JPH057101A - Package for electronic circuit - Google Patents

Abstract

PURPOSE:To make the waveguide mode unremarkable in the package by providing a resistance layer to the inner face of the package. CONSTITUTION:An upper part of a package 1 for an electronic circuit in which a microwave semiconductor circuit 4 is contained is closed by an upper cover 2. A metallic coating 10, a dielectric coating 9 and a resistance layer film 8 made of a resistance layer are laminated to the inner face of the cover 2. A current flowing to the inside of the package is attenuated by the waveguide mode arisen by the film to eliminate the waveguide mode. As a result, the package for the electronic circuit in which the waveguide mode is eliminated is avoided. Furthermore, a secular characteristic deterioration is prevented through the configuration in which a rubber absorbing body using ferrite powder as a raw powder is not required to be coated on the upper cover.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a container for electronic circuits, for example, a container for microwave semiconductor circuits used for satellite communication, terrestrial microwave communication, radar and the like.

[0002]

2. Description of the Related Art In recent years, semiconductor elements such as FETs and transistors have been improved in performance, and amplifiers using these elements,
Microwave semiconductor devices such as oscillators and mixers have been put to practical use. In these amplifiers, oscillators, mixers and the like, a container with a lid is generally used to protect semiconductors and the like.

FIG. 5 shows, for example, JP-A-62-109403.
FIG. 6 is a configuration diagram of a conventional microwave semiconductor circuit container shown in FIG. In the figure, 1 is a container, 2 is an upper lid, 3 is an insulating substrate, 4 is a microwave semiconductor circuit, 5 is an input terminal, 6
Is an output terminal, and 7 is a bias terminal. The container 1 and the lid 2 are made of metal. An insulating substrate 3 is mounted on the bottom surface of the container 1, and an input terminal 5, an output terminal 6 and a bias terminal 7 are provided on the side surface. A microwave circuit 4 is formed on the surface of the insulating substrate 3. In addition, the microwave semiconductor circuit is protected by covering the entire surface of the microwave semiconductor circuit 4 with the container 1 and the upper lid 2 mounted on the upper surface of the container 1 by soldering or the like.

Next, the operation will be described. In order to prevent the container 1 from affecting the microwave semiconductor circuit 4, the lateral width of the container 1 is selected so that the cutoff frequency is sufficiently higher than the working frequency. Thus, the cutoff frequency of the container is sufficiently higher than the working frequency. Since it is selected, the microwave incident from the input terminal 5 is amplified, attenuated or modulated by the microwave semiconductor circuit 4 without being affected by the container,
It is output from the output terminal 6. A desired bias is applied from the bias terminal 7.

[0005]

Generally, the lateral width of the container 1 is selected as described above, but depending on the microwave semiconductor circuit 4, the cutoff frequency determined by the lateral width of the container 1 may not be sufficiently higher than the operating frequency. In such a case, there is a problem that a waveguide mode is set up inside the container 1 and the upper lid 2 and the characteristics of the microwave semiconductor circuit are deteriorated. To avoid this, a rubber-like absorber made of ferrite powder is attached to the upper lid 2 by using an adhesive or the like. There is a problem that it may be peeled off from the top cover 2 or that ferrite powder may adhere to the semiconductor or the like to deteriorate the characteristics or damage it.

The present invention has been made to solve the above problems, and an object thereof is to obtain an electronic circuit container which does not affect an electronic circuit such as a microwave semiconductor circuit housed inside. To do.

[0007]

An electronic circuit container such as a microwave semiconductor circuit according to the present invention has a resistance layer such as a resistance coating provided on the inner surface of the container.

[0008]

In the container for electronic circuits such as the microwave semiconductor circuit according to the present invention, the current flowing through the inner surface of the container due to the standing of the waveguide mode is attenuated by the resistance layer such as the resistance coating provided inside the container to guide the wave. Tube mode is gone.

[0009]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing an embodiment of a microwave semiconductor circuit container according to the present invention. 8 is a resistance film which is an example of a resistance layer, 9 is a dielectric substrate, and 10 is a metal film. W is the thickness of the dielectric substrate. The resistance coating 8 is provided on the surface of the dielectric substrate 9, and the dielectric substrate 9 is covered with the upper lid 2.
A metal coating 10 is provided on the back surface of the dielectric substrate 9 so that it can be soldered to the.

