JPH0557846U - Curing furnace for resin encapsulation of semiconductor chips - Google Patents

Abstract

(57) [Abstract] [Purpose] When a semiconductor chip is mounted and a carrier tape coated with a sealing resin is made to meander in multiple steps to run in a furnace to cure the resin, It is possible to completely prevent the occurrence of resin dripping, cracking, and the like, and to control heating without correcting the reference temperature. An infrared panel heater is provided so as to heat the resin of the carrier tape not only in a position where the carrier tape travels straight, but also in a position where the travel direction of the carrier tape is reversed.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a curing furnace for resin encapsulation of semiconductor chips.

[0002]

[Prior Art]

 Conventionally, various types of resin encapsulation curing furnaces for semiconductor chip encapsulation that heat and cure encapsulation resin (thermosetting resin) coating a semiconductor chip mounted on a carrier tape are known. For example, in Japanese Patent Laid-Open No. 3-108346 or Japanese Patent Publication No. 3-120842, the carrier tape is provided in the furnace body so that the carrier tape can be made to meander in a plurality of steps from the inlet to the outlet of the furnace body. A resin-sealed structure that has a plurality of feed rolls and a heater that can heat the sealing resin at the location where the carrier tape running from the inlet to the outlet travels straight. A curing oven is disclosed.

[0003]

[Problems to be solved by the device]

 However, in such a curing furnace, since the heater is arranged only at the position where the carrier tape travels straight, the uncured sealing resin is at the position of the feed roll, that is, the carrier. There is a risk that the coating may be deformed or cracked as it is temporarily cooled as it passes through a portion where the tape is running in the opposite direction.

[0006] Therefore, heater control is performed so as to heat the temperature to a temperature much higher than the actually required reference temperature (to a temperature obtained by adding the lowered temperature to the reference temperature) at a place where the vehicle is allowed to travel straight ahead until reaching here. In this way, the carrier tape was prevented from cooling the encapsulating resin to a temperature below the allowable minimum temperature at the location where the running direction of the carrier tape was opposite, but such control is troublesome. In both cases, the encapsulating resin is temporarily heated to a high temperature, which may cause cracks and the like.

The present invention pays attention to such a situation, and as a result of earnest studies from various directions to solve this, as a result, in addition to the place where the carrier tape runs straight, the carrier tape runs in the opposite direction. It has been found that the above-mentioned problems can be solved all at once by disposing an infrared panel heater so that the sealing resin of the carrier tape can be heated even at the location indicated by.

[0006]

[Means for Solving the Problems]

 That is, the semiconductor chip resin encapsulation curing furnace according to the present invention is a semiconductor chip resin encapsulation curing furnace that heats and cures the encapsulation resin coating the semiconductor chip mounted on the carrier tape. In the above, a plurality of feed rolls are arranged in the furnace main body so that the carrier tape can be made to meander in a plurality of steps from the inlet to the outlet of the furnace main body, and the carrier tape can be moved from the inlet to the outlet. Far infrared panel heaters are provided so that the sealing resin can be heated at the location where the carrier tape is run straight and the location where the running direction is opposite. To do.

[0007]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, feed rollers 4a and 4b and far infrared panel heaters 5a to 5k are provided in a furnace body 3 having an inlet 1 and an outlet 2. However, both of the rollers 4a and 4b are mounted so that they can be driven, and the feed roller 4a is inserted into the feed holes that are penetrated in a row at both ends in the width direction of the carrier tape 6 at a constant pitch. , 4b so that the carrier tape 6 can be made to meander in a plurality of steps from the inlet 1 to the outlet 2 by successively engaging the feed claws protruding from the outer peripheral surface with a constant pitch. It is installed in.

That is, the carrier tape 6 has a pre-process such as a bonding process for mounting the semiconductor chip 7 thereon and a potting process for coating the mounted semiconductor chip 7 with a sealing resin (thermosetting resin). Although it is transferred to here, it is made to travel so as to meander in a plurality of steps by the rollers 4a, 4b, and during the traveling, the far infrared panel heaters 5a to 5e, 5g, 5h, 5j, The sealing resin of the carrier tape 6 running straight ahead is radiantly heated by 5k, and the running direction is reversed by the feed rollers 4a and 4b by the far infrared panel heaters 5f and 5i. The sealing resin is radiantly heated.

