JP2555612B2 - LSI socket - Google Patents

LSI socket

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Publication number
JP2555612B2
JP2555612B2 JP62179520A JP17952087A JP2555612B2 JP 2555612 B2 JP2555612 B2 JP 2555612B2 JP 62179520 A JP62179520 A JP 62179520A JP 17952087 A JP17952087 A JP 17952087A JP 2555612 B2 JP2555612 B2 JP 2555612B2
Authority
JP
Japan
Prior art keywords
contact
spring
lsi
hole
cover member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62179520A
Other languages
Japanese (ja)
Other versions
JPS6422053A (en
Inventor
毅 奥山
英夫 宮澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62179520A priority Critical patent/JP2555612B2/en
Publication of JPS6422053A publication Critical patent/JPS6422053A/en
Application granted granted Critical
Publication of JP2555612B2 publication Critical patent/JP2555612B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】 〔概 要〕 大規模集積回路(以下「LSI」という)等をプリント
基板に着脱自在に接続する際に使用されるソケットに係
り、特に端子密度が高く多端子数のLSIが容易に接続可
能なLSIソケットに関し、 PGA(Pin Grid Array)構成の信号ピン配列を有するL
SIを押し付けるだけで接続できるLSIソケットを提供す
ることを目的とし、 中心部から外周部へ向かって高くなる複数段のステッ
プが形成されたベース部材と、 前記ステップの各段に嵌合するスペーサ部材と、 上端に接触部と、下側にレバー部と、中間に抜止め部
とが形成された略棒状のコンタクトと、 前記コンタクトを先端で載置する水平ばね部と端子部
とからなるL字形状のばね部材と、 コンタクトを変位自在にガイドするカバー部材および
ガイド部材と、 前記カバー部材に回転自在に保持される締結手段とを
少なくとも具備し、 上記ベース部材と上記カバー部材との間に、順次積層
されて、前記ばね部材の水平ばね部が前記スペーサ部材
により狭持され、 さらに前記コンタクトの抜止め部が前記ガイド部材と
前記カバー部材とで変位可能に狭持されて構成される。
DETAILED DESCRIPTION OF THE INVENTION [Overview] The present invention relates to a socket used for detachably connecting a large-scale integrated circuit (hereinafter referred to as “LSI”) or the like to a printed circuit board. Regarding an LSI socket that can be easily connected to an LSI, L that has a signal pin arrangement of PGA (Pin Grid Array) configuration
For the purpose of providing an LSI socket that can be connected simply by pressing SI, a base member having a plurality of steps that rise from the central part to the outer peripheral part, and a spacer member that fits in each step of the steps An L-shaped contact consisting of a contact portion at the upper end, a lever portion at the lower side, a substantially rod-shaped contact having a retaining portion in the middle, a horizontal spring portion for mounting the contact at the tip, and a terminal portion. At least a spring member having a shape, a cover member and a guide member for movably guiding the contact, and a fastening unit rotatably held by the cover member, and between the base member and the cover member, The spring members are sequentially laminated, the horizontal spring portion of the spring member is sandwiched by the spacer member, and the retaining portion of the contact is displaced between the guide member and the cover member. It is sandwiched as much as possible.

〔産業上の利用分野〕[Industrial applications]

本発明はLSI等をプリント基板に着脱自在に接続する
際に使用されるソケットに係り、特に端子密度が高く多
端子数のLSIが容易に接続可能なLSIソケットに関する。
The present invention relates to a socket used when detachably connecting an LSI or the like to a printed circuit board, and particularly to an LSI socket having a high terminal density and capable of easily connecting a large number of LSIs.

