JPH0576730B2 - - Google Patents

Info

Publication number

JPH0576730B2

JPH0576730B2 JP16830784A JP16830784A JPH0576730B2 JP H0576730 B2 JPH0576730 B2 JP H0576730B2 JP 16830784 A JP16830784 A JP 16830784A JP 16830784 A JP16830784 A JP 16830784A JP H0576730 B2 JPH0576730 B2 JP H0576730B2

Authority

JP

Japan

Prior art keywords

metal

insulating case

easily fusible

outer periphery

terminal wire

Prior art date

1984-08-10

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

• Espacenet
• Global Dossier
• Discuss

• 229910052751 metal Inorganic materials 0.000 claims description 57
• 239000002184 metal Substances 0.000 claims description 57
• 238000004519 manufacturing process Methods 0.000 claims description 15
• 238000000034 method Methods 0.000 claims description 4
• 230000004907 flux Effects 0.000 claims description 3
• 229920005989 resin Polymers 0.000 claims description 3
• 239000011347 resin Substances 0.000 claims description 3
• 238000003466 welding Methods 0.000 claims description 3
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 229910045601 alloy Inorganic materials 0.000 description 7
• 239000000956 alloy Substances 0.000 description 7
• 239000003973 paint Substances 0.000 description 5
• 229920005992 thermoplastic resin Polymers 0.000 description 5
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
• 238000010438 heat treatment Methods 0.000 description 4
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
• 229910052738 indium Inorganic materials 0.000 description 3
• APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
• 238000002844 melting Methods 0.000 description 3
• 230000008018 melting Effects 0.000 description 3
• 238000007789 sealing Methods 0.000 description 3
• 229920001187 thermosetting polymer Polymers 0.000 description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 229910052797 bismuth Inorganic materials 0.000 description 2
• JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
• 229910052793 cadmium Inorganic materials 0.000 description 2
• BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 229910052802 copper Inorganic materials 0.000 description 2
• 239000010949 copper Substances 0.000 description 2
• 230000006866 deterioration Effects 0.000 description 2
• 229910000743 fusible alloy Inorganic materials 0.000 description 2
• 238000003780 insertion Methods 0.000 description 2
• 230000037431 insertion Effects 0.000 description 2
• 229910052742 iron Inorganic materials 0.000 description 2
• 238000000576 coating method Methods 0.000 description 1
• 238000010924 continuous production Methods 0.000 description 1
• 230000007423 decrease Effects 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000011521 glass Substances 0.000 description 1
• 238000013021 overheating Methods 0.000 description 1
• 229920002545 silicone oil Polymers 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1