JPH0567485A - Socket contact and socket for pin grid array type lsi - Google Patents

Abstract

PURPOSE:To install an input/output pin easily/reliably without causing buckling to the input/output pin or without causing damage to a contact point part in a socket contact to keep the input/output pin for LSI under an electrically continuing condition. CONSTITUTION:A socket contact 1 is formed of a coil spring constituted in such a way that the upper part is formed in an extension coil spring 1a, and the lower part is also formed in a compression coil spring 1b, and a small diameter operation part 1c is provided in the intermediate section.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket contact for holding an input / output pin of an LSI and a socket for a pin grid array type LSI. The present invention relates to a socket contact capable of easily mounting an input / output pin of an LSI while preventing damage to the contact as much as possible, and a pin grid array type LSI socket using this socket contact.

[0002]

2. Description of the Related Art Conventionally, a pin grid array type LSI
A socket having the configuration shown in FIGS. 6 and 7 is known as a power socket (hereinafter abbreviated as PGA socket).

In the figure, reference numeral a designates a box-shaped housing having a plurality of guide holes b through which the input / output pins 3 of a pin grid array type LSI (hereinafter simply referred to as LSI) 2 are inserted. Inside the housing a, cylindrical socket contacts c having a bottom are provided at positions corresponding to the respective guide holes b.

Inside the socket contact c, as shown in FIG. 7, there is provided a cylindrical inner contact d having a pencil-like lower end, and the LSI 2 is inserted into the inner contact d. The output pin 3 is inserted, and the lower end of the inner contact d clamps and fixes the input / output pin 3.

A contact pin e is integrally projectingly provided at the center of the bottom portion of the socket contact c, and the tip end portion thereof projects from the lower surface of the housing a. As shown in FIG. 7, this contact pin e is connected to the printed board 4 by inserting it into a through hole of the printed board 4.

The socket contact c, the inner contact d, and the contact pin e are all made of a conductive material, and the input / output pin 3 is connected via the inner contact d, the socket contact c, and the contact pin e. And a printed wiring (not shown) of the printed circuit board 4 are connected.

[0007]

However, the PGA socket having such a structure receives a high load from the inner contact d when the input / output pin 3 is inserted into the socket contact c or when the input / output pin 3 is pulled out. , Requires a considerable amount of mounting force or pulling force. For this reason,
There arises a problem that a dedicated insertion / extraction tool is required, the input / output pin 3 and the inner contact d are strongly rubbed with each other, and the plating of the input / output pin 3 and the inner contact d is peeled off.

Further, due to the miniaturization of the pin diameter accompanying the recent increase in density of LSI, the strength of the pin is weakened. Therefore, in a severe case, the pin may buckle when the input / output pin is inserted. is there.

The present invention has been made in view of the above problems, and the input / output pins of an LSI can be mounted easily and reliably without causing buckling of the input / output pins or damage to the contact portions. Socket contact and pin grid array type LSI using this socket contact
The purpose is to provide a socket for use.

[0010]

In order to achieve the above object, the socket contact of the present invention has an upper part formed of a tension coil spring and a lower part formed of a compression coil spring, and has a small diameter in the middle part. It is configured by a coil spring having a formed action portion.

Further, the pin grid array type LSI socket of the present invention comprises a box-shaped housing having a plurality of guide holes formed in the upper wall through which the input / output pins of the pin grid array type LSI are inserted. Pin grid array type LS
A fixing means for fixing I on the upper surface of the housing, and the socket contact according to claim 1 arranged below each guide hole in the housing.

[0012]

Operation: The socket contact having the above structure is LS
When the I / O pin is attached, the I / O pin is inserted into the upper tension coil spring portion, and the tip of the I / O pin is brought into contact with the action portion formed with a small diameter, and this is pressed to press the lower compression coil spring portion. Is compressed and the upper tension coil spring portion is extended, the upper tension coil spring portion is reduced in diameter with the extension, and the input / output pin is clamped and fixed.

When the input / output pin is removed, the pressed state of the input / output pin is released, whereby the lower compression coil spring portion and the upper tension coil spring portion elastically return,
The upper tension coil spring portion expands its diameter to release the pinned and fixed state of the input / output pin, and the lower compression coil spring portion pushes up the input / output pin.

