JPH0573270B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for an integrated circuit used in, for example, an electronic computer.

[Conventional technology]

As the integration of electronic circuits progresses, processing of the generated heat is becoming a problem. Conventionally, as shown in FIG. circuit case 2
A metal cooling pipe 4 is fixed to the heat dissipation surface 3 with solder 5, and a refrigerant is passed through the cooling pipe 4 to cool the integrated circuit case 2.

[Problem that the invention seeks to solve]

However, in such a structure, when replacing a defective integrated circuit, after melting the solder 5 and removing the integrated circuit case 2, a good integrated circuit case 2 is mounted on the printed wiring board 1 again. Since soldering work was required, there was a problem that the work was extremely complicated. In addition, in an integrated circuit in which a large number of integrated circuit cases 2 are mounted on a printed wiring board 1, it is difficult to make all the integrated circuit cases 2 have the same height. I have no choice but to solder while bending the parts. As a result, stress is applied to the integrated circuit, causing damage and the like. Furthermore, since the cooling pipes 4 must be arranged and soldered onto the printed wiring board 1 in a complicated manner, there is also an inconvenience that manufacturing costs increase.

[Means for solving problems]

The present invention was made in view of these circumstances, and its purpose is to facilitate the replacement of integrated circuits,
Moreover, the present invention provides a cooling structure for integrated circuits that can suppress damage to the integrated circuits and increase in manufacturing costs. In the integrated circuit cooling structure according to the present invention, the heat conduction plate and the pressing member, which are removably fixed to the integrated circuit case by the fixing means, are arranged to face each other at a distance in a direction perpendicular to the heat dissipation surface. The cold plate is provided with protruding holding parts, and has connecting parts which are held by these holding parts in a protruding manner and has a refrigerant passage therein.

[Effect]

In the present invention, the difference in height of the cold plate relative to the integrated circuit case is absorbed by the heat conductive plate and the clamping portion of the holding member, and the cold plate is detachably attached to the integrated circuit case.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view showing a cooling structure for an integrated circuit according to the present invention. In the figure, 1 is a printed wiring board, and 2 is a plurality of integrated circuits mounted on the printed wiring board 1 and having integrated circuits mounted therein. It is an integrated circuit case. The integrated circuit case 2 is formed into a box shape like the conventional one, and has a heat dissipation surface 3 formed on its surface for dissipating the heat of the integrated circuit, and is arranged relatively close to each other.

Reference numeral 11 designates a heat conduction plate which is superimposed on the heat dissipation surface 3 of each integrated circuit case 2, and reference numeral 12 designates a pressing member which is superimposed on these heat conduction plates 11. The back surface of the heat conduction plate 11 is in close contact with the heat dissipation surface 3, and the front surface of the heat conduction plate 11 is in close contact with the back surface of the pressing member 12. These heat conduction plates 11 and holding members 12 are made of metal plates such as copper or aluminum having high thermal conductivity, and by bending the ends, they are spaced apart from each other in the direction perpendicular to the heat dissipation surface 3 and toward the surface side. Plate-shaped clamping parts 11a and 12a are provided so as to face each other at a distance.

Reference numeral 15 designates a fixing screw as a fixing means for fixing the heat conduction plate 11 and the holding member 12 to the integrated circuit case 2 in a detachable manner. This fixing screw 15 is connected to the heat conduction plate 11 and the holding member 12.
The two members are screwed into the screw holes 16 of the integrated circuit case 2 through a fixing hole drilled in the hole, and the two members are fastened and fixed to the integrated circuit case 2. The fixing hole has an inner diameter somewhat larger than the outer diameter of the threaded portion of the fixing screw 15 so that even if the mounting position of the integrated circuit case 2 is slightly shifted, it can be absorbed.

21 is a heat dissipation surface 3 of a plurality of integrated circuit cases 2;
This is a cold plate placed opposite to the cold plate.
The cold plate 21 is formed of a metal with high thermal conductivity into a thick plate shape with a flat back surface 21a, and a refrigerant passage 22 is provided inside. In this embodiment, three refrigerant passages 22 each having a rectangular cross section are provided for every two integrated circuit cases 2 . 23 is this cold plate 21
It is a connecting member attached to provide a connecting part to be described later, and the surface 23 is made of a metal with high thermal conductivity and is brought into close contact with the back surface 21a of the cold plate 21.
It is formed into a thick plate shape with a. Although not shown, this connecting member 23 is fastened to the cold plate 21 with bolts or the like, and on the back side, a plurality of connecting portions 24 held by the holding portions 11a and 12a are provided in the direction of each integrated circuit case 2. It is integrally protruded. Here, the height of the connecting portion 24 is the same as that of the holding portion 1 provided in the integrated circuit case 2 having an average height.
The height is set at such a height that a gap h is formed between the heat conductive plate 11 and the surface of the heat conductive plate 11 when the plate is sandwiched between 1a and 12a. The gap h is determined in consideration of variations that occur when the integrated circuit case 2 is mounted on the printed wiring board 1.

