JPH0576050U - Board dividing device - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] Efficiently divides the board without damaging the electronic components or applying stress to the board itself. [Structure] The holding plate 9 for holding the substrate 2 has an elastic force of a spring 14 acting between the holding plate 9 and the lower blade base 12, and the upper blade base 15
Is a spring plunger 16 fixed to its four corners.
The substrate 2 is cut at the time when the tip of the blade is lowered while pressing the holding plate 9 and the upper and lower blades are butted. If the elastic coefficient of the plunger spring 18 is made larger than that of the spring 14, when the upper blade base 15 is lowered, the spring 14 holding the holding plate 9 first forms and then the plunger spring 18 Is deformed, the two springs serve as a cushioning material, the impact on the substrate 2 is reduced, and the holding plate 9 of the substrate 2 after cutting is lifted by the elastic force of the spring 14, so that the substrate 2 is separated from the lower blade 6 ′. Will be easier.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a board dividing device suitable for cutting a plurality of sets of printed wiring boards and dividing the printed wiring boards into individual printed wiring boards.

[0002]

[Prior Art]

 Generally, when mounting a circuit component on a printed wiring board (hereinafter, simply referred to as a substrate), the circuit component is mounted on a collective substrate that is a group of substrates, and then the ear around it is cut off. In addition, the collective substrate is divided into each substrate (hereinafter referred to as cutting). For example, as shown in FIG. 4, an aggregate substrate 1 that is an aggregate of substrates 2 is divided into a plurality of substrates 2 by dividing lines L by vertical and horizontal V-groove cuts, and these substrates 2 and their surroundings also have ear portions. 2'is divided by a dividing line L'consisting of so-called perforation cuts, which is composed of slits and spot-shaped connecting portions.

Conventionally, as a method of dividing the mother board 1 along the division line L ′ including the perforation cuts as described above, the push-cut method shown in FIG. 5A and the protrusion shown in FIG. There are matching methods. In the former method, a plurality of positioning pins 4 are provided on a plate 3 made of resin or the like, and the positioning pins 4 are inserted into holes 5 formed in the mother board 1 to determine the position of the mother board 1, and then the cutting blade 6 is placed on the mother board 1. It is lowered along the dividing line and cut. The plate 3 is provided with a recess 8 so that the electronic component 7 can also be mounted on the back surface of the substrate 2, that is, so-called double-sided mounting. In the latter case, the mother board 1 is fixed to the positioning pins 4 attached to the holding plate 9 and cut by the upper and lower cutting blades 6 and 6 '. Specifically, while keeping the upper cutting blade 6 pressed against the motherboard 1 fixed to the stepped positioning pin 4, lower the motherboard 1 to the position of the lower cutting blade 6 ', and It is cut by abutting with the cutting blade 6 of.

[0004]

[Problems to be solved by the device]

 However, in the conventional dividing means, in the above-mentioned pressing method, the cutting blade is applied to the surface of the substrate and the pressing force is applied at the same time to cut, so the longer the cutting distance is (in other words, when the cutting line is long, ) The load required for cutting becomes large and a large device is required. Also, when cutting a double-sided mounted motherboard, the electronic components mounted on the individual boards are wired up to near the dividing line, and provided to escape the electronic components mounted on the back surface of the above board. Since the cutting blade hits near the recessed part and a large pressing force is applied, the plate made of resin or the like may be deformed, and stress is also generated on the motherboard itself, so that near the cutting position. It may be deformed.

Further, since the electronic components are mounted up to the vicinity of the dividing line in the above-mentioned butt joint method, there is a problem that the electronic components are damaged when the lower blade is aligned with the back surface of the substrate when setting the substrate. Also, when the board is cut, the upper blade is pressed down against the board while it is lowered, so stress is applied to the board from the beginning, which causes the board to deform, and even changes the characteristics of the electronic circuit. There is a problem to say. Further, since the upper and lower blades are cut by butting, the substrate may adhere to the blades, resulting in a problem that work efficiency is significantly deteriorated.

The present invention has been made in order to solve the above-mentioned problems, and its purpose is to prevent damage to electronic components and stress on the substrate itself, and to improve work efficiency. It is to provide a substrate dividing device.

[0007]

[Means for Solving the Problems]

 The gist of the present invention for achieving the above object is to provide a holding device for holding the substrate in a substrate dividing device that cuts the substrate along a dividing line formed on the substrate by abutting upper and lower blades. A plate, a lower blade base provided with the holding plate fixed to be slidable via a spring and the lower blade, and a spring plunger for lowering the holding plate while pressing the holding plate with a plunger spring. A substrate splitting device comprising an upper blade base provided with the upper blade, wherein the elastic coefficient of the plunger spring is set to be larger than the elastic coefficient of the spring. It is a dividing device.

[0008]

[Action]

 According to the present invention, in order to lower the substrate held by the holding plate to the position of the lower blade, the holding plate itself is held between the lower blade base to which the lower blade is attached via a spring. The upper blade base to which the upper blade is attached is lowered with the tips of the spring plungers fixed to the four corners pressing the holding plate, and the upper and lower blades project. Once assembled, the substrate is cut. At this time, if the elastic coefficient of the latter of the spring and the plunger spring is set to be larger than that of the former, the upper blade base will not press the holding plate at the tip of the plunger. When descending, the spring holding the holding plate deforms first, and then the plunger spring deforms, so that the two springs act as a cushioning material, reducing the impact on the substrate and reducing the impact after cutting. Since the holding plate of the substrate is raised by the spring, the substrate can be easily detached from the lower blade.