Therefore, according to this contact socket, when the input / output pin is mounted, it is sufficient to press the LSI with a force that can compress the lower compression coil spring portion, and when the input / output pin is removed, L
When the pressed state of SI is released, the fixed state of the input / output pin is automatically released. Therefore, it is possible to easily attach / detach the input / output pins without the need for a dedicated insertion / extraction tool.

Further, when the input / output pins are attached / detached, the pin surface is not rubbed or an unnecessary load is not applied to the pins. Therefore, the plating on the pin surface is peeled off at the time of attachment / detachment.
The pin does not buckle.

Further, the pin grid, which has the above-mentioned structure,
Array type LSI socket (PGA socket) is LS
By inserting the I / O pin into the guide hole and pressing the LSI, and fixing the LSI on the housing by the fixing means in this state, the coil spring is provided below each guide hole in the housing. The socket contact holds and fixes the input / output pin in the conductive state by the above-described operation.

When the LSI is removed, the LS is fixed by releasing the fixing state of the LSI by the fixing means.
The socket contact, which holds the I / O pin in between, is released from the fixed state by the above operation, and the LSI is brought into the non-fixed state.

Therefore, according to this PGA socket, when the LSI is mounted, the input / output pins of the LSI are inserted into the guide holes to press the LSI, and in this state L
The SI may be fixed on the housing by a fixing means,
When removing the LSI, use the fixing means
The fixed state of should be released. Therefore, it is possible to easily attach / detach the LSI without the need for a dedicated insertion / removal tool.

Further, since the socket contact composed of the coil spring is used as the socket contact for fixing the input / output pin of the LSI to the conductive state, the surface of the input / output pin is rubbed when the LSI is attached / detached, and the pin is unnecessary. No load is applied, and therefore the plating on the pin surface does not peel off or the pin does not buckle when it is attached or detached.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2A and 2B show a contact socket according to an embodiment of the present invention. As shown in FIG. 1, the socket contact 1 is formed by winding one metal wire. It is composed of a coil spring, and the upper part 1a thereof is a tension coil spring and the lower part 1a.
b is a compression coil spring. And the intermediate portion 1c
Is formed with an action portion wound in a small diameter.

The tension coil spring portion 1a is a socket portion into which the input / output pin 3 of the LSI is inserted, and its inner diameter is large enough to insert the input / output pin 3 into the coil without rubbing it. Is formed. Further, one end of the metal wire forming the coil spring extends in the tangential direction of the coil from the upper end of the tension coil spring portion 1a to form a locking end portion 1d.

The compression coil spring portion 1b is formed to have a slightly larger diameter than the tension coil spring portion 1a, and the other end of the metal wire forming the coil spring extends from the lower end portion thereof along the axial direction of the coil. To form a contact pin portion 1e connected to a printed circuit board or the like.

The operating portion 1c is formed to have a small diameter so that the input / output pin 3 cannot pass therethrough, and the tip of the input / output pin 3 inserted into the tension coil spring portion 1a abuts on the operating portion 1c. It has become.

The tension coil spring portion 1a, the acting portion 1c, and the compression coil spring portion 1b are formed so that their axes coincide with each other.

Next, the operation of the socket contact 1 will be described. The socket contact 1 is used in a state in which the locking end portion 1d and the lower end portion of the compression coil spring portion 1d or the contact pin portion 1e are fixed, respectively.
Is held in a conductive state, the tension coil spring portion 1
The I / O pin 3 of the LSI is inserted into the inside of a and pressed.

At this time, as shown in FIGS. 1 and 2 (A), the tip of the input / output pin 3 abuts on the acting portion 1c, and the input / output pin is further pressed from this state, so that FIG. 2 (B) is obtained. As shown in, the compression coil spring portion 1b is compressed and the tension coil spring portion 1a extends. In this way, the extension of the tension coil spring portion 1a reduces the inner diameter of the extension coil spring portion 1a to clamp and fix the input / output pin 3 inserted therein.

