JPH0572730B2 - - Google Patents
Info
- Publication number
- JPH0572730B2 JPH0572730B2 JP6318584A JP6318584A JPH0572730B2 JP H0572730 B2 JPH0572730 B2 JP H0572730B2 JP 6318584 A JP6318584 A JP 6318584A JP 6318584 A JP6318584 A JP 6318584A JP H0572730 B2 JPH0572730 B2 JP H0572730B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- nozzle
- chip inductor
- ferrite
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 4
- 239000000696 magnetic material Substances 0.000 claims 2
- 239000000470 constituent Substances 0.000 claims 1
- 229910000859 α-Fe Inorganic materials 0.000 description 24
- 238000003475 lamination Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/043—Printed circuit coils by thick film techniques
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、産業用および民生用の電子機器に用
いられるチツプインダクタの製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a chip inductor used in industrial and consumer electronic equipment.
（従来例の構成とその問題点）
近年、電子機器の軽量化傾向に伴ない、ハンダ
デイツプ、ハンダリフローで実装できるチツプイ
ンダクタの需要が増大している。(Conventional Structures and Their Problems) In recent years, with the trend toward lighter weight electronic devices, there has been an increasing demand for chip inductors that can be mounted by solder dip or solder reflow.
チツプインダクタの代表的な製造方法として
は、フエライトコアに被膜銅線を巻線して、コイ
ルを構成し、このコイルに耐熱性樹脂の外装を施
すものがある。この製造方法では、１ｍＨまでの
比較的大きなインダクタンスが得られ、また高い
Ｑも得られる反面、フエライトコアの製造面およ
び巻線作業による制約で、チツプインダクタの高
さ寸法を巾寸法とほぼ同じにする必要があり、小
型、薄型化が困難な欠点があつた。 A typical method for manufacturing a chip inductor is to wind a coated copper wire around a ferrite core to form a coil, and then cover the coil with a heat-resistant resin. With this manufacturing method, a relatively large inductance of up to 1 mH can be obtained, and a high Q can also be obtained.However, due to constraints due to the manufacturing of the ferrite core and the winding process, the height dimension of the chip inductor is almost the same as the width dimension. However, it had the disadvantage that it was difficult to make it smaller and thinner.
この欠点の解決方法として、積層セラミツクコ
ンデンサの製造方法を応用した、印刷積層工法が
ある。第１図ａないし同図ｅはこの印刷積層工法
の工程を示している。同図において１ａ，１ｂ，
１ｃはフエライトペースト、２ａ，２ｂ，２ｃは
導電性ペーストである。製造工程は次のようであ
る、
(1) フエライトペースト１ａをポリエステルフイ
ルム等（図示せず）に印刷する。 As a solution to this drawback, there is a printed lamination method, which is an application of the manufacturing method of laminated ceramic capacitors. Figures 1a to 1e show the steps of this printing lamination method. In the same figure, 1a, 1b,
1c is a ferrite paste, and 2a, 2b, and 2c are conductive pastes. The manufacturing process is as follows: (1) The ferrite paste 1a is printed on a polyester film or the like (not shown).
(2) 外部電気端子との接続用およびコイルパター
ンの一部となる導電性ペースト２ａを印刷す
る。(2) Print conductive paste 2a for connection with external electrical terminals and to become part of the coil pattern.
(3) フエライトペースト１ｂを印刷する。(3) Print ferrite paste 1b.
(4) 導電性ペースト２ｂを、その一端を導電性ペ
ースト２ａの一端と重ね、他端をフエライトペ
ースト１ｂに重ねて印刷する。(4) Print the conductive paste 2b so that one end overlaps one end of the conductive paste 2a and the other end overlaps the ferrite paste 1b.
(5) フエライトペースト１ｃを印刷する。(5) Print ferrite paste 1c.
(6) 導電性ペースト２ｃを、その一端を導電性ペ
ースト２ｂの一端と重ね、他端をフエライトペ
ースト１ｃと重ねて印刷する。(6) One end of the conductive paste 2c is overlapped with one end of the conductive paste 2b, and the other end is overlapped with the ferrite paste 1c, and printed.
以上の工程でコイルパターンの１ターンが完成
し、同様の手順で所定のターン数のコイルパター
ンの印刷積層ができる。 One turn of the coil pattern is completed through the above steps, and a predetermined number of turns of the coil pattern can be printed and laminated using the same procedure.
この印刷積層工法によれば、チツプインダクタ
の巾寸法が3.2mmとすると、その高さ寸法は1.5mm
前後となり、小型、薄型化が図れる。しかし、１
ターンのコイルパターンを形成するのに約５工程
を要し、工程が煩雑になる欠点があつた。 According to this printing lamination method, if the width dimension of the chip inductor is 3.2 mm, its height dimension is 1.5 mm.
It can be made smaller and thinner. However, 1
It takes about five steps to form a turn coil pattern, which has the disadvantage of making the steps complicated.
（発明の目的）
本発明の目的は、従来の欠点を解消し、工程が
簡単で、量産性に優れた積層タイプのチツプイン
ダクタの製造方法を提供することである。(Objective of the Invention) An object of the present invention is to provide a method for manufacturing a multilayer chip inductor that eliminates the conventional drawbacks, has simple steps, and is excellent in mass production.
