JPH0566978U - Sealing device - Google Patents

Abstract

(57) [Summary] [Purpose] The purpose of the present invention is to enable high-speed sealing of both high-viscosity and low-viscosity resins. [Structure] A guide 8 in which an electric circuit board 3 on which an electronic component 1 to be sealed is mounted can be arranged at a predetermined interval and is movable, and a guide 8 which is directly above the electronic component 1 and which is transferred in synchronization with the guide 8. The resin supply jig 9 is provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a seal device for sealing an electronic component such as a semiconductor element mounted on a COB or the like.

[0002]

[Prior Art]

 In general, as shown in FIG. 4, an electronic component 1 such as a semiconductor device is die-bonded to an electric circuit board 3 by a resin paste 2 such as silver paste, and gold or aluminum thin wires 4 are wire-bonded to connect the terminals thereof. Has been done. Then, in order to protect this from dirt and mechanical stress from the outside, resin sealing is performed, and the process is shown in FIGS. 5 and 6.

It should be noted that the electronic component 1 is fixedly mounted on the electric circuit board with the resin paste 2. For this fixing, when mounting on a metal such as a lead frame, solder, Au-Si eutectic, Au- It is fixedly mounted by a fixing material such as Sn.

In the example of FIGS. 5A to 5C, a resin 5 having a relatively high viscosity is used, and the resin 5 is quantitatively applied onto the electronic component 1 by the dispenser 6, and the viscosity of the resin 5 is increased. The height is used to cure the electronic component 1 while maintaining the shape in which it is wrapped.

Further, in the examples of FIGS. 6 (A) to 6 (C), a resin 5 having a low viscosity is used, and a punch 7 for preventing resin outflow is provided in the electronic component 1, and the punch 7 is provided in the punch 7. This is a so-called casting method (potting) in which the resin 5 is applied in a fixed amount and cured in this state.

In the sealing device shown in FIG. 5, in order to make the shape after resin sealing constant, it is necessary to keep the amount of the resin 5 constant and also keep the viscosity constant at all times. Also, the coating position must be constant. However, when the viscosity of the resin 5 coming out from the tip of the dispenser 6 is high, the resin does not come out directly below, and it is very difficult to control the direction. Further, in the sealing device shown in FIG. 6, in addition to the control of the coating amount, it is necessary to bring a spill prevention blade 7 into close contact with the electric circuit board 3 so that the spill does not flow out from the gap. It is necessary to fix 7 so that it does not move during casting, which inevitably increases the number of processes.

[0007]

[Problems to be solved by the device]

 However, if the sealing device having the above-mentioned configuration, particularly the high-viscosity sealing resin, is used for potting until the sealing of each seal is completed, it takes a long time and the work cannot be speeded up. Therefore, it is possible to drop a large amount of resin at a time to speed up potting, but a high-viscosity encapsulating resin takes a long time to seal, and a large amount cannot be dropped at one time. Further, a low-viscosity encapsulating resin can be forcibly dropped in a large amount by pressurization, but there is a problem that the seal tends to flow in an unevenly distributed direction.

[0008]

[Means for Solving the Problems]

 In the sealing device according to the present invention, an electric circuit board on which electronic components are mounted is arranged at a predetermined interval on a movable guide, and a resin supply jig is also transferred and fixed in synchronization with the transfer of the guide. A certain amount of resin is dropped from the dispenser to the resin supply jig and the resin is naturally dropped from the dropping port of the resin supply jig during the process of transferring the guide. is there.

[0009]

[Action]

 According to the present invention, since the guide can be continuously transferred and the electronic parts can be sealed during the transfer process, high speed processing is possible.

[0010]

【Example】

 FIG. 1 is a side view showing an embodiment of the sealing device according to the present invention. In the figure, 8 is a guide for moving the electric circuit board 3 on which the electronic component 1 is fixedly mounted, 9 is a storage portion 9A for temporarily storing a certain amount of the resin 5 dripping from the dispenser 6 and the stored resin 5. It is a resin supply jig that has a drip port 9B for spontaneously dropping by a fixed amount and moves in synchronization with the movement of the guide 8.

It is needless to say that the dropping port 6 A of the dispenser 6 has a large diameter so that a predetermined amount can be discharged in a short time when the resin 5 has a high viscosity. The arrangement of the dispenser 6 can be changed according to various states and conditions, and the arrangement is not limited, as a matter of course.

