JPH0557846U - Curing furnace for resin encapsulation of semiconductor chips - Google Patents

Curing furnace for resin encapsulation of semiconductor chips

Info

Publication number
JPH0557846U
JPH0557846U JP443592U JP443592U JPH0557846U JP H0557846 U JPH0557846 U JP H0557846U JP 443592 U JP443592 U JP 443592U JP 443592 U JP443592 U JP 443592U JP H0557846 U JPH0557846 U JP H0557846U
Authority
JP
Japan
Prior art keywords
carrier tape
resin
semiconductor chip
furnace
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP443592U
Other languages
Japanese (ja)
Other versions
JP2516905Y2 (en
Inventor
満彦 谷口
修 冨岡
雅典 秋田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to JP1992004435U priority Critical patent/JP2516905Y2/en
Publication of JPH0557846U publication Critical patent/JPH0557846U/en
Application granted granted Critical
Publication of JP2516905Y2 publication Critical patent/JP2516905Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Tunnel Furnaces (AREA)

Abstract

(57)【要約】 【目的】 半導体チップを装着し、かつこのチップを封
止用樹脂でコーテイングしたキャリアテープを、多段状
に蛇行させて炉内を走行させて前記樹脂を硬化させる際
し、樹脂の液だれやクラック等の発生を完全に防止する
ことができると共に基準温度を補正しないで加熱制御し
得るようにする。 【構成】 キャリアテープが直進走行される箇所に加え
て、キャリアテープがその走行方向を反対方向にされる
箇所においても、キャリアテープの前記樹脂を加熱し得
るように赤外線パネルヒータを配設する。
(57) [Abstract] [Purpose] When a semiconductor chip is mounted and a carrier tape coated with a sealing resin is made to meander in multiple steps to run in a furnace to cure the resin, It is possible to completely prevent the occurrence of resin dripping, cracking, and the like, and to control heating without correcting the reference temperature. An infrared panel heater is provided so as to heat the resin of the carrier tape not only in a position where the carrier tape travels straight, but also in a position where the travel direction of the carrier tape is reversed.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial application]

本考案は、半導体チップの樹脂封止用硬化炉に関するものである。 The present invention relates to a curing furnace for resin encapsulation of semiconductor chips.

【0002】[0002]

【従来の技術】[Prior Art]

キャリアテープに装着された半導体チップをコーテイングしている封止用樹脂 (熱硬化性樹脂)を加熱して硬化させる半導体チップの樹脂封止用硬化炉は従来 、各種型式のものが公知であり、例えば、特開平3−108346号公報又は特 開平3−120842号公報においては、前記キャリアテープを、炉本体の入口 から出口に向って複数段状に蛇行させて走行させ得るように炉本体内に複数の送 りロールを配設すると共に、前記入口から出口に向って走行せしめられるキャリ アテープが直進走行される箇所に、前記封止用樹脂を加熱し得るようにヒータを 配設した樹脂封止用硬化炉が開示されている。 Conventionally, various types of resin encapsulation curing furnaces for semiconductor chip encapsulation that heat and cure encapsulation resin (thermosetting resin) coating a semiconductor chip mounted on a carrier tape are known. For example, in Japanese Patent Laid-Open No. 3-108346 or Japanese Patent Publication No. 3-120842, the carrier tape is provided in the furnace body so that the carrier tape can be made to meander in a plurality of steps from the inlet to the outlet of the furnace body. A resin-sealed structure that has a plurality of feed rolls and a heater that can heat the sealing resin at the location where the carrier tape running from the inlet to the outlet travels straight. A curing oven is disclosed.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかし、係る硬化炉は、前記キャリアテープが直進走行される箇所だけに、ヒ ータを配設するものであるから、未硬化状態の前記封止用樹脂が送りロールの所 、すなわち、前記キャリアテープの走行方向が反対方向にされる箇所を通過する 際に一時的に冷却されて塗布姿の変形やクラック等が発生する恐れがあった。 However, in such a curing furnace, since the heater is arranged only at the position where the carrier tape travels straight, the uncured sealing resin is at the position of the feed roll, that is, the carrier. There is a risk that the coating may be deformed or cracked as it is temporarily cooled as it passes through a portion where the tape is running in the opposite direction.

