JPH0557835A - Metal foil clad laminated sheet - Google Patents
Metal foil clad laminated sheetInfo
- Publication number
- JPH0557835A JPH0557835A JP3221927A JP22192791A JPH0557835A JP H0557835 A JPH0557835 A JP H0557835A JP 3221927 A JP3221927 A JP 3221927A JP 22192791 A JP22192791 A JP 22192791A JP H0557835 A JPH0557835 A JP H0557835A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- resin
- base material
- foil
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器、電気機器、
計算機器、通信機器等に用いられる金属箔張り積層板に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
The present invention relates to a metal foil-clad laminate used for computing equipment, communication equipment and the like.
【０００２】[0002]
【従来の技術】従来、電子機器、電気機器、計算機器、
通信機器等に用いられる金属箔張り積層板は、樹脂含浸
基材と接着剤付金属箔とを加熱加圧成形してなるもので
あるが、１５０〜２００℃の成形温度、４０〜１５０Ｋ
ｇ／ｃｍ2の成形圧力で、接着剤が溶融してしまい接着
剤厚みが薄くなり、耐熱性、金属箔ピール強度を低下さ
せる要因となっていた。2. Description of the Related Art Conventionally, electronic equipment, electric equipment, computing equipment,
The metal foil-clad laminate used for communication equipment is formed by heating and pressing a resin-impregnated base material and a metal foil with an adhesive. The molding temperature is 150 to 200 ° C., 40 to 150K.
With a molding pressure of g / cm 2 , the adhesive was melted and the thickness of the adhesive was reduced, which was a factor of reducing heat resistance and metal foil peel strength.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来の金属箔張り積層板では、耐熱性、金属箔ピ
ール強度が弱く、プリント配線板の耐熱性、金属箔ピー
ル強度を低下させる要因となっていた。本発明は従来の
技術における上述の問題点に鑑みてなされたもので、そ
の目的とするところは、耐熱性、金属箔ピール強度の優
れた金属箔張り積層板を提供することにある。As described in the prior art, in the conventional metal foil-clad laminate, the heat resistance and the metal foil peel strength are weak, and the heat resistance and the metal foil peel strength of the printed wiring board are lowered. It was a factor to make. The present invention has been made in view of the above-mentioned problems in the prior art, and an object thereof is to provide a metal foil-clad laminate having excellent heat resistance and metal foil peel strength.
【０００４】[0004]
【課題を解決するための手段】本発明は樹脂含浸基材と
金属箔との間に、厚さ２０ミクロン以上の接着剤層を介
在させたことを特徴とする金属箔張り積層板のため、上
記目的を達成することができたもので、以下本発明を詳
細に説明する。According to the present invention, there is provided a metal foil-clad laminate comprising a resin-impregnated base material and a metal foil, and an adhesive layer having a thickness of 20 μm or more is interposed therebetween. Now that the above object has been achieved, the present invention will be described in detail below.
【０００５】本発明の金属箔張り積層板の樹脂含浸基材
の基材は、ガラス、アスベスト等の無機質繊維や、ポリ
エステル、ポリアミド、ポリアクリル、ポリビニルアル
コール、ポリイミド、フッ素樹脂等の有機質繊維や木綿
等の天然繊維からなる織布、不織布、マット、紙等であ
る。基材に含浸させる樹脂としては、フエノール、エポ
キシ、不飽和ポリエステル樹脂、ポリイミド、フッ素樹
脂、ポリフエニレンオキサイド等の樹脂が用いられ、必
要に応じてタルク、クレー、シリカ、炭酸カルシュウ
ム、水酸化アルミニゥム等の無機質粉末充填剤を添加す
ることができる。基材の樹脂含浸量は乾燥後樹脂量で４
０〜６０重量％（以下単に％と記す）であることが好ま
しい。樹脂量の調節はスクイズロール等で行うことがで
きる。乾燥工程は熱風等の加熱炉、赤外線照射等が用い
られ任意である。樹脂含浸基材は必要とする積層板厚み
に応じて所要枚数用いるものである。金属箔としては
銅、アルミニュウム、真鍮、ニッケル、鉄等の単独、合
金、複合箔を用いることができ、エポキシ樹脂、フェノ
−ル樹脂、メラミン樹脂、ブチラール樹脂等の接着剤を
金属箔の片面に予め塗布した接着剤付金属箔として用い
るものであるが、加熱加圧成形時の接着剤の溶融による
厚み減少を防止するため接着剤の硬化を予め進ませ、半
硬化状で用いることが必要である。The base material of the resin-impregnated base material of the metal foil-clad laminate of the present invention includes inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide and fluororesin, and cotton. Woven fabrics, non-woven fabrics, mats, papers, etc. made of natural fibers such as. Resins such as phenol, epoxy, unsaturated polyester resin, polyimide, fluororesin, and polyphenylene oxide are used as the resin with which the base material is impregnated, and if necessary, talc, clay, silica, calcium carbonate, aluminum hydroxide. Inorganic powder fillers such as can be added. The amount of resin impregnated into the base material is 4 after the resin is dried.
It is preferably 0 to 60% by weight (hereinafter simply referred to as "%"). The amount of resin can be adjusted with a squeeze roll or the like. A heating furnace such as hot air or infrared irradiation is used for the drying step, which is optional. The required number of resin-impregnated base materials is used according to the required thickness of the laminated plate. As the metal foil, copper, aluminum, brass, nickel, iron, etc. can be used alone, alloy, or composite foil, and an adhesive such as epoxy resin, phenol resin, melamine resin, butyral resin can be used on one side of the metal foil. It is used as a metal foil with adhesive applied in advance, but it is necessary to advance the curing of the adhesive in advance and use it in a semi-cured state in order to prevent thickness reduction due to melting of the adhesive during heat and pressure molding. is there.
