JPH0564769A - Method for repairing and sealing surface of wood board - Google Patents

Method for repairing and sealing surface of wood board

Info

Publication number
JPH0564769A
JPH0564769A JP25411191A JP25411191A JPH0564769A JP H0564769 A JPH0564769 A JP H0564769A JP 25411191 A JP25411191 A JP 25411191A JP 25411191 A JP25411191 A JP 25411191A JP H0564769 A JPH0564769 A JP H0564769A
Authority
JP
Japan
Prior art keywords
putty
wood board
resin
formaldehyde resin
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25411191A
Other languages
Japanese (ja)
Inventor
Natsuhi Tsuruta
夏日 鶴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OOSHIKA SHINKO KK
OSHIKA SHINKO CO
Original Assignee
OOSHIKA SHINKO KK
OSHIKA SHINKO CO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OOSHIKA SHINKO KK, OSHIKA SHINKO CO filed Critical OOSHIKA SHINKO KK
Priority to JP25411191A priority Critical patent/JPH0564769A/en
Publication of JPH0564769A publication Critical patent/JPH0564769A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To repair and seal the surface of a wood board with putty composed of a mixture of a main agent consisting of a solid component and a formaldehyde resin and a curing agent, not generating foaming, grain depression and a crack and excellent in flocculation force, water resistance and durability and curing the putty layer. CONSTITUTION:The surface of a wood board such as plywood or laminated lumber having a recessed surface such as a conduit, a crack, a haircrack or a pinhole is coated with putty to be repaired and sealed. At this time, putty composed of a mixture of a main agent containing 78-85% of a solid component (e.g. clay) with formaldehyde resin content of 13-20% and a curing agent (e.g. ammonium chloride) is applied to the wood board to be cured. As a result, the fault possessed by the formaldehyde resin to the repairing and sealing use of the surface of the wood board can be improved and the putty not generating foaming, grain depression and a crack and excellent in flocculation force, water resistance and durability can be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、木製ボ−ド類の表面補
修・目止め方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface repairing / sealing method for wooden boards.

【0002】[0002]

【従来の技術】合板、集成材の表面には、木材本来の性
質に起因する導管、逆目、ピンホ−ル、節穴や加工時に
発生する干割れ、微細なヘアクラック、プレ−ナ−のナ
イフマ−ク、プレスマ−ク、等大小さまざまの凹凸が存
在する。この為、外観により等級区分される製品では、
その欠点のため低グレ−ド品と看なされたり、また、当
該製品の表面に、紙、突き板、プラスチックシ−ト等を
二次的に接着する場合には、これら欠点の影響が、製品
の表面に現れ、問題となるケ−スが多々ある。例えば、
合板表面に数十〜数百ミクロンという極めて薄い紙や突
き板を貼る場合、接着後あるいは塗装後に、割れや節
穴、時として導管までもが、表面に悪影響を及ぼし、美
観を損ないクレ−ムの原因となることがある。
2. Description of the Related Art On the surface of plywood and laminated wood, there are conduits, barbs, pinholes, cracks caused by knot holes and processing, fine hair cracks, planer knife markers on the surface of wood. -There are various unevennesses such as black and white, press marks and the like. Therefore, for products classified by appearance,
Due to its defects, it is regarded as a low grade product, and when paper, veneer, plastic sheet, etc. are secondarily adhered to the surface of the product, the effects of these defects are There are many cases that appear on the surface of and cause problems. For example,
When sticking an extremely thin paper or veneer of several tens to several hundreds of microns on the surface of plywood, cracks, knot holes, and sometimes even pipes after bonding or painting adversely affect the surface and damage the aesthetics. It may be a cause.

【0003】従来より、これら欠点をカバ−する手段と
して、アクリル樹脂、エポキシ樹脂、ウレタン樹脂等を
ベ−スとしたパテを用いて、当該パテを塗り込む方式が
採られているが、パテの乾燥が、主として水や有機溶剤
の揮散に基づくため、硬化後、充填部が陥没するいわゆ
る「目やせ」が発生したり、逆に、発泡して後工程での
サンディング処理で気泡の多い充填物が得られ、機械的
強度が低下したり、また、乾燥に長時間を要したり、水
不溶性のため作業性が悪いといった問題があった。
Conventionally, as a means for covering these defects, a method of applying the putty using a putty made of an acrylic resin, an epoxy resin, a urethane resin or the like has been adopted. Since the drying is mainly based on the volatilization of water and organic solvents, so-called "eye loss" occurs, in which the filling part collapses after curing, or conversely, foaming and filling with a lot of bubbles in the sanding process in the post process. However, there are problems that the mechanical strength is lowered, that it takes a long time to dry, and that the workability is poor because it is insoluble in water.