近時、LSIの高集積化が進み、大型汎用コンピュータ
のCPUのゲート回路用等では、入出力用の信号ピンの数
は数百端子に、またピン間隔も50MIL(1.27mm)から25M
IL(0.675mm)にも達するものが用いられるようになっ
た。かかる多端子、高密度のLSIの試験やバーンイン等
の際、信号ピンに損傷を与えることなく、容易に多端子
の接続、分離が可能なLSIソケットに対する要求が強
い。
In recent years, high integration of LSIs has progressed, and for large-scale general-purpose computer CPU gate circuits, etc., the number of signal pins for input and output is several hundred, and the pin interval is 50 MIL (1.27 mm) to 25 M.
Those that reach IL (0.675 mm) have come to be used. There is a strong demand for an LSI socket capable of easily connecting and disconnecting multiple terminals without damaging signal pins during testing or burn-in of such multiple terminals and high-density LSI.

〔従来の技術〕[Conventional technology]

従来のこの種のLSI用ソケットとしては、信号ピンの
外周部を直径方向に押圧する接触部を備えたコンタクト
(接触子)の接触圧を弱くして、ソケット本体に多数個
植設し、LSI信号のピンの一個当たりの挿抜力を小さく
して、LSIを上方から差し込むように低挿抜力方式のソ
ケットがある。
In this type of conventional LSI socket, the contact pressure of the contact (contactor) having the contact portion that presses the outer peripheral portion of the signal pin in the diameter direction is weakened, and a large number of LSIs are implanted in the socket body. There is a low insertion / removal type socket that inserts and removes the signal pin from each pin so that the LSI can be inserted from above.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

上記従来のLSIソケットでは、コンタクトの軸と垂直
方向にばねをたわませた接触圧を発生させるため、コン
タクトの断面の占有面積をあまり小さくできず、従って
高密度の端子配列を実現することが困難であった。
In the above-mentioned conventional LSI socket, since the contact pressure generated by bending the spring in the direction perpendicular to the axis of the contact is generated, the area occupied by the cross section of the contact cannot be reduced so much, and thus a high-density terminal arrangement can be realized. It was difficult.

また良好な電気的接続を形成するためには、ある程度
の接触圧以上にする必要があり、従ってコンタクト当た
りの低挿抜力化にも限界があり、信号ピン数が数百本に
なると、挿入抜去力が100kg近くにも達しLSIに損傷を与
えずに挿入、抜去することは困難である。端子数が多い
のでLSIの外周部のみならず、LSI下面の広い領域に信号
ピンが配置されているピングリッドアレィ(PGA)構造
を採用しているため、特に抜去の際にLSI本体の外周部
のみを持って引き抜くと、LSI本体を構成するセラミッ
クなどが曲げ応力で破損するという問題があった。
In addition, in order to form a good electrical connection, it is necessary to maintain a certain level of contact pressure or more, so there is a limit to the low insertion / extraction force per contact, and when the number of signal pins reaches several hundreds, insertion / extraction is performed. The force reaches nearly 100 kg, and it is difficult to insert and remove without damaging the LSI. Since the number of terminals is large, the pin grid array (PGA) structure in which the signal pins are arranged in a wide area on the lower surface of the LSI is adopted not only on the outer periphery of the LSI, but especially on the outer periphery of the LSI main body when removing. When pulling out only the part, there was a problem that the ceramic etc. that compose the LSI body was damaged by bending stress.

〔問題点を解決するための手段〕[Means for solving problems]