When the pinching and fixing state of the input / output pin 3 is released and the input / output pin 3 is removed from the socket contact 1, the pressing state of the input / output pin 3 is released so that the compression coil spring portion 1a and the tension portion are pulled. Coil spring part 1b
Elastically recovers, the upper tension coil spring portion 1a expands in diameter to release the pinned and fixed state of the input / output pin 3, and the lower compression coil spring portion 1b pushes up the input / output pin.
As a result, the input / output pin 3 is in a freely detachable state (the state shown in FIGS. 1 and 2A).

Therefore, according to this contact socket 1, when the input / output pin 3 is mounted, L is applied with a force sufficient to compress the lower compression coil spring portion 1b.
It suffices to press SI, and when the input / output pin 3 is removed, if the pressed state of the LSI is released, the fixed state of the input / output pin 3 is automatically released. For this reason, a dedicated insertion / extraction tool is not required when attaching / detaching the input / output pin 3.
Can be easily attached and detached.

Further, when the input / output pin 3 is attached or detached, the surface of the pin 3 is not rubbed or an unnecessary load is not applied to the pin. Therefore, the plating on the surface of the pin 3 is peeled off at the time of attachment or detachment, or the pin is removed. There is no chance that 3 will buckle.

Next, a pin grid array type LSI socket (PGA) using this socket contact 1
Socket). 3 to 5 show a PGA socket according to an embodiment of the present invention.
As shown in FIG. 3, the GA socket includes a rectangular box-shaped housing 7, the socket contact 1 arranged in the housing 8, and a pair of fixing levers 7 and 7 for fixing the LSI 2. Become.

As shown in FIGS. 3 and 5, the housing 8 has a square block-shaped base housing 5 in which a large number of socket receiving grooves 9 are formed in a lattice shape, and a large number of guide holes 10 in a lattice shape. Square plate cover housing 6
And the socket receiving groove 9 and the guide hole 10
The cover housing 6 is fixed on the base housing 8 so that and communicate with each other.

The socket contacts 1 are arranged in the socket receiving grooves 9 of the housing 8, respectively. Here, as shown in FIG. 5, a part of the inner surface of the upper end portion of the socket accommodation groove 9 is notched so that the notch groove 11 is formed.
Is formed, and a contact pin insertion hole 12 is formed at the center of the bottom. The contact socket 1 arranged in the socket accommodating groove 9 has the engaging end portion 1d engaged with the cutout groove 11, and the contact pin portion 1e has the contact pin insertion hole 12 therein. The front end of the housing 8 projects from the lower wall of the housing 8.

As shown in FIG. 3, the fixing levers 7, 7 are formed by projecting locking projections 7a along the lengthwise direction on the lateral rod portion of the staple lever body. The fixing levers 7 and 7 are axially attached to both ends of the housing 8 at the ends of the respective vertical rods so that the locking projections 7a and 7a of the fixing levers 7 and 7 face each other. Is becoming

Next, the usage and operation of this PGA socket will be described. In this PGA socket, as shown in FIGS. 4 and 5, the contact pin 1e is inserted into the through hole of the printed circuit board 4 and the printed circuit board 4 is inserted.
Then, by fixing the LSI 2 to the PGA socket, the input / output pin 3 of the LSI 2 and the printed wiring (not shown) of the printed board 4 are connected.

In this case, when mounting the LSI 2, first, the fixing levers 7, 7 of the PGA socket are respectively rotated outward, and the input / output pin 3 of the LSI 2 is inserted into the guide hole 10 of the housing 8, The LSI 2 is pressed to clamp and fix the input / output pin 3 in the socket contact 1 arranged in the socket accommodating groove 9 of the housing 8. The operation of sandwiching and fixing the input / output pin 3 by the socket contact 1 at this time is the same as the operation described with reference to FIGS. 2 (A) and 2 (B), and therefore the description thereof is omitted.

Then, in this state, both fixing levers 7 and 7 are rotated inward so that the respective locking protrusions 7a and 7a are LSI.
The LSI 2 is fixed on the PGA socket by engaging with the upper surface of 2 (see FIG. 4). As a result, the input / output pin 3 of the LSI 2 is held in a state of being sandwiched and fixed to the socket contact 1, and the input / output pin 3 of the LSI 2 is connected to the printed wiring of the printed circuit board 4 via the socket contact 1.

