JPH0571155B2 - - Google Patents

Info

Publication number
JPH0571155B2
JPH0571155B2 JP60029038A JP2903885A JPH0571155B2 JP H0571155 B2 JPH0571155 B2 JP H0571155B2 JP 60029038 A JP60029038 A JP 60029038A JP 2903885 A JP2903885 A JP 2903885A JP H0571155 B2 JPH0571155 B2 JP H0571155B2
Authority
JP
Japan
Prior art keywords
fabric
warp
printed circuit
woven
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60029038A
Other languages
Japanese (ja)
Other versions
JPS61188992A (en
Inventor
Masaharu Yano
Kazuyoshi Takasago
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arisawa Mfg Co Ltd
Original Assignee
Arisawa Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arisawa Mfg Co Ltd filed Critical Arisawa Mfg Co Ltd
Priority to JP60029038A priority Critical patent/JPS61188992A/en
Publication of JPS61188992A publication Critical patent/JPS61188992A/en
Publication of JPH0571155B2 publication Critical patent/JPH0571155B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Treatment Of Fiber Materials (AREA)
  • Woven Fabrics (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

この発明は、ガラス織物の耳部をほつれ止めす
る際その耳部が織物地よりも耳高にならないプリ
ント基板用ガラス織物に係るものである。 本発明を添付図面を参照して詳述すると次の通
りである。 無杼織機によりプリント基板用ガラス織物を製
織する際プリント基板用織物の両側の耳部1の経
糸2を織地部経糸3よりも細い経糸を使用し、且
つ織地部4よりも経糸密度を高くして耳部1が織
地部4より薄いガラス織物5を製織し、この薄い
耳部1にほつれ防止剤6を耳部1が織地部4と略
同厚になるように塗布せしめる。 ほつれ防止剤は、プリント基板用の樹脂含浸時
に使用する溶剤に殆ど溶解しない、且つ含浸織物
の乾燥温度において軟化しない接着剤を採用す
る。 ほつれ防止剤の塗布は、上記耳部の切断前でも
切断後でもよく、塗布方法は溶液型塗布またはホ
ツトメルト型塗布等適宜都合の良い方法で行えば
良い。(図中二点鎖線が切断位置である。) ほつれ防止剤の塗布量は、細糸を使用した耳部
にほつれ防止剤をほつれ防止効果が充分に発揮で
きる量とし、且つほつれ防止剤を塗布した耳部の
厚さを織地部の厚さと実質的に同一厚さになるよ
うに樹脂量を選択する。 少し位薄くなることは許容出来るが厚くしな
い。 従来、無杼織機により製織したプリント基板用
ガラス織物には、例えば特開昭52−34094号に記
載されているように織物地部と同一構成である耳
部にほつれ防止剤を塗布し、乾燥後その耳部の外
端を切除してロール巻きする方法が開示されてい
る。 このような方法で製造した長尺のガラス織物を
ロール巻きにすると耳部が織物地よりも肉厚の為
捲回量が多くなればなる程耳高を生じる危険があ
り、耳部近くでシワや織地部の緯糸の目曲がりが
発生し、品質の低下をもたらす欠点があつた。 更に、ほつれ防止剤の塗布量をロール巻き時の
耳高が生じない程度に減ずれば、ほつれ防止効果
が不充分となり、織物のロール巻き時やその織物
に樹脂を含浸、乾燥する時に切断端部の経糸ほつ
れが発生し、ロールにからまつたり、或るいはプ
リプレグ中に混入したりする欠点があつた。 また、この従来の方法で製造したガラス織物に
ほつれ防止効果を充分に発揮できる量のほつれ防
止剤を塗布すると、プリプレグを所望の長さに切
断し積み重ねた時に耳高のためそれの中程が湾曲
し、自動機械による搬送上のトラブルを生じる欠
点があつた。 本発明は、このような欠点を解決したもので、
耳部の経糸は織地部の経糸よりも細く、且つ経糸
密度を高くするから耳部は必ず織物地よりも薄く
なる。 この薄くなつた耳部にほつれ防止剤を塗布する
から在来のように耳部が織地部より肉厚になるこ
とが防止され、所謂耳高による前記したような欠
点が全て是正されることになり、ガラス織物をロ
ール巻きする時、またガラス織物を基材としてプ
リプレグを製造する時のいずれに際しても、ほつ
れ防止の効果を充分に発揮でき且つ耳高による支
障を発生させないプリント基板用ガラス織物とな
る。 その上細い経糸が密に並べられているところに
ほつれ防止剤を塗布すれば太い経糸を並べている
場合よりも接着にあずかる表面積が大きくなるか
らそれだけ接着が良好となり、少ない樹脂量でも
確実にほつれ止め効果が得られることになる。 この為ほつれ止防止剤を塗布した部分を織地部
と同厚にすることも容易となる。 このように織地部と耳部とが同一厚のガラス織
物を使用してプリント基板を製造すればプリント
基板は必ず平らな基板にあるから銅箔を重ねた場
合でもその銅箔にシワが生じて不良品になること
などもなくなる等プリント基板用ガラス織物とし
て秀れた実用性を発揮する。 尚本発明のプリント基板用ガラス織物と、従来
の製品との対比測定表を提示する。 以下、実施例により本発明の具体化の諸態様を
説明するが、本発明はこれに限定されるものでは
ない。 実施例 プリント基板用ガラス織物を以下の方法で製織
した。 整経機で織地部用の経糸にECG751/0のヤーン
(EはEガラス、Cは長繊維、Gはモノフイラメ
ントの太さ751/0は番手である)を2172本、耳部
用の経糸にECG1501/0のヤーンを16本使用して
ワープービームに巻き取つた。 このワープービームを無杼織機に仕掛け、緯糸
にECG751/0のヤーンを使用して製織した。上記
織物を350℃で100時間ヒートクリーニングした
後、γ−グリシドオキシプロピルトリメトキシシ
ランの0.1%水溶液で処理乾燥した。 次で、前記織物の耳部の経方向に帯状のテレフ
タル酸−イソフタル酸−アジピン酸−1.4−ブタ
ンジオールの組成より成る共重合ポリエステル樹
脂で軟化点180°のほつれ防止剤を5%塩化メチレ
ン溶液で塗布乾燥した。 ほつれ防止剤の塗布幅は約6m/m、樹脂付着
量は6%であつた。 ほつれ防止剤塗布帯の中央付近をスリツターで
カツトした。 ほつれ防止効果を見るため、切断後の最端部の
経糸の引き剥がしをテストしたが目止め力が強
く、その経糸は切断した。 上記のように製造したほつれ防止剤を塗布した
プリント基板用ガラス織物の4000mを紙管にシヨ
アー硬度約80でロール巻きしたが、ほつれ及び耳
高、シワ、目曲がりなどは全く生じなかつた。 更に、上記織物にエポキシ樹脂を含浸・乾燥さ
せて樹脂含量37%のプリプレグを作製した。 比較例 次に比較例として、経糸、緯糸ともにECG75
1/0のヤーンを使用して織地部と耳部の構成が同
一であるガラス織物を無杼織機で製織した。 この織物の耳部に実施例と同一の方法でほつれ
防止剤を塗布しスリツターでカツトした。この織
物及び実施例と同一の方法で作製したプリプレグ
の各々の厚さを測定した。 以上の実施例と比較例とを対比した測定表は次
の通りである。