上記問題点は、 中心部から外周部へ向かって高くなるステップと該ス
テップ面に端子孔とが形成されたベース部材と、 前記ステップの各段の外壁と嵌合する外形と厚さを有
し、上面に、外周側端部に貫通孔を有するばねガイド溝
が形成されたスペーサ部材が、前記ステップの段数と等
しい枚数と、 上端に接触部と、下側にレバー部と、中間に前記接触
部および前記レバー部より径が大きい抜止め部とが形成
された略棒状のコンタクトと、 前記コンタクトを先端で載置し前記ばねガイド溝によ
ってガイドされる水平ばね部と、前記貫通孔と前記端子
孔とを貫通して前記ベース部材の下面に導出する、前記
水平ばね部と直角な端子部とからなるL字形状のばね部
材と、 上面にLSIを位置決めする凹部と、前記コンタクトの
接触部を遊合する接触子孔とが形成されたカバー部材
と、 前記カバー部材の接触子孔に対応した位置に前記コン
タクトのレバー部を遊合するガイド孔が形成された階段
状のガイド部材と、 前記カバー部材に回転自在に保持され、LSIの上面を
前記凹部に対して押圧保持する締結手段と、 を少なくとも具備し、 上記ベース部材と上記カバー部材との間に、上記ベー
ス部材の各ステップに対応する前記スペーサ部材と前記
ばね部材とが順次積層されて、前記ばね部材の水平ばね
部が前記スペーサ部材により狭持され、 さらに上下方向に変位可能に前記コンタクトの抜止め
部が前記ガイド部材と前記カバー部材とで狭持されてい
ることを特徴とする本発明のLSI用ソケットにより解決
される。
The above-mentioned problems include a base member having a step increasing from the central portion toward the outer peripheral portion and a terminal hole formed on the step surface, and an outer shape and a thickness for fitting with the outer wall of each step of the step. A spacer member having a spring guide groove having a through hole at the outer peripheral end is formed on the upper surface, the number of spacers is equal to the number of steps of the step, the contact portion is at the upper end, the lever portion is at the lower side, and the contact is at the middle. Portion and a retaining portion having a diameter larger than that of the lever portion, a substantially rod-shaped contact, a horizontal spring portion on which the contact is placed at the tip and guided by the spring guide groove, the through hole and the terminal An L-shaped spring member consisting of the horizontal spring portion and a terminal portion perpendicular to the horizontal member that extends through the hole to the lower surface of the base member; a concave portion for positioning the LSI on the upper surface; and a contact portion of the contact. Contact A cover member in which a hole is formed, a step-like guide member in which a guide hole for loosely engaging the lever portion of the contact is formed at a position corresponding to the contactor hole of the cover member, and the cover member is rotatable. Fastening means for holding the upper surface of the LSI against the concave portion, and a spacer member corresponding to each step of the base member between the base member and the cover member. The spring member is sequentially laminated, the horizontal spring portion of the spring member is sandwiched by the spacer member, and the retaining portion of the contact is narrowed by the guide member and the cover member so as to be vertically displaceable. It is solved by the socket for LSI of the present invention characterized by being held.

〔作用〕 ばね部材の水平ばね部を接触圧発生用の片持梁ばねと
して用い、水平ばね部の先端に載置されるコンタクトに
は、単なるたわみ伝達用のレバーとしての働きのみを行
わしめることにより、接触部に接触圧発生のためのばね
機構を持たせる必要がなくなり、従ってLSI直下でのコ
ンタクト当たりの断面積を小さくすることができ、高密
度のコンタクト配列が可能となる。
[Operation] Use the horizontal spring portion of the spring member as a cantilever spring for generating contact pressure, and the contact placed at the tip of the horizontal spring portion should only function as a lever for transmitting deflection. As a result, it is not necessary to provide the contact portion with a spring mechanism for generating contact pressure. Therefore, the cross-sectional area per contact right under the LSI can be reduced, and a high-density contact arrangement can be achieved.

LSIを装着する際には、LSIを凹部で位置決めして載置
した後、上面をレバーにより押圧して、LSIを下方へ変
位させると、信号ピンの先端に当接しているコンタクト
が下方に垂直に変位し、片持梁ばねを構成する水平ばね
部がたわみ、接触圧が発生し、信号ピンとコンタクトと
の間に良好な電気的接続が形成される。
When mounting the LSI, position the LSI in the recess and place it, and then press the upper surface with the lever to displace the LSI downward, and the contact that is in contact with the tip of the signal pin will be vertically downward. The horizontal spring portion that constitutes the cantilever spring is deflected, a contact pressure is generated, and a good electrical connection is formed between the signal pin and the contact.

レバーは押圧状態で保持されるので、電気的接続は維
持される。
Since the lever is held in the pressed state, the electrical connection is maintained.

