JPH0562051U - Heat sink and electronic component device - Google Patents

Abstract

(57) [Summary] [Purpose] To improve the heat dissipation efficiency of a heat sink used as a heat dissipation means for electronic components. [Structure] The heat sink 1 includes an electronic component 5 via a bottom plate 4.
It is composed of a pillar 2 for transmitting heat from the column, and a spiral heat radiating plate 3 formed around the pillar 2. The heat generated from the electronic component 5 is radiated from the support column 2 and the heat radiating plate 3, the air around the heat sink 1 is warmed, and the warmed air rises while vortexing. Since cool air flows into the heat dissipation plate 3 from the periphery, the air flow can be positively created without considering the direction of the air flow, and efficient and sufficient cooling can be performed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heat sink used as a heat radiating means for electronic parts, and more particularly to a heat sink capable of efficiently cooling electronic parts by positively creating a flow of air without considering the direction of air flow. ..

[0002]

[Prior Art]

 Conventionally, this type of heat sink has been shown in FIG.

In FIG. 4, reference numeral 10 denotes a heat sink, which is composed of a column 20, a plurality of disc-shaped heat dissipation plates 30, and a bottom plate 40.

A column 20 for transmitting heat from the bottom plate 40 is formed in substantially the center of the bottom plate 40, and a plurality of disc-shaped heat radiation plates 30 are fixed around the column 20 at regular intervals. .. The electronic component 50 is cooled by mounting the bottom plate 40 of the heat sink 10 on the upper surface of the electronic component 50 such as an IC component to be cooled and radiating heat from the heat sink 10.

[0005]

[Problems to be solved by the device]

 In the above-described conventional heat sink 10, since there is no escape path for the air warmed by the heat from the electronic component 50 between the disc-shaped heat sinks 30, this air may settle and the cooling cannot be performed efficiently. There was a flaw.

Therefore, an object of the present invention is to improve the heat dissipation efficiency of a heat sink.

[0007]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention has a structure in which a heat sink used for cooling an electronic component is composed of a pillar and a spiral heat radiating plate formed around the pillar.

[0008]

[Action]

 According to the heat sink 1 having the above structure, the air warmed by the heat radiation rises while winding the vortex along the spiral heat radiation plate 3. Therefore, since negative pressure is generated near the heat sink 3 and cold air flows into the heat sink 3 from the surroundings, warm air is used to positively control the air flow without considering the direction in which the air flows. You can make it. Therefore, the electronic component 5 efficiently radiates heat, and thus is sufficiently cooled.

[0009]

【Example】

 Next, an embodiment of the heat sink according to the present invention will be described in detail with reference to FIGS.

FIG. 1 is a perspective view showing a heat sink according to an embodiment of the present invention.

In the drawings, reference numeral 1 denotes a heat sink, which is composed of a pillar 2, a spiral heat dissipation plate 3, and a bottom plate 4. The heat sink 1 is provided with a bottom plate 4 having a surface area substantially the same as that of the upper surface of the electronic component 5 at the bottom.

A column 2 for transmitting heat from the bottom plate 4 is formed substantially in the center of the bottom plate 4, and a heat dissipation plate 3 having a spiral shape is formed around the column 2.

FIG. 2 is a perspective view showing a heat sink according to another embodiment of the present invention.

In the drawings, the electronic component 5 is directly attached to the support column 2 that transfers heat from the electronic component 5.

FIG. 3 is a perspective view showing a heat sink according to another embodiment of the present invention.

In the drawing, an electronic component 5 smaller than the bottom plate 4 is mounted on the bottom plate 4 that transfers heat of the electronic component 5.

Therefore, according to such a heat sink, the electronic component 5 to be cooled is adhered or screwed and fixed to the bottom plate 4 or the pillar 2 of the heat sink 1. As a result, the heat of the electronic component 5 is transmitted to the heat radiating plate 3 through the bottom plate 4 and the column 2 or the column 2. The conducted heat is radiated from the heat radiating plate 3 to warm the air around the heat sink 1. This warmed air rises while winding a vortex along the spiral radiator plate 3, so that a negative pressure is generated near the radiator plate 3. Therefore, cold air flows into the heat dissipation plate 3 from the periphery, and convection of the air occurs, and this convection allows efficient and sufficient heat dissipation and cooling. Therefore, according to this example, warmed air can be used to positively create an air flow without considering the direction of air flow, and heat can be efficiently dissipated. Further, according to this example, it is possible to provide a heat sink which is smaller in size than the conventional heat sink and has good heat dissipation efficiency.

[0018]

[Effect of the device]

 As described above, according to the present invention, by forming the heat dissipation plate in a spiral shape, the rising airflow of the heated air causes cool air to flow from the surroundings and convection of the air, thereby dissipating and cooling the electronic components. Is effective and efficient.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment.

FIG. 2 is a perspective view of another embodiment.

FIG. 3 is a perspective view of another embodiment.

FIG. 4 is a diagram showing a conventional example, in which (a) is a perspective view and (b) is a front view.

[Explanation of symbols]

 1 heat sink 2 support 3 heat sink 4 bottom plate 5 electronic component

Claims (3)

[Scope of utility model registration request] 1. A heat sink used for cooling an electronic component, which comprises a support and a spiral heat dissipation plate formed around the support. 2. A heat sink used for cooling an electronic component, which comprises a bottom plate for mounting the electronic component, a support erected on the bottom plate, and a spiral heat dissipation plate formed around the support. A heat sink characterized in that. 3. An electronic component device, wherein an electronic component is directly attached to the support pillar of the heat sink according to claim 1.