【0004】 そこで、ここに到達するまでの直進走行せしめられる箇所で、実際に必要とさ れる基準温度よりも一段と高温度に(基準温度に降下温度を加えた温度に)加熱 するようにヒータ制御を行い、これにより前記キャリアテープが、その走行方向 を反対方向にされる箇所において、前記封止用樹脂が許容最低温度以下に冷却さ れるのを防止していたが、このような制御は煩わしい共に前記封止用樹脂が、一 時的に高温度にされるのでクラック等が発生する恐れがあった。[0006] Therefore, heater control is performed so as to heat the temperature to a temperature much higher than the actually required reference temperature (to a temperature obtained by adding the lowered temperature to the reference temperature) at a place where the vehicle is allowed to travel straight ahead until reaching here. In this way, the carrier tape was prevented from cooling the encapsulating resin to a temperature below the allowable minimum temperature at the location where the running direction of the carrier tape was opposite, but such control is troublesome. In both cases, the encapsulating resin is temporarily heated to a high temperature, which may cause cracks and the like.

【0005】 本考案は、このようなことに着目し、これを解決すべく各方面から鋭意検討の 結果、キャリアテープが直進走行される箇所に加えて、キャリアテープがその走 行方向を反対方向にされる箇所においても、キャリアテープの前記封止樹脂を加 熱し得るように赤外線パネルヒータを配設することにより、上述の問題を一挙に 解決し得ることを見出したのである。The present invention pays attention to such a situation, and as a result of earnest studies from various directions to solve this, as a result, in addition to the place where the carrier tape runs straight, the carrier tape runs in the opposite direction. It has been found that the above-mentioned problems can be solved all at once by disposing an infrared panel heater so that the sealing resin of the carrier tape can be heated even at the location indicated by.

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

すなわち、本考案に係る半導体チップの樹脂封止用硬化炉は、キャリアテープ に装着された半導体チップをコーテイングしている封止用樹脂を加熱して硬化さ せる半導体チップの樹脂封止用硬化炉において、前記キャリアテープを、炉本体 の入口から出口に向って複数段状に蛇行させて走行させ得るように前記炉本体内 に複数の送りロールを配設すると共に、前記入口から出口に向って走行せしめら れる前記キャリアテープが直進走行される箇所及びその走行方向が反対方向にさ れる箇所夫々に、前記封止用樹脂を加熱し得るように遠赤外線パネルヒータを配 設したことを特徴とするものである。 That is, the semiconductor chip resin encapsulation curing furnace according to the present invention is a semiconductor chip resin encapsulation curing furnace that heats and cures the encapsulation resin coating the semiconductor chip mounted on the carrier tape. In the above, a plurality of feed rolls are arranged in the furnace main body so that the carrier tape can be made to meander in a plurality of steps from the inlet to the outlet of the furnace main body, and the carrier tape can be moved from the inlet to the outlet. Far infrared panel heaters are provided so that the sealing resin can be heated at the location where the carrier tape is run straight and the location where the running direction is opposite. To do.

【0007】[0007]

【実施例】【Example】

以下、本考案に係る一実施例について図面に基いて述べると、図1において、 入口1及び出口2を有する炉本体3内に、送りローラ4a,4b及び遠赤外線パ ネルヒータ5a〜5kが配設されているが、係るローラ4a,4bはいずれも、 駆動し得るように装着され、かつキャリアテープ6の巾方向両端部夫々に列状に 一定ピッチで貫通されている送り穴に、送りローラ4a,4bの外周面に一定ピ ッチで突設されている送り爪を次々と係合させてキャリアテープ6を、入口1か ら出口2に向って複数段状に蛇行させて走行させ得るように配設されている。 An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, feed rollers 4a and 4b and far infrared panel heaters 5a to 5k are provided in a furnace body 3 having an inlet 1 and an outlet 2. However, both of the rollers 4a and 4b are mounted so that they can be driven, and the feed roller 4a is inserted into the feed holes that are penetrated in a row at both ends in the width direction of the carrier tape 6 at a constant pitch. , 4b so that the carrier tape 6 can be made to meander in a plurality of steps from the inlet 1 to the outlet 2 by successively engaging the feed claws protruding from the outer peripheral surface with a constant pitch. It is installed in.