（発明の構成）
本発明の、チツプインダクタの製造方法は、絶
縁基材と、少なくとも一対のノズルとを略円形状
に相対的に移動させ、前記ノズルの一方から導電
性インクを、前記絶縁基材上に連続的に吐出し、
他方のノズルから、前記の吐出した導電性インク
およびその周辺の面上に絶縁性インクを連続的に
吐出してコイルを形成するものであり、これによ
り積層タイプのチツプインダクタの量産性を向上
できるものである。(Structure of the Invention) The method for manufacturing a chip inductor of the present invention involves relatively moving an insulating base material and at least a pair of nozzles in a substantially circular shape, and applying conductive ink from one of the nozzles to the insulating base material. Continuously discharges onto the material,
From the other nozzle, insulating ink is continuously ejected onto the ejected conductive ink and its surrounding surface to form a coil, thereby improving the mass productivity of multilayer chip inductors. It is something.
（実施例の発明）
本発明の一実施例を第２図ないし第４図に基づ
いて説明する。(Embodiment of the Invention) An embodiment of the present invention will be described based on FIGS. 2 to 4. FIG.
第２図は本発明の製造方法によるチツプインダ
クタの構成を概略的に示す断面図である。同図に
おいて、３は絶縁基材であるフエライト板であ
り、その厚さは約0.2mmである。フエライト板３
の両端にはAgPdペーストの焼付による端子電極
４，５が設けられている。６は導電性インク吐出
用ノズル、７は絶縁性インク吐出用ノズルであ
り、ノズル６の内径は0.1mm、ノズル７の内径は
0.5mmである。８は導電性インクであるAgPdペー
スト、９は絶縁性インクであるフエライトペース
トである。フエライトペースト９は、6.7％ブチ
ラール樹脂粉末＋3.3％フタル酸ジｎブチル＋90
％テルピノールのビイクルに60％の酸性粉末を加
えたペーストに、ポリイソシアネートの45％酢酸
エチル溶液20％を添加したものである。 FIG. 2 is a sectional view schematically showing the structure of a chip inductor manufactured by the manufacturing method of the present invention. In the figure, 3 is a ferrite plate which is an insulating base material, and its thickness is about 0.2 mm. Ferrite plate 3
Terminal electrodes 4 and 5 are provided at both ends by baking AgPd paste. 6 is a nozzle for discharging conductive ink, and 7 is a nozzle for discharging insulating ink. The inner diameter of nozzle 6 is 0.1 mm, and the inner diameter of nozzle 7 is 0.1 mm.
It is 0.5mm. 8 is an AgPd paste which is a conductive ink, and 9 is a ferrite paste which is an insulating ink. Ferrite paste 9 is 6.7% butyral resin powder + 3.3% di-n-butyl phthalate + 90
A paste of 60% acid powder in a vehicle of terpinol was added with 20% of a 45% solution of polyisocyanate in ethyl acetate.
ノズル６はAdPdペースト８をまず端子電極４
上に吐出し、その後AgPdgペースト８を吐出し
ながらフエライト板３上を略円形状に移動する。
ノズル７はノズル６の後方に一定の間隔を保ちな
がらノズル６と同様に略円形状に移動し、AgPd
ペースト８およびフエライト板３上にフエライト
ペースト９を吐出す。ノズル６、ノズル７が１回
の円を描くことによつて１ターンのコイルがフエ
ライト板３の上に形成され、その後所定のインダ
クタンスが得られる回数だけ略円運動を行ない、
AgPdペースト８とフエライトペースト９を積層
させる。AgPdペースト８によるコイルターンの
最終端は、端子電極５に接続される。 Nozzle 6 first applies AdPd paste 8 to terminal electrode 4.
Afterwards, it moves on the ferrite plate 3 in a substantially circular shape while discharging the AgPdg paste 8.
The nozzle 7 moves in a substantially circular shape like the nozzle 6 while maintaining a certain distance behind the nozzle 6, and the AgPd
Ferrite paste 9 is discharged onto paste 8 and ferrite plate 3. One turn of the coil is formed on the ferrite plate 3 by the nozzle 6 and the nozzle 7 drawing one circle, and then approximately circular motion is performed as many times as necessary to obtain a predetermined inductance.
AgPd paste 8 and ferrite paste 9 are laminated. The final end of the coil turn made of AgPd paste 8 is connected to terminal electrode 5.
所定のコイルパターンを形成したものを約900
℃で焼成するとチツプインダクタが得られる。第
３図はその平面図であり、第４図はその断面図で
ある。 Approximately 900 coils are formed into a specified coil pattern.
When fired at ℃, a chip inductor is obtained. FIG. 3 is a plan view thereof, and FIG. 4 is a sectional view thereof.
以上のように、本実施例では、絶縁基材として
フエライト板を用い、絶縁性インクとしてフエラ
イトペーストを用いたことにより、磁気シールド
効果をもつチツプインダクタが得られる。 As described above, in this embodiment, by using a ferrite plate as the insulating base material and using ferrite paste as the insulating ink, a chip inductor having a magnetic shielding effect can be obtained.
