JPH0575266A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To improve the efficiency of wiring alignment operation by visually confirming the quantity of an insulating wire displaced to the internal layer of a printed wiring board, in which the insulating wire is used as a signal circuit. CONSTITUTION:Wires 2 for a test are wired to the internal layer patterns 1 of wiring alignment at different pitches, and etching characters 3 displaying the quantity of displacement and the direction of displacement generated after wiring are indicated previously on the sides of the internal layer lines of the internal layer patterns 1. When the wires 2 for the test are not displaced to the internal patterns 1, the coincidence of the internal layer line designated as '0' in the etching characters 3 and the wire 2 for the test is visually confirmed. When displacement is generated, the internal layer line corresponding to the quantity of displacement and the wire 2 for the test agree, the quantity of displacement and the direction of displacement are affirmed by visually observing the etching character 3 at the position of the agreement, and a wiring head is moved and adjusted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring wiring aligning operation and a method of manufacturing a printed wiring board excellent in wiring wiring position accuracy when wiring an insulated wire used in a signal circuit with a wiring machine.

[0002]

2. Description of the Related Art In a conventional method for manufacturing a printed wiring board, when an insulating wire used for a signal circuit is laid by a laying machine, a laying position is determined by a laying head. A grid-shaped wiring alignment pattern 4 composed of inner layer lines formed of copper foil by etching is provided at four corners of the inner layer of the printed wiring board.

An adhesive sheet 6 is laminated on the wiring alignment pattern 4 provided at the four corners of the inner layer so that the pattern can be visually recognized. After the insulation wire 5 having the same cross pattern as this pattern is laid on the wiring alignment pattern 4 from above the adhesive sheet 6, the wiring position of the insulation wire 5 with respect to the inner layer is compared by comparing the deviation. Is generally used to adjust the movement of the wiring head.

[0004]

However, in the method of adjusting the movement of the wiring head in the above-mentioned conventional method for manufacturing a printed wiring board, the wiring alignment pattern provided in the inner layer has the same cross pattern as this pattern. Since the insulated wire is laid in the wiring, if the wiring head is misaligned or the wiring guide hole is misaligned, and the wiring position of the insulated wire is misaligned with respect to the inner layer, insulation of the wiring alignment pattern provided on the inner layer The displacement direction of the wire can be visually confirmed, but the displacement amount must be measured by a microscope to confirm the displacement amount, and the displacement amount cannot be visually confirmed.

Therefore, in the production of a printed wiring board using an insulated wire for a signal circuit, when the creepage of the through hole and the insulated wire is small, a small diameter drill is used to make a hole, and the insulated wire is placed at an accurate position. In order to perform wiring, the shift amount of the wiring head can be determined only after checking the amount of deviation between the insulated wire and the wiring alignment pattern provided on the inner layer with a microscope. There is a problem that a large amount of work time is spent to move and adjust the.

Therefore, the present invention has been made in view of the above-mentioned problems, and a test wire is laid in the inner layer, and the amount of deviation of the wire laying position of the test wire can be visually confirmed. Provided is a method for manufacturing a printed wiring board for determining the amount of shift of a head and improving the efficiency of the wiring positioning operation in a high-density printed wiring board and the wiring position accuracy.

[0007]

In order to achieve the above object, the present invention provides a method for manufacturing a printed wiring board, in which an insulating wire used for a signal circuit is laid by a wiring machine to manufacture a printed wiring board. Prior to the work of laying the insulated wire at a predetermined position on the inner layer of the printed wiring board, in order to confirm the wiring position, a test wire is provided at a predetermined pitch on the inner layer and laid at a different pitch for the inner layer pattern touched. ,
The shift between the test wire and the inner layer pattern caused by the difference in the pitch is visually checked by the value displayed on the inner layer so as to correspond to the shift, and then the shift amount and the shift direction of the wiring head of the above-mentioned wiring machine are determined. Then, after adjusting the movement of the wiring head, the insulating wire is wired.

[0008]

In the above structure, the test wires for confirming the wiring position are laid at different pitches with respect to the pattern having a predetermined pitch provided on the inner layer, and the test wire and the inner layer pattern are compared. By visually recognizing the value displayed on the inner layer to show the shift, the shift amount and the shift direction are confirmed, and the shift amount and the shift direction for moving and adjusting the wiring head are determined.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to FIGS. 1, 3 and 4. Fig. 1 shows 0.025
It is an example of an inner layer pattern and a test wire formed on an inner layer so that a deviation amount of 4 mm (1 mi1) can be directly read by visual observation.