【0004】一方、ホルムアルデヒド系樹脂も当該用途
に使用されることがある。ホルムアルデヒド系樹脂は、
木材に対する良好な接着性を有し、また、調合糊液の粘
度の安定性や水可溶性といった良好な作業性を有し、さ
らには、その大きなメリットとして、量産され、コスト
が安く、経済的である。しかるに、一般的に,ホルムア
ルデヒド系樹脂、例えば尿素樹脂では,加熱硬化させる
と,系中の水分のため発泡し,硬化後脆弱なスポンジ状
となったり、同じく水分のため収縮したり、さらには、
元来有している低耐久性のため割れが発生し、当該用途
には全く不向きと考えられていた。
On the other hand, formaldehyde resins are also sometimes used for this purpose. Formaldehyde resin is
It has good adhesion to wood, good workability such as viscosity stability and water solubility of the prepared paste solution, and its major advantages are mass production, low cost and economical. is there. However, in general, when a formaldehyde resin, such as a urea resin, is heat-cured, it foams due to water in the system, becomes a brittle sponge after curing, and also contracts due to water.
It was considered to be completely unsuitable for this application because of cracking due to its low durability originally.

【0005】[0005]

【発明が解決しょうとする課題】本発明は、木材に対す
る良好な接着性、調合糊液の粘度の安定性や水可溶性と
いった良好な作業性、さらには、経済性を有する当該ホ
ルムアルデヒド系樹脂の利点を生かし、当該用途に対す
る改良技術を提供することを目的としたものである。
DISCLOSURE OF THE INVENTION The present invention provides advantages of the formaldehyde-based resin having good adhesion to wood, good workability such as stability of viscosity of prepared paste solution and water solubility, and economical efficiency. The present invention aims to provide an improved technique for the use by utilizing the above.

【0006】[0006]

【課題を解決するための手段】本発明は、導管、割れ、
ヘアクラック、ピンホ−ル等の凹面を有する合板、集成
材などの木製ボ−ド類表面にパテを塗布し、当該表面を
補修し、目止めする際に、(1)固形分が78〜85%
で、その中に13〜20%のホルムアルデヒド系樹脂を
含有してなる主剤と(2)硬化剤の2種混合から成るパ
テを塗布し、当該パテを硬化させることを特徴とする木
製ボ−ド類の表面補修・目止め方法に係るものである。
SUMMARY OF THE INVENTION The present invention is directed to conduits, cracks,
When applying putty to the surface of wooden boards such as plywood having a concave surface such as hair cracks and pinholes and laminated wood, and repairing and sealing the surface, (1) the solid content is 78 to 85. %
Then, a putty consisting of a mixture of two kinds of a main agent containing 13 to 20% of formaldehyde resin and (2) a curing agent is applied therein, and the putty is cured. It is related to the surface repair / sealing method of a class.

