JPH0573496U - Solder reflow equipment - Google Patents

Abstract

(57) [Summary] [Purpose] The sealing performance between the upper half of the furnace and the lower half of the furnace can be maintained for a long period of time, and even if there are irregularities on the opening edge surfaces of the upper and lower half of the furnace, the sealing performance is impaired. To provide a solder reflow device that does not interfere with the process. [Construction] The furnace 1 of the solder reflow apparatus is divided into a furnace upper half 2 and a furnace lower half 3 and can be opened and closed. An upper mica-made heat insulating material layer 7 is provided on the lower surface of the opening edge of the upper furnace half 2 and a lower mica-made heat insulating material layer 8 is provided on the upper surface of the opening edge of the lower furnace half 3. On the upper surface of the lower heat insulating material layer 8, a first silicone / rubber packing 9 having a circular cross section along the outer peripheral edge of the lower heat insulating material layer 8 and a second silicone / rubber rubber packing 10 having a rectangular cross section along the inner peripheral edge thereof. Are glued together. The diameter of the first packing 9 is larger than the thickness of the second packing 10 when no load is applied.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a solder reflow device for soldering electronic parts and the like to a printed circuit board.

[0002]

[Prior Art]

 2. Description of the Related Art A solder reflow device in which a furnace is divided into an inverted U-shaped upper half body and a U-shaped lower half body so that the furnace can be opened and closed is conventionally known. In this type of solder reflow apparatus, the upper half of the furnace and the lower half of the furnace, which are divided into two parts, are sealed by one packing having a circular cross section adhered to the upper surface of the opening edge of the lower half of the furnace. It was

[0003]

[Problems to be solved by the device]

 In the above conventional solder reflow equipment, the total weight of the upper half of the furnace is received by only one packing, and since the packing is easily deteriorated by the heat from the upper and lower half of the furnace, it is easy to deteriorate. There was a problem that the sealability between the upper half of the furnace and the lower half of the furnace deteriorated. There is also a problem in that the sealability is impaired when the opening edge surface of the upper and lower half of the furnace is uneven.

The object of the present invention is to maintain the sealing performance between the upper half of the furnace and the lower half of the furnace for a long period of time, and to impair the sealing performance even when the surface of the opening edge of the upper and lower half of the furnace is uneven. It is to provide a solder reflow device that does not have any problems.

[0005]

[Means for Solving the Problems]

 The solder reflow apparatus according to the present invention is a solder reflow apparatus in which the furnace is divided into an inverted U-shaped upper half body and a U-shaped lower half body to be opened and closed. An upper heat insulating material layer is provided on the lower surface, a lower heat insulating material layer is provided on the upper surface of the opening edge of the lower half of the furnace, and the upper and lower heat insulating material layers are provided on either the upper heat insulating material lower surface or the lower heat insulating material upper surface. The first packing made of an elastic material along the outer peripheral edge portion and the second packing made of an elastic material along the inner peripheral edge portion are adhered, and the thickness of the first packing and the thickness of the second packing when no load is applied are It is characterized by being different.

As the heat insulating material, mica (mica), mica night, micalex, asbestos, etc. are used, and as the elastic material, silicone rubber, fluororubber, etc. are used.

[0007]

[Action]

 According to the solder reflow device of the present invention, the upper heat insulating material layer is provided on the lower surface of the opening edge of the upper half of the furnace, and the lower heat insulating material layer is provided on the upper surface of the opening edge of the lower half of the furnace. The first packing made of elastic material along the outer peripheral edge of the upper and lower heat insulating material layers and the second packing made of elastic material along the inner peripheral edge of the upper and lower heat insulating material layers are attached to either the upper surface of the lower heat insulating material layer or the lower heat insulating material layer. Since the thickness of the first packing and the thickness of the second packing at the time are different, an appropriate crushing allowance is given to the thick packing when the furnace is closed. The upper half of the furnace and the lower half of the furnace are sealed by both the first and second packings. Further, the weight of the upper half of the furnace is received by both the first and second packings, and neither of the first and second packings is affected by the heat from the upper and lower halfs of the furnace.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. In the following description, the front and rear are based on the moving direction of the printed circuit board to be processed, and the front is the front and the opposite side is the rear, and the left and right are the front, that is, the left side of FIG. Is the left and the right side of the figure is the right.

FIG. 1 shows a vertical cross section of a furnace (1) of a solder reflow apparatus. The box-shaped furnace (1) is composed of an inverted U-shaped upper half body (2) and a U-shaped lower furnace. The upper half (2) and the lower half (3) of the furnace are connected to each other by a hinge (11) and can be opened and closed while being divided into two halves. . Inside the furnace (1), there are a board transfer rail (4) extending in the front and rear, a substrate heating heater (5) arranged above the board transfer rail (4), and a furnace lower half (3). It is provided with a fan (6) for circulating atmospheric gas, which is arranged in the middle of the bottom wall (3a).