An inner layer pattern 1 (hereinafter referred to as an inner layer pattern) 1 for wiring position alignment shown in the figure is 2.54 mm (10
Is formed by a plurality of inner layer lines with a pitch of 0 mil),
The wiring alignment test wire (hereinafter referred to as the test wire) 2 is different from the pitch of the inner layer pattern 1 with respect to the inner layer line labeled "± 0" which is the center of the inner layer pattern 1, and is 2.59 mm. Wiring is performed on the upper surface of the inner layer pattern 1 at a (102 mil) pitch to confirm the wiring position.

Numerical values such as "± 0" displayed beside the inner layer line are formed by etching, and the deviation amount (mil) of the test wire 2 from the inner layer pattern 1 is measured.
It is the etching character 3 indicating the value) and the deviation direction (±).

After the test wire 2 is laid on the inner layer pattern 1 as described above, if the test wire 2 laid on the inner layer pattern 1 is not displaced, "± 0" is displayed. It is visually confirmed that the inner layer line and the test wire 2 are in agreement with each other and not in other places.

However, when the test wire 2 is misaligned with the inner layer pattern 1, the inner layer line labeled "± 0" does not match the test wire 2, but does match the other inner layer lines. It is visually confirmed.

As an example, in the wiring state shown in FIG. 3, the inner layer pattern 1 and the test wire 2 are coincident with each other in the inner layer line of "-2", and the distance from "± 0" to "-2" is , The test wire 2 is 2.59 mm (102 mi
l) and the inner layer line is 2.54 mm (100 mil), the difference, that is, the deviation amount is 2.59 mm-2.
54 mm = 0.05 mm (2 mil), the shift direction is on the right, and the shift amount and the shift direction are indicated by the numerical value "-2" displayed beside the inner layer line.

That is, in the present invention, by visually observing the numerical value displayed at the position where the inner layer line of the inner layer pattern 1 for the wiring position alignment and the test wire 2 coincide with each other,
The amount of deviation and the direction of deviation are confirmed, the wiring head is moved and adjusted according to the amount of deviation and direction of deviation, and then the insulated wire is laid.

Next, as an embodiment of the present invention, the wiring state of the test wire 2 on the inner layer pattern 1 is shown in FIGS. 3 and 4. In the case of FIG. 3, it is confirmed that the inner layer line indicated by “−2” and the test wire 2 are visually coincident with each other. Therefore, the shift direction and the shift amount for moving and adjusting the wiring head are adjusted. Is minus, that is, 0.05 mm (2 mil) to the left. Similarly, in the case of FIG. 4, there is no position where the inner layer line and the test wire 2 are coincident with each other, but it can be visually confirmed that they are deviated to the right of "-2" and the left of "-4". , "-2" and "-4" are taken in the middle, the shift direction and shift amount of the wiring head become 0.076 mm (3 mil) in the minus direction, that is, to the left.

[0017]

As is apparent from the above description, in the method of manufacturing a printed wiring board according to the present invention, a test wire having a pitch different from the pitch of this pattern is laid on the inner layer pattern provided in the inner layer, The amount of shift caused by the difference and the direction of the shift can be visually confirmed by the numerical values displayed on the inner layer pattern to determine the shift amount for moving and adjusting the wiring head of the wiring machine without using a microscope. As a result, it is possible to improve the efficiency of the wiring positioning operation of the wiring head in the high-density printed wiring board and to improve the wiring position accuracy, as compared with the conventional case.

[Brief description of drawings]

FIG. 1 is a schematic view of an inner layer pattern for wiring position alignment and a test wire according to an embodiment of the present invention.

FIG. 2 is a schematic view of an inner layer pattern for wiring position alignment and an insulated wire according to a conventional example.

FIG. 3 is a state diagram showing an example of a wiring state of a test wire with respect to an inner layer pattern for wiring position alignment according to the present invention.

FIG. 4 is a state diagram showing another example of the wiring state of the test wire to the inner layer pattern for wiring position alignment according to the present invention.

[Explanation of symbols]

 1 Inner layer pattern for wiring alignment 2 Test wire for wiring alignment 3 Etching character indicating displacement amount and displacement direction 4 Inner layer pattern for wiring alignment 5 Insulation wire for wiring alignment 6 Adhesive sheet

Claims (1)

[Claims] 1. A method for manufacturing a printed wiring board, wherein an insulating wire used for a signal circuit is laid by a wire laying machine to produce a printed wiring board, and the insulating wire is laid at a predetermined position on an inner layer of the printed wiring board. Prior to the wiring work, in order to confirm the wiring position, the test wires are laid at different pitches with respect to the inner layer pattern provided at a predetermined pitch on the inner layer, and the test wire and the inner layer pattern caused by the difference in the pitch. After visually confirming the deviation with the value displayed on the inner layer so as to correspond to this deviation, determine the shift amount and shift direction of the wiring head of the wiring machine, adjust the movement of the wiring head, and then insulate A method for manufacturing a printed wiring board, which comprises laying wires.