【0008】 すなわち、キャリアテープ6は、これに半導体チップ7を装着するボンデイン グ工程及び装着された半導体チップ7を封止用樹脂(熱硬化性樹脂)でコーテイ ングするポッテイング工程等の前工程を経てここに移送されて来るが、係るロー ラ4a,4bで複数段状に蛇行されるように走行せしめられ、そして、係る走行 中において、遠赤外線パネルヒータ5a〜5e、5g,5h,5j,5kにより 、直進走行されるキャリアテープ6の前記封止用樹脂が輻射加熱されると共に、 遠赤外線パネルヒータ5f,5iにより、送りローラ4a,4bでその走行方向 が反対方向にされるキャリアテープ6の前記封止用樹脂が輻射加熱される。That is, the carrier tape 6 has a pre-process such as a bonding process for mounting the semiconductor chip 7 thereon and a potting process for coating the mounted semiconductor chip 7 with a sealing resin (thermosetting resin). Although it is transferred to here, it is made to travel so as to meander in a plurality of steps by the rollers 4a, 4b, and during the traveling, the far infrared panel heaters 5a to 5e, 5g, 5h, 5j, The sealing resin of the carrier tape 6 running straight ahead is radiantly heated by 5k, and the running direction is reversed by the feed rollers 4a and 4b by the far infrared panel heaters 5f and 5i. The sealing resin is radiantly heated.

【0009】 なお、遠赤外線パネルヒータ5a〜5kは、電熱プレートのセラミックコーテ イング体で構成され、これによる加熱制御は、封止用樹脂の種類等のコーテイン グ条件によって異なるが、コーテイングしている樹脂の姿が変形したり、あるい は他の物と接触すると付着してしまうといったことが発生しない状態に仮硬化さ せ得るような基準温度を目標に制御され、また、炉内雰囲気は、必要に応じて無 酸化雰囲気にされる。The far-infrared panel heaters 5a to 5k are composed of a ceramic coating body of an electric heating plate, and heating control by the heaters is performed, although it depends on the coating conditions such as the type of sealing resin. The temperature of the furnace is controlled so that it can be pre-cured so that the shape of the resin does not deform or adheres when it comes into contact with other objects. A non-oxidizing atmosphere is created if necessary.

【0010】 而して、キャリアテープ6が直進走行される箇所における加熱に加えて、その 走行方向が反対方向にされる箇所における加熱も行うことができるから、キャリ アテープ6の前記封止用樹脂を、仮硬化に好適な基準温度に近い温度に常時、加 熱保持することができ、従って、樹脂の液だれやクラック等の発生を完全に防止 することができると共に基準温度を補正しないで制御することができるから、そ の制御を容易化することができる。Therefore, in addition to the heating of the portion where the carrier tape 6 travels straight ahead, the heating of the portion where the traveling direction is in the opposite direction can be performed. Can be constantly heated and maintained at a temperature close to the reference temperature suitable for temporary curing, and therefore it is possible to completely prevent the occurrence of resin dripping, cracks, etc., and control without correcting the reference temperature. Therefore, the control can be facilitated.

【0011】 図2において、基準温度を80℃とした場合の遠赤外線パネルヒータ5a〜5 fによる第1段加熱に続いて、基準温度を100℃とした場合の遠赤外線パネル ヒータ5g〜5iによる第2段加熱を行い、更に続いて、基準温度を120℃と した場合の遠赤外線パネルヒータ5j〜5kによる第3段加熱を行ったときのキ ャリアテープ6の加熱温度を実線で示すが、鎖線で示されている従来の硬化炉に よるそれと比較して著しく基準温度に近い加熱温度が得られていることが判る。In FIG. 2, after the first-stage heating by the far infrared panel heaters 5a to 5f when the reference temperature is 80 ° C., the far infrared panel heaters 5g to 5i when the reference temperature is 100 ° C. The solid line indicates the heating temperature of the carrier tape 6 when the second stage heating is performed and then the third stage heating is performed by the far infrared panel heaters 5j to 5k when the reference temperature is 120 ° C. It can be seen that the heating temperature remarkably close to the reference temperature is obtained as compared with that by the conventional curing furnace shown in.