取り外しの際は、レバーによる押圧を解除するだけで
よく、抜去力を必要としない。
At the time of removal, it is only necessary to release the pressing by the lever, and no withdrawal force is required.

〔実施例〕〔Example〕

以下図面を参照しながら本発明の実施例を説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第1図は本発明に係るLSIソケットの一部切欠側面
図、第2図は第1図に於けるC部の拡大図である。
1 is a partially cutaway side view of an LSI socket according to the present invention, and FIG. 2 is an enlarged view of a C portion in FIG.

まず第1図により、全体の構造を説明する。 First, the overall structure will be described with reference to FIG.

図に示す如く、本LSIソケットは7種類の主要要素、
すなわち、ベース部材1、外形が相似で大きさが若干異
なる複数のスペーサ部材2、長さの異なる複数のコンタ
クト31(図ではそれぞれ実線で示す)、コンタクト31の
下端と接触しているばね部材32(同じく実線で示す)、
カバー部材4、コンタクトをガイドするガイド部材8、
例えば二つのレバーA6、レバーB7よりなる締結手段とか
ら構成されている。
As shown in the figure, this LSI socket has seven main elements,
That is, the base member 1, the plurality of spacer members 2 having similar outer shapes and slightly different sizes, the plurality of contacts 31 having different lengths (indicated by solid lines in the drawing), and the spring member 32 in contact with the lower ends of the contacts 31. (Also indicated by a solid line),
Cover member 4, guide member 8 for guiding the contact,
For example, it is composed of a fastening means composed of two levers A6 and B7.

5は装着されるLSIで、下面に多数本の信号ピン51が
高密度に格子状に設けられている。
Reference numeral 5 is an LSI to be mounted, and a large number of signal pins 51 are provided on the lower surface in a high density grid.

締結手段は、カバー部材4の中央の位置決め用凹部41
にLSI5を搭載した後、カバー部材4に軸支されているレ
バーA6を、矢印A方向に回転させ押圧面61をLSI5の上面
に当接させ、次いで同様に軸支されているレバーB7を矢
印B方向に回転させることにより締結爪71が、レバーA6
の爪受け62に係合し、LSI5がカバー部材4の凹部41の底
面に押圧保持されるよう構成されている。
The fastening means is a positioning recess 41 at the center of the cover member 4.
After mounting the LSI5 on the LSI, the lever A6 pivotally supported on the cover member 4 is rotated in the direction of arrow A to bring the pressing surface 61 into contact with the upper surface of the LSI5, and then the lever B7 similarly pivotally supported. When it is rotated in the B direction, the fastening claw 71 moves to the lever A6.
The LSI 5 is configured to be engaged with the claw receiver 62 and to be pressed and held by the bottom surface of the recess 41 of the cover member 4.

次に、第2図により、その他の要素を詳細に説明す
る。
Next, other elements will be described in detail with reference to FIG.

ベース部材1は外形が4角形で、中心部から外周部に
向かって高くなる複数段の階段状のステップ11と、該ス
テップ11の各段に、下方へ貫通する端子孔12(紙面垂直
方向に複数個並設)とが形成されている。
The base member 1 has a quadrangular outer shape, and has a plurality of stepwise steps 11 that increase from the central portion toward the outer peripheral portion, and terminal holes 12 that penetrate downward at each step of the step 11 (in the direction perpendicular to the paper surface). A plurality of them are arranged side by side).