The present invention relates to a glass fabric for printed circuit boards in which the edges of the glass fabric do not become higher than the fabric when the edges of the glass fabric are prevented from fraying. The present invention will be described in detail with reference to the accompanying drawings. When weaving a glass fabric for printed circuit boards using a shuttleless loom, the warp threads 2 of the edges 1 on both sides of the fabric for printed circuit boards are thinner than the warp threads 3 of the woven fabric part, and the warp density is higher than that of the woven fabric part 4. A glass fabric 5 in which the selvedge part 1 is thinner than the woven fabric part 4 is woven, and a fraying preventive agent 6 is applied to the thin selvedge part 1 so that the selvedge part 1 has approximately the same thickness as the woven fabric part 4. As the anti-fray agent, an adhesive is used that hardly dissolves in the solvent used for impregnating the resin for printed circuit boards and does not soften at the drying temperature of the impregnated fabric. The anti-fray agent may be applied before or after cutting the ears, and may be applied by any convenient method such as solution type coating or hot melt type coating. (The two-dot chain line in the figure is the cutting position.) The amount of fray preventive agent to be applied is such that the fray preventive effect is sufficiently exerted on the ears where the thin thread is used, and the fray preventive agent is applied to the ears where the thin thread is used. The amount of resin is selected so that the thickness of the selvedge portion is substantially the same as the thickness of the fabric portion. I can tolerate it being a little thinner, but I don't want it to be thicker. Conventionally, glass fabrics for printed circuit boards woven using shuttleless looms have been coated with an anti-fray agent on the edges, which have the same structure as the textile fabric, as described in JP-A No. 52-34094, and then dried. A method is disclosed in which the outer ends of the ears are then cut off and rolled. When a long glass fabric manufactured by this method is rolled, the selvage part is thicker than the fabric, so the more the winding amount is, the higher the selvage is. However, the weft yarns in the woven fabric part were bent, resulting in a deterioration in quality. Furthermore, if the amount of anti-raveling agent applied is reduced to such an extent that no selvage occurs when the fabric is rolled, the anti-raveling effect will be insufficient, and the cut edges will be removed when the fabric is rolled or impregnated with resin and dried. There were disadvantages in that the warp threads frayed in some parts, got tangled in the rolls, or got mixed into the prepreg. Furthermore, if a sufficient amount of anti-fray agent is applied to the glass fabric manufactured by this conventional method to have a sufficient anti-fray effect, when the prepreg is cut to a desired length and stacked, the middle part of the prepreg will be cut due to the height of the edges. It had the disadvantage that it was curved and caused trouble when being transported by automatic machines. The present invention solves these drawbacks, and