An upper mica-made insulation layer (7) is formed on the lower surface of the opening edge of the upper furnace half (2), and a lower mica-made insulating material layer (8) is formed on the upper surface of the opening edge of the lower half of the furnace (3). ) Are respectively provided on the upper surface of the lower heat insulating material layer (8) and the first silicone rubber packing (9) along the outer peripheral edge of the lower heat insulating material layer (8) and the silicone rubber along the inner peripheral edge thereof. The second made packing (10) is attached.

The first packing (9) has a circular cross section, its unloaded diameter is 8 mm, and the second packing (10) has a rectangular cross section, its unloaded thickness is 5 mm and its width is 25 mm. Is being done.

Therefore, when the furnace (1) is opened, as shown in FIG. 2, the first packing (9) projects above the second packing (10). Then, when the furnace (1) is closed, as shown in FIG. 3, the first packing (9) is crushed to give an appropriate crushing margin (3 mm in this embodiment), and the upper half of the furnace is crushed. The weight of (2) is received by both the first and second packings (9) (10).

A through hole (12) through which the fan shaft portion (13) is inserted is provided in the middle of the bottom wall (3a) of the lower furnace half (3). A cylindrical motor base (17) with a circular opening is fixed to the top wall (17a) on the outer surface of the bottom wall (3a) of the lower furnace half (3). ) A motor (14) for driving the fan shaft portion (13) is attached to the outer surface of the bottom wall.

A ring-shaped sintered oil-impregnated alloy receiving metal (15) is press-fitted into the opening of the motor base top wall (17a) in close contact with the lower edge of the through hole (12). The fan shaft (13) is rotatably inserted in the ring (15). Then, the pointed portion of the elastic V packing (16) fixed to the fan shaft portion (13) is brought into contact with the receiver (15), and the fan shaft portion (13) and the receiver (15). The space between and is sealed.

The V packing (16) is pressed against the lower surface of the receiving metal (15) from below by the packing retainer (18) fixed to the fan shaft portion (13). A V-packing cooling blade (19) is attached to the lower surface of the packing retainer (18). The fan shaft portion (13), the V packing (16), the packing retainer (18) and the V packing cooling blade (19) are all housed in the motor base (17).

The shapes and sizes of the first and second packings are not limited to those in the above embodiment, and can be changed as appropriate.

[0017]

[Effect of the device]

 According to the solder reflow device of the present invention, when the furnace is closed, the packing having a large thickness is given an appropriate squeezing allowance, and the upper half of the furnace and the lower half of the furnace are provided with both the first and second packings. Since it is sealed, it has excellent sealing properties, and even if there are irregularities on the opening edge surface of the upper and lower half of the furnace, the sealing properties are not impaired. Further, the weight of the upper half of the furnace is received by both the first and second packings, and neither of the first and second packings is affected by the heat from the upper and lower half of the furnace, so that it is less likely to deteriorate. The sealability between the upper half of the furnace and the lower half of the furnace can be maintained for a long time.

[Brief description of drawings]

1 is a schematic vertical cross-sectional view of a solder reflow apparatus according to the present invention.

FIG. 2 is an enlarged vertical cross-sectional view of an essential part when the furnace is opened.

FIG. 3 is an enlarged vertical cross-sectional view of essential parts when the furnace is closed.

[Explanation of symbols]

 (1) Furnace (2) Upper half of furnace (3) Lower half of furnace (7) (8) Heat insulation layer (9) First packing (10) Second packing

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location // F27D 7/06 B 6977-4K

Claims (1)

[Scope of utility model registration request] 1. A solder reflow apparatus in which a furnace (1) is divided into an inverted U-shaped upper half body (2) and a U-shaped lower half body (3) and can be opened and closed. On the lower surface of the opening edge of the half body (2), the upper insulation layer (7) is
A lower heat insulating material layer (8) is provided on the upper surface of the opening edge of the lower furnace half (3), and upper and lower heat insulating layers are provided on either the lower surface of the upper heat insulating material layer (7) or the upper surface of the lower heat insulating material layer (8). Elastic material first packing (9) along the outer peripheral edge portions of the material layers (7) and (8) and elastic material second packing (10) along the inner peripheral edge portions are adhered,
A solder reflow device, wherein the thickness of the first packing (9) and the thickness of the second packing (10) are different when no load is applied.