JPH0574798U - Board divider - Google Patents

Abstract

(57) [Abstract] [Purpose] It is possible to prevent the substrate cut into a predetermined width from coming off between the lower cutting blades, and to improve the work efficiency. Further, it prevents distortion of the substrate when the substrate is taken out. [Structure] Cutting blades 3 are provided on an upper surface 2 of a lower die 1 at a predetermined interval. A substrate take-out device 9 that moves up and down inside both cutting blades 3 of the lower die 1 is installed. A substrate dividing machine 13 is constructed by installing an upper mold 10 having a pressing projection 12 protruding from a lower surface 11 facing the cutting blade 3 above the lower mold 1 so as to be movable up and down.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a board dividing machine for cutting a board material into a predetermined width to form a board for a circuit.

[0002]

[Prior Art]

 Conventionally, the substrate dividing machine 20 has a pair of cutting blades 22 and 22 projectingly provided on the upper surface of the lower mold 21 at a predetermined interval according to the width of a desired substrate. An upper mold 24 having a pressing projection 23 facing the cutting blade is provided so as to be vertically movable (FIG. 6 (a)). Then, the substrate material 25 is placed on the cutting blade 22 of the lower die 21, the upper die 24 is lowered, and the substrate material 25 is sandwiched between the cutting blade 22 and the pressing protrusion 23 (FIG. 6 (b)). The substrate 25a was formed by pressing and cutting (FIG. 6C).

[0003]

[Problems to be solved by the device]

 In the above-mentioned conventional technique, there is a problem that the substrate 25a cut into a predetermined width may be caught between the cutting blade 22 and the cutting blade 22 (FIG. 6C), and may not come off from the lower die 21. It was Further, when the sandwiched substrate 25a is directly taken out by hand, there is a possibility that the cutting blade 22 may damage the hand. Further, when the substrate is taken out by hand, the substrate 25a is bent, so that the substrate may be distorted. Especially, when an electronic component is connected to the substrate, the component is damaged or the pattern is peeled off. There was a problem that occurred.

[0004]

[Means for Solving the Problems]

 However, the present invention solves the above-mentioned problem because the lower die is provided with a device for taking out the substrate which moves up and down inside both cutting blades.

That is, according to this invention, a cutting blade is projected on the upper surface of the lower mold at a predetermined interval, and an upper mold having a pressing projection facing the cutting blade is projected on the lower surface of the lower mold to move up and down. In the substrate divider installed freely, a substrate take-out device that moves up and down inside the lower cutting blades of the lower die is installed.

Further, the take-out device is configured by providing a lifting member on the lifting member, and the upper edge of the lifting member has a length equal to the thickness of the substrate to be cut at the position where the lifting member is lowered. Is a substrate divider located below the upper edge of the cutting blade and above the upper edge of the cutting blade at a position where the lifting member is raised. Further, the pushing-up member of the take-out device is a substrate dividing machine installed near the cutting blade.

[0007]

[Action]

 The substrate is formed by sandwiching and pressing the substrate material with the cutting blade of the lower mold and the pressing protrusion of the upper mold to cut the substrate material into a predetermined width. Further, the take-out device rises between the cutting blades and pushes the substrate above the cutting blades.

[0008]

【Example】

 An embodiment of this invention will be described with reference to the drawings.

Cutting blades 3, 3 are provided on the upper surface 2 of the lower mold 1 at predetermined intervals so as to project with the cutting edges facing upward. The predetermined interval mentioned above is adjusted according to the width of the substrate to be cut.

Inside the lower mold 1, an elevating rod 4 is installed, which is provided with push-up rods 5 and 5 projecting from the upper part thereof at predetermined intervals. The push-up rods 5 and 5 penetrate through the through holes 6 and 6 in the upper wall of the lower mold 1 and project upward from the upper surface 2. The push-up rods 5 and 5 are located between the cutting blades 3 and 3 and near the cutting blade 3. Further, the lower surface of the elevating rod 4 is connected to a rod 8 of an air cylinder 7 so that the elevating rod 4 moves up and down together with the rod 8. A take-out device 9 is composed of the lifting rod 4, the push-up rod 5, the air cylinder 7, and the rod 8.

In addition, in the above description, the upper edge 5a of the push-up rod 5 is located below the upper edge 3a of the cutting blade 3 at a position where the push-up rod 5 is lowered and has a length equivalent to the thickness of the substrate to be cut. Is located in. Further, the upper edge 5a of the push-up rod 5 is formed so as to be located above the upper edge 3a of the cutting blade 3 at the position where the push-up rod 5 is raised. Alternatively, the operation of the air cylinder 7 is adjusted so that the pushing rod 5 takes the above position.

Further, an upper die 10 is installed above the lower die 1 so as to be able to move up and down, and pressing projections 12, 12 facing the cutting blades 3, 3 are provided on a lower surface 11 of the upper die 10 downward. To project. The substrate dividing machine 13 is formed as described above (FIG. 1). Reference numeral 16 in the figure denotes a base to which the lower mold 1 is fixed.

Next, the use of the substrate divider 13 of the present invention based on the above embodiment will be described.