Next, the operation of the sealing device having the above configuration will be described. First, the electric circuit board 3 on which the electronic component 1 is fixedly mounted is fixed to a predetermined position on the guide 8, and the guide 8 and the resin supply jig 9 are moved in synchronization. Then, when the electronic component 1 and the resin supply tool 9 come directly under the dispenser 6, a predetermined amount of N ₂ gas, an inert gas, an emer or the like is pulsed to the dispenser 6 in the direction of the arrow 10. When injected, a predetermined amount of the resin 5 is dropped from the dropping port 6A of the dispenser 6 and is temporarily stored in the storage portion 9A of the resin supply jig 9. Then, while the guide 8 and the resin supply jig 9 are moving, that is, the process is sequentially advanced, and during the time when the process is advanced, the resin 5 spontaneously drops from the dropping port 9B of the resin supply jig 9 to cause the electronic component 1 Drop it on the top and spread as the process progresses to complete the seal.

As described above, the dispenser 6 only needs to supply a fixed amount of the resin 5 at high speed to the resin supply jigs 9 sent one after another by the guides 8. Will fall by itself, and the sealing will be completed as the process progresses sequentially. Moreover, the correspondence between the tip of the dispenser 6 and the resin supply jig 9 can be rough.

FIG. 2 is a side view showing another embodiment of the sealing device according to the present invention. In the figure, 11 is a resin supply jig in which a storage portion 11A for temporarily storing a fixed amount of the resin 5 dropped from the dispenser 6 is flat, and a predetermined amount of the resin 5 is naturally dropped from the dropping port 11B. It moves in synchronization with the movement of the guide 8.

The resin supply jig 11 can be expected to have a relatively high degree of freedom in attaching and detaching work to and from the sealing device, and workability can be improved. Moreover, since the storage portion 11A is flat, the dropping area of the resin 5 can be wide, and the frame 11C for temporarily holding a predetermined amount of the resin 5 is attached to the flat storage portion 11A. The amount to hold the resin 5 can be variously changed depending on the size and the width.

FIG. 3 is a side view showing still another embodiment of the sealing device according to the present invention. In the figure, reference numeral 12 is a resin supply tool in which a storage portion 12A for temporarily storing a predetermined amount of the resin 5 dropped from the dispenser 6 is flat and the dropping port 12B is formed in a downward projection shape.

Since the dropping port 12B of the resin supply jig 12 is formed in a downward projection shape, it is possible to improve the breakage of the resin due to a natural drop.

The material and shape of the resin supply jigs 9 and 11 (including the frame 11C) and 12 are not limited to the examples, and a structure capable of holding a fixed amount of the resin 5 at a time, Of course, it is only necessary to obtain the function.

[0019]

[Effect of the device]

 As described in detail above, according to the sealing device of the present invention, in order to achieve high-speed sealing of high-viscosity resin and low-viscosity resin, the dispenser temporarily drops the resin on the resin supply jig. High-speed sealing is performed as the process progresses sequentially and the resin is naturally dropped from the natural dropping port of the resin supply tool during the process progressing and diffuses and seals as the process progresses. There is an effect that can be.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a sealing device according to the present invention.

FIG. 2 is a side view showing another embodiment of the sealing device according to the present invention.

FIG. 3 is a side view showing still another embodiment of the sealing device according to the present invention.

FIG. 4 is a perspective view showing an electric circuit board on which electronic components are mounted.

FIG. 5 is a diagram showing a sealing process of a conventional sealing device.

FIG. 6 is a diagram showing a sealing process of another conventional sealing device.

[Explanation of symbols]

 8 Guides 9, 11, 12 Resin supply jig

Claims (2)

[Scope of utility model registration request] 1. A guide for mounting an electric circuit board on which an electronic component to be sealed is mounted, and a resin supply jig provided directly above the electronic component mounted on the guide for allowing the resin to naturally drop from a drip port. A sealing device, comprising: a dispenser that supplies a predetermined amount of the resin to the resin supply jig. 2. A guide in which a plurality of electric circuit boards on which electronic components to be sealed are mounted can be arranged at predetermined intervals and which can be transferred, and a guide which is located directly above each of these electronic parts and which is transferred in synchronization with the guide. It has a resin supply jig for spontaneously dropping the resin onto the electronic component from a drip opening, and a dispenser for supplying a predetermined amount of the resin to a predetermined resin supply jig of the resin supply jig. And sealing device.