スペーサ部材2は、上記の各ステップの周囲の壁面と
同一外周で中央部に開口部を有する略枠状の外形と、ス
テップの高さに等しい厚さを有し、各ステップに嵌合す
るように形成されている。そして各スペーサ部材2の上
面には、ばね部材32の水平ばね部32aを収納するための
複数のガイド溝21が、所定のピッチで形成されており
(図面垂直方向へ並設)、ガイド溝21の外周側端部(図
では右側)にはばね部材32の端子部32bが貫通するコン
タクト孔22が形成されている。
The spacer member 2 has a substantially frame-shaped outer shape having the same outer circumference as the wall surface around each step described above and an opening in the center, and a thickness equal to the height of the step, and is fitted to each step. Is formed in. A plurality of guide grooves 21 for accommodating the horizontal spring portions 32a of the spring members 32 are formed on the upper surface of each spacer member 2 at a predetermined pitch (arranged in the vertical direction in the drawing). A contact hole 22 through which the terminal portion 32b of the spring member 32 penetrates is formed at the outer peripheral side end portion (right side in the figure).

コンタクト31は、上端面にLSI5の信号ピン51の先端に
当接する接触部31aと、下側にレバー部31bと、中間に接
触部31aがカバー部材4の凹部41の底面と同一面となる
よう位置決めし、かつカバー部材から脱落を防ぐために
接触子孔41より径の大きい抜止め部31cとを有する略棒
状の金属性部材である。
The contact 31 has a contact portion 31a that abuts against the tip of the signal pin 51 of the LSI 5 on the upper end surface, a lever portion 31b on the lower side, and a contact portion 31a in the middle that is flush with the bottom surface of the recess 41 of the cover member 4. It is a substantially rod-shaped metallic member having a positioning portion 31c having a diameter larger than that of the contact hole 41 for positioning and preventing the cover member from falling off.

ばね部材32はばね材料よりなり、所定の長さが上記ス
ペーサ部材の開口部端面23から突出して先端に上記コン
タクト31を載置、接触する水平片持梁ばねとなり、他の
部分はスペーサ部材のガイド溝21に収納され、直上に積
層された次のスペーサ部材の底面で固定保持される水平
部ばね部32aと、下端がベース部材の端子孔11の下面に
突出してプリント基板等に半田付け等で接続される端子
部32bとの2部分がL字形状に形成されている。
The spring member 32 is made of a spring material, and is a horizontal cantilever spring having a predetermined length protruding from the end face 23 of the opening of the spacer member and mounting and contacting the contact 31 at the tip, and the other portion is the spacer member. The horizontal spring portion 32a housed in the guide groove 21 and fixedly held by the bottom surface of the next spacer member laminated immediately above, and the lower end protruding to the lower surface of the terminal hole 11 of the base member and soldered to a printed circuit board or the like. The two portions with the terminal portion 32b connected with are formed in an L shape.

カバー部材4には、LSIの高密度の信号ピン51に対応
する位置に、コンタクト31を正確に配置するための接触
孔42が形成されているが、コンタクト31の断面形状が単
純なため、近接して配列することが可能となりピッチ間
隔25MIL(0.675mm)を達成することが容易である。
The cover member 4 has a contact hole 42 for accurately disposing the contact 31 at a position corresponding to the high-density signal pin 51 of the LSI. It is possible to arrange them in parallel and it is easy to achieve a pitch interval of 25 MIL (0.675 mm).

ガイド部材8は、レバー部31bを遊合してコンタクト3
1を垂直に上下させるためのガイド孔81が、カバー部材
4の接触子孔42と同一配列に形成された階段状の部材で
ある。
The guide member 8 engages the lever portion 31b to contact the contact 3
Guide holes 81 for vertically moving 1 are stepwise members formed in the same arrangement as the contactor holes 42 of the cover member 4.

そして、LSI5が搭載され、前記締結手段により押圧さ
れると、コンタクト31は下方へ変位し、ばね部材32の先
端をたわませるので、所望の接触圧が発生する。
Then, when the LSI 5 is mounted and pressed by the fastening means, the contact 31 is displaced downward and the tip of the spring member 32 is bent, so that a desired contact pressure is generated.

この場合、複数本のばね部材は、その水平片持梁ばね
の長さが全て等しくなるように構成されているので、全
信号ピンに対して接触圧のバラツキの少ない良好な電気
的接続が形成される。
In this case, the plurality of spring members are configured such that the lengths of the horizontal cantilever springs thereof are all equal, so that a good electrical connection with a small contact pressure variation is formed for all the signal pins. To be done.