The board dividing machine 13 is in a position in which the upper die 10 is raised and in a position in which the elevating rod 4 is lowered, and the circuit board material 14 to be cut is placed on the cutting blade 3 of the lower die 1 ( (Fig. 1). Next, the upper die 10 is lowered, the lower surface of the pressing protrusion 12 of the upper die 10 is pressed from the upper surface of the substrate material 14, and the substrate material 14 is cut by the cutting blade 3. At this time, the substrate 14a cut into a predetermined width remains between the cutting blades 3 and 3, and the surplus piece 14b of the substrate material 14 falls outside the cutting blade 3 (FIG. 2).

Next, the air cylinder 7 is operated to raise the rod 8, the lifting rod 4, and the push-up rod 5. As the push-up rod 5 rises, the upper edge 5a of the push-up rod 5 contacts the lower surface of the substrate 14a, and further pushes the substrate 14a above the cutting blades 3 and 3 (FIG. 3). Next, the pushed-up board 14a is removed from the pushing-up rod 5.

In the above-mentioned embodiment, since the push-up rod 5 is installed in the vicinity of the cutting blades 3 and 3, the push-up efficiency is good, and since the substrate is not bent when pushing up the substrate, it is possible to further reduce the strain generated in the substrate. However, if the push-up rod 5 is located between the cutting blades 3 and 3, it can be installed at another position.

Further, although the push-up rod 5 is used as the push-up member in the above-described embodiment, the connecting rod 15 for connecting the push-up rods 5, 5 to the upper edge 5a is attached to the upper edge 5a of the push-up rods 5, 5. It can also be a push-up member (Fig. 4). When the connecting rod 15 is used, the upper edge 15a of the connecting rod 15 is at the position where the connecting rod 15 is lowered and the upper edge 3a of the cutting blade 3 is as long as the thickness of the substrate to be cut. It is formed so as to be located below and above the upper edge 3a of the cutting blade 3 at a position where the connecting rod 15a is raised. Alternatively, the operation of the air cylinder 7 is adjusted so that the connecting rod 15 takes the above position.

Further, in the above-mentioned embodiment, the take-out device 9 is configured by projecting the lifting rod 5 on the lifting rod 4 connected to the air cylinder 7. However, as another example of the lifting member and the pushing member, a lifting plate is used. It is also possible to connect the lower surface of 17 to the air cylinder 7 and to project the lifting plates 18, 18 along the cutting blade 3 on the upper surface of the elevating plate 17 to form the take-out device 9a (FIG. 5). The vertical sectional shape of the substrate dividing machine using the take-out device 9a is the same as that shown in FIG.

Further, a magnet cylinder or other cylinders can be used in place of the air cylinder 7 as long as it has a function of allowing the lifting rod 4 to move up and down.

[0020]

[Effect of the device]

 In this invention, since the take-out device is provided in the cutting blade, the board sandwiched between the cutting blades can be pushed up and taken out, and manual work is unnecessary, and it is possible to prevent hand injury. effective. Therefore, there is no need to remove the substrate from the substrate dividing machine, and there is no delay in the work of dividing the substrate, which has the effect of increasing the efficiency of the substrate dividing work. In addition, when the substrate is taken out, the stress generated on the substrate can be suppressed to a minimum, and there is an effect that damage of parts and peeling of the pattern can be eliminated and trouble can be prevented.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of an embodiment of the present invention, showing a state in which an upper die is raised.

FIG. 2 is a vertical sectional view of an embodiment of the present invention, showing a state in which a substrate is cut.

FIG. 3 is a vertical sectional view of an embodiment of the present invention, showing a state in which a substrate is taken out.

FIG. 4 is a vertical cross-sectional view of another embodiment of the present invention.

FIG. 5 is a perspective view of a take-out device according to another embodiment of the present invention.

FIG. 6 is a front view of a conventional example, in which (a) is a state in which an upper die is raised, (b) is a state in which a substrate is sandwiched between an upper die and a lower die, (c).
Indicates a state in which the substrate is cut.

[Explanation of symbols]

 1 Lower Die 3 Cutting Blade 4 Elevating Rod 5 Push Up Rod 9 Ejecting Device 10 Upper Die 12 Pressing Protrusion 13 Substrate Divider 14 Substrate Material 14a Substrate

Claims (3)

[Scope of utility model registration request] 1. An upper die, which is provided with cutting blades projecting from the upper surface of a lower die at predetermined intervals, and a pressing projection which is provided on the lower surface of the lower die so as to be opposed to the cutting blade, and is vertically movable. In the substrate dividing machine described above, a substrate extracting device that moves up and down inside the lower cutting blades is installed. 2. The take-out device is configured by providing a lifting member on the lifting member, and the upper edge of the lifting member has a length equivalent to the thickness of the substrate to be cut at the position where the lifting member is lowered. The substrate dividing machine according to claim 1, wherein the substrate dividing machine is installed so as to be located below the upper edge of the cutting blade and above the upper edge of the cutting blade when the elevating member is raised. 3. The substrate dividing machine according to claim 2, wherein the push-up member of the take-out device is installed near the cutting blade.