical light transmitting bodies in succession on the groove to form a row of these cylindrical light transmitting bodies; Step (b) of bonding the members, and bonding another plate member to the plate member with the optical transmitter array obtained in step (b), or bonding the plate member with the optical transmitter array obtained in the step (b). A method for manufacturing a gradient index optical transmitter array, comprising the step of (c) gluing two members together and sandwiching the optical transmitter array between the two plate members. 2. As the guide plate, use is made of an adhesive tape arranged on the surface of the cylindrical light transmitting bodies, and when the cylindrical light transmitting bodies are arranged side by side in the step (a), the cylindrical light transmitting bodies are 2. The method of manufacturing a gradient index optical transmission body array according to claim 1, wherein the optical fiber array is temporarily fixed on the guide plate with an adhesive tape, and the step (b) is carried out in this state. 3. As the guide plate, a vacuum chuck type V-grooved guide plate with an air intake hole is used, and when the cylindrical optical transmission bodies are arranged side by side in the step (a), the cylindrical optical transmission bodies are pulled in a vacuum. Said V
Temporarily fix it in close contact with the groove, and then proceed to step (b) in that state.
A method for manufacturing a refractive index gradient type optical transmission body array according to claim 1, which carries out the following. 4. The refraction method according to claim 1, wherein in the step (b), an adhesive sheet is provided on the optical transmitter array, and the optical transmitter array and the plate member are bonded by the adhesive sheet. A method for manufacturing a rate distribution type optical transmitter array.