The warp of the selvage is thinner than the warp of the woven fabric, and the warp density is increased, so the selvedge is always thinner than the woven fabric. By applying an anti-fray agent to this thinned selvage, it is possible to prevent the selvage from becoming thicker than the fabric part, which is the case in conventional fabrics, and all of the above-mentioned defects caused by the so-called high selvage can be corrected. A glass fabric for printed circuit boards that can fully exhibit the effect of preventing fraying and does not cause problems due to the height of the edges, both when winding the glass fabric into rolls and when producing prepreg using the glass fabric as a base material. Become. Furthermore, if an anti-fray agent is applied to areas where thin warp threads are closely arranged, the surface area available for adhesion will be larger than when thick warp threads are arranged, so the adhesion will be that much better, and even a small amount of resin will definitely prevent fraying. The effect will be obtained. For this reason, it is easy to make the part coated with the anti-fray agent the same thickness as the woven fabric part. In this way, if a printed circuit board is manufactured using a glass fabric with the same thickness for the fabric part and the edge part, the printed circuit board will always be a flat board, so even if copper foil is overlapped, there will be no wrinkles in the copper foil. It exhibits excellent practicality as a glass fabric for printed circuit boards, such as eliminating the possibility of defective products. A comparison measurement table between the glass fabric for printed circuit boards of the present invention and conventional products will be presented. Hereinafter, various embodiments of the present invention will be explained with reference to Examples, but the present invention is not limited thereto. Example A glass fabric for printed circuit boards was woven by the following method. Using a warping machine, 2172 ECG751/0 yarns (E is E glass, C is long fiber, G is monofilament thickness 751/0 is the count) are used as warp threads for the woven fabric part, and warp threads for the selvage part. 16 yarns of ECG1501/0 were used to wind the warp beam. This warp beam was mounted on a shuttleless loom and woven using ECG751/0 yarn for the weft. The fabric was heat cleaned at 350° C. for 100 hours, then treated with a 0.1% aqueous solution of γ-glycidoxypropyltrimethoxysilane and dried. Next, a band-shaped copolyester resin having a composition of terephthalic acid, isophthalic acid, adipic acid, and 1,4-butanediol, and an anti-fray agent having a softening point of 180° are added in a 5% methylene chloride solution in the warp direction of the selvage of the fabric. It was coated and dried. The coating width of the anti-raveling agent was approximately 6 m/m, and the amount of resin deposited was 6%. A slitter was used to cut the area near the center of the anti-raveling agent coated band. In order to see the effect of preventing fraying, we tested peeling off the warp at the end after cutting, but the sealing force was strong and that warp was cut. When 4,000 m of the glass fabric for printed circuit boards coated with the anti-fray agent produced as described above was rolled around a paper tube with a Shore hardness of approximately 80, no fraying, selvage height, wrinkles, or bending of the edges occurred. Furthermore, the fabric was impregnated with an epoxy resin and dried to produce a prepreg with a resin content of 37%. Comparative example Next, as a comparative example, both warp and weft are ECG75.
A glass fabric having the same construction of the fabric part and the selvage part was woven using a shuttleless loom using 1/0 yarn. An anti-fray agent was applied to the edges of this fabric in the same manner as in the example, and the fabric was cut with a slitter. The thickness of each of this woven fabric and prepreg produced by the same method as in the example was measured. A measurement table comparing the above examples and comparative examples is as follows.