なお、絶縁基材、絶縁性インクは本実施例で示
したフエライト板、フエライトペーストに限定さ
れるものではなく、絶縁性が保たれ、ハンダデイ
ツプ、ハンダフロー時の熱に耐えられるものであ
ればよい。 Note that the insulating base material and insulating ink are not limited to the ferrite plate and ferrite paste shown in this example, but may be any material that maintains insulation and can withstand the heat during solder dip and solder flow. .
また、本実施例ではフエライト板を固定し、ノ
ズルを移動させてコイルパターンを得たが、これ
は逆にノズルを、フエライト板を移動させてもよ
い。 Further, in this example, the coil pattern was obtained by fixing the ferrite plate and moving the nozzle, but the nozzle and the ferrite plate may be moved conversely.
さらに、ノズルとしてパイプ状のものを用いた
がインクジエツトヘツドも用いることができる。 Furthermore, although a pipe-shaped nozzle is used, an ink jet head may also be used.
（発明の効果）
本発明によれば絶縁基材と一対のノズルとを相
対的に移動させ、一方のノズルから導電性インク
を、他方のノズルから絶縁性インクを各々連続的
に吐出してコイルパターンを得るように構成して
いるので、単一工程でコイルパターンの積層がで
き、印刷マスクは必要としないため、工程が簡単
で量産性に優れている大きな効果がある。(Effects of the Invention) According to the present invention, the insulating base material and the pair of nozzles are moved relatively, and the conductive ink is continuously ejected from one nozzle and the insulating ink is ejected from the other nozzle. Since the structure is configured to obtain a pattern, the coil patterns can be laminated in a single process, and a printing mask is not required, so the process is simple and has the great effect of being excellent in mass production.
第１図は従来のチツプインダクタの印刷積層工
程を示す図、第２図は本発明の一実施例によるチ
ツプインダクタの構成を概略的に示す断面図、第
３図は本発明の製造方法で得たチツプインダクタ
の平面図、第４図は同断面図である。
３……フエライト板、４，５……端子電極、６
……導電性インク吐出用ノズル、７……絶縁性イ
ンク吐出用ノズル、８……AgPdペースト、９…
…フエライトペースト。
FIG. 1 is a diagram showing the printing and lamination process of a conventional chip inductor, FIG. 2 is a sectional view schematically showing the structure of a chip inductor according to an embodiment of the present invention, and FIG. FIG. 4 is a plan view of the chip inductor, and FIG. 4 is a sectional view thereof. 3... Ferrite plate, 4, 5... Terminal electrode, 6
...Conductive ink ejection nozzle, 7...Insulating ink ejection nozzle, 8...AgPd paste, 9...
...Ferite paste.
Claims (1)
円形状に相対的に移動させ、前記ノズルの一方か
ら導電性インクを、前記絶縁基材上に連続的に吐
き出し、他方のノズルから、前記の吐出した導電
性インクおよび周辺の面上に絶縁性インクを連続
的に吐き出してコイルを形成することを特徴とす
るチツプインダクタの製造方法。 ２ 前記絶縁基材が磁性体であることを特徴とす
る特許請求の範囲第１項記載のチツプインダクタ
の製造方法。 ３ 前記絶縁性インクの主構成材料が磁性体であ
ることを特徴とする特許請求の範囲第１項記載の
チツプインダクタの製造方法。[Scope of Claims] 1. An insulating base material and at least one pair of nozzles are moved relative to each other in a substantially circular shape, and conductive ink is continuously discharged onto the insulating base material from one of the nozzles, and the other A method for manufacturing a chip inductor, comprising the step of continuously discharging insulating ink from a nozzle onto the discharged conductive ink and a surrounding surface to form a coil. 2. The method for manufacturing a chip inductor according to claim 1, wherein the insulating base material is a magnetic material. 3. The method of manufacturing a chip inductor according to claim 1, wherein the main constituent material of the insulating ink is a magnetic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6318584A JPS60208820A (en) | 1984-04-02 | 1984-04-02 | Production of chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6318584A JPS60208820A (en) | 1984-04-02 | 1984-04-02 | Production of chip inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60208820A JPS60208820A (en) | 1985-10-21 |
| JPH0572730B2 true JPH0572730B2 (en) | 1993-10-12 |
Family
ID=13221925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6318584A Granted JPS60208820A (en) | 1984-04-02 | 1984-04-02 | Production of chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60208820A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0658907A1 (en) * | 1993-12-14 | 1995-06-21 | Antenna Products Limited | Methods of manufacture of electrical components |
| KR100638725B1 (en) | 2005-02-23 | 2006-10-30 | 삼성전기주식회사 | Method for manufacturing planar passive device using soft magnetic ink printing |
| KR101038962B1 (en) | 2009-09-02 | 2011-06-03 | 주식회사 지오 | Method for forming sheet comprising layers of different materials as one in manufacturing chip type inductors |
-
1984
- 1984-04-02 JP JP6318584A patent/JPS60208820A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60208820A (en) | 1985-10-21 |
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