JPH0557801A - Manufacture of resin impregnated base material - Google Patents

Abstract

PURPOSE:To generate no unimpregnated sections and improve resistance to heat, resistance to insulation and resistance to humidity of a laminate, a printed wiring board and the like/by impregnating a base material with resin, passing the same through a squeeze roll and further pressurizing and drying the resin impregnated base material. CONSTITUTION:Inorganic fiber such as glass, organic fiber such as polyester, polymide or others, on a natural fiber such as cotton, paper or others is used as a base material, and said base material is impregnated in a manner of forming 50% resin amount, for example, 50% resin amount after being dried in phenol resin varnish. The base material is passed through a squeeze roll, and then passed through heating rolls forming a couple of roll clearances to have the resin permeated into the base material, and then heated and dried by a drier. The base material is cut into the required dimension after being cooled to manufacture a resin impregnated base material. The generation of unimpregnated sections is eliminated by said method, and resistance to heat, resistance to insulation and the like can be improved in the case the base material is used for an electric laminate sheet, the printed distributing board or the like.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
The present invention relates to a method for producing a resin-impregnated base material used for electrical laminates, printed wiring boards and the like used in computing equipment, communication equipment and the like.

[0002]

2. Description of the Related Art Conventionally, a resin-impregnated base material used for electrical laminates, printed wiring boards, etc. is a long base material such as paper or glass cloth impregnated with resin, and the resin impregnation amount is set in a clearance such as a squeeze roll. However, it is difficult to evenly impregnate the base material with the resin, and if there is a non-impregnated part, it may cause a non-impregnated part. Heat resistance, insulation of wiring board,
It has been a factor that reduces the moisture absorption resistance.

[0003]

As described in the prior art, in the conventional resin-impregnated base material, unimpregnated portions are apt to occur, and the heat resistance, the insulation property of the electrical laminate and the printed wiring board,
It has been a factor that reduces the moisture absorption resistance. The present invention has been made in view of the above problems in the conventional art,
An object of the invention is to provide a method for producing a resin-impregnated base material in which no unimpregnated portion is generated.

[0004]

The present invention is characterized in that a base material is impregnated with a resin and is passed through a squeeze roll, and then the resin-impregnated base material is temporarily pressurized and then dried. The above-described object can be achieved by the manufacturing method of 1., and the present invention will be described in detail below.

The base material of the resin-impregnated base material used in the present invention includes inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide and fluororesin, and natural fibers such as cotton. Woven fabric, non-woven fabric, mat, paper, etc. Resins such as phenol, epoxy, unsaturated polyester resin, polyimide, fluororesin, and polyphenylene oxide are used as the resin with which the base material is impregnated, and if necessary, talc, clay, silica, calcium carbonate, aluminum hydroxide. Inorganic powder fillers such as can be added. The resin may be impregnated into the substrate regardless of whether it is impregnated on the entire surface or impregnated on one surface. The resin impregnation amount is 40 to 6 after drying.
It is preferably 0% by weight (hereinafter simply referred to as%).
The amount of resin can be adjusted with one or several squeeze rolls, but a pair of squeeze rolls is preferable. A roll or the like is used for temporary pressurization after the squeeze roll treatment, and one or a plurality of pairs may be used as necessary, but there is no particular limitation. Drying is optional using a heating furnace such as hot air or infrared irradiation.

The present invention will be described below based on examples.

[0007]

[Example] Kraft paper with a thickness of 0.15 mm was made to have a resin amount of 50.
% Phenol resin varnish is impregnated so that the amount of the resin becomes 50% after drying, and after passing through a squeeze roll, through a pair of roll clearance 100 micron pressure rolls, sufficient penetration of the resin into the substrate is achieved. And then 155
The resin-impregnated base material was obtained by sending the resin-impregnated base material to a dryer at 0 ° C., heating it at 155 ° C. for 20 minutes, cooling it, and then cutting it to the required size. Next, a laminated body was prepared by placing one adhesive-bonded copper foil having a thickness of 0.018 mm on the upper surface of the eight resin-impregnated base materials with the adhesive side facing inward at a molding pressure of 100 Kg / cm ² and 160 ° C. The laminate was heat and pressure molded for 1 minute to obtain a laminated plate having a thickness of 1.6 mm.

[0008]

Comparative Example A resin-impregnated base material was obtained in the same manner as in the example except that the pressure roll was not used after the squeeze roll, and a laminate having a thickness of 1.6 mm was obtained.

The performances of the laminates of Examples and Comparative Examples are shown in Table 1. The insulation resistance along the layer is 2 in boiling water at 100 ℃.
Numerical value after immersion for a long time, moisture absorption solder heat resistance is 60 ° C, humidity is 9
Numerical value, water absorption after treatment for 24 hours in 5% air is 23 ℃
Is the value after immersion in water for 24 hours.

[0010]

[0011]

The present invention is constructed as described above.
In the method for producing a resin-impregnated base material having the structure described in the claims, it has been confirmed that there is no unimpregnated portion and the heat resistance, insulation property and moisture absorption resistance of the laminated board and the wiring board are improved.

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Claims (1)

[Claims] 1. A method for producing a resin-impregnated base material, which comprises impregnating a base material with a resin, passing it through a squeeze roll, and then temporarily pressing the resin-impregnated base material and then drying it.