【0012】 なお、遠赤外線パネルヒータを用いているのは、他のヒータに比して、加熱の 迅速性等が優れているからである。また、徐々に高温加熱するように3段階に加 熱しているのは、最初から高温加熱すると、樹脂中の溶剤により気泡が発生した り、あるいはクラックが発生する恐れがあるからであり、かつ、このような多段 階加熱においては、第1段加熱のパスライン長さと温度プロフイルとによって硬 化炉の性能が決まるといっても過言でない。何故ならば、温度が低すぎると、液 だれが発生し、樹脂厚さの不均一や塗布姿の変形といった問題が生ずるからであ る。The far infrared panel heater is used because it is superior in heating speed and the like as compared with other heaters. In addition, the reason why the heating is performed in three stages so that the temperature is gradually raised to high temperature is that when the high temperature is heated from the beginning, bubbles may be generated or cracks may be generated due to the solvent in the resin, and In such multi-stage heating, it is no exaggeration to say that the performance of the hardening furnace is determined by the pass line length of the first stage heating and the temperature profile. This is because if the temperature is too low, dripping will occur, causing problems such as uneven resin thickness and deformation of the coating pattern.

【0013】 このようなことからして、半導体チップ7に封止用樹脂をポッテイングした方 の面を上側にして入口1から炉本体3内に移送されるキャリアテープ6に対し、 最初にその下面側だけから遠赤外線パネルヒータ5aにより加熱し、続いて、上 下両面側から遠赤外線パネルヒータ5b〜5eにより加熱するようにしている。 そして、更に、これに続く第2段加熱においては、前記下面側(半導体チップ7 に対して封止用樹脂をポッテイングした方の面と反対の面側)だけから遠赤外線 パネルヒータ5h,5gにより加熱すると共に第3段加熱においては、前記上面 側だけから遠赤外線パネルヒータ5j,5kにより加熱するようにして良好に硬 化処理し得るようにしている。From the above, the lower surface of the carrier tape 6 transferred from the inlet 1 into the furnace body 3 with the surface of the semiconductor chip 7 on which the sealing resin is potted facing upward is first The far-infrared panel heater 5a heats only from the side, and then the far-infrared panel heaters 5b to 5e heat from both upper and lower sides. Further, in the subsequent second stage heating, far infrared panel heaters 5h and 5g are used only from the lower surface side (the surface side opposite to the surface on which the sealing resin is potted with respect to the semiconductor chip 7). In addition to the heating, in the third stage heating, the far infrared ray panel heaters 5j and 5k are used to heat only from the upper surface side so that the hardening treatment can be performed well.

【0014】 以上、本考案に係る一実施例について述べたが、本考案においては、送りロー ラは、キャリアテープを三段以外の段数に蛇行させ得るように配設してもよく、 また、キャリアテープがその走行方向を反対方向にされる箇所において封止用樹 脂を加熱する遠赤外線パネルヒータを湾曲形状に構成してもよい。Although one embodiment according to the present invention has been described above, in the present invention, the feed roller may be arranged so that the carrier tape can meander in a number of stages other than three stages. The far-infrared panel heater that heats the sealing resin may be formed in a curved shape at a location where the carrier tape is run in the opposite direction.