【0007】本発明では、上記手段により、特に、パテ
の主剤中に占める当該樹脂の割合を、硬化性、耐水性を
阻害しない程度に少なくし、一方、主剤において、当該
樹脂と充填剤よりなる系における固形分について工夫を
施し、充填剤により高固形分とすることによって、ホル
ムアルデヒド系樹脂のもつ上記の欠点を改善することが
可能となった。即ち、本発明の完成に際し、本発明者ら
の鋭意検討によれば、当該系中の固形分が78%未満で
は、硬化後に収縮とそれに伴う割れが観察されることが
判った。従って、これらを解消するためには、それより
も高固形分とする必要があるが、余りにも高固形分では
不都合を生じるし、さらに、その中に占めるホルムアル
デヒド系樹脂の含有率(以下樹脂率ということもある)
も大きく影響を与えることも判った。つまり、ホルムア
ルデヒド系樹脂は、硬化する過程で縮合反応により水を
生成する。この水は、系中に調製時より存在する水と同
様、熱硬化時の発泡をもたらしたり、逆に、硬化過程で
揮散し硬化物の収縮(いわゆる目やせ)や割れを引き起
こすのである。ただし、この現象を抑制するために、樹
脂率を大きく低減させると、バインダ−としての凝集力
に欠け、パテの十分な強度と耐水性能が得られないこと
も判った。そこで、本発明者らは更に鋭意検討した結
果、固形分を78〜85%とし、その内の樹脂率を13
〜20%とすることによって、先に述べたような発泡、
目やせ、割れが認められず、かつ、凝集力、耐水性、耐
久性に優れたパテを開発することが可能となった
In the present invention, by the above means, the proportion of the resin in the main component of the putty is reduced to such an extent that curability and water resistance are not impaired, while the main component comprises the resin and the filler. By devising the solid content in the system and increasing the solid content by the filler, it has become possible to improve the above-mentioned drawbacks of the formaldehyde resin. That is, upon completion of the present invention, the inventors of the present invention have made earnest studies and found that when the solid content in the system is less than 78%, shrinkage and accompanying cracking are observed after curing. Therefore, in order to eliminate these, it is necessary to make the solid content higher than that, but too high a solid content causes inconvenience, and further, the content rate of the formaldehyde resin in it (hereinafter referred to as resin rate). Sometimes
It was also found to have a great influence. That is, the formaldehyde resin produces water by a condensation reaction in the process of curing. This water causes foaming at the time of thermosetting as well as water existing in the system from the time of preparation, and conversely volatilizes in the curing process to cause shrinkage (so-called eye loss) or cracking of the cured product. However, it was also found that if the resin ratio is greatly reduced in order to suppress this phenomenon, the cohesive force as a binder is lacking, and sufficient strength and water resistance of the putty cannot be obtained. Therefore, as a result of further diligent studies, the present inventors have determined that the solid content is 78 to 85%, and the resin ratio therein is 13%.
By setting the content to ˜20%, the foaming as described above,
It has become possible to develop putty that has no cohesiveness, water resistance, and durability with no visible skin loss or cracking.

【0008】以下、本発明についてその構成を補充す
る。本発明に使用される主剤は、ホルムアルデヒド系樹
脂と充填剤とを含有して成る。本発明で言うホルムアル
デヒド系樹脂とは、木材工業で一般的に使用されるもの
で良く、尿素(A)、メラミン(B)、フェノ−ル
(C)のうち1種または2種以上の化学種とホルムアル
デヒドの共縮合体を指し、性状を左右するモル比、すな
はち選ばれた尿素(A)、メラミン(B)、フェノ−ル
(C)のうち1種または2種以上の化学種のモル数に対
するホルムアルデヒド(F)のモル数比(F/A,B,
C)は1.3〜2.5が好ましい。当該樹脂は、チオ尿
素、ベンゾグアナミン、タンニン、リゾニン、クレゾ−
ル、レゾルシン等で変性することも可能である。
The constitution of the present invention will be supplemented below. The main agent used in the present invention comprises a formaldehyde resin and a filler. The formaldehyde resin referred to in the present invention may be one generally used in the wood industry, and one or more chemical species of urea (A), melamine (B) and phenol (C). And a formaldehyde co-condensate, which has a molar ratio that influences the properties, that is, one or more chemical species selected from urea (A), melamine (B), and phenol (C) selected. The mole ratio of formaldehyde (F) to the mole number (F / A, B,
C) is preferably 1.3 to 2.5. The resin is thiourea, benzoguanamine, tannin, rhizonine, crezo-
It is also possible to denature it with resulcin, resorcin, etc.

【0009】上記充填剤としては、例えば、クレ−、炭
酸カルシウム、硫酸カルシウム、酸化チタン、ベントナ
イト、ドロマイト等の無機系充填剤、または、木粉、小
麦粉、米粉、大豆粉、ヤシ殻粉、コ−ンスタ−チ等の植
物性充填剤が使用可能である。当該主剤には、充填剤に
可撓性を付与するためにポリ酢酸ビニル樹脂エマルジョ
ン、エチレン酢酸ビニル樹脂エマルジョン、スチレンゴ
ムラテックス、ニトリルゴムラテックス等の可撓性付与
剤を適量混合することも可能である。
Examples of the above-mentioned filler include inorganic fillers such as clay, calcium carbonate, calcium sulfate, titanium oxide, bentonite and dolomite, or wood flour, wheat flour, rice flour, soybean flour, coconut shell flour, coke A vegetable filler such as starch can be used. It is also possible to mix an appropriate amount of a flexibility-imparting agent such as polyvinyl acetate resin emulsion, ethylene-vinyl acetate resin emulsion, styrene rubber latex, nitrile rubber latex or the like with the base material in order to impart flexibility to the filler. is there.