When the LSI 2 is detached from the PGA socket, the fixing levers 7 and 7 are rotated outward to release the fixing state of the LSI 2 by the fixing levers 7 and 7 so that the input / output pins of the LSI 2 are released. The socket contact 1 that was sandwiching and fixing 3 in FIG.
By the operation described with reference to (B), the fixed state is released, and the LSI 2 and its input / output pin 3 become the non-fixed state.

Therefore, according to this PGA socket, when the LSI 2 is mounted, the input / output pin 3 of the LSI 2 is inserted into the guide hole 10 and the LSI 2 is pressed,
In this state, the LSI 2 is fixed to the housing 8 by the fixing levers 7 and 7.
It may be fixed on the upper side, and when the LSI 2 is removed, the fixing levers 7 and 7 may be rotated outward to release the fixed state of the LSI 2. Therefore, the LSI 2 can be easily attached and detached without the need for a dedicated insertion / extraction tool.

Further, since the socket contact 1 made of the coil spring is used as the socket contact for fixing the input / output pin 3 of the LSI 2 in the conductive state, the LS
When I2 is attached or detached, the surface of the input / output pin 3 rubs, or the pin 3
No unnecessary load is applied to the pin 3, and therefore, the plating on the surface of the pin 3 does not peel off or the pin 3 buckles when the pin 3 is attached or detached.

The socket contact and the pin grid array type LSI socket of the present invention are not limited to the above embodiments. For example, in the pin-grid-array type LSI socket of the above embodiment, a pair of fixing levers 7 and 7 having locking projections 7a are used as means for fixing the LSI 2 on the housing 8, but a belt is used. Other fixing means may be adopted, and other configurations may be variously modified without departing from the gist of the present invention.

[0041]

As described above, according to the socket contact of the present invention, it is possible to easily attach / detach the input / output pins of the LSI without using a special insertion / extraction tool. In addition, when the I / O pin is attached / detached, the pin surface is not rubbed or an unnecessary load is not applied to the pin. Therefore, when the I / O pin is attached / detached, the plating on the pin surface is not peeled off and the pin is not buckled. ..

Therefore, according to the pin grid array type LSI socket of the present invention using this socket contact, the attachment / detachment work of the LSI can be easily performed without damaging the input / output pins of the LSI.

[Brief description of drawings]

FIG. 1 is a front view showing a socket contact according to an embodiment of the present invention.

2 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 2B is a cross-sectional view showing a state where an input / output pin of an LSI is sandwiched and fixed to the socket contact.

FIG. 3 is a partially cutaway perspective view showing a pin grid array type LSI socket according to an embodiment of the present invention.

FIG. 4 is a front view showing a state in which an LSI is mounted in the pin grid array type LSI socket.

FIG. 5 is an enlarged cross-sectional view showing a socket contact portion showing a state in which an LSI is mounted in the pin grid array type LSI socket.

FIG. 6 is a partially cutaway perspective view showing a conventional pin grid array type LSI socket.

FIG. 7 is an enlarged sectional view showing a socket contact portion showing a state in which an LSI is mounted on a conventional pin grid array type LSI socket.

[Explanation of symbols]

 1 socket contact 1a tension coil spring part 1b compression coil spring part 1c working part 2 pin grid array type LSI (LSI) 3 input / output pin 4 printed circuit board 5 base housing 6 cover housing 7 fixing lever (fixing means) 8 housing 9 socket accommodating Groove 10 Guide hole

Claims (2)

[Claims] 1. A socket contact for holding an input / output pin of an LSI in a conductive state, wherein an upper part is formed of a tension coil spring, a lower part is formed of a compression coil spring, and a small diameter is formed in an intermediate part. A socket contact comprising a coil spring having an activated portion. 2. A pin grid array type LSI on the upper wall
Box-shaped housing having a large number of guide holes through which the I / O pins are inserted, fixing means for fixing the pin grid array type LSI on the upper surface of the housing, and below the guide holes in the housing. Claim 1 arranged in
A socket for a pin grid array type LSI, comprising the socket contact described above.