When the cutoff frequency determined by the width of the container 1 cannot be set to be sufficiently higher than the operating frequency, the container 1
A waveguide mode stands inside, and a current flows through the inner surface of the container as indicated by the arrow in the perspective view of FIG. Here, by mounting the dielectric substrate 9 configured as described above on the upper lid 2, a current flows through the container inner surfaces of the upper lid 2 and the dielectric 9 as indicated by the arrow in the cross-sectional view of FIG. Then, the current is attenuated by the resistance coating 8 provided on the surface of the dielectric substrate 9. As a result, the attenuation of the current and the attenuation of the magnetic field occur synergistically, and the waveguide mode is lost in the container, and the microwave semiconductor circuit 4 operates without being adversely affected by the container. It should be noted that the dielectric substrate 9 is used because the resistance film 8 and the metal film 1 are formed on the dielectric substrate 9.
This is because it is easy and inexpensive to form 0. Therefore, the thickness W of the dielectric substrate 9
Is preferably as thin as possible so that an electric current having a property of transmitting on the inner surface of the container exceeds the thickness W and easily flows to the resistance film 8 side.

As described above, the microwave semiconductor container using the dielectric substrate 9 having the resistance coating 8 on the front surface and the metal coating 10 on the back surface uses the rubber-like absorber made of ferrite powder. It has the same electrical effect as the microwave semiconductor circuit container.

However, the dielectric substrate 9 has a metal coating 1 on the back surface.
Since 0 is provided and can be attached with solder when attaching to the upper lid 2, it is not necessary to use the adhesive that was used when attaching a rubber-like absorber in the past, and the adhesive will be attached over the years. The strength is weakened so that the absorber is peeled off from the upper lid 2, and since the absorber made of ferrite is not used, the ferrite powder does not adhere to the semiconductor or the like and the characteristics are not deteriorated or damaged.

Further, since the waveguide mode is not lost in the container 1, the width of the container 1 can be selected without considering the cutoff frequency determined by the width of the container 1.
The container can be of any size.

Example 2. FIG. 2 is a configuration diagram of another embodiment of the upper lid 2 of the microwave semiconductor circuit container according to the present invention.
The resistance coating 8 is directly formed on the upper lid 2 by vapor deposition or the like. As described above, when the resistance coating 8 is directly formed on the inner surface of the upper lid 2, the thickness W of the dielectric substrate 9 described in the first embodiment is lost, and the current transmitted through the inner surface of the container easily flows through the resistance coating 8. The effect of the resistance coating 8 is increased.

Example 3. FIG. 3 is a view showing another embodiment of the upper lid 2, in which the shape of the resistance coating 8 is changed.
Since the current flows toward the center of the upper lid, this is an example in which the resistive film 8 is formed in a band shape so as to block the current toward the center.

Example 4. FIG. 4 is a constitutional view of another embodiment of the microwave semiconductor circuit container of the present invention. This container is provided with a resistance coating on the metal side surface inside the container. In this way, the resistance coating may be directly provided on the metal side surface inside the container. Further, the portion where the resistance film is provided may be provided not only on one side surface but also on the other side surface, and may be provided anywhere where a current flows.

Embodiment 5. In the above Examples 1 to 4,
Although the container for the microwave semiconductor circuit has been described as an example,
The present invention is not limited to the case of accommodating the microwave semiconductor circuit, but may be an electronic circuit container accommodating other electronic circuits.

[0018]

As described above, according to the present invention, a resistance layer such as a resistance coating is provided inside a container for an electronic circuit such as a container for a microwave semiconductor circuit in which a waveguide mode stands. , The electronic circuit that does not have a bad influence on the electronic circuit such as microwave semiconductor circuit because the rubber-like absorber made of ferrite powder and the adhesive used for mounting it are no longer needed. A container for use can be obtained. Further, since the waveguide mode does not stand in the container, the lateral width of the container can be selected without considering the cutoff frequency determined by the lateral width of the container, and the container can be freely sized.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of a microwave semiconductor circuit container according to the present invention.

FIG. 2 is a configuration diagram of another embodiment of the microwave semiconductor circuit container of the present invention.

FIG. 3 is a structural view of another embodiment of the microwave semiconductor circuit container of the present invention.

FIG. 4 is a structural view of another embodiment of the microwave semiconductor circuit container of the present invention.

FIG. 5 is a configuration diagram of a conventional microwave semiconductor circuit container.

[Explanation of symbols]

 1 Container 2 Top Lid 3 Insulating Substrate 4 Microwave Semiconductor Circuit 5 Input Terminal 6 Output Terminal 7 Bias Terminal 8 Resistive Film 9 Dielectric Film 10 Metal Film

Claims (1)

Claim: What is claimed is: 1. An electronic circuit container for accommodating an electronic circuit such as a microwave semiconductor circuit, wherein a resistance layer is provided on the inner surface of the container.