【0010】本発明においては、主剤の固形分は78〜
85wt%、その中のホルムアルデヒド系樹脂の割合は
13〜20wt%の範囲にあることが必要である。当該
系の固形分が78wt%未満では、硬化後に収縮とそれ
に伴う割れが発生し、一方、当該系の固形分が85wt
%を超えるときには、バインダ−としての凝集力に欠
け、パテの十分な強度と耐水性能が得られ難い。これら
固形分は、その中に占めるホルムアルデヒド系樹脂の含
有率(樹脂率)とのバランスをとることが必要であり、
主剤中のホルムアルデヒド系樹脂の割合が13wt%未
満では、バインダ−としての凝集力に欠け、パテの十分
な強度と耐水性能が得られ難いし、一方、20wt%を
超えるときには、熱硬化時の発泡をもたらしたり、逆
に、硬化過程で水分が揮散し硬化物の収縮(いわゆる目
やせ)や割れを引き起こし易い。
In the present invention, the solid content of the main component is 78 to
It is necessary that the content of the formaldehyde-based resin is 85 wt% and that the content of the formaldehyde resin is in the range of 13 to 20 wt%. If the solid content of the system is less than 78 wt%, shrinkage and accompanying cracking will occur after curing, while the solid content of the system will be 85 wt%.
When it exceeds%, the cohesive force as a binder is insufficient, and it is difficult to obtain sufficient strength and water resistance of the putty. These solid contents need to be balanced with the content rate (resin rate) of the formaldehyde resin in the solid content,
When the proportion of the formaldehyde resin in the base resin is less than 13 wt%, the cohesive force as a binder is lacking, and it is difficult to obtain sufficient strength and water resistance of the putty. On the other hand, when it exceeds 20 wt%, foaming during thermosetting occurs. Or conversely, moisture is likely to evaporate during the curing process to cause shrinkage (so-called eye loss) or cracking of the cured product.

【0011】パテは、(1)ホルムアルデヒド系樹脂を
含有してなる主剤と(2)硬化剤の2種混合タイプで使
用される。硬化剤としては、ホルムアルデヒド系樹脂の
硬化促進剤として一般に知られている塩化アンモン、硫
酸アンモン、酢酸アンモン等のアンモニウム塩、塩化ア
ルミニウム、硫酸アルミニウム等の酸性塩、塩酸、硫酸
等の無機塩、酢酸、シュウ酸、パラトルエンスルホン酸
等の有機酸を1種または2種以上の組み合わせで単体ま
たは希釈液、水溶液として用いればよい。上記した可撓
性付与剤を混合する場合、また、上記した硬化剤を粉末
として用いる場合は問題ないが、液体で用いる場合は主
剤と混合されると粘度が低下し、木部に充填された時に
流れてしまい硬化後目やせとなって現れることがあるの
で、これを解決するために、当該硬化液に、ポリビニル
アルコ−ル、ヒドロキシエチルセルロ−ス、カルボキシ
メチルセルロ−ス、コ−ンスタ−チ、小麦粉、大豆粉等
のいわゆる増粘剤を添加してシロップ状、あるいはペ−
スト状とするとよい。
The putty is used as a mixture of two kinds of (1) a main agent containing a formaldehyde resin and (2) a curing agent. Examples of the curing agent include ammonium salts such as ammonium chloride, ammonium sulfate, and ammonium acetate, which are generally known as curing accelerators for formaldehyde resins, acidic salts such as aluminum chloride and aluminum sulfate, inorganic salts such as hydrochloric acid and sulfuric acid, and acetic acid. , Organic acids such as oxalic acid and paratoluene sulfonic acid may be used alone or in combination of two or more as a single substance or as a diluting solution or an aqueous solution. When the above-mentioned flexibility-imparting agent is mixed, or when the above-mentioned curing agent is used as a powder, there is no problem, but when it is used as a liquid, the viscosity is lowered when mixed with the main agent, and the wood is filled. Since it sometimes flows and may appear as a thin layer after curing, in order to solve this, polyvinyl alcohol, hydroxyethyl cellulose, carboxymethyl cellulose, cone star are added to the curing liquid. Soybean flour, soybean flour, etc.
It is good to make a strike.

【0012】本発明では、パテを塗布後、当該パテを硬
化させる。硬化は加熱により促進されるが、熱風タイプ
のドライヤ−、逆赤外線タイプのドライヤ−の使用が勧
められる。80〜200℃の雰囲気温度が適当である。
In the present invention, after applying the putty, the putty is cured. The curing is accelerated by heating, but it is recommended to use a hot air type dryer or a reverse infrared type dryer. An ambient temperature of 80 to 200 ° C is suitable.

