JPH0556879B2 - - Google Patents
Info
- Publication number
- JPH0556879B2 JPH0556879B2 JP10831087A JP10831087A JPH0556879B2 JP H0556879 B2 JPH0556879 B2 JP H0556879B2 JP 10831087 A JP10831087 A JP 10831087A JP 10831087 A JP10831087 A JP 10831087A JP H0556879 B2 JPH0556879 B2 JP H0556879B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- circuit pattern
- forming
- printed wiring
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10831087A JPS63273399A (ja) | 1987-04-30 | 1987-04-30 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10831087A JPS63273399A (ja) | 1987-04-30 | 1987-04-30 | 多層印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63273399A JPS63273399A (ja) | 1988-11-10 |
| JPH0556879B2 true JPH0556879B2 (enrdf_load_stackoverflow) | 1993-08-20 |
Family
ID=14481466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10831087A Granted JPS63273399A (ja) | 1987-04-30 | 1987-04-30 | 多層印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63273399A (enrdf_load_stackoverflow) |
-
1987
- 1987-04-30 JP JP10831087A patent/JPS63273399A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63273399A (ja) | 1988-11-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |