JPH0557748B2 - - Google Patents
Info
- Publication number
- JPH0557748B2 JPH0557748B2 JP17004888A JP17004888A JPH0557748B2 JP H0557748 B2 JPH0557748 B2 JP H0557748B2 JP 17004888 A JP17004888 A JP 17004888A JP 17004888 A JP17004888 A JP 17004888A JP H0557748 B2 JPH0557748 B2 JP H0557748B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- laser device
- mounting block
- terminal
- airtight package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 57
- 238000001816 cooling Methods 0.000 claims description 25
- 230000003071 parasitic effect Effects 0.000 description 23
- 238000010586 diagram Methods 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 238000009529 body temperature measurement Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17004888A JPH0221680A (ja) | 1988-07-09 | 1988-07-09 | 半導体レーザ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17004888A JPH0221680A (ja) | 1988-07-09 | 1988-07-09 | 半導体レーザ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0221680A JPH0221680A (ja) | 1990-01-24 |
| JPH0557748B2 true JPH0557748B2 (fr) | 1993-08-24 |
Family
ID=15897652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17004888A Granted JPH0221680A (ja) | 1988-07-09 | 1988-07-09 | 半導体レーザ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221680A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9586370B2 (en) | 2013-08-15 | 2017-03-07 | Biomet Manufacturing, Llc | Method for making ultra high molecular weight polyethylene |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09251120A (ja) * | 1996-03-15 | 1997-09-22 | Nec Corp | 半導体レーザモジュール |
| JP6497980B2 (ja) * | 2015-03-04 | 2019-04-10 | 日本オクラロ株式会社 | 光送信モジュール及び光送受信モジュール |
-
1988
- 1988-07-09 JP JP17004888A patent/JPH0221680A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9586370B2 (en) | 2013-08-15 | 2017-03-07 | Biomet Manufacturing, Llc | Method for making ultra high molecular weight polyethylene |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0221680A (ja) | 1990-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5065226A (en) | Laser diode module | |
| US4989930A (en) | Optoelectronics package | |
| JP4199901B2 (ja) | 光送信モジュール | |
| US7130100B2 (en) | Optical module | |
| US4802178A (en) | High speed fiberoptic laser module | |
| KR100575969B1 (ko) | 티오-캔 구조의 광 모듈 | |
| US6181718B1 (en) | Electronically cooled semiconductor laser module with modified ground line inductance | |
| US6404042B1 (en) | Subcarrier and semiconductor device | |
| KR20040058658A (ko) | 광모듈 | |
| US4912715A (en) | Semiconductor laser module incorporating driver circuit therein | |
| US7167494B2 (en) | Optical transmission module | |
| JP4122577B2 (ja) | 光モジュールの実装構造 | |
| JPH0557748B2 (fr) | ||
| KR0181896B1 (ko) | 고속 광 모듈의 광대역화 장치 | |
| JPH11186668A (ja) | 光半導体モジュール | |
| JPH09148675A (ja) | 光モジュールの実装構造 | |
| JP2723565B2 (ja) | 半導体レーザ装置 | |
| JP2500591B2 (ja) | 半導体レ―ザ装置 | |
| JP4393187B2 (ja) | 半導体光素子用チップキャリア、光モジュール、及び光送受信器 | |
| CN1790845A (zh) | 高速宽频光电传输to－can组件 | |
| JP2728104B2 (ja) | 半導体レーザモジュール | |
| JP2723564B2 (ja) | 半導体レーザモジュール | |
| JPH1187852A (ja) | 電子冷却器付半導体レーザモジュール | |
| US20010021054A1 (en) | Optical telecommunication module | |
| JPH031587A (ja) | 半導体レーザ装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070824 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080824 Year of fee payment: 15 |
|
| EXPY | Cancellation because of completion of term |