[0009]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a conceptual diagram for explaining an embodiment of the present invention. In addition, the present invention will be described with reference to the dividing device by the above-mentioned butting method. That is, the holding plate 9 for fixing the mother board 1 (hereinafter, the substrate is referred to as a mother board in this embodiment) has two positioning pins 4 for fixing the mother board 1 on the holding plate 9. The lower blade 6 ′ (hereinafter referred to as the lower blade 6 ′) is provided at the corner or at the four corners, and when the mother board 1 is cut, the holding plate 9 is brought into contact with the lower surface of the mother board 1. A hole 10 is opened for this purpose. Further, bushes 11 are attached to the four corners of the holding plate 9, and a plurality of rods 13 attached to a lower blade base 12 to which a lower blade 6 ′ is fixed are inserted through the bushes 11. .. A spring 14 is provided on each of the rods 13, and the holding plate 9 is configured to be capable of vertically sliding movement against the spring 14 as shown by an arrow in the figure. On the other hand, the upper blade base 15 to which the upper blade 6 (hereinafter referred to as the upper blade 6) is attached has the spring plungers 16 attached to the four corners thereof. The spring plunger 16 comprises a plunger 19 which is constantly pressed by a plunger spring 18 in a plunger case 17 as shown in the partial sectional view of FIG. It is fixed to the upper blade base 15.

Next, the operation of the above dividing device will be described. Now, the holding plate 9 to which the mother board 1 is fixed is configured to be able to slide up and down along the rod 13 described above, and when it slides downward, it moves against the spring 14. .. The downward movement of the holding plate 9 is stopped by the stopper 21 attached to the lower blade base 12. Here, when the mother board 1 is cut, the upper blade base 15 is lowered by a pressing device (not shown) or the like. At this time, if the upper blade 15 is directly pressed against the holding plate 9, stress is applied to the motherboard 1. Therefore, when the upper blade base 15 is lowered, first, the plunger 19 at the tip of the spring plunger 16 is held by the holding plate. Hit 9 At this time, if the spring coefficient of the plunger spring 18 is set to be larger than the spring coefficient of the spring 14 that supports the holding plate 9, the plunger spring 18 does not deform and the plunger 19 is pressed against the holding plate 9. In this state, the holding plate 9 is lowered against the spring 14. Then, the holding plate 9 is brought into contact with the upper blade 6 and the lower blade 6'at a predetermined descending end, whereby the mother board 1 is cut. After the cutting is completed, the upper blade base 15 rises, and at the same time, the holding plate 9 also rises to the original position by the elastic force of the spring 14, so that the cut mother board 1 is completely separated from the lower blade 6 ′. It will be.

FIG. 3 is a diagram showing a case where the above-mentioned dividing device is applied to the press device 22. Immediately, if the upper blade base 15, the holding plate 9 and the lower blade base 12 which compose the above-mentioned dividing device are attached to the die set 23 of the press device 22 and a press source such as an air press 24 is used, the above-mentioned small dividing device is used. The device will be realized.

As described above, when the holding plate 9 to which the mother board 1 is fixed is lowered for cutting, the mother board 1 does not directly contact the upper blade 6, and the holding plate 9 and the lower blade base 12 are not in contact with each other. Since the spring 14 between and and the plunger spring 18 serve as a cushioning material, there is no direct impact on the motherboard 1. Moreover, since the plunger 19 is pressed against the holding plate 9 and lowered, the motherboard 1 is not stressed. This is particularly effective against changes in electrical characteristics caused by the stress when the mother board 1 having a high frequency circuit incorporated therein is cut. Moreover, after cutting the mother board 1, the holding plate 9 rises by the elastic force of the spring 14 at the same time when the upper blade base 15 rises, and returns to its original position, so that the mother board 1 should be separated from the lower blade 6 '. It becomes easier and the detachment work which was conventionally done by hand is eliminated, thereby significantly improving the work efficiency.

[0013]

[Effect of the device]

 As described above, according to the present invention, when the motherboard is cut by the abutting of the upper blade and the lower blade, the motherboard itself is not stressed when the motherboard is moved to the position of the blade in advance. Therefore, the characteristics of the electronic circuit formed on the substrate do not change, and the cutting is easily performed after the cutting, so that the working efficiency is significantly improved.

[Brief description of drawings]

FIG. 1 is a conceptual diagram illustrating an embodiment of a dividing device of the present invention.

FIG. 2 is a partial sectional view of a spring plunger used in the present invention.

FIG. 3 is a view showing a case where the dividing device of the present invention is applied to a press device.

FIG. 4 is an explanatory diagram of a motherboard that is an assembly of substrates.

FIG. 5 is a diagram illustrating a conventional method of cutting a motherboard.

[Explanation of symbols]

 1 Motherboard 2 Board 4 Positioning Pin 6 Upper Blade 6'Lower Blade 9 Holding Plate 11 Bushing 12 Lower Blade Base 13 Rod 14 Spring 15 Upper Blade Base 16 Spring Plunger 18 Plunger Spring

[Procedure amendment]

[Submission date] May 20, 1992

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

[Figure 5]

Claims (2)

[Reference number] 0031144-01 [Claims for utility model registration] 1. A substrate dividing device that cuts the substrate along a dividing line formed by abutting upper and lower blades on the substrate, and a holding plate for holding the substrate and a slide via a spring. A lower blade base provided with the holding plate and the lower blade that are fixed as possible, a spring plunger that lowers the holding plate while pressing the holding plate via a plunger spring, and the upper blade. A board dividing device comprising a blade base. 2. The substrate dividing device according to claim 1, wherein the elastic coefficient of the plunger spring is set to be larger than the elastic coefficient of the spring.