JPH0558393B2 - - Google Patents

Info

Publication number

JPH0558393B2

JPH0558393B2 JP29983287A JP29983287A JPH0558393B2 JP H0558393 B2 JPH0558393 B2 JP H0558393B2 JP 29983287 A JP29983287 A JP 29983287A JP 29983287 A JP29983287 A JP 29983287A JP H0558393 B2 JPH0558393 B2 JP H0558393B2

Authority

JP

Japan

Prior art keywords

sealing

honeycomb

hole

holes

mask material

Prior art date

1987-11-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

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• 239000000463 material Substances 0.000 claims description 37
• 238000000034 method Methods 0.000 claims description 30
• 238000007789 sealing Methods 0.000 claims description 30
• 239000003566 sealing material Substances 0.000 claims description 19
• 238000005192 partition Methods 0.000 claims description 7
• 239000010408 film Substances 0.000 description 6
• 239000002002 slurry Substances 0.000 description 5
• 238000007796 conventional method Methods 0.000 description 4
• 239000000843 powder Substances 0.000 description 3
• 239000010409 thin film Substances 0.000 description 3
• 229910052581 Si3N4 Inorganic materials 0.000 description 2
• 239000011230 binding agent Substances 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 239000004927 clay Substances 0.000 description 2
• 239000002131 composite material Substances 0.000 description 2
• 238000010586 diagram Methods 0.000 description 2
• 238000001125 extrusion Methods 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 150000004767 nitrides Chemical class 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
• 239000004840 adhesive resin Substances 0.000 description 1
• 229920006223 adhesive resin Polymers 0.000 description 1
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
• 229910052799 carbon Inorganic materials 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052878 cordierite Inorganic materials 0.000 description 1
• JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
• 238000007598 dipping method Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000010304 firing Methods 0.000 description 1
• 239000012530 fluid Substances 0.000 description 1
• 239000000446 fuel Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 230000000873 masking effect Effects 0.000 description 1
• 150000001247 metal acetylides Chemical class 0.000 description 1
• 238000003825 pressing Methods 0.000 description 1
• 238000000746 purification Methods 0.000 description 1
• 239000002994 raw material Substances 0.000 description 1
• 239000000565 sealant Substances 0.000 description 1
• 229910052710 silicon Inorganic materials 0.000 description 1
• 239000010703 silicon Substances 0.000 description 1
• HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
• 229910010271 silicon carbide Inorganic materials 0.000 description 1