JP2710599B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an IC socket, and more particularly to an IC socket for an SOJ package type IC used for an electrical characteristic test.

[0002]

2. Description of the Related Art FIGS. 2A to 2D show an example of a conventional IC.
It is the top view (a) which shows a socket, the side view (b), CC sectional view (c), and DD sectional view (d). 2. Description of the Related Art Conventionally, as shown in FIG. 2, this type of IC socket has a plurality of leads 7 which are led out from a side surface of an outer shell and bent in one direction.
A socket body 5 having a bottom surface 4 on which the C6 is inserted and on which the IC 6 is placed, and a contact having a contact 3 that penetrates the socket body 5 at one end and makes contact with the lead 7 of the IC 6 at the other end by spring pressure. I have. The contact is provided with a curved portion 2 that branches off from the contact 3 and holds down the outer body of the IC 6.

The contact having the curved portion 2 and the contact 5 is made of a metal such as beryllium copper having good electrical conductivity and resiliency, and a portion protruding from the socket body 5 is connected to a terminal of a measuring device. Is done.

In order to load the IC 6 into the IC socket, the IC 6 is first inserted into the recess of the socket body 5 and pushed until the outer body contacts the bottom surface 4. As a result, the lead 7 of the IC 6 pushes over the curved portion 2 and then climbs over the curved portion 2, and at the same time when the lead 7 comes into contact with the contact 3, the curved portion 2 rides on the bent portion of the lead 7 and puts the lead 7. The IC was held by holding it down.

[0005]

In the above-mentioned conventional IC socket, the lead and the contact are applied to the lead with a force greater than the force required for electrical contact at the time of insertion and removal of the IC, and the lead is expanded by bending the lead. There is a problem that the solder plating of the lead is peeled off due to the repulsive force applied to the lead and the friction caused by the relative movement at the time of pushing or removing.

Of course, if the spring property of the curved portion is weakened, the peeling of the solder plating is reduced, but in order to secure the stable contact between the lead and the contact, it is necessary to prevent the IC from coming out of the socket. Some power must be secured. For example, when the IC is an SOJ300 mil 20 pin, an IC holding force of about 600 g is required, and a converted force per lead is about 30 g. This is much larger than the contact pressure of the contact. Since such a force is repeatedly applied to the curved portion of the contact every time the IC is inserted or removed, there is a disadvantage that the root of the curved portion is fatigued, the spring property is lost, and the contact itself has a long life.

In order to replace a contact, since the contact is usually molded in the socket body, the contact is
The C socket itself must be replaced. This causes a problem that the life of the IC socket is shortened and the operation cost of the inspection is increased.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an IC socket which can be inserted and removed without removing the solder plating of the lead and has a long life.

[0009]

SUMMARY OF THE INVENTION A feature of the present invention is that a socket having a bottom surface on which an IC having a plurality of leads led out from a side surface of an outer package and bent in one direction is inserted and the outer package of the IC is placed. In an IC socket including a main body and a plurality of contacts that penetrate one end of the socket main body and the other end thereof comes into contact with each of the leads by spring pressure, the tip extends from the top of the socket main body to the bottom surface, and has a curved end. An IC socket including a plurality of plate-shaped spring members that presses a slope at a side end of an outer body of the IC with a curved portion. Further, it is preferable that a mechanism for attaching and detaching the plate-like spring member to and from the socket body is provided.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

1 (a) to 1 (d) are a top view (a), a side view (b), an AA sectional view (c) and a BB sectional view (d) showing an IC socket according to an embodiment of the present invention. It is. This IC socket has a lead 7 as shown in FIG.
The socket body 5 is separated from the contact 3a
A plurality of leaf springs 1 are provided which extend from the upper part of a to the bottom surface 4, bend their tips, and press the slopes 6 a at the side ends of the outer body of the IC 6 with the curved portions 1 a. Otherwise, it is the same as the conventional example.

The leaf spring 1 holding the IC 6 is formed by bending a single springy plate. The material is not particularly limited as long as it is a spring material, and may be, for example, stainless steel, resin, steel, or the like. One end of the leaf spring 1 is fixed to the upper part of the socket body 5a by a holding plate 8 which can be attached and detached, and the other end is extended downward and bent in a curved shape, and the curved portion 6a presses the slope 6a of the outer shell of the IC. doing.