【表】 尚ほつれ防止剤の樹脂含量6%、エポキシ樹脂
含量39%である。
[Table] The resin content of the anti-fray agent is 6% and the epoxy resin content is 39%.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の一実施例を示すもので、第1図
は半製品一部の斜視図、第2図は耳部の拡大断面
図、第3図は製品一部の斜視図である。 1……耳部、2……経糸、3……織地部経糸、
4……織地部、5……ガラス織物、6……ほつれ
防止剤。
The drawings show one embodiment of the present invention; FIG. 1 is a perspective view of a part of a semi-finished product, FIG. 2 is an enlarged sectional view of a lug, and FIG. 3 is a perspective view of a part of a product. 1...Selvage part, 2...Warp thread, 3...Fabric part warp thread,
4... Textile portion, 5... Glass fabric, 6... Anti-raveling agent.

Claims (1)

【特許請求の範囲】[Claims] 1 無杼織機によりプリント基板用ガラス織物を
製織する際プリント基板用織物の両側の耳部の経
糸を織地部経糸よりも細い経糸を使用し、且つ織
地部よりも経糸密度を高くして耳部が織地部より
薄いガラス織物を製織し、この薄い耳部にほつれ
防止剤を耳部が織地部と略同厚になるように塗布
せしめたことを特徴とするプリント基板用ガラス
織物。
1. When weaving glass fabric for printed circuit boards using a shuttleless loom, the warp for the edges on both sides of the fabric for printed circuit boards is thinner than the warp for the woven fabric, and the density of the warp is higher than that for the woven fabric. 1. A glass fabric for a printed circuit board, characterized in that a glass fabric is woven thinner than a woven fabric part, and an anti-fray agent is applied to the thin edge part so that the edge part has approximately the same thickness as the woven fabric part.
JP60029038A 1985-02-16 1985-02-16 Glass fabrics for printed circuit board Granted JPS61188992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60029038A JPS61188992A (en) 1985-02-16 1985-02-16 Glass fabrics for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60029038A JPS61188992A (en) 1985-02-16 1985-02-16 Glass fabrics for printed circuit board

Publications (2)

Publication Number Publication Date
JPS61188992A JPS61188992A (en) 1986-08-22
JPH0571155B2 true JPH0571155B2 (en) 1993-10-06

Family

ID=12265229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60029038A Granted JPS61188992A (en) 1985-02-16 1985-02-16 Glass fabrics for printed circuit board

Country Status (1)

Country Link
JP (1) JPS61188992A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2613144B2 (en) * 1991-10-18 1997-05-21 日東紡績株式会社 Tuck-in treated low elongation fiber fabric

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4930656A (en) * 1972-07-20 1974-03-19
JPS5234094A (en) * 1975-09-12 1977-03-15 Asahi Shiyueeberu Kk Prodvction of glass cloth tape

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4930656A (en) * 1972-07-20 1974-03-19
JPS5234094A (en) * 1975-09-12 1977-03-15 Asahi Shiyueeberu Kk Prodvction of glass cloth tape

Also Published As

Publication number Publication date
JPS61188992A (en) 1986-08-22

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