【0015】[0015]

【考案の効果】[Effect of the device]

上述の如く、本考案によると、キャリアテープに装着された半導体チップをコ ーテイングしている封止用樹脂を、硬化に好適な基準温度に近い温度に常時、加 熱保持することができて、樹脂の液だれや割れ等の発生を完全に防止することが できると共に基準温度を補正しないで制御することができて制御の容易化を図る ことができる半導体チップの樹脂封止用硬化炉を得ることができる。 As described above, according to the present invention, the encapsulating resin coating the semiconductor chip mounted on the carrier tape can be constantly heated and maintained at a temperature close to the reference temperature suitable for curing. A curing furnace for resin encapsulation of a semiconductor chip that can completely prevent the occurrence of resin dripping and cracking, and can control without correcting the reference temperature to facilitate control. be able to.

【図面の簡単な説明】[Brief description of drawings]

【図1】半導体チップの樹脂封止用硬化炉の正面図であ
る。
FIG. 1 is a front view of a curing furnace for resin encapsulation of a semiconductor chip.

【図2】キャリアテープの加熱状態を示す線図である。FIG. 2 is a diagram showing a heated state of a carrier tape.

【符号の説明】[Explanation of symbols]

1 入口 2 出口 3 炉本体 4 送りローラ 5a〜5k 遠赤外線パネルヒータ 6 キャリアテープ 7 半導体チップ 1 Inlet 2 Outlet 3 Furnace body 4 Feed roller 5a-5k Far infrared panel heater 6 Carrier tape 7 Semiconductor chip

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 キャリアテープに装着された半導体チッ
プをコーテイングしている封止用樹脂を加熱して硬化さ
せる半導体チップの樹脂封止用硬化炉において、前記キ
ャリアテープを、炉本体の入口から出口に向って複数段
状に蛇行させて走行させ得るように前記炉本体内に複数
の送りロールを配設すると共に、前記入口から出口に向
って走行せしめられる前記キャリアテープが直進走行さ
れる箇所及びその走行方向が反対方向にされる箇所夫々
に、前記封止用樹脂を加熱し得るように遠赤外線パネル
ヒータを配設したことを特徴とする半導体チップの樹脂
封止用硬化炉。
1. A curing furnace for resin encapsulation of a semiconductor chip, which heats and cures a sealing resin coating a semiconductor chip mounted on a carrier tape, wherein the carrier tape is discharged from an inlet of a furnace body. A plurality of feed rolls are arranged in the furnace body so that the carrier tape can be made to meander in a plurality of steps toward a position where the carrier tape that is made to run from the inlet to the outlet is run straight and A far-infrared panel heater is provided so as to heat the encapsulating resin at each of the locations where the traveling directions are opposite to each other.
JP1992004435U 1992-01-09 1992-01-09 Curing furnace for resin encapsulation of semiconductor chips Expired - Fee Related JP2516905Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1992004435U JP2516905Y2 (en) 1992-01-09 1992-01-09 Curing furnace for resin encapsulation of semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1992004435U JP2516905Y2 (en) 1992-01-09 1992-01-09 Curing furnace for resin encapsulation of semiconductor chips

Publications (2)

Publication Number Publication Date
JPH0557846U true JPH0557846U (en) 1993-07-30
JP2516905Y2 JP2516905Y2 (en) 1996-11-13

Family

ID=11584163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1992004435U Expired - Fee Related JP2516905Y2 (en) 1992-01-09 1992-01-09 Curing furnace for resin encapsulation of semiconductor chips

Country Status (1)

Country Link
JP (1) JP2516905Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006145184A (en) * 2004-11-25 2006-06-08 Ricoh Co Ltd Heating device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289059A (en) * 1988-09-26 1990-03-29 Hitachi Electron Eng Co Ltd Baking method
JPH02278841A (en) * 1989-04-20 1990-11-15 Nec Corp Resin sealing apparatus for semiconductor device use

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289059A (en) * 1988-09-26 1990-03-29 Hitachi Electron Eng Co Ltd Baking method
JPH02278841A (en) * 1989-04-20 1990-11-15 Nec Corp Resin sealing apparatus for semiconductor device use

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006145184A (en) * 2004-11-25 2006-06-08 Ricoh Co Ltd Heating device
JP4566711B2 (en) * 2004-11-25 2010-10-20 株式会社リコー Heating device

Also Published As

Publication number Publication date
JP2516905Y2 (en) 1996-11-13

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