【0013】[0013]

【実施例】次に、本発明を実施例に基づいて説明する。 実施例1. (1)主剤の調製 メラミン・ユリア樹脂(商品名:大鹿レヂン PWP−
520C/大鹿振興社製、固形分70%)100重量部
に、水42重量部と分散剤3重量部を加え撹拌しつつ,
クレ−265重量部を徐々に分散させた。 (2)硬化剤の調製 塩化アンモニウム20重量部を水80重量部に溶解さ
せ、コ−ンスタ−チ10重量部を徐々に加えて分散させ
た。混合物を70〜80℃に加温し糊化させて硬化剤ペ
−ストを得た。上記主剤と硬化剤を、重量比で100:
5に混ぜ、導管、割れ、ヘアクラック、ピンホ−ル等を
有した9ミリ合板上に、ヘラで均一に塗布し、80〜1
50℃乾燥器中で完全硬化させた。
EXAMPLES Next, the present invention will be explained based on examples. Example 1. (1) Preparation of main agent Melamine-urea resin (trade name: Oshika Resin PWP-
520C / Oshika Shinko Co., Ltd., solid content 70%) 100 parts by weight, 42 parts by weight of water and 3 parts by weight of dispersant are added and stirred,
Kure-265 parts by weight were gradually dispersed. (2) Preparation of curing agent Ammonium chloride (20 parts by weight) was dissolved in water (80 parts by weight), and 10 parts by weight of cone starch was gradually added and dispersed. The mixture was heated to 70 to 80 ° C. and gelatinized to obtain a hardener paste. The weight ratio of the main component and the curing agent is 100:
Mix with 5 and apply evenly with a spatula on a 9 mm plywood having conduits, cracks, hair cracks, pinholes, etc., 80-1
It was completely cured in a 50 ° C. oven.

【0014】比較例1. (1)主剤の調製 ユリア樹脂接着剤(商品名:大鹿レヂン #104/大
鹿振興社製、固形分70%)100重量部に変性ポリ酢
酸ビニル樹脂接着剤(商品名:マルチボンド #530
/大鹿振興社製、固形分55%)20重量部、分散剤1
重量部を加え、撹拌しつつクレ−80重量部を分散させ
た。 (2)硬化剤の調製 硫酸アンモニウム40重量部を水60重量部に溶解させ
たものを調製。上記主剤と硬化剤を重量比で100:
2.5に混ぜ、実施例1と同様の方法で塗付、硬化させ
た。
Comparative Example 1. (1) Preparation of main agent Urea resin adhesive (trade name: Oshika Resin # 104 / Oshika Shinko Co., Ltd., solid content 70%) 100 parts by weight of modified polyvinyl acetate resin adhesive (trade name: Multibond # 530)
/ Oshika Shinko Co., Ltd., solid content 55%) 20 parts by weight, dispersant 1
By weight, 80 parts by weight of Kle was dispersed with stirring. (2) Preparation of curing agent Prepared by dissolving 40 parts by weight of ammonium sulfate in 60 parts by weight of water. The weight ratio of the main agent and the curing agent is 100:
The mixture was mixed with 2.5 and applied and cured in the same manner as in Example 1.

【0015】比較例2. (1)主剤の調製 ユリア樹脂接着剤(商品名:大鹿レヂン #104/同
上)30重量部、メラミン樹脂接着剤(商品名:大鹿レ
ヂン M34/同上、固形分60%)70重量部、変性
ポリ酢酸ビニル樹脂接着剤(商品名:マルチボンド #
530/同上)20重量部、水50重量部、分散剤1重
量部を加え、撹拌しつつクレ−120重量部を徐々に分
散させた。 (2)硬化剤の調製 塩化アンモン20重量部を水80に溶解させたものを調
製。上記主剤と硬化剤を重量比で100:5に混ぜ、実
施例1と同様の方法で塗付、硬化させた。
Comparative Example 2. (1) Preparation of main agent 30 parts by weight of urea resin adhesive (trade name: Oshika Resin # 104 / same as above), 70 parts by weight of melamine resin adhesive (product name: Oshika Resin M34 / as above, solid content 60%), modified poly Vinyl acetate resin adhesive (Product name: Multibond #
530 / same as above) 20 parts by weight, water 50 parts by weight and dispersant 1 part by weight were added, and while stirring, 120 parts by weight of the clay was gradually dispersed. (2) Preparation of curing agent Prepared by dissolving 20 parts by weight of ammonium chloride in water 80. The above main agent and curing agent were mixed at a weight ratio of 100: 5, and applied and cured in the same manner as in Example 1.