The far-infrared panel heaters 5a to 5k are composed of a ceramic coating body of an electric heating plate, and heating control by the heaters is performed, although it depends on the coating conditions such as the type of sealing resin. The temperature of the furnace is controlled so that it can be pre-cured so that the shape of the resin does not deform or adheres when it comes into contact with other objects. A non-oxidizing atmosphere is created if necessary.

Therefore, in addition to the heating of the portion where the carrier tape 6 travels straight ahead, the heating of the portion where the traveling direction is in the opposite direction can be performed. Can be constantly heated and maintained at a temperature close to the reference temperature suitable for temporary curing, and therefore it is possible to completely prevent the occurrence of resin dripping, cracks, etc., and control without correcting the reference temperature. Therefore, the control can be facilitated.

In FIG. 2, after the first-stage heating by the far infrared panel heaters 5a to 5f when the reference temperature is 80 ° C., the far infrared panel heaters 5g to 5i when the reference temperature is 100 ° C. The solid line indicates the heating temperature of the carrier tape 6 when the second stage heating is performed and then the third stage heating is performed by the far infrared panel heaters 5j to 5k when the reference temperature is 120 ° C. It can be seen that the heating temperature remarkably close to the reference temperature is obtained as compared with that by the conventional curing furnace shown in.

The far infrared panel heater is used because it is superior in heating speed and the like as compared with other heaters. In addition, the reason why the heating is performed in three stages so that the temperature is gradually raised to high temperature is that when the high temperature is heated from the beginning, bubbles may be generated or cracks may be generated due to the solvent in the resin, and In such multi-stage heating, it is no exaggeration to say that the performance of the hardening furnace is determined by the pass line length of the first stage heating and the temperature profile. This is because if the temperature is too low, dripping will occur, causing problems such as uneven resin thickness and deformation of the coating pattern.

From the above, the lower surface of the carrier tape 6 transferred from the inlet 1 into the furnace body 3 with the surface of the semiconductor chip 7 on which the sealing resin is potted facing upward is first The far-infrared panel heater 5a heats only from the side, and then the far-infrared panel heaters 5b to 5e heat from both upper and lower sides. Further, in the subsequent second stage heating, far infrared panel heaters 5h and 5g are used only from the lower surface side (the surface side opposite to the surface on which the sealing resin is potted with respect to the semiconductor chip 7). In addition to the heating, in the third stage heating, the far infrared ray panel heaters 5j and 5k are used to heat only from the upper surface side so that the hardening treatment can be performed well.

Although one embodiment according to the present invention has been described above, in the present invention, the feed roller may be arranged so that the carrier tape can meander in a number of stages other than three stages. The far-infrared panel heater that heats the sealing resin may be formed in a curved shape at a location where the carrier tape is run in the opposite direction.

[0015]

[Effect of the device]

 As described above, according to the present invention, the encapsulating resin coating the semiconductor chip mounted on the carrier tape can be constantly heated and maintained at a temperature close to the reference temperature suitable for curing. A curing furnace for resin encapsulation of a semiconductor chip that can completely prevent the occurrence of resin dripping and cracking, and can control without correcting the reference temperature to facilitate control. be able to.

[Brief description of drawings]

FIG. 1 is a front view of a curing furnace for resin encapsulation of a semiconductor chip.

FIG. 2 is a diagram showing a heated state of a carrier tape.

[Explanation of symbols]

 1 Inlet 2 Outlet 3 Furnace body 4 Feed roller 5a-5k Far infrared panel heater 6 Carrier tape 7 Semiconductor chip

Claims (1)

[Scope of utility model registration request] 1. A curing furnace for resin encapsulation of a semiconductor chip, which heats and cures a sealing resin coating a semiconductor chip mounted on a carrier tape, wherein the carrier tape is discharged from an inlet of a furnace body. A plurality of feed rolls are arranged in the furnace body so that the carrier tape can be made to meander in a plurality of steps toward a position where the carrier tape that is made to run from the inlet to the outlet is run straight and A far-infrared panel heater is provided so as to heat the encapsulating resin at each of the locations where the traveling directions are opposite to each other.