Next, the operation of inserting and removing the IC from the IC socket will be described. First, the outer body of the IC is connected to the socket body 5a.
The leaf spring 1 is bent toward the inner wall of the socket body 5a. Further, by the pushing operation of the IC 6, the outer body of the IC 6 becomes the curved portion 1 a of the leaf spring 1.
And is placed in contact with the bottom surface 4. Then, the leaf spring 1 returns to its original state by the return force of the spring, and the curved portion 1a holds down the slope 6a (the slope formed by the draft of the mold) of the outer shell of the IC 6, and the IC 6 is held. On the other hand, curled I
The lead 7 of C6 descends by this pushing operation and comes into contact with the portion of the contact 3a whose tip is bent in an R shape, and the contact 3
a are bent and come into contact with each other by their spring pressure.

Further, in order to remove the IC 6, the outer body of the IC 6 exposed from the notch of the socket body 5a is grasped and extracted. As a result, the lead 7 is detached from the contact 3a, and the curved portion 1a of the leaf spring 1 slides smoothly on the slope of the outer body of the IC 6, the root is bent toward the inner wall side, and the curved portion 1a passes over the outer body of the IC 6. Detach from IC6.

The holding force of the leaf spring 1 is 600 g in the case of a 20-pin SOJ 300 mil if it falls down, so that the holding force per one leaf spring 1 may be 200 g. In addition, although a bending force is applied to the base of the leaf spring 1 when the IC 6 is inserted and removed, the bending force is gradually applied while sliding on the slope 6a of the outer shell of the IC, and the bending force (about 10 g) itself is small. The life of the leaf spring 1 due to fatigue can be extended. On the other hand, the shape of the contact 3a of the IC socket does not have a mechanism for holding the IC, so that only the tip may be rounded and substantially linear, and the force (10 g) necessary to make electrical contact with the lead may be provided. .

Here, some SOJ package type ICs do not have a predetermined number of leads. For example, in a package having 26 pins, there is a package in which the actual number of leads is only 20 pins. In this case, the leaf spring 1 can be installed in a portion where the lead is omitted. In such a case, two leaf springs 1 may be arranged in the portions where the leads are led out and on both sides where there are no leads, and there is an advantage that the structure of the IC socket becomes simpler.

[0017]

As described above, according to the present invention, apart from the contact which comes into contact with the lead of the IC, the tip extends downward from the upper part of the socket body, and the tip is bent.
By providing a plate-shaped spring member for holding a slope having a draft angle, there is no member for holding the lead for holding the IC, and as a result, there is an effect that peeling of the solder plating of the lead can be greatly reduced.

[0018] Further, since the slope of the outer body of the IC is pressed by the curved portion to hold the IC, the curved portion at the tip end of the plate-shaped spring member slides smoothly on the slope when the IC is inserted or removed. The force applied to the base of the plate-shaped spring member can be reduced, and the fatigue of the plate-shaped spring member is reduced and the life of the IC socket is prolonged. In addition, if necessary,
The life of the IC socket can be further prolonged by allowing the leaf spring member to be replaced.

[Brief description of the drawings]

FIG. 1 is a top view (a), a side view (b), an AA sectional view (c) and a BB sectional view (d) showing an IC socket according to an embodiment of the present invention.

FIG. 2 is a top view (a), a side view (b), a CC sectional view (c) and a DD sectional view (d) showing an example of a conventional IC socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Leaf spring 1a, 2 Bending part 3, 3a Contact 4 Bottom surface 5, 5a Socket body 6 IC 6a Slope 7 Lead 8 Pressing plate

Claims (2)

(57) [Claims] 1. A socket body having a bottom surface on which an IC having a plurality of leads led out from a side surface of an outer shell and bent in one direction is inserted and on which the outer shell of the IC is mounted, and one end of the socket main body penetrates the socket main body. And an IC socket having a plurality of contacts, the other ends of which are in contact with the respective leads by spring pressure. The IC socket extends from an upper portion of the socket body toward the bottom surface, and has a curved end. An IC socket comprising a plurality of leaf spring members for pressing a slope at a side end. 2. The IC socket according to claim 1, further comprising a mechanism for attaching and detaching the plate spring member to and from the socket body.