【0016】これら実施例および比較例における性能評
価結果を表1に示す。
Table 1 shows the results of performance evaluation in these examples and comparative examples.

【0017】[0017]

【表1】 [Table 1]

【0018】[0018]

【発明の効果】本発明によれば、木材に対する良好な接
着性、作業性、さらには、経済性を有する当該ホルムア
ルデヒド系樹脂の利点を生かし、導管、割れ、ヘアクラ
ック、ピンホ−ル等の凹面を有する合板、集成材などの
木製ボ−ド類表面の補修、目止め用途に対するホルムア
ルデヒド系樹脂のもつ欠点を改善することが可能とな
り、発泡、目やせ、割れが認められず、かつ、凝集力、
耐水性、耐久性に優れたパテを開発することに成功し
た。
According to the present invention, the advantage of the formaldehyde resin having good adhesion to wood, workability, and economy can be utilized, and concave surfaces such as conduits, cracks, hair cracks and pinholes can be obtained. It is possible to repair the surface of wooden boards such as plywood and laminated wood, and to improve the drawbacks of formaldehyde resins for sealing applications, and no foaming, blinding or cracking is observed, and cohesive strength. ,
We succeeded in developing putty with excellent water resistance and durability.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】導管、割れ、ヘアクラック、ピンホ−ル等
の凹面を有する合板、集成材などの木製ボ−ド類表面に
パテを塗布し、当該表面を補修し、目止めする際に、
(1)固形分が78〜85%で、その中に13〜20%
のホルムアルデヒド系樹脂を含有してなる主剤と(2)
硬化剤の2種混合から成るパテを塗布し、当該パテを硬
化させることを特徴とする木製ボ−ド類の表面補修・目
止め方法。
Claims: 1. When applying putty to the surface of a wooden board such as a conduit, a crack, a hair crack, a plywood having a concave surface such as a pinhole, a laminated lumber, etc.
(1) Solid content is 78 to 85%, of which 13 to 20%
And a main agent containing the formaldehyde resin of (2)
A surface repair / sealing method for wooden boards, which comprises applying a putty composed of a mixture of two kinds of curing agents and curing the putty.
【請求項2】主剤が、ホルムアルデヒド系樹脂と充填剤
から成る、請求項1に記載の木製ボ−ド類の表面補修・
目止め方法。
2. The surface repair of the wooden board according to claim 1, wherein the main component is a formaldehyde resin and a filler.
How to stop.
JP25411191A 1991-09-06 1991-09-06 Method for repairing and sealing surface of wood board Pending JPH0564769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25411191A JPH0564769A (en) 1991-09-06 1991-09-06 Method for repairing and sealing surface of wood board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25411191A JPH0564769A (en) 1991-09-06 1991-09-06 Method for repairing and sealing surface of wood board

Publications (1)

Publication Number Publication Date
JPH0564769A true JPH0564769A (en) 1993-03-19

Family

ID=17260380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25411191A Pending JPH0564769A (en) 1991-09-06 1991-09-06 Method for repairing and sealing surface of wood board

Country Status (1)

Country Link
JP (1) JPH0564769A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6010793A (en) * 1993-11-22 2000-01-04 Yamaha Corporation Wood board, surface-decorated wood board, and manufacturing method therefor
WO2001038056A1 (en) * 1999-11-19 2001-05-31 Dimitar Borissov Nikolov Method of modifying of solid wood
EP1238904A3 (en) * 2001-03-05 2003-01-22 Illinois Tool Works Inc. Wood replacement system and method
CN103286832A (en) * 2013-05-22 2013-09-11 湖州职业技术学院 Acacia mangium board mending agent and acacia mangium board mending method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6010793A (en) * 1993-11-22 2000-01-04 Yamaha Corporation Wood board, surface-decorated wood board, and manufacturing method therefor
WO2001038056A1 (en) * 1999-11-19 2001-05-31 Dimitar Borissov Nikolov Method of modifying of solid wood
EP1238904A3 (en) * 2001-03-05 2003-01-22 Illinois Tool Works Inc. Wood replacement system and method
CN103286832A (en) * 2013-05-22 2013-09-11 湖州职业技术学院 Acacia mangium board mending agent and acacia mangium board mending method

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