また、LSIを取り外すには、簡単なレバー操作で締結
手段を解除すればよく、前記従来のソケットの如く大き
な抜去力を必要としないので、LSIに損傷を与えること
もない。
Further, in order to remove the LSI, it suffices to release the fastening means by a simple lever operation, and it does not require a large withdrawal force as in the conventional socket, so that the LSI is not damaged.

なお、コンタクトの抜止め部31cにより、LSI装着前の
状態で予め水平ばね部32aに撓みを与えて接触力に予圧
を与えることも容易にできる。
The contact retaining portion 31c can easily preliminarily apply a preload to the contact force by preliminarily bending the horizontal spring portion 32a before mounting the LSI.

さらに、本構成によれば、ばね部材の水平ばね部32a
の長さを変えることにより、端子部32bの導出位置を任
意に変えることができるため、本ソケットを搭載するた
めのプリント板には、LSI程の高端子密度を必要とせ
ず、通常のプリント板で十分である。
Further, according to this configuration, the horizontal spring portion 32a of the spring member is
Since the lead-out position of the terminal part 32b can be changed arbitrarily by changing the length of, the printed board for mounting this socket does not require the high terminal density of LSI, Is enough.

〔発明の効果〕〔The invention's effect〕

本発明によれば、高密度、多端子数の平面信号ピン配
列を有するLSIを、容易に着脱できる接続信頼性の高いL
SIソケットを提供することが可能となり、コンピュータ
の高性能変等に貢献することが顕著である。
According to the present invention, it is possible to easily attach / detach an LSI having a high-density, multi-terminal planar signal pin array, which has a high connection reliability.
It becomes possible to provide SI sockets, and it is remarkable that they contribute to the high performance change of computers.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明に係るLSIソケットの一部切欠側面図、 第2図は第1図におけるC部の拡大図、 である。 図において、 1……ベース部材、11……ステップ、 12……端子孔、2……スペーサ部材、 21……ばねガイド溝、22……貫通孔、 23……開口部端面、 31……コンタクト、31a……接触部、 31b……レバー部、31c……抜止め部、 32……ばね部材、32a……水平ばね部、 32b……端子部、4……カバー部材、 41……凹部、42……接触子孔、 5……LSI、51……信号ピン、 6……レバーA、61……押圧面、 62……爪受け、7……レバーB、 71……締結爪、8……ガイド部材、 81……ガイド孔、 である。 FIG. 1 is a partially cutaway side view of an LSI socket according to the present invention, and FIG. 2 is an enlarged view of portion C in FIG. In the figure, 1 ... Base member, 11 ... Step, 12 ... Terminal hole, 2 ... Spacer member, 21 ... Spring guide groove, 22 ... Through hole, 23 ... Opening end face, 31 ... Contact , 31a ... Contact part, 31b ... Lever part, 31c. 42 ... Contact hole, 5 ... LSI, 51 ... Signal pin, 6 ... Lever A, 61 ... Pressing surface, 62 ... Claw receiver, 7 ... Lever B, 71 ... Fastening claw, 8 ... ... guide member, 81 ... guide hole.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】中心部から外周部へ向かって高くなるステ
ップ(11)と該ステップ(11)面に端子孔(12)とが形
成されたベース部材(1)と、 前記ステップ(11)の各段の外壁と嵌合する外形と厚さ
を有し、上面に、外周側端部に貫通孔(22)を有するば
ねガイド溝(21)が形成された前記ステップの段数と等
しい枚数のスペーサ部材(2)と、 上端に接触部(31a)と、下側にレバー部(31b)と、中
間に前記接触部(31a)および前記レバー部(31b)より
径が大きい抜止め部(31c)とが形成された略棒状のコ
ンタクト(31)と、 前記コンタクト(31)を先端で載置し前記ばねガイド溝
(21)によってガイドされる水平ばね部(32a)と、前
記貫通孔(22)と前記端子孔(12)とを貫通して前記ベ
ース部材(1)の下面に導出する、前記水平ばね部(32
a)と直角な端子部(32b)とからなるL字形状のばね部
材(32)と、 上面にLSIを位置決めする凹部(41)と、前記コンタク
トの接触部(31a)を遊合する接触子孔(42)とが形成
されたカバー部材(4)と、 前記カバー部材の接触子孔(42)に対応した位置に前記
コンタクトのレバー部(31b)を遊合するガイド孔(8
1)が形成された階段状のガイド部材(8)と、 前記カバー部材(4)に回転自在に保持され、LSIの上
面を前記凹部(41)に対して押圧保持する締結手段
(6、7)と、 を少なくとも具備し、 上記ベース部材(1)と上記カバー部材(4)との間
に、上記ベース部材(1)の各ステップに対応する前記
スペーサ部材(2)と前記ばね部材(32)とが順次積層
されて、前記ばね部材の水平ばね部(32a)が前記スペ