In the integrated circuit cooling structure configured as described above, by screwing the fixing screws 15 into the screw holes 16, the heat conduction plate 11 and the holding member 12 can be fixed to the integrated circuit case 2, and at the same time, The connecting portion 24 can be held between the holding portions 11a and 12a. Therefore, the cold plate 21 can be attached to the integrated circuit case 2. At this time, the heat generated in the integrated circuit in the integrated circuit case 2 is transferred from the integrated circuit case 2 to the connection part 2 through the heat conduction plate 11 and the holding member 12.
4 to the cold plate 21 and diffused into the refrigerant flowing through the refrigerant passage 22.

Also, by removing the fixing screws 15 from the screw holes 16, the heat conductive plate 11 and the holding member 1 can be removed.
2 from the integrated circuit case 2, and at the same time, the cold plate 21 can also be removed.

Furthermore, since the clamping parts 11a and 12a protrude in a direction perpendicular to the heat dissipation surface 3 of the integrated circuit case 2, the height of each integrated circuit case 2 can be adjusted when the integrated circuit case 2 is mounted on the printed wiring board 1. Even if a difference occurs, this difference can be absorbed within the range of the gap h, and the integrated circuit case 2 and the cold plate 21 can be clamped without affecting them in any way. In other words, the integrated circuit case 2 and the cold plate 21 functioning as a cooling pipe
No stress is applied to the

In the above embodiment, an example was described in which three refrigerant passages 22 having a rectangular cross section were provided in the cold plate 21 for two integrated circuit cases 2, but the present invention is not limited to this. Rather, the shape and number of refrigerant passages 22 can be changed as appropriate. In addition, the fixing screw 15 is used as a fixing means.
In addition to this, various other methods can be considered, such as fixing using the elastic force of a spring member or using a cam mechanism.

〔Effect of the invention〕

As explained above, according to the present invention, the heat conduction plate and the pressing member, which are detachably fixed to the integrated circuit case by the fixing means, are arranged so as to face each other at a distance in a direction perpendicular to the heat dissipation surface. In addition to providing a protruding clamping part, a cold plate having a refrigerant passage inside and having a protruding connection part clamped between these clamping parts is provided.
Differences in the height of the cold plate relative to the integrated circuit case can be accommodated, and the cold plate can be detachably attached to the integrated circuit case.

Therefore, the integrated circuit case can be attached and detached without melting solder or soldering as in the conventional case, making it easy to replace the integrated circuit. Furthermore, even if there is a difference in height when the integrated circuit case is mounted on the printed wiring board, this difference can be absorbed, so it is possible to prevent the integrated circuit from being damaged. Furthermore, by installing a cold plate,
Since the passage through which the refrigerant flows can be integrally provided, an increase in manufacturing cost can be suppressed compared to the case where individual cooling pipes are soldered.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an integrated circuit cooling structure according to the present invention, and FIG. 2 is a sectional view showing a conventional integrated circuit cooling structure. 2... Integrated circuit case, 11... Heat conduction plate, 11a... Holding part, 12... Holding member, 1
2a... Holding part, 15... Fixing screw, 21... Cold plate, 22... Refrigerant passage, 24... Connection part.

Claims (1)

[Claims] 1. In a structure for cooling an integrated circuit mounted inside an integrated circuit case, a heat conduction plate is stacked on the heat dissipation surface of the integrated circuit case, a holding member is stacked on the heat conduction plate, and these members are detachable. and a fixing means for fixing to the integrated circuit case, and the heat conduction plate and the holding member are provided with a plurality of holding portions that protrude so as to face each other at intervals in a direction perpendicular to the heat dissipation surface, and 1. A cooling structure for an integrated circuit, characterized in that a cold plate facing a heat dissipating surface of an integrated circuit case and having a refrigerant passage therein is provided with a plurality of connecting parts protruding from the cold plate to be held between the holding parts.