【０００６】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【０００７】[0007]
【実施例】１１６ｇ／ｍ2 のクラフト紙を樹脂量５０％
のフェノ−ル樹脂ワニスに、乾燥後樹脂量が５０％にな
るように含浸してから、１５５℃の乾燥炉で２０分間加
熱後、冷却してから所要寸法に切断して樹脂含浸基材を
得た。次に該樹脂含浸基材８枚の上面に厚み０．０３５
ｍｍの銅箔の片面に、エポキシ樹脂８０重量部（以下単
に部と記す）に対してブチラール樹脂４０部、ジシアン
ジアミド１部、イミダゾール０．２部を加えメチルエチ
ルケトン、トルエンの混合溶剤に２５℃での粘度が１０
００ＣＰＳになるように調整した接着剤を乾燥後樹脂付
着量が３０ｇ／ｍ2 になるように塗布、乾燥後１５０℃
で３分間硬化させた半硬化状接着剤付銅箔１枚を、接着
剤側を内側にして載置した積層体を成形圧力１００Ｋｇ
／ｃｍ 2 、１６０℃で６０分間加熱加圧成形して厚み
１．６ｍｍの積層板を得た。Example: 116 g / m250% resin in kraft paper
After drying the phenol resin varnish of
Soaked in a drying oven at 155 ° C for 20 minutes.
After heating, cool and then cut to the required size to obtain a resin-impregnated base material.
Obtained. Next, a thickness of 0.035 is applied to the upper surfaces of the eight resin-impregnated base materials.
80 parts by weight of epoxy resin (hereinafter referred to as a single
40 parts of butyral resin, dicyan
Add 1 part of diamide and 0.2 part of imidazole and add methyl ethyl.
A mixed solvent of ruketone and toluene has a viscosity of 10 at 25 ° C.
After drying the adhesive adjusted to 00 CPS, attach the resin
Wearing amount is 30g / m2So that the coating becomes dry, then dry at 150 ℃
Adhere one sheet of semi-cured adhesive-bonded copper foil cured for 3 minutes
Molding pressure is 100 Kg for the laminate placed with the agent side inside.
/ Cm 2, Thickness for 60 minutes at 160 ℃
A 1.6 mm laminated plate was obtained.
【０００８】[0008]
【比較例】半硬化状接着剤付銅箔を用いず、未硬化状接
着剤付銅箔を用いた以外は、実施例と同様に処理して厚
み１．６ｍｍの積層板を得た。Comparative Example A laminated board having a thickness of 1.6 mm was obtained in the same manner as in Example except that the uncured adhesive-coated copper foil was not used.
【０００９】実施例及び比較例の積層板の性能は第１表
のようである。半田耐熱性は２６０℃の溶融半田に積層
板を浮かべ積層板にふくれが発生するまでの秒数、ピー
ル強度はＫｇ／ｃｍで、熱時ピール強度は２６０℃の溶
融半田に１０秒間浮かべた後の金属箔ピール強度であ
る。The performances of the laminates of Examples and Comparative Examples are shown in Table 1. Solder heat resistance is the number of seconds until a laminated plate floats on molten solder at 260 ° C and blisters occur on the laminated plate, the peel strength is Kg / cm, and the peel strength at heating is after floating on molten solder at 260 ° C for 10 seconds. It is the peel strength of the metal foil.
【００１０】 [0010]
【００１１】[0011]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する金属箔張り積層
板においては、耐熱性、金属箔ピール強度が向上し本発
明の優れていることを確認した。The present invention is constructed as described above.
It was confirmed that the metal foil-clad laminate having the structure described in the claims has excellent heat resistance and metal foil peel strength and is excellent in the present invention.
Claims (1)
０ミクロン以上の接着剤層を介在させたことを特徴とす
る金属箔張り積層板。1. A thickness of 2 between the resin-impregnated base material and the metal foil.
A metal foil-clad laminate having an adhesive layer of 0 micron or more interposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221927A JPH0557835A (en) | 1991-09-03 | 1991-09-03 | Metal foil clad laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221927A JPH0557835A (en) | 1991-09-03 | 1991-09-03 | Metal foil clad laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0557835A true JPH0557835A (en) | 1993-03-09 |
Family
ID=16774342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3221927A Pending JPH0557835A (en) | 1991-09-03 | 1991-09-03 | Metal foil clad laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0557835A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100741449B1 (en) * | 2004-01-30 | 2007-07-23 | 히다치 가세고교 가부시끼가이샤 | Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board |
-
1991
- 1991-09-03 JP JP3221927A patent/JPH0557835A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100741449B1 (en) * | 2004-01-30 | 2007-07-23 | 히다치 가세고교 가부시끼가이샤 | Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board |
| KR100741615B1 (en) * | 2004-01-30 | 2007-07-23 | 히다치 가세고교 가부시끼가이샤 | Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board |
| KR100767177B1 (en) * | 2004-01-30 | 2007-10-15 | 히다치 가세고교 가부시끼가이샤 | Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board |
| US7629045B2 (en) | 2004-01-30 | 2009-12-08 | Hitachi Chemical Company, Ltd. | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| US7862889B2 (en) | 2004-01-30 | 2011-01-04 | Hitachi Chemical Co., Ltd. | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| US8815334B2 (en) | 2004-01-30 | 2014-08-26 | Hitachi Chemical Co., Ltd. | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
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