ーサ部材(2)により狭持され、 さらに上下方向に変位可能に前記コンタクトの抜止め部
(31c)が前記ガイド部材(8)と前記カバー部材
(4)とで狭持されているることを特徴とするLSIソケ
ット。
1. A base member (1) having a step (11) increasing from a central portion toward an outer peripheral portion and a terminal hole (12) formed on a surface of the step (11); A spacer having an outer shape and a thickness that fits the outer wall of each step, and a spring guide groove (21) having a through hole (22) at the outer peripheral side end portion is formed on the upper surface, and the number of spacers is equal to the number of steps of the step. A member (2), a contact part (31a) on the upper end, a lever part (31b) on the lower side, and a retaining part (31c) having a diameter larger than the contact part (31a) and the lever part (31b) in the middle. A substantially rod-shaped contact (31) in which is formed, a horizontal spring portion (32a) on which the contact (31) is mounted at its tip and guided by the spring guide groove (21), and the through hole (22). The horizontal spring portion (32) that extends through the terminal hole (12) and the terminal hole (12) and is led out to the lower surface of the base member (1).
a) L-shaped spring member (32) consisting of a terminal section (32b) perpendicular to a), a recess (41) for positioning the LSI on the upper surface, and a contactor for loosely contacting the contact section (31a) of the contact. A cover member (4) having a hole (42) formed therein, and a guide hole (8) for loosely engaging the lever portion (31b) of the contact at a position corresponding to the contactor hole (42) of the cover member.
1) A stepwise guide member (8) and a fastening means (6, 7) rotatably held by the cover member (4) to press and hold the upper surface of the LSI against the recess (41). ), And at least the spacer member (2) and the spring member (32) corresponding to each step of the base member (1) between the base member (1) and the cover member (4). ) Are sequentially stacked, the horizontal spring portion (32a) of the spring member is sandwiched by the spacer member (2), and the contact retaining portion (31c) is vertically displaceable so that the guide member has the retaining portion (31c). An LSI socket, which is sandwiched between (8) and the cover member (4).
JP62179520A 1987-07-17 1987-07-17 LSI socket Expired - Fee Related JP2555612B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62179520A JP2555612B2 (en) 1987-07-17 1987-07-17 LSI socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62179520A JP2555612B2 (en) 1987-07-17 1987-07-17 LSI socket

Publications (2)

Publication Number Publication Date
JPS6422053A JPS6422053A (en) 1989-01-25
JP2555612B2 true JP2555612B2 (en) 1996-11-20

Family

ID=16067213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62179520A Expired - Fee Related JP2555612B2 (en) 1987-07-17 1987-07-17 LSI socket

Country Status (1)

Country Link
JP (1) JP2555612B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013168196A1 (en) * 2012-05-10 2013-11-14 ユニテクノ株式会社 Semiconductor transport test jig

Also Published As

Publication number Publication date
JPS6